TIP122
NPN Silicon
Transistors
Features
Darlington configuration in Jedec TO-220 package
The complementary PNP types are the TIP127 respectively.
Maximum Ratings
Symbol Rating Rating Unit
VCEO Collector-Emitter Voltage 100 V
VCBO Collector-Base Voltage 100 V
VEBO Emitter-Base Voltage 5.0 V
ICP Peak Collector Current 8.0 A
IC Collector Current 5.0 A
PC Collector power dissipation 65 W
TJ Junction Temperature -55 to +150 OC
TSTG Storage Temperature -55 to +150 OC
Electrical Characteristics @ 25OC Unless Otherwise Specified
Symbol Parameter Min Max Units
OFF CHARACTERISTICS
V(BR)CEO Collector-Emitter Breakdown Voltage
(IC=30mAdc, IB=0) 100 --- Vdc
ICBO Collector-Base Cutoff Current
(VCB=100Vdc,IE=0) --- 0.2 mAdc
IEBO Emitter-Base Cutoff Current
(VEB=5.0Vdc, IC=0) --- 2.0 mAdc
ICEO Collector-Emitter Cutoff Current
(VCE=50Vdc, IB=0) --- 0.5 mAdc
ON CHARACTERISTICS
hFE-1 Forward Current Transfer Ratio
(IC=0.5Adc, VCE=3.0Vdc) 1000 ---
hFE-2 Forward Current Transfer Ratio
(IC=3.0Adc, VCE=3.0Vdc) 1000 ---
VCE(sat)-1 Collector-Emitter Saturation Voltage
(IC=3.0Adc, IB=12mAdc) --- 2.0 Vdc
VCE(sat)-2 Collector-Emitter Saturation Voltage
(IC=5.0Adc, IB=20mAdc) --- 4.0 Vdc
VBE(sat) Base-Emitter Saturation Voltage
(IC=3.0Adc, VCE=3.0Adc) --- 2.5 Vdc
TO-220
Revision: B 2011/06/01
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Notes:1.High Temperature Solder Exemption Applied, see EU Directive Annex 7.
Lead Free Finish/RoHS Compliant(Note 1) ("P" Suffix designates
RoHS Compliant. See ordering information)
MIN MAX NOTE
A .560 .625 14.22 15.88
B .380 .420 9.65 10.67
C .140 .190 3.56 4.82
D .020 .045 0.51 1.14
F .139 .161 3.53 4.09
G .190 .110 2.29 2.79
H --- .250 --- 6.35
J .012 .025 0.30 0.64
K .500 .580 12.70 14.73
L .045 .060 1.14 1.52
N .190 .210 4.83 5.33
Q .100 .135 2.54 3.43
R .080 .115 2.04 2.92
S .045 .055 1.14 1.39
T .230 .270 5.84 6.86
U ----- .050 ----- 1.27
V .045 ----- 1.15 -----
G
R
B
Q
H
U
L
D
C
J
K
A
F
S
T
1
3
2
N
V
DIMENSIONS
INCHES MM
DIMMIN MAX
Epoxy meets UL 94 V-0 flammability rating
Moisure Sensitivity Level 1
Mounting Torgue: 5 in-lbs Maximum
MCC
Revision: B 2011/06/01
TM
Micro Commercial Components
www.mccsemi.com
2 of 2
Ordering Information :
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Device Packing
Part Number-BP
Bulk;1Kpcs/Box