NRND
LMX5452
www.ti.com
SNOSAU1A –FEBRUARY 2006–REVISED MARCH 2013
Micro-Module Integrated Bluetooth
®
1.2 Baseband Controller and Radio
Check for Samples: LMX5452
1FEATURES INTERFACES
23• Compliant with the Bluetooth 1.2 Core • Full-duplex UART Supporting Transfer Rates
Specification up to 921.6 kbps Including Baud Rate
Detection for HCI
• -80 dBm Receiver Sensitivity (Typical) • Full Speed (12 Mbps) USB 2.0 for HCI
• Class 2 Operation • ACCESS.bus and SPI/Microwire for Interfacing
• Low Power Consumption: with External Non-volatile Memory
– Advanced Power Management Features • Advanced Audio Interface (AAI) for Interfacing
– Clocking Option 12/13 MHz with PLL with External 8-kHz PCM Codec
Bypass Mode for Power Reduction • Up to 3 GPIO port Pins (OP4/PG4, PG6, PG7)
• High integration: Controllable by HCI Commands
– Implemented in 0.18 μm CMOS Technology • JTAG Based Serial On-chip Debug Interface
– RF Includes On-chip Antenna Filter and • Single Rx/Tx-pad Radio Interface
Switch
– On-chip Firmware with Complete HCI DESCRIPTION
• Embedded ROM and Patch RAM Memory The LMX5452 is a highly integrated Bluetooth 1.2
• Up to Seven Asynchronous Connection Less compliant solution. The integrated baseband
controller and 2.4 GHz radio combine to form a
(ACL) Links complete, small form-factor (6.1 mm × 9.1 mm × 1.2
• Support for Two Simultaneous Voice or mm) Bluetooth node.
Synchronous Connection Oriented (SCO)
Links The baseband controller has a standard Host
Controller Interface (HCI). Based on the Texas
• Accepts10-20 MHz External Clock or Crystal Instruments CompactRISCTM 16-bit processor, the
Network LMX5452 is optimized to handle the audio, data, and
• Fractional-N Sigma/Delta Modulator link management processing requirements of a
Bluetooth node.
• Operating Voltage Range 2.5–3.6V
• I/O Voltage Range 1.6–3.6V The on-chip memory, ROM, and Patch RAM provide
lowest cost and minimize design risk with the
• 60-pad micro-module NFBGA package (6.1 mm flexibility of firmware upgrades.
× 9.1 mm × 1.2 mm) The firmware supplied in the on-chip ROM supports a
APPLICATIONS complete Bluetooth Link Manager and HCI with
communication through a UART or USB interface.
• Mobile Handsets This firmware features point-to-point and point-to-
• USB Dongles multipoint link management, supporting data rates up
• Stereo Headsets to 723 kbps.
• Personal Digital Assistants The radio employs an integrated antenna filter and
• Personal Computers switch to minimize the number of external
components.
• Automotive Telematics The radio has a heterodyne receiver architecture with
a low intermediate frequency (IF), which enables the
IF filters to be integrated on-chip. The transmitter
uses direct IQ-modulation with Gaussian-filtered bit-
stream data, a voltage-controlled oscillator (VCO)
buffer, and a power amplifier.
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2Bluetooth is a registered trademark of Bluetooth SIG, Inc.
3All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2006–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
NRND
LMX5452
SNOSAU1A –FEBRUARY 2006–REVISED MARCH 2013
www.ti.com
DESCRIPTION (CONTINUED)
The LMX5452 module is lead free and RoHS (Restriction of Hazardous Substances) compliant. For more
information on those quality standards, please visit our quality and reliability website at
http://focus.ti.com/quality/docs/qualityhome.tsp
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Functional Block Diagram
Connection Diagram
Figure 1. NFBGA, Plastic, Laminate, 9x6x1.2mm, 60 Ball, 0.8mm Pitch Package
2Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: LMX5452
NRND
LMX5452
SNOSAU1A –FEBRUARY 2006–REVISED MARCH 2013
www.ti.com
REVISION HISTORY
Changes from Original (March 2013) to Revision A Page
• Changed layout of National Data Sheet to TI format ............................................................................................................ 2
4Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: LMX5452
PACKAGE OPTION ADDENDUM
www.ti.com 6-Nov-2017
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LMX5452SMX/NOPB NRND NFBGA NZB 60 2500 Green (RoHS
& no Sb/Br) SNAGCU Level-4-260C-72 HR -40 to 85 5452SM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LMX5452SMX/NOPB NFBGA NZB 60 2500 330.0 16.4 6.4 9.4 2.3 8.0 16.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 21-Nov-2016
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMX5452SMX/NOPB NFBGA NZB 60 2500 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 21-Nov-2016
Pack Materials-Page 2
MECHANICAL DATA
NZB0060A
www.ti.com
SLF60A (Rev A)
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