LMK04011BISQE/NOPB - Texas Instruments

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

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SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

LMK04000 Family Low-Noise Clock Jitter Cleaner with Cascaded PLLs

Check for Samples: LMK04000,LMK04001,LMK04002,LMK04010,LMK04011,LMK04031,LMK04033

1FEATURES

23• Cascaded PLLatinum™ PLL Architecture • Support Clock Rates up to 1080 MHz

– PLL1 • Default Clock Output (CLKout2) at power up

– Phase Detector Rate of up to 40 MHz • Five Dedicated Channel Divider and Delay

Blocks

– Integrated Low-Noise Crystal Oscillator

Circuit • Pin Compatible Family of Clocking Devices

– Dual Redundant Input Reference Clock • Industrial Temperature Range: -40 to 85 °C

with LOS • 3.15 V to 3.45 V Operation

– PLL2 • Package: 48 Pin WQFN (7.0 x 7.0 x 0.8 mm)

– Normalized [1 Hz] PLL Noise Floor of -

224 dBc/Hz APPLICATIONS

– Phase Detector Rate up to 100 MHz • Data Converter Clocking

– Input Frequency-Doubler • Wireless Infrastructure

– Integrated Low-Noise VCO • Networking, SONET/SDH, DSLAM

• Ultra-Low RMS Jitter Performance • Medical

– 150 fs RMS Jitter (12 kHz – 20 MHz) • Military / Aerospace

– 200 fs RMS Jitter (100 Hz – 20 MHz) • Test and Measurement

• LVPECL/2VPECL, LVDS, and LVCMOS outputs • Video

DESCRIPTION

The LMK04000 family of precision clock conditioners provides low-noise jitter cleaning, clock multiplication and

distribution without the need for high-performance voltage controlled crystal oscillators (VCXO) module. Using a

cascaded PLLatinum™ architecture combined with an external crystal and varactor diode, the LMK04000 family

provides sub-200 femtosecond (fs) root mean square (RMS) jitter performance.

The cascaded architecture consists of two high-performance phase-locked loops (PLL), a low-noise crystal

oscillator circuit, and a high-performance voltage controlled oscillator (VCO). The first PLL (PLL1) provides a low-

noise jitter cleaner function while the second PLL (PLL2) performs the clock generation. PLL1 can be configured

to either work with an external VCXO module or use the integrated crystal oscillator with an external crystal and

a varactor diode. When used with a very narrow loop bandwidth, PLL1 uses the superior close-in phase noise

(offsets below 50 kHz) of the VCXO module or the crystal to clean the input clock. The output of PLL1 is used as

the clean input reference to PLL2 where it locks the integrated VCO. The loop bandwidth of PLL2 can be

optimized to clean the far-out phase noise (offsets above 50 kHz) where the integrated VCO outperforms the

VCXO module or crystal used in PLL1.

The LMK04000 family features dual redundant inputs, five differential outputs, and an optional default-clock upon

power up. The input block is equipped with loss of signal detection and automatic or manual selection of the

reference clock. Each clock output consists of a programmable divider, a phase synchronization circuit, a

programmable delay, and an LVDS, LVPECL, or LVCMOS output buffer. The default startup clock is available on

CLKout2 and it can be used to provide an initial clock for the field-programmable gate array (FPGA) or

microcontroller that programs the jitter cleaner during the system power up sequence.

1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2PLLatinum is a trademark of Texas Instruments.

3All other trademarks are the property of their respective owners.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

LMK040xx

Precision Clock

Conditioner

Recovered

³GLUW\´FORFNRU

clean clock

0XOWLSOH³FOHDQ´FORFNVDW

different frequencies

Fout

CLKout4

CLKout2A

CLKout1

CLKout0

DAC

Serializer/

Deserializer

LMX2531

PLL+VCO

ADC

> 1 Gsps

FPGA

CLKin0

Crystal or

VCXO

Backup

Reference

Clock

CLKin1

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

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Table 1. Device Configuration Information

2VPECL / LVPECL

NSID PROCESS LVDS OUTPUTS LVCMOS OUTPUTS VCO

OUTPUTS

LMK04000BISQ BiCMOS 3 4 1185 to 1296 MHz

LMK04001BISQ BiCMOS 3 4 1430 to 1570 MHz

LMK04002BISQ BiCMOS 3 4 1600 to 1750 MHz

LMK04010BISQ BiCMOS 5 1185 to 1296 MHz

LMK04011BISQ BiCMOS 5 1430 to 1570 MHz

LMK04031BISQ BiCMOS 2 2 2 1430 to 1570 MHz

LMK04033BISQ BiCMOS 2 2 2 1840 to 2160 MHz

NSID CLKout0 CLKout1 CLKout2 CLKout3 CLKout4

LMK04000BISQ 2VPECL / LVPECL LVCMOS x 2 LVCMOS x 2 2VPECL / LVPECL 2VPECL / LVPECL

LMK04001BISQ 2VPECL / LVPECL LVCMOS x 2 LVCMOS x 2 2VPECL / LVPECL 2VPECL / LVPECL

LMK04002BISQ 2VPECL / LVPECL LVCMOS x 2 LVCMOS x 2 2VPECL / LVPECL 2VPECL / LVPECL

LMK04010BISQ 2VPECL / LVPECL 2VPECL / LVPECL 2VPECL / LVPECL 2VPECL / LVPECL 2VPECL / LVPECL

LMK04011BISQ 2VPECL / LVPECL 2VPECL / LVPECL 2VPECL / LVPECL 2VPECL / LVPECL 2VPECL / LVPECL

LMK04031BISQ LVDS 2VPECL / LVPECL LVCMOS x 2 2VPECL / LVPECL LVDS

LMK04033BISQ LVDS 2VPECL / LVPECL LVCMOS x 2 2VPECL / LVPECL LVDS

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

OSCin

OSCin*

R1 Divider Phase

Detector

PLL1

N1 Divider

VCO

Divider

CLKout4

CLKout4*

CLKout3B

CLKout3A

CLKout2B

CLKout2A

CLKout1

CLKout1*

CPout1

Internal VCO

Partially

Integrated

Loop Filter

Delay Mux

Divider Delay Mux

Distribution

Path

CLK

DATA

Control

Registers

PWire

Port

Device

Control LD

GOE

SYNC*

Fout

Clock Buffers

Mux

Divider

CLKin0

CLKin0*

CLKin1

CLKin1*

R2 Divider Phase

Detector

PLL2

N2 Divider

CPout2

CLKout0

CLKout0*

Delay MuxDivider

LOS

LOS0

LOS1

Mux

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

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SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

Functional Block Diagram

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

4748 46 45 44 43 42 41 40 39 38 37

1413 15 16 17 18 19 20 21 22 23 24

36GND

Fout

Vcc1

Vcc2

Vcc3

DLD_BYP

Vcc5

Vcc6

CLKin1*

Vcc8

Vcc9

Vcc10

Vcc11

Vcc12

Vcc13

Vcc14

CLKuWire

DATAuWire

LEuWire

LDObyp1

LDObyp2

GOE

CLKout0

CLKout0*

GND

Vcc4

CLKin0

CLKin0*

CPout1

Vcc7

CLKin1

SYNC*

OSCin

OSCin*

CPout2

CLKin0_LOS

CLKin1_LOS

Bias

CLKout1

CLKout1*

CLKout2

CLKout2*

CLKout3

CLKout3*

CLKout4

CLKout4*

DAP

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

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Connection Diagram

Figure 1. 48-Pin WQFN Package

Top View

PIN DESCRIPTIONS

Pin Number Name(s) I/O Type Description

1 GND GND Ground (For Fout Buffer)

2 Fout O ANLG VCO Frequency Output Port

3 VCC1 PWR Power Supply for VCO Output Buffer

4 CLKuWire I CMOS Microwire Clock Input

5 DATAuWire I CMOS Microwire Data Input

6 LEuWire I CMOS Microwire Latch Enable Input

7 NC No Connection

8 VCC2 PWR Power Supply for VCO

9 LDObyp1 ANLG LDO Bypass, bypassed to ground with a 10 µF capacitor

10 LDObyp2 ANLG LDO Bypass, bypassed to ground with a 0.1 µF

capacitor

11 GOE I CMOS Global Output Enable

12 LD O CMOS Lock Detect and PLL multiplexer Output

13 VCC3 PWR Power Supply for CLKout0

14 CLKout0 O LVDS/LVPECL Clock Channel 0 Output

15 CLKout0* O LVDS/LVPECL Clock Channel 0* Output

16 DLD_BYP ANLG DLD Bypass, bypassed to ground with a 0.47 µF

capacitor

17 GND GND Ground (Digital)

18 VCC4 PWR Power Supply for Digital

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

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SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

PIN DESCRIPTIONS (continued)

Pin Number Name(s) I/O Type Description

19 VCC5 PWR Power Supply for CLKin buffers and PLL1 R-divider

20 CLKin0 I ANLG Reference Clock Input Port for PLL1 - AC or DC

Coupled (1)

21 CLKin0* I ANLG Reference Clock Input Port for PLL1 (complimentary) -

AC or DC Coupled (1)

22 VCC6 PWR Power Supply for PLL1 Phase Detector and Charge

Pump

23 CPout1 O ANLG Charge Pump1 Output

24 VCC7 PWR Power Supply for PLL1 N-Divider

25 CLKin1 I ANLG Reference Clock Input Port for PLL1 - AC or DC

Coupled (1)

26 CLKin1* I ANLG Reference Clock Input Port for PLL1 (complimentary) -

AC or DC Coupled (1)

27 SYNC* I CMOS Global Clock Output Synchronization

28 OSCin I ANLG Reference oscillator Input for PLL2 - AC Coupled

29 OSCin* I ANLG Reference oscillator Input for PLL2 - AC Coupled

30 VCC8 PWR Power Supply for OSCin Buffer and PLL2 R-Divider

31 VCC9 PWR Power Supply for PLL2 Phase Detector and Charge

Pump

32 CPout2 O ANLG Charge Pump2 Output

33 VCC10 PWR Power Supply for VCO Divider and PLL2 N-Divider

34 CLKin0_LOS O LVCMOS Status of CLKin0 reference clock input

35 CLKin1_LOS O LVCMOS Status of CLKin1 reference clock input

36 Bias I ANLG Bias Bypass. AC coupled with 1 µF capacitor to Vcc1

37 VCC11 PWR Power Supply for CLKout1

38 CLKout1 O LVPECL/LVCMOS Clock Channel 1 Output

39 CLKout1* O LVPECL/LVCMOS Clock Channel 1* Output

40 VCC12 PWR Power Supply for CLKout2

41 CLKout2 O LVPECL/LVCMOS Clock Channel 2 Output

42 CLKout2* O LVPECL/LVCMOS Clock Channel 2* Output

43 VCC13 PWR Power Supply for CLKout3

44 CLKout3 O LVPECL Clock Channel 3 Output

45 CLKout3* O LVPECL Clock Channel 3* Output

46 VCC14 PWR Power Supply for CLKout4

47 CLKout4 O LVDS/LVPECL Clock Channel 4 Output

48 CLKout4* O LVDS/LVPECL Clock Channel 4* Output

DAP DAP DIE ATTACH PAD, connect to GND

(1) The reference clock inputs may be either AC or DC coupled.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

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Absolute Maximum Ratings(1)(2)(3)(4)

Parameter Symbol Ratings Units

Supply Voltage (5) VCC -0.3 to 3.6 V

Input Voltage VIN -0.3 to (VCC + 0.3) V

Storage Temperature Range TSTG -65 to 150 °C

Lead Temperature (solder 4 sec) TL+260 °C

Differential Input Current (CLKinX/X*, IIN ± 5 mA

OSCin/OSCin*)

(1) "Absolute Maximum Ratings" indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test

conditions, see the Electrical Characteristics. The guaranteed specifications apply only to the test conditions listed.

(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

(3) This device is a high performance RF integrated circuit with an ESD rating up to 8 KV Human Body Model, up to 300 V Machine Model

and up to 1,250 V Charged Device Model and is ESD sensitive. Handling and assembly of this device should only be done at ESD-free

workstations.

(4) Stresses in excess of the absolute maximum ratings can cause permanent or latent damage to the device. These are absolute stress

ratings only. Functional operation of the device is only implied at these or any other conditions in excess of those given in the operation

sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect device reliability.

(5) Never to exceed 3.6 V.

Package Thermal Resistance

Package θJA θJ-PAD (Thermal Pad)

48-Lead WQFN (1) 27.4° C/W 5.8° C/W

(1) Specification assumes 16 thermal vias connect the die attach pad to the embedded copper plane on the 4-layer JEDEC board. These

vias play a key role in improving the thermal performance of the WQFN. It is recommended that the maximum number of vias be used in

the board layout.

Recommended Operating Conditions

Parameter Symbol Condition Min Typical Max Unit

Ambient TAVCC = 3.3 V -40 25 85 °C

Temperature

Supply Voltage VCC 3.15 3.3 3.45 V

Electrical Characteristics

(3.15 V ≤VCC ≤3.45 V, -40 °C ≤TA≤85 °C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA= 25

°C, at the Recommended Operating Conditions at the time of product characterization and are not guaranteed.)

Symbol Parameter Conditions Min Typ Max Units

Current Consumption

ICC_PD Power Down Supply Current 1 mA

LMK04000, LMK04001,

LMK04002 380 435

(2)

Supply Current with all clocks

ICC_CLKS enabled, all delay bypassed, LMK04010, LMK04011 mA

378 435

Fout disabled. (1) (2)

LMK04031, LMK04033 335 385

(2)

CLKin0/0* and CLKin1/1* Input Clock Specifications

Manual Select mode 0.001 400

Clock Input Frequency

fCLKin MHz

(3) Auto-Switching mode 1 400

(1) Load conditions for output clocks: LVPECL: 50 Ωto VCC-2 V. 2VPECL: 50 Ωto VCC-2.36 V. LVDS: 100 Ωdifferential. LVCMOS: 10 pF.

(2) Additional test conditions for ICC limits: All clock delays disabled, CLKoutX_DIV = 510, PLL1 and PLL2 locked. (See Table 33 for more

information)

(3) CLKin0 and CLKin1 maximum of 400 MHz is guaranteed by characterization, production tested at 200 MHz.

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

www.ti.com

SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

Electrical Characteristics (continued)

(3.15 V ≤VCC ≤3.45 V, -40 °C ≤TA≤85 °C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA= 25

°C, at the Recommended Operating Conditions at the time of product characterization and are not guaranteed.)

Symbol Parameter Conditions Min Typ Max Units

Slew Rate on CLKin

SLEWCLKin 20% to 80% 0.15 0.5 V/ns

(4)

AC coupled to CLKinX;

Input Voltage Swing, CLKinX* AC coupled to Ground 0.25 2.0 Vpp

single-ended input (CLKinX_TYPE=0)

VCLKin (Bipolar input buffer

mode) CLKinX and CLKinX* are both

Input Voltage Swing, driven, AC coupled. 0.5 3.1 Vpp

differential input (CLKinX_TYPE=0)

DC offset voltage between

VCLKin-offset (Bipolar input Each pin AC coupled

CLKinX/CLKinX* 44 mV

buffer mode) (CLKinX_TYPE=0)

|CLKinX-CLKinX*| AC coupled to CLKinX;

Input Voltage Swing, single- CLKinX* AC coupled to Ground 0.25 2.0 Vpp

ended input (CLKinX_TYPE=1)

VCLKin (MOS input buffer

mode) CLKinX and CLKinX* are both

Input Voltage Swing, driven, AC coupled. 0.5 3.1 Vpp

differential input (CLKinX_TYPE=1)

DC coupled to CLKinX;

VCLKin-VIH (MOS input buffer Maximum input voltage CLKinX* AC coupled to Ground 2.0 VCC V

mode) (CLKinX_TYPE=1)

DC coupled to CLKinX;

VCLKin-VIL (MOS input buffer CLKinX* AC coupled to Ground 0.0 0.4 V

mode) (CLKinX_TYPE=1)

DC offset voltage between

VCLKin-offset (MOS input Each pin AC coupled

CLKinX/CLKinX* 294 mV

buffer mode) (CLKinX_TYPE=1)

|CLKinX-CLKinX*|

PLL1 Specifications

PLL1 Phase Detector

fPD 40 MHz

Frequency VCPout1 = VCC/2, 25

PLL1_CP_GAIN = 100b

VCPout1 = VCC/2, 50

PLL1_CP_GAIN = 101b

VCPout1 = VCC/2, 100

PLL1_CP_GAIN = 110b

VCPout1 = VCC/2,

PLL1 Charge Pump Source 400

ICPout1 SOURCE µA

PLL1_CP_GAIN = 111b

Current (5)

PLL1_CP_GAIN = 000b NA

PLL1_CP_GAIN = 001b NA

VCPout1=VCC/2, PLL1_CP_GAIN 20

= 010b

VCPout1=VCC/2, PLL1_CP_GAIN 80

= 011b

(4) In order to meet the jitter performance listed in the subsequent sections of this data sheet, the minimum recommended slew rate for all

input clocks is 0.5 V/ns. This is especially true for single-ended clocks. Phase noise performance will begin to degrade as the clock input

slew rate is reduced. However, the device will function at slew rates down to the minimum listed. When compared to single-ended

clocks, differential clocks (LVDS, LVPECL) will be less susceptible to degradation in phase noise performance at lower slew rates due to

their common mode noise rejection. However, it is also recommended to use the highest possible slew rate for differential clocks to

achieve optimal phase noise performance at the device outputs.

(5) This parameter is programmable

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

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Electrical Characteristics (continued)

(3.15 V ≤VCC ≤3.45 V, -40 °C ≤TA≤85 °C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA= 25

°C, at the Recommended Operating Conditions at the time of product characterization and are not guaranteed.)

Symbol Parameter Conditions Min Typ Max Units

VCPout1=VCC/2, PLL1_CP_GAIN -25

= 100b

VCPout1=VCC/2, PLL1_CP_GAIN -50

= 101b

VCPout1=VCC/2, PLL1_CP_GAIN -100

= 110b

VCPout1=VCC/2, PLL1_CP_GAIN

PLL1 Charge Pump Sink -400

ICPout1 SINK µA

= 111b

Current (5)

PLL1_CP_GAIN = 000b NA

PLL1_CP_GAIN = 001b NA

VCPout1=VCC/2, PLL1_CP_GAIN -20

= 010b

VCPout1=VCC/2, PLL1_CP_GAIN -80

= 011b

Charge Pump Sink / Source

ICPout1 %MIS VCPout1 = VCC/2, T = 25 °C 3 10 %

Mismatch

Magnitude of Charge Pump 0.5 V < VCPout1 < VCC - 0.5 V

ICPout1VTUNE Current vs. Charge Pump 4 %

TA= 25 °C

Voltage Variation

Charge Pump Current vs.

ICPout1 %TEMP 4 %

Temperature Variation

Charge Pump TRI-STATE

PLL1 ICPout1 TRI 0.5 V < VCPout < VCC - 0.5 V 5 nA

Leakage Current

PLL2 Reference Input (OSCin) Specifications

EN_PLL2_REF 2X = 0 250

PLL2 Reference Input (7)

fOSCin MHz

(6) EN_PLL2_REF 2X = 1 50

PLL2 Reference Clock

SLEWOSCin 20% to 80% 0.15 0.5 V/ns

minimum slew rate on OSCin AC coupled; Single-ended

Input Voltage for OSCin or

VOSCin (Single-ended) (Unused pin AC coupled to 0.2 2.0 Vpp

OSCin* GND)

VOSCin (Differential) Differential voltage swing AC coupled 0.4 3.1 Vpp

Crystal Oscillator Mode Specifications

fXTAL Crystal Frequency Range 6 20 MHz

Crystal Effective Series

ESR 6 MHz < FXTAL < 20 MHz 100 Ohms

Resistance Vectron VXB1 crystal, 12.288

PXTAL Crystal Power Dissipation (8) 200 µW

MHz, RESR < 40 Ω

Input Capacitance of

CIN -40 to +85 °C 6 pF

LMK040xx OSCin port

PLL2 Phase Detector and Charge Pump Specifications

fPD Phase Detector Frequency 100 MHz

(6) FOSCin maximum frequency guaranteed by characterization. Production tested at 200 MHz.

(7) The EN_PLL2_REF2X bit (Register 13) enables/disables a frequency doubler mode for the PLL2 OSCin path.

(8) See Application Section discussion of Crystal Power Dissipation.

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

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SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

Electrical Characteristics (continued)

(3.15 V ≤VCC ≤3.45 V, -40 °C ≤TA≤85 °C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA= 25

°C, at the Recommended Operating Conditions at the time of product characterization and are not guaranteed.)

Symbol Parameter Conditions Min Typ Max Units

VCPout2=VCC/2, PLL2_CP_GAIN 100

= 00b

VCPout2=VCC/2, PLL2_CP_GAIN 400

= 01b

PLL2 Charge Pump Source

ICPoutSOURCE µA

Current (9) VCPout2=VCC/2, PLL2_CP_GAIN 1600

= 10b

VCPout2=VCC/2, PLL2_CP_GAIN 3200

= 11b

VCPout2=VCC/2, PLL2_CP_GAIN -100

= 00b

VCPout2=VCC/2, PLL2_CP_GAIN -400

= 01b

PLL2 Charge Pump Sink

ICPoutSINK µA

Current (9) VCPout2=VCC/2, PLL2_CP_GAIN -1600

= 10b

VCPout2=VCC/2, PLL2_CP_GAIN -3200

= 11b

Charge Pump Sink/Source

ICPout2%MIS VCPout2=VCC/2, TA= 25 °C 3 10 %

Mismatch

Magnitude of Charge Pump 0.5 V < VCPout2 < VCC - 0.5 V

ICPout2VTUNE Current vs. Charge Pump 4 %

TA= 25 °C

Voltage Variation

Charge Pump Current vs.

ICPout2%TEMP 4 %

Temperature Variation

ICPout2TRI Charge Pump Leakage 0.5 V < VCPout2 < VCC - 0.5 V 10 nA

PLL 1/f Noise at 10 kHz offset PLL2_CP_GAIN = 400 µA -117

PN10kHz (10). Normalized to dBc/Hz

PLL2_CP_GAIN = 3200 µA -122

1 GHz Output Frequency PLL2_CP_GAIN = 400 µA -219

Normalized Phase Noise

PN1Hz dBc/Hz

Contribution (11) PLL2_CP_GAIN = 3200 µA -224

Internal VCO Specifications

LMK040x0 1185 1296

LMK040x1 1430 1570

fVCO VCO Tuning Range MHz

LMK040x2 1600 1750

LMK040x3 1840 2160

LMK040x0, TA= 25 °C, single- 3

ended

LMK040x1, TA= 25 °C, single- 3

ended

VCO Output power to a LMK040x2, TA= 25 °C, single-

PVCO 2 dBm

50 Ωload driven by Fout ended

LMK040x3, TA= 25 °C, single- 0

ended 1840 MHz

LMK040x3, TA= 25 °C, single- -5

ended 2160 MHz

(9) This parameter is programmable

(10) A specification in modeling PLL in-band phase noise is the 1/f flicker noise, LPLL_flicker(f), which is dominant close to the carrier. Flicker

noise has a 10 dB/decade slope. PN10kHz is normalized to a 10 kHz offset and a 1 GHz carrier frequency. PN10kHz = LPLL_flicker(10

kHz) - 20log(Fout / 1 GHz), where LPLL_flicker(f) is the single side band phase noise of only the flicker noise's contribution to total noise,

L(f). To measure LPLL_flicker(f) it is important to be on the 10 dB/decade slope close to the carrier. A high compare frequency and a clean

crystal are important to isolating this noise source from the total phase noise, L(f). LPLL_flicker(f) can be masked by the reference

oscillator performance if a low power or noisy source is used. The total PLL inband phase noise performance is the sum of LPLL_flicker(f)

and LPLL_flat(f).

(11) A specification modeling PLL in-band phase noise. The normalized phase noise contribution of the PLL, LPLL_flat(f), is defined as:

PN1HZ=LPLL_flat(f)-20log(N)-10log(fCOMP). LPLL_flat(f) is the single side band phase noise measured at an offset frequency, f, in a 1 Hz

bandwidth and fCOMP is the phase detector frequency of the synthesizer. LPLL_flat(f) contributes to the total noise, L(f).

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

www.ti.com

Electrical Characteristics (continued)

(3.15 V ≤VCC ≤3.45 V, -40 °C ≤TA≤85 °C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA= 25

°C, at the Recommended Operating Conditions at the time of product characterization and are not guaranteed.)

Symbol Parameter Conditions Min Typ Max Units

Fine Tuning Sensitivity LMK040x0 7 to 9

(The range displayed in the LMK040x1 8 to 11

typical column indicates the LMK040x2 9 to 14

lower sensitivity is typical at

KVCO the lower end of the tuning MHz/V

range, and the higher tuning

sensitivity is typical at the LMK040x3 14 to 26

higher end of the tuning

range). After programming R15 for

Allowable Temperature Drift lock, no changes to output

|ΔTCL| for Continuous Lock 125 °C

configuration are permitted to

(12) guarantee continuous lock

Internal VCO Open Loop Phase Noise and Jitter

Offset = 1 kHz -66

Offset = 10 kHz -94

LMK040x0

fVCO = 1185 MHz Offset = 100 kHz -119

SSB Phase Noise dBc/Hz

Offset = 1 MHz -139

PLL2 = Open Loop

Measured at Fout Offset = 10 MHz -158

Offset = 20 MHz -163

Offset = 1 kHz -64

Offset = 10 kHz -91

LMK040x0

fVCO = 1296 MHz Offset = 100 kHz -117

SSB Phase Noise dBc/Hz

Offset = 1 MHz -138

PLL2 = Open Loop

Measured at Fout Offset = 10 MHz -157

Offset = 20 MHz -161

L(f)Fout Offset = 1 kHz -61

Offset = 10 kHz -91

LMK040x1

fVCO = 1440 MHz Offset = 100 kHz -117

SSB Phase Noise dBc/Hz

Offset = 1 MHz -138

PLL2 = Open Loop

Measured at Fout Offset = 10 MHz -158

Offset = 20 MHz -160

Offset = 1 kHz -58

Offset = 10 kHz -89

LMK040x1

fVCO = 1560 MHz Offset = 100 kHz -115

SSB Phase Noise dBc/Hz

Offset = 1 MHz -137

PLL2 = Open Loop

Measured at Fout Offset = 10 MHz -157

Offset = 20 MHz -162

(12) Maximum Allowable Temperature Drift for Continuous Lock is how far the temperature can drift in either direction from the value it was

at the time that the R0 register was last programmed, and still have the part stay in lock. The action of programming the R0 register,

even to the same value, activates a frequency calibration routine. This implies the part will work over the entire frequency range, but if

the temperature drifts more than the maximum allowable drift for continuous lock, then it will be necessary to reload the R0 register to

ensure it stays in lock. Regardless of what temperature the part was initially programmed at, the temperature can never drift outside the

frequency range of -40 °C to 85 °C without violating specifications.

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

www.ti.com

SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

Electrical Characteristics (continued)

(3.15 V ≤VCC ≤3.45 V, -40 °C ≤TA≤85 °C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA= 25

°C, at the Recommended Operating Conditions at the time of product characterization and are not guaranteed.)

Symbol Parameter Conditions Min Typ Max Units

Offset = 1 kHz -63

Offset = 10 kHz -91

LMK040x2

fVCO = 1600 MHz Offset = 100 kHz -115

SSB Phase Noise dBc/Hz

Offset = 1 MHz -137

PLL2 = Open Loop

Measured at Fout Offset = 10 MHz -156

Offset = 20 MHz -161

Offset = 1 kHz -61

Offset = 10 kHz -90

LMK040x2

fVCO = 1750 MHz Offset = 100 kHz -114

SSB Phase Noise dBc/Hz

Offset = 1 MHz -136

PLL2 = Open Loop

Measured at Fout Offset = 10 MHz -155

Offset = 20 MHz -160

L(f)Fout Offset = 1 kHz -58

Offset = 10 kHz -88

LMK040x3

fVCO = 1840 MHz Offset = 100 kHz -113

SSB Phase Noise dBc/Hz

Offset = 1 MHz -135

PLL2 = Open Loop

Measured at Fout Offset = 10 MHz -155

Offset = 20 MHz -158

Offset = 1 kHz -54

Offset = 10 kHz -84

LMK040x3

fVCO = 2160 MHz Offset = 100 kHz -110

SSB Phase Noise dBc/Hz

Offset = 1 MHz -132

PLL2 = Open Loop

Measured at Fout Offset = 10 MHz -154

Offset = 20 MHz -157

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

www.ti.com

Electrical Characteristics (continued)

(3.15 V ≤VCC ≤3.45 V, -40 °C ≤TA≤85 °C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA= 25

°C, at the Recommended Operating Conditions at the time of product characterization and are not guaranteed.)

Symbol Parameter Conditions Min Typ Max Units

Internal VCO Closed Loop Phase Noise and Jitter Specifications using an Instrumentation Quality VCXO

Offset = 1 kHz -111

Offset = 10kHz -119

LMK040x0 (13) Offset = 100 kHz -121

fVCO = 1200 MHz

SSB Phase Noise Offset = 1 MHz -133 dBc/Hz

PLL2 = Closed Loop Offset = 10 MHz -157

Measured at Fout Offset = 20 MHz -162

Offset = 40 MHz -165

Offset = 1 kHz -110

Offset = 10 kHz -117

LMK040x1 (14) Offset = 100 kHz -120

fVCO = 1500 MHz

SSB Phase Noise Offset = 1 MHz -132 dBc/Hz

PLL2 = Closed Loop Offset = 10 MHz -156

Measured at Fout Offset = 20 MHz -160

Offset = 40 MHz -163

L(f)Fout Offset = 1 kHz -111

Offset = 10 kHz -118

LMK040x2 (15) Offset = 100 kHz -120

fVCO = 1600 MHz

SSB Phase Noise Offset = 1 MHz -132 dBc/Hz

PLL2 = Closed Loop Offset = 10 MHz -156

Measured at Fout Offset = 20 MHz -162

Offset = 40 MHz -165

Offset = 1 kHz -107

Offset = 10 kHz -114

LMK040x3 (16) Offset = 100 kHz -117

fVCO = 2000 MHz

SSB Phase Noise Offset = 1 MHz -126 dBc/Hz

PLL2 = Closed Loop Offset = 10 MHz -152

Measured at Fout Offset = 20 MHz -156

Offset = 40 MHz -160

(13) For LMK040x0, fVCO = 1200 MHz. PLL1 is powered down. A 100 MHz Wenzel XO (model: 501-04623G) drives the OSCin input of

PLL2. PLL2 parameters: VCO_DIV = 3, N2 = 5, R2 = 1, FDET = 100 MHz, ICP2 = 1.6 mA, C1 = 22 pF, C2 = 5.6 nF, R2 = 1.8 kΩ, LBW =

268 kHz, PM = 75°. Wenzel XO phase noise: 100 Hz: -132 dBc/Hz; 1 kHz: -147 dBc/Hz; 10 kHz: -159 dBc/Hz; 100 kHz: -167 dBc/Hz.

(14) For LMK040x1, fVCO = 1500 MHz. PLL1 is powered down. A 100 MHz Wenzel XO (model: 501-04623G) drives the OSCin input of

PLL2. PLL2 parameters: VCO_DIV = 3, N2 = 5, R2 = 1, FDET = 100 MHz, ICP2 = 1.6 mA, C1 = 22 pF, C2 = 5.6 nF, R2 = 1.8 kΩ, LBW =

268 kHz, PM = 75°. Wenzel XO phase noise: 100 Hz: -132 dBc/Hz; 1 kHz: -147 dBc/Hz; 10 kHz: -159 dBc/Hz; 100 kHz: -167 dBc/Hz.

(15) For LMK040x2, fVCO = 1600 MHz. PLL1 is powered down. A 100 MHz Wenzel XO (model: 501-04623G) drives the OSCin input of

PLL2. PLL2 parameters: VCO_DIV = 2, N2 = 8, R2 = 1, FDET = 100 MHz, ICP2 = 1.6 mA, C1 = 22 pF, C2 = 5.6 nF, R2 = 1.8 kΩ, LBW =

252 kHz, PM = 76°. Wenzel XO phase noise: 100 Hz: -132 dBc/Hz; 1 kHz: -147 dBc/Hz; 10 kHz: -159 dBc/Hz; 100 kHz: -167 dBc/Hz.

(16) For LMK040x3, fVCO = 2000 MHz. PLL1 is powered down. A 100 MHz Wenzel XO (model: 501-04623G) drives the OSCin input of

PLL2. PLL2 parameters: VCO_DIV = 2, N2 = 10, R2 = 1, FDET = 100 MHz, ICP2 = 1.6 mA, C1 = 22 pF, C2 = 5.6 nF, R2 = 1.8 kΩ, LBW

= 434 kHz, PM = 69°. Wenzel XO phase noise: 100 Hz: -132 dBc/Hz; 1 kHz: -147 dBc/Hz; 10 kHz: -159 dBc/Hz; 100 kHz: -167 dBc/Hz.

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

www.ti.com

SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

Electrical Characteristics (continued)

(3.15 V ≤VCC ≤3.45 V, -40 °C ≤TA≤85 °C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA= 25

°C, at the Recommended Operating Conditions at the time of product characterization and are not guaranteed.)

Symbol Parameter Conditions Min Typ Max Units

LMK040x0 (13) BW = 12 kHz to 20 MHz 105

fVCO = 1200 MHz BW = 100 Hz to 20 MHz 110

Integrated RMS Jitter

LMK040x1 (14) BW = 12 kHz to 20 MHz 100

fVCO = 1500 MHz BW = 100 Hz to 20 MHz 105

Integrated RMS Jitter

JFout fs

LMK040x2 (15) BW = 12 kHz to 20 MHz 95

fVCO = 1600 MHz BW = 100 Hz to 20 MHz 100

Integrated RMS Jitter

LMK040x3 (16) BW = 12 kHz to 20 MHz 105

fVCO = 2000 MHz BW = 100 Hz to 20 MHz 110

Integrated RMS Jitter

CLKout's Internal VCO Closed Loop Phase Noise and Jitter Specifications using an Instrumentation Quality VCXO

Offset = 1 kHz -125

LMK040x0 (17)

fCLKout = 250 MHz Offset = 10 kHz -130

SSB Phase Noise Offset = 100 kHz -132

Measured at Clock Outputs Offset = 1 MHz -148

Value is average for all output

types Offset = 10 MHz -157

Offset = 1 kHz -126

LMK040x1 (18)

fCLKout = 250 MHz Offset = 10 kHz -133

SSB Phase Noise Offset = 100 kHz -136

Measured at Clock Outputs Offset = 1 MHz -147

Value is average for all output

types Offset = 10 MHz -156

L(f)CLKout dBc/Hz

Offset = 1 kHz -127

LMK040x2 (19)

fCLKout = 250 MHz Offset = 10 kHz -133

SSB Phase Noise Offset = 100 kHz -134

Measured at Clock Outputs Offset = 1 MHz -145

Value is average for all output

types Offset = 10 MHz -157

Offset = 1 kHz -125

LMK040x3 (20)

fCLKout = 250 MHz Offset = 10 kHz -132

SSB Phase Noise Offset = 100 kHz -135

Measured at Clock Outputs Offset = 1 MHz -145

Value Is average for all output

types Offset = 10 MHz -156

(17) For LMK040x0, fVCO = 1250 MHz. PLL1 is powered down. A 100 MHz Wenzel XO (model: 501-04623G) drives the OSCin input of

PLL2. PLL2 parameters: VCO_DIV = 5, N2 = 5, R2 = 2, FDET = 50 MHz, ICP2 = 3.2 mA, C1 = 22 pF, C2 = 5.6 nF, R2 = 1.8 kΩ, LBW =

251 kHz, PM = 76°. Wenzel XO phase noise: 100 Hz: -132 dBc/Hz; 1 kHz: -147 dBc/Hz; 10 kHz: -159 dBc/Hz; 100 kHz: -167 dBc/Hz.

CLKoutX_DIV = Bypass. CLKout_DLY = OFF.

(18) For LMK040x1, fVCO = 1500 MHz. PLL1 is powered down. A 100 MHz Wenzel XO (model: 501-04623G) drives the OSCin input of

PLL2. PLL2 parameters: VCO_DIV = 3, N2 = 5, R2 = 1, FDET = 100 MHz, ICP2 = 1.6 mA, C1 = 22 pF, C2 = 5.6 nF, R2 = 1.8 kΩ, LBW =

268 kHz, PM = 75°. Wenzel XO phase noise: 100 Hz: -132 dBc/Hz; 1 kHz: -147 dBc/Hz; 10 kHz: -159 dBc/Hz; 100 kHz: -167 dBc/Hz.

CLKoutX_DIV = 2. CLKout_DLY = OFF.

(19) For LMK040x2, fVCO = 1750 MHz. PLL1 is powered down. A 100 MHz Wenzel XO (model: 501-04623G) drives the OSCin input of

PLL2. PLL2 parameters: VCO_DIV = 7, N2 = 5, R2 = 2, FDET = 50 MHz, ICP2 = 1.6 mA, C1 = 22 pF, C2 = 5.6 nF, R2 = 1.8 kΩ, LBW =

354 kHz, PM = 73°. Wenzel XO phase noise: 100 Hz: -132 dBc/Hz; 1 kHz: -147 dBc/Hz; 10 kHz: -159 dBc/Hz; 100 kHz: -167 dBc/Hz.

CLKoutX_DIV = Bypass. CLKout_DLY = OFF.

(20) For LMK040x3, fVCO = 2000 MHz. PLL1 is powered down. A 100 MHz Wenzel XO (model: 501-04623G) drives the OSCin input of

PLL2. PLL2 parameters: VCO_DIV = 2, N2 = 10, R2 = 1, FDET = 100 MHz, ICP2 = 1.6 mA, C1 = 22 pF, C2 = 5.6 nF, R2 = 1.8 kΩ, LBW

= 434 kHz, PM = 69°. Wenzel XO phase noise: 100 Hz: -132 dBc/Hz; 1 kHz: -147 dBc/Hz; 10 kHz: -159 dBc/Hz; 100 kHz: -167 dBc/Hz.

CLKoutX_DIV = 4. CLKout_DLY = OFF.

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

www.ti.com

Electrical Characteristics (continued)

(3.15 V ≤VCC ≤3.45 V, -40 °C ≤TA≤85 °C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA= 25

°C, at the Recommended Operating Conditions at the time of product characterization and are not guaranteed.)

Symbol Parameter Conditions Min Typ Max Units

LMK040x0 (21) BW = 12 kHz to 20 MHz 130

fCLKout = 250 MHz BW = 100 Hz to 20 MHz 135

Integrated RMS Jitter

LMK040x1 (22) BW = 12 kHz to 20 MHz 115

fCLKout = 250 MHz BW = 100 Hz to 20 MHz 120

Integrated RMS Jitter

JCLKout fs

LVPECL/2VPECL/LVDS LMK040x2 (23) BW = 12 kHz to 20 MHz 130

fCLKout = 250 MHz BW = 100 Hz to 20 MHz 135

Integrated RMS Jitter

LMK040x3 (24) BW = 12 kHz to 20 MHz 125

fCLKout = 250 MHz BW = 100 Hz to 20 MHz 130

Integrated RMS Jitter

LMK040x0 (21) BW = 12 kHz to 20 MHz 140

fCLKout = 250 MHz BW = 100 Hz to 20 MHz 145

Integrated RMS Jitter

LMK040x1 (22) BW = 12 kHz to 20 MHz 110

fCLKout = 250 MHz BW = 100 Hz to 20 MHz 115

Integrated RMS Jitter

JCLKout fs

LVCMOS LMK040x2 (23) BW = 12 kHz to 20 MHz 130

fCLKout = 250 MHz BW = 100 Hz to 20 MHz 135

Integrated RMS Jitter

LMK040x3 (24) BW = 12 kHz to 20 MHz 120

fCLKout = 250 MHz BW = 100 Hz to 20 MHz 125

Integrated RMS Jitter

CLKout's Internal VCO Closed Loop Jitter Specifications using a Commercial Quality VCXO

(21) For LMK040x0, fVCO = 1250 MHz. PLL1 is powered down. A 100 MHz Wenzel XO (model: 501-04623G) drives the OSCin input of

PLL2. PLL2 parameters: VCO_DIV = 5, N2 = 5, R2 = 2, FDET = 50 MHz, ICP2 = 3.2 mA, C1 = 22 pF, C2 = 5.6 nF, R2 = 1.8 kΩ, LBW =

251 kHz, PM = 76°. Wenzel XO phase noise: 100 Hz: -132 dBc/Hz; 1 kHz: -147 dBc/Hz; 10 kHz: -159 dBc/Hz; 100 kHz: -167 dBc/Hz.

CLKoutX_DIV = Bypass. CLKout_DLY = OFF.

(22) For LMK040x1, fVCO = 1500 MHz. PLL1 is powered down. A 100 MHz Wenzel XO (model: 501-04623G) drives the OSCin input of

PLL2. PLL2 parameters: VCO_DIV = 3, N2 = 5, R2 = 1, FDET = 100 MHz, ICP2 = 1.6 mA, C1 = 22 pF, C2 = 5.6 nF, R2 = 1.8 kΩ, LBW =

268 kHz, PM = 75°. Wenzel XO phase noise: 100 Hz: -132 dBc/Hz; 1 kHz: -147 dBc/Hz; 10 kHz: -159 dBc/Hz; 100 kHz: -167 dBc/Hz.

CLKoutX_DIV = 2. CLKout_DLY = OFF.

(23) For LMK040x2, fVCO = 1750 MHz. PLL1 is powered down. A 100 MHz Wenzel XO (model: 501-04623G) drives the OSCin input of

PLL2. PLL2 parameters: VCO_DIV = 7, N2 = 5, R2 = 2, FDET = 50 MHz, ICP2 = 1.6 mA, C1 = 22 pF, C2 = 5.6 nF, R2 = 1.8 kΩ, LBW =

354 kHz, PM = 73°. Wenzel XO phase noise: 100 Hz: -132 dBc/Hz; 1 kHz: -147 dBc/Hz; 10 kHz: -159 dBc/Hz; 100 kHz: -167 dBc/Hz.

CLKoutX_DIV = Bypass. CLKout_DLY = OFF.

(24) For LMK040x3, fVCO = 2000 MHz. PLL1 is powered down. A 100 MHz Wenzel XO (model: 501-04623G) drives the OSCin input of

PLL2. PLL2 parameters: VCO_DIV = 2, N2 = 10, R2 = 1, FDET = 100 MHz, ICP2 = 1.6 mA, C1 = 22 pF, C2 = 5.6 nF, R2 = 1.8 kΩ, LBW

= 434 kHz, PM = 69°. Wenzel XO phase noise: 100 Hz: -132 dBc/Hz; 1 kHz: -147 dBc/Hz; 10 kHz: -159 dBc/Hz; 100 kHz: -167 dBc/Hz.

CLKoutX_DIV = 4. CLKout_DLY = OFF.

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

www.ti.com

SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

Electrical Characteristics (continued)

(3.15 V ≤VCC ≤3.45 V, -40 °C ≤TA≤85 °C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA= 25

°C, at the Recommended Operating Conditions at the time of product characterization and are not guaranteed.)

Symbol Parameter Conditions Min Typ Max Units

LMK040x0 (25) (26) BW = 12 kHz to 20 MHz 140 200

fCLKout = 250 MHz BW = 100 Hz to 20 MHz 185

Integrated RMS Jitter

LMK040x1 (27) (26) BW = 12 kHz to 20 MHz 130 200

fCLKout = 250 MHz BW = 100 Hz to 20 MHz 190

Integrated RMS Jitter

JCLKout fs

LVPECL/2VPECL LMK040x2 (28) (26) BW = 12 kHz to 20 MHz 150 200

fCLKout = 250 MHz BW = 100 Hz to 20 MHz 190

Integrated RMS Jitter

LMK040x3 (29) (26) BW = 12 kHz to 20 MHz 145 200

fCLKout = 250 MHz BW = 100 Hz to 20 MHz 200

Integrated RMS Jitter

LMK040x1 (30) BW = 12 kHz to 20 MHz 130

fCLKout = 250 MHz BW = 100 Hz to 20 MHz 190

Integrated RMS Jitter

JCLKout fs

LVDS LMK040x3 (31) BW = 12 kHz to 20 MHz 145

fCLKout = 250 MHz BW = 100 Hz to 20 MHz 200

Integrated RMS Jitter

(25) For LMK040x0, FVCO = 1250 MHz. PLL1 parameters: FDET = 1 MHz, ICP1 = 100 µA, loop bandwidth = 20 Hz. A 100 MHz VCXO drives

the OSCin input of PLL2. PLL2 parameters: VCO_DIV = 5, N2 = 5, R2 = 2, FDET = 50 MHz, ICP2 = 3.2 mA, C1 = 0 pF, C2 = 12 nF, R2

= 1.8 kΩ, LBW = 254 kHz, PM = 81°. CLKDIST parameters: CLKoutX_DIV = Bypass, CLKout_DLY = OFF. VCXO phase noise: 100 Hz:

-100 dBc/Hz; 1 kHz: -128 dBc/Hz; 10 kHz: -144 dBc/Hz; 100 kHz: -147 dBc/Hz.

(26) Max jitter specification applies to CH3 (LVPECL) output and guaranteed by test in production.

(27) For LMK040x1, FVCO = 1500 MHz. PLL1 parameters: FDET = 1 MHz, ICP1 = 100 µA, loop bandwidth = 20 Hz. A 100 MHz VCXO drives

the OSCin input of PLL2. PLL2 parameters: VCO_DIV = 3, N2 = 5, R2 = 1, FDET = 100 MHz, ICP2 = 1.6 mA, C1 = 0 pF, C2 = 12 nF, R2

= 1.8 kΩ, LBW = 271 kHz, PM = 80°. CLKDIST parameters: CLKoutX_DIV = 2, CLKout_DLY = OFF. VCXO phase noise: 100 Hz: -100

dBc/Hz; 1 kHz: -128 dBc/Hz; 10 kHz: -144 dBc/Hz; 100 kHz: -147 dBc/Hz.

(28) For LMK040x2, FVCO = 1750 MHz. PLL1 parameters: FDET = 1 MHz, ICP1 = 100 µA, loop bandwidth = 20 Hz. A 100 MHz VCXO drives

the OSCin input of PLL2. PLL2 parameters: VCO_DIV = 7, N2 = 5, R2 = 2, FDET = 50 MHz, ICP2 = 3.2 mA, C1 = 0 pF, C2 = 12 nF, R2

= 1.8 kΩ, LBW = 360 kHz, PM = 79°. CLKDIST parameters: CLKoutX_DIV = Bypass, CLKout_DLY = OFF. VCXO phase noise: 100 Hz:

-100 dBc/Hz; 1 kHz: -128 dBc/Hz; 10 kHz: -144 dBc/Hz; 100 kHz: -147 dBc/Hz.

(29) For LMK040x3, FVCO = 2000 MHz. PLL1 parameters: FDET = 1 MHz, ICP1 = 100 µA, loop bandwidth = 20 Hz. A 100 MHz VCXO drives

the OSCin input of PLL2. PLL2 parameters: VCO_DIV = 2, N2 = 10, R2 = 1, FDET = 100 MHz, ICP2 = 1.6 mA, C1 = 0 pF, C2 = 12 nF,

R2 = 1.8 kΩ, LBW = 445 kHz, PM = 76°. CLKDIST parameters: CLKoutX_DIV = 4, CLKout_DLY = OFF. VCXO phase noise: 100 Hz: -

100 dBc/Hz; 1 kHz: -128 dBc/Hz; 10 kHz: -144 dBc/Hz; 100 kHz: -147 dBc/Hz.

(30) For LMK040x1, FVCO = 1500 MHz. PLL1 parameters: FDET = 1 MHz, ICP1 = 100 µA, loop bandwidth = 20 Hz. A 100 MHz VCXO drives

the OSCin input of PLL2. PLL2 parameters: VCO_DIV = 3, N2 = 5, R2 = 1, FDET = 100 MHz, ICP2 = 1.6 mA, C1 = 0 pF, C2 = 12 nF, R2

= 1.8 kΩ, LBW = 271 kHz, PM = 80°. CLKDIST parameters: CLKoutX_DIV = 2, CLKout_DLY = OFF. VCXO phase noise: 100 Hz: -100

dBc/Hz; 1 kHz: -128 dBc/Hz; 10 kHz: -144 dBc/Hz; 100 kHz: -147 dBc/Hz.

(31) For LMK040x3, FVCO = 2000 MHz. PLL1 parameters: FDET = 1 MHz, ICP1 = 100 µA, loop bandwidth = 20 Hz. A 100 MHz VCXO drives

the OSCin input of PLL2. PLL2 parameters: VCO_DIV = 2, N2 = 10, R2 = 1, FDET = 100 MHz, ICP2 = 1.6 mA, C1 = 0 pF, C2 = 12 nF,

R2 = 1.8 kΩ, LBW = 445 kHz, PM = 76°. CLKDIST parameters: CLKoutX_DIV = 4, CLKout_DLY = OFF. VCXO phase noise: 100 Hz: -

100 dBc/Hz; 1 kHz: -128 dBc/Hz; 10 kHz: -144 dBc/Hz; 100 kHz: -147 dBc/Hz.

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

www.ti.com

Electrical Characteristics (continued)

(3.15 V ≤VCC ≤3.45 V, -40 °C ≤TA≤85 °C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA= 25

°C, at the Recommended Operating Conditions at the time of product characterization and are not guaranteed.)

Symbol Parameter Conditions Min Typ Max Units

LMK040x0 (32) BW = 12 kHz to 20 MHz 150

fCLKout = 250 MHz BW = 100 Hz to 20 MHz 190

Integrated RMS Jitter

LMK040x1 (30) BW = 12 kHz to 20 MHz 125

fCLKout = 250 MHz BW = 100 Hz to 20 MHz 185

Integrated RMS Jitter

JCLKout fs

LVCMOS LMK040x2 (33) BW = 12 kHz to 20 MHz 150

fCLKout = 250 MHz BW = 100 Hz to 20 MHz 190

Integrated RMS Jitter

LMK040x3 (31) BW = 12 kHz to 20 MHz 145

fCLKout = 250 MHz BW = 100 Hz to 20 MHz 195

Integrated RMS Jitter

CLKout's Internal VCO Closed Loop Jitter Specifications using the Integrated Low Noise Crystal Oscillator Circuit

LMK040x0 (34) BW = 12 kHz to 20 MHz 190

fCLKout = 245.76 MHz BW = 100 Hz to 20 MHz 230

Integrated RMS Jitter

LMK040x1 (35) BW = 12 kHz to 20 MHz 200

fCLKout = 245.76 MHz BW = 100 Hz to 20 MHz 230

Integrated RMS Jitter

JCLKout fs

LVPECL/2VPECL/LVDS LMK040x2 (36) BW = 12 kHz to 20 MHz 195

fCLKout = 245.76 MHz BW = 100 Hz to 20 MHz 230

Integrated RMS Jitter

LMK040x3 (37) BW = 12 kHz to 20 MHz 245

fCLKout = 245.76 MHz BW = 100 Hz to 20 MHz 260

Integrated RMS Jitter

(32) For LMK040x0, FVCO = 1250 MHz. PLL1 parameters: FDET = 1 MHz, ICP1 = 100 µA, loop bandwidth = 20 Hz. A 100 MHz VCXO drives

the OSCin input of PLL2. PLL2 parameters: VCO_DIV = 5, N2 = 5, R2 = 2, FDET = 50 MHz, ICP2 = 3.2 mA, C1 = 0 pF, C2 = 12 nF, R2

= 1.8 kΩ, LBW = 254 kHz, PM = 81°. CLKDIST parameters: CLKoutX_DIV = Bypass, CLKout_DLY = OFF. VCXO phase noise: 100 Hz:

-100 dBc/Hz; 1 kHz: -128 dBc/Hz; 10 kHz: -144 dBc/Hz; 100 kHz: -147 dBc/Hz.

(33) For LMK040x2, FVCO = 1750 MHz. PLL1 parameters: FDET = 1 MHz, ICP1 = 100 µA, loop bandwidth = 20 Hz. A 100 MHz VCXO drives

the OSCin input of PLL2. PLL2 parameters: VCO_DIV = 7, N2 = 5, R2 = 2, FDET = 50 MHz, ICP2 = 3.2 mA, C1 = 0 pF, C2 = 12 nF, R2

= 1.8 kΩ, LBW = 360 kHz, PM = 79°. CLKDIST parameters: CLKoutX_DIV = Bypass, CLKout_DLY = OFF. VCXO phase noise: 100 Hz:

-100 dBc/Hz; 1 kHz: -128 dBc/Hz; 10 kHz: -144 dBc/Hz; 100 kHz: -147 dBc/Hz.

(34) For LMK040x0, FVCO = 1228.8 MHz. PLL1 parameters: FDET = 1.024 MHz, ICP1 = 100 µA, loop bandwidth = 20 Hz. A 12.288 MHz

Vectron crystal (model: VXB1-1127-12M288000) and tuning circuitry is used with on-chip XO circuitry. PLL2 parameters: VCO_DIV = 5,

N2 = 10, EN_PLL2_REF2X = 1, FDET = 24.576 MHz, ICP2 = 3.2 mA, C1 = 0 pF, C2 = 12 nF, R2 = 1.8 kΩ, R3 = 600 Ω, R4 = 10 kΩ, C3

= 150 pF, C4 = 60 pF, LBW = 109 kHz, PM = 43°, CLKoutX_DIV = 2, CLKout_DLY = OFF.

(35) For LMK040x1, FVCO = 1474.56 MHz. PLL1 parameters: FDET = 1.024 MHz, ICP1 = 100 µA, loop bandwidth = 20 Hz. A 12.288 MHz

Ecliptek crystal (model: ECX-6465) and tuning circuitry is used with on-chip XO circuitry. PLL2 parameters: VCO_DIV = 3, N2 = 20,

EN_PLL2_REF2X = 1, FDET = 24.576 MHz, ICP2 = 3.2 mA, C1 = 0 pF, C2 = 12 nF, R2 = 1.8 kΩ, R3 = 600 Ω, R4 = 10 kΩ, C3 = 150

pF, C4 = 60 pF, LBW = 103 kHz, PM = 44°, CLKoutX_DIV = 2, CLKout_DLY = OFF.

(36) For LMK040x2, FVCO = 1720.32 MHz. PLL1 parameters: FDET = 1.024 MHz, ICP1 = 100 µA, loop bandwidth = 20 Hz. A 12.288 MHz

Vectron crystal (model: VXB1-1127-12M288000) and tuning circuitry is used with on-chip XO circuitry. PLL2 parameters: VCO_DIV = 7,

N2 = 10, EN_PLL2_REF2X = 1, FDET = 24.576 MHz, ICP2 = 3.2 mA, C1 = 0 pF, C2 = 12 nF, R2 = 1.8 kΩ, R3 = 600 Ω, R4 = 10 kΩ, C3

= 150 pF, C4 = 60 pF, LBW = 120 kHz, PM = 40°, CLKoutX_DIV = 2, CLKout_DLY = OFF.

(37) For LMK040x3, FVCO = 1966.08 MHz. PLL1 parameters: FDET = 1.024 MHz, ICP1 = 100 µA, loop bandwidth = 20 Hz. A 12.288 MHz

Ecliptek crystal (model: ECX-6465) and tuning circuitry is used with on-chip XO circuitry. PLL2 parameters: VCO_DIV = 4, N2 = 20,

EN_PLL2_REF2X = 1, FDET = 24.576 MHz, ICP2 = 3.2 mA, C1 = 0 pF, C2 = 12 nF, R2 = 1.8 kΩ, R3 = 600 Ω, R4 = 10 kΩ, C3 = 150

pF, C4 = 60 pF, LBW = 91 kHz, PM = 47°, CLKoutX_DIV = 2, CLKout_DLY = OFF.

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

www.ti.com

SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

Electrical Characteristics (continued)

(3.15 V ≤VCC ≤3.45 V, -40 °C ≤TA≤85 °C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA= 25

°C, at the Recommended Operating Conditions at the time of product characterization and are not guaranteed.)

Symbol Parameter Conditions Min Typ Max Units

LMK040x0 (34) BW = 12 kHz to 20 MHz 195

fCLKout = 245.76 MHz BW = 100 Hz to 20 MHz 230

Integrated RMS Jitter

LMK040x1 (35) BW = 12 kHz to 20 MHz 195

fCLKout = 245.76 MHz BW = 100 Hz to 20 MHz 220

Integrated RMS Jitter

JCLKout fs

LVCMOS LMK040x2 (36) BW = 12 kHz to 20 MHz 195

fCLKout = 245.76 MHz BW = 100 Hz to 20 MHz 230

Integrated RMS Jitter

LMK040x3 (37) BW = 12 kHz to 20 MHz 240

fCLKout = 245.76 MHz BW = 100 Hz to 20 MHz 260

Integrated RMS Jitter

Digital Inputs (CLKuWire, DATAuWire, LEuWire)

VIH High-Level Input Voltage 1.6 VCC V

VIL Low-Level Input Voltage 0.4 V

IIH High-Level Input Current VIH = VCC -5 25 µA

IIL Low-Level Input Current VIL = 0 -5.0 5.0 µA

Digital Inputs (GOE, SYNC*)

VIH High-Level Input Voltage 1.6 VCC V

VIL Low-Level Input Voltage 0.4 V

IIH High-Level Input Current VIH = VCC -5.0 5.0 µA

IIL Low-Level Input Current VIL = 0 -40.0 5.0 µA

Digital Outputs (CLKinX_LOS, LD)

VOH High-Level Output Voltage IOH = -500 µA VCC - 0.4 V

VOL Low-Level Output Voltage IOL = 500 µA 0.4 V

Default Power On Reset Clock Output Frequency

CLKout2, LM040x0 50

CLKout2, LM040x1 62

Default output clock frequency

fCLKout-startup MHz

at device power on CLKout2, LM040x2 68

CLKout2, LM040x3 81

LVDS Clock Outputs (CLKoutX)

Maximum Frequency

fCLKout RL= 100 Ω1080 MHz

(38)

CLKoutX to CLKoutY LVDS-LVDS, T = 25 °C,

TSKEW 30 ps

(39) FCLK = 800 MHz, RL= 100 Ω

VOD Differential Output Voltage 250 350 450 mV

Change in Magnitude of VOD R = 100 Ωdifferential

ΔVOD for complementary output -50 50 mV

termination, AC coupled to

states receiver input,

FCLK = 800 MHz,

VOS Output Offset Voltage 1.125 1.25 1.375 V

T = 25 °C

Change in VOS for

ΔVOS 35 |mV|

complementary output states

ISA Output short circuit current - Single-ended output shorted to -24 24 mA

ISB single ended GND, T = 25 °C

Output short circuit current - Complimentary outputs tied

ISAB -12 12 mA

differential together

LVPECL Clock Outputs (CLKoutX) (40)

(38) For Clock output frequencies > 1 GHz, the maximum allowable clock delay is limited to ½ of a period, or, 0.5/FCLKoutX.

(39) Equal loading and identical channel configuration on each channel is required for specification to be valid. Specification not valid for

delay mode.

(40) LVPECL/2VPECL is programmable for all NSIDs.

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

www.ti.com

Electrical Characteristics (continued)

(3.15 V ≤VCC ≤3.45 V, -40 °C ≤TA≤85 °C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA= 25

°C, at the Recommended Operating Conditions at the time of product characterization and are not guaranteed.)

Symbol Parameter Conditions Min Typ Max Units

Maximum Frequency

fCLKout 1080 MHz

(41)

LVPECL-to-LVPECL,

CLKoutX to CLKoutY T = 25 °C, FCLK = 800 MHz,

TSKEW 40 ps

(42) each output terminated with

120 Ωto GND. VCC -

VOH Output High Voltage V

0.93

FCLK = 100 MHz, T = 25 °C

Termination = 50 Ωto VCC -

VOL Output Low Voltage V

VCC - 2 V 1.82

VOD Output Voltage 660 890 965 mV

2VPECL Clock Outputs (CLKoutX)

Maximum Frequency

fCLKout 1080 MHz

(41)

2VPECL-2VPECL, T=25 °C,

CLKoutX to CLKoutY

TSKEW FCLK = 800 MHz, each output 40 ps

(42) terminated with 120 Ωto GND. VCC -

VOH Output High Voltage V

0.95

FCLK = 100 MHz, T = 25 °C

Termination = 50 Ωto VCC -

VOL Output Low Voltage V

VCC - 2 V 1.98

VOD Output Voltage 800 1030 1200 mV

LVCMOS Clock Outputs (CLKoutX)

fCLKout Maximum Frequency 5 pF Load 250 MHz

VOH Output High Voltage 1 mA Load VCC - 0.1 V

VOL Output Low Voltage 1 mA Load 0.1 V

IOH Output High Current (Source) VCC = 3.3 V, VO= 1.65 V 28 mA

IOL Output Low Current (Sink) VCC = 3.3 V, VO= 1.65 V 28 mA

Skew between any two RL= 50 Ω, CL= 10 pF,

TSKEW LVCMOS outputs, same T = 25 °C, FCLK = 100 MHz. 100 ps

channel or different channel (43)

VCC/2 to VCC/2, FCLK = 100

DUTYCLK Output Duty Cycle 45 50 55 %

MHz, T = 25 °C (44)

20% to 80%, RL = 50 Ω,

TROutput Rise Time 400 ps

CL = 5 pF

80% to 20%, RL = 50 Ω,

TFOutput Fall Time 400 ps

CL = 5 pF

Mixed Clock Skew

Same device, T = 25 °C,

LVPECL to LVDS skew -230 ps

250 MHz

Same device, T = 25 °C,

TSKEW ChanX - ChanY LVDS to LVCMOS skew 770 ps

250 MHz

Same device, T = 25 °C,

LVCMOS to LVPECL skew -540 ps

250 MHz

Microwire Interface Timing

TCS Data to Clock Set Up Time See Microwire Input Timing 25 ns

TCH Data to Clock Hold Time See Microwire Input Timing 8 ns

(41) For Clock output frequencies > 1 GHz, the maximum allowable clock delay is limited to ½ of a period, or, 0.5/FCLKoutX.

(42) Equal loading and identical channel configuration on each channel is required for specification to be valid. Specification not valid for

delay mode.

(43) Equal loading and identical channel configuration on each channel is required for specification to be valid. Specification not valid for

delay mode.

(44) Guaranteed by characterization.

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

tCES tCS

D27 D26 D25 D24

tCH tCWH tCWL

D23 D0 A3 A2 A1 A0

MSB LSB

DATAuWire

CLKuWire

LEuWire

tES

tEWH

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

www.ti.com

SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

Electrical Characteristics (continued)

(3.15 V ≤VCC ≤3.45 V, -40 °C ≤TA≤85 °C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA= 25

°C, at the Recommended Operating Conditions at the time of product characterization and are not guaranteed.)

Symbol Parameter Conditions Min Typ Max Units

TCWH Clock Pulse Width High See Microwire Input Timing 25 ns

TCWL Clock Pulse Width Low See Microwire Input Timing 25 ns

Clock to Latch Enable

TES See Microwire Input Timing 25 ns

Set Up Time

TCES Clock to Enable Setup Time See Microwire Input Timing 25 ns

TEW Load Enable Pulse Width See Microwire Input Timing 25 ns

Serial Data Timing Diagram

the CLKuWire signal. On the rising edge of the LEuWire signal, the register is sent from the shift register to the

complete the CLKuWire, DATAuWire, and LEuWire signals should be returned to a low state. If the CLKuWire or

DATAuWire lines are toggled while the VCO is in lock, as is sometimes the case when these lines are shared

with other parts, the phase noise may be degraded during this programming.

Charge Pump Current Specification Definitions

I1 = Charge Pump Sink Current at VCPout = VCC -ΔV

I2 = Charge Pump Sink Current at VCPout = VCC/2

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

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I3 = Charge Pump Sink Current at VCPout =ΔV

I4 = Charge Pump Source Current at VCPout = VCC -ΔV

I5 = Charge Pump Source Current at VCPout = VCC/2

I6 = Charge Pump Source Current at VCPout =ΔV

ΔV = Voltage offset from the positive and negative supply rails. Defined to be 0.5 V for this device.

Charge Pump Output Current Magnitude Variation vs. Charge Pump Output Voltage

Charge Pump Sink Current vs. Charge Pump Output Source Current Mismatch

Charge Pump Output Current Magnitude Variation vs. Temperature

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

FREQUENCY (MHz)

NOISE FLOOR (dBc/Hz)

-130

-135

-140

-145

-150

-155

-160

-165

-170

10 100 1000

Delay = 0 ps

Delay = 450 ps

Delay = 1800 ps

Delay = 900 ps

Delay = 2100 ps

FREQUENCY (MHz)

NOISE FLOOR (dBc/Hz)

-130

-135

-140

-145

-150

-155

-160

-165

-170

10 100 1000

LVCMOS

LVDS (differential)

LVPECL (differential)

FREQUENCY (MHz)

SINGLE-ENDED P-P VOLTAGE (V)

0 100 200 300 400 500

No Load

47 pF Load

22 pF Load

10 pF Load

100 pF Load

FREQUENCY (MHz)

ICC (mA)

0 50 100 150 200 250 300 350 400

FREQUENCY (MHz)

DIFFERENTIAL P-P VOLTAGE (V)

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.00 300 600 900 1.2k 1.5k 1.8k

FREQUENCY (MHz)

DIFFERENTIAL P-P VOLTAGE (V)

2.5

2.0

1.5

1.0

0.5

0.00 400 800 1.2k 1.6k 2k

NORMAL Mode

LV2PECL Mode

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

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SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

Typical Performance Characteristics

Clock Output AC Characteristics

LVDS VOD LVPECL VOD

vs. vs.

Frequency Frequency

Figure 2. Figure 3.

LVCMOS Vpp

vs. Typical Dynamic ICC, LVCMOS Driver, VCC = 3.3 V,

Frequency Temp = 25 °C, CL= 5 pF

Figure 4. Figure 5.

Clock Channel Delay Noise Floor Clock Output Noise Floor

vs. vs.

Frequency Frequency

Figure 6. Figure 7.

To estimate this noise, only the output frequency is required. Divide value and input frequency are not relevant.

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

100 1000 10000 100000

OFFSET (Hz)

-170

-160

-150

-140

-130

-120

-110

-100

-90

-80

dBc

1000000 10000000 100000000

100 1000 10000 100000

OFFSET (Hz)

-170

-160

-150

-140

-130

-120

-110

-100

-90

-80

dBc

1000000 10000000 100000000

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

www.ti.com

Typical Performance Characteristics (continued)

The noise of the delay block is independent of output type and only applies if the delay is enabled. The noise floor,

due to the distribution section accounting for the delay noise, can be calculated as: Total Output Noise = 10 x

log(10Output Buffer Noise/10 + 10Delay Noise Floor/10).

Typical LVDS Phase Noise, FCLK = 250 MHz, RMS Jitter = 192 fs (100 Hz to 20 MHz)

Figure 8.

Typical LVPECL Phase Noise, FCLK = 250 MHz, RMS Jitter = 196 fs (100 Hz to 20 MHz)

Figure 9.

Reference clock = 10 MHz, PLL1_R = 10, PLL1_N = 100, PLL1_CP_GAIN = 100 µA, PLL1 Loop BW = 20 Hz, VCXO

= 100 MHz Crystek CVPD-920-100, PLL2_R = 2, PLL2_N = 10, PLL2_CP_GAIN = 1600 µA, PLL2 Loop BW = 137

kHz, fVCO = 1500 MHz, VCO_DIV = 3, CLKoutX_DIV = 2, CLK_DLY = OFF.

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

100 1000 10000 100000

OFFSET (Hz)

-170

-160

-150

-140

-130

-120

-110

-100

-90

-80

dBc

1000000 10000000 100000000

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

www.ti.com

SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

Typical Performance Characteristics (continued)

Typical LVCMOS Phase Noise, FCLK = 250 MHz, RMS Jitter = 188 fs (100 Hz to 20 MHz)

Figure 10.

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

www.ti.com

FEATURES

System Architecture

The cascaded PLL architecture of the LMK040xx was chosen to provide the lowest jitter performance over the

widest range of output frequencies and phase noise offset frequencies. The first stage PLL (PLL1) is used in

conjunction with an external reference clock and an external VCXO to provide a frequency accurate, low phase

noise reference clock for the second stage frequency multiplication PLL (PLL2). PLL1 typically uses a narrow

loop bandwidth (10 Hz to 200 Hz) to retain the frequency accuracy of the reference clock input signal while at the

same time suppressing the higher offset frequency phase noise that the reference clock may have accumulated

along its path or from other circuits. The “cleaned” reference clock frequency accuracy is combined with the low

phase noise of an external VCXO to provide the reference input to PLL2. The low phase noise reference

provided to PLL2 allows it to use wider loop bandwidths (50 kHz to 200 kHz). The chosen loop bandwidth for

PLL2 should take best advantage of the superior high offset frequency phase noise profile of the internal VCO

and the good low offset frequency phase noise of the reference VCXO for PLL2. Ultra low jitter is achieved by

allowing the external VCXO’s phase noise to dominate the final output phase noise at low offset frequencies and

the internal VCO’s phase noise to dominate the final output phase noise at high offset frequencies. This results in

best overall phase noise and jitter performance.

Redundant Reference Inputs (CLKin0/CLKin0*, CLKin1/CLKin1*)

The LMK040xx has two LVDS/LVPECL/LVCMOS compatible reference clock inputs for PLL1, CLKin0 and

CLKin1. The selection of the preferred input may be fixed to either CLKin0 or CLKin1, or may be configured to

employ one of two automatic switching modes when redundant clock signals are present. The PLL1 reference

clock input buffers may also be individually configured as either a CMOS buffered input or a bipolar buffered

input.

PLL1 CLKinX (X=0,1) LOSS OF SIGNAL (LOS)

When either of the two auto-switching modes is selected for the reference clock input mode, the signal status of

the selected reference clock input is indicated by the state of the CLKinX_LOS (loss-of-signal) output. These

outputs may be configured as either CMOS (active HIGH on loss-of-signal), NMOS open-drain or PMOS open-

drain. If PLL1 was originally locked and then both reference clocks go away, then the frequency accuracy of the

LMK04000 device will be set by the absolute tuning range of the VCXO used on PLL1. The absolute tuning

range of the VCXO can be determined by multiplying its' tuning constant by the charge pump voltage.

Integrated Loop Filter Poles

The LMK040xx features programmable 3rd and 4th order loop filter poles for PLL2. When enabled, internal

resistors and capacitor values may be selected from a fixed range of values to achieve either 3rd or 4th order

loop filter response. These programmable components compliment external components mounted near the chip.

Clock Distribution

The LMK040xx features a clock distribution block with a minimum of five outputs that are a mixture of LVPECL,

2VPECL, LVDS, and LVCMOS. The exact combination is determined by the part number. The 2VPECL is a

National Semiconductor proprietary configuration that produces a 2 Vpp differential swing for compatibility with

many data converters. More than five outputs may be available for device versions that offer dual LVCMOS

outputs.

CLKout Divide (CLKoutX_DIV, X = 0 to 4)

Each individual clock distribution channel includes a channel divider. The range of divide values is 2 to 510, in

steps of 2. “Bypass” mode operates as a divide-by-1.

CLKout Delay (CLKoutX_DLY, X = 0 to 4)

Each individual clock distribution channel includes a delay adjustment. Clock output delay registers

(CLKoutX_DLY) support a nominal 150 ps step size and range from 0 to 2250 ps of total delay.

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

Distribution

Path

SYNC*

CLKout0

CLKout1

CLKout2

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

www.ti.com

SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

Global Clock Output Synchronization (Sync*)

The SYNC* input is used to synchronize the active clock outputs. When SYNC* is held in a logic low state, the

outputs are also held in a logic low state. When SYNC* goes high, the clock outputs are activated and will

transition to a high state simultaneously with one another.

SYNC* must be held low for greater than one clock cycle of the Clock Distribution Path. After this low event has

been registered, the outputs will not reflect the low state for four more cycles. Similarly after SYNC* becomes

high, the outputs will simultaneously transition high after four Clock Distribution Path cycles have passed. See

Figure 11 for further detail.

Figure 11. Clock Output synchronization using the SYNC* pin

Global Output Enable and Lock Detect

Each Clock Output Channel may be either enabled or put into a high impedance state via the Clock Output

Enable control bit (one for each channel). Each output enable control bit is gated with the Global Output Enable

input pin (GOE). The GOE pin provides an internal pull-up so that if it is un-terminated externally, then the clock

output states are determined by the Clock Channel Output Enable Register bits. All clock outputs can be

disabled simultaneously if the GOE pin is pulled low by an external signal.

Table 2. Clock Output Control

CLKoutX EN_CLKout CLKoutX Output State

GOE pin

_EN bit _Global bit

1 1 Low Low

Don't care 0 Don't care Off

0 Don't care Don't care Off

1 1 High / No Connect Enabled

The Lock Detect (LD) signal can be connected to the GOE pin in which case all outputs are disabled

automatically if the synthesizer is not locked. See EN_CLKoutX: Clock Channel Output Enable and also System

Level Diagram for actual implementation details.

The Lock Detect (LD) pin can be programmed to output a ‘High’ when both PLL1 and PLL2 are locked, or only

when PLL1 is locked or only when PLL2 is locked.

FUNCTIONAL DESCRIPTION

Architectural Overview

The LMK040xx chip consists of two high performance synthesizer blocks (Phase Locked Loop, internal

VCO/VCO Divider, and loop filter), source selection, distribution system, and independent clock output channels.

The Phase Frequency Detector in PLL1 compares the divided (R Divider 1) system clock signal from the

selected CLKinX and CLKinX* input with the divided (N Divider 1) output of the external VCXO attached to the

PLL2 OSCin port. The external loop filter for PLL1 should be narrow to provide an ultra clean reference clock

from the external VCXO to the OSCin/OSCin* pins for PLL2.

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

www.ti.com

The Phase Frequency Detector in PLL2 then compares the divided (R Divider 2) reference signal from the PLL2

OSCin port with the divided (N Divider 2 and VCO Divider) output of the internal VCO. The bandwidth of the

external loop filter for PLL2 should be designed to be wide enough to take advantage of the low in-band phase

noise of PLL2 and the low high offset phase noise of the internal VCO. The VCO output is passed through a

common VCO divider block and placed on a distribution path for the clock distribution section. It is also routed to

the PLL2_N counter. Each clock output channel allows the user to select a path with a programmable divider

block, a phase synchronization circuit, a programmable delay, and LVDS/LVPECL/2VPECL/LVCMOS compatible

output buffers.

Phase Detector 1 (PD1)

Phase Detector 1 in PLL1 (PD1) can operate up to 40 MHz. Since a narrow loop bandwidth should be used for

PLL1, the need to operate at high phase detector rate to lower the in-band phase noise becomes unnecessary.

Phase Detector 2 (PD2)

Phase Detector 2 in PLL2 (PD2) supports a maximum comparison rate of 100 MHz, though the actual maximum

frequency at the input port (PLL2 OSCin/OSCin*) is 250 MHz. Operating at highest possible phase detector rate

will ensure low in-band phase noise for PLL2 which in turn produces lower total jitter, as the in-band phase noise

from the reference input and PLL are proportional to N2.

PLL2 Frequency Doubler

The PLL2 reference input at the OSCin port may be optionally routed through a frequency doubler function rather

than through the PLL2_R counter. The maximum phase comparison frequency of the PLL2 phase detector is 100

MHz, so the input to the frequency doubler is limited to a maximum of 50 MHz. The frequency doubler feature

allows the phase comparison frequency to be increased when a relative low frequency oscillator is driving the

OSCin port. By doubling the PLL2 phase comparison frequency, the in-band PLL2 noise is reduced by about 3

dB.

Inputs / Outputs

PLL1 Reference Inputs (CLKin0 / CLKin0*, CLKin1 / CLKin1*)

The reference clock inputs for PLL1 may be selected from either CLKin0 and CLKin1. The user has the capability

to manually select one of the two inputs or to configure an automatic switching mode operation. A detailed

description of this function is described in the uWire programming section of this data sheet.

PLL2 OSCin / OSCin* Port

The feedback from the external oscillator being locked with PLL1 is injected to the PLL2 OSCin/OSCin* pins.

This input may be driven with either a single- ended or differential signal. If operated in single ended mode, the

unused input should be tied to GND with a 0.1 µF capacitor. Either AC or DC coupling is acceptable. Internal to

the chip, this signal is routed to the PLL1_N Counter and to the reference input for PLL2. The internal circuitry of

the OSCin port also supports the optional implementation of a crystal based oscillator circuit. A crystal, varactor

diode and a small number of other external components may be used to implement the oscillator. The internal

oscillator circuit is enabled by setting the EN_PLL2_XTAL bit.

CPout1 / CPout2

The CPout1 pin provides the charge pump current output to drive the loop filter for PLL1. This loop filter should

be configured so that the total loop bandwidth for PLL1 is less than 200 Hz. When combined with an external

oscillator that has low phase noise at offsets close to the carrier, PLL1 generates a reference for PLL2 that is

frequency locked to the PLL1 reference clock but has the phase noise performance of the oscillator. The CPout2

pin provides the charge pump current output to drive the loop filter for PLL2. This loop filter should be configured

so that the total loop bandwidth for PLL2 is in the range of 50 kHz to 200 kHz. See the section on uWire device

control for a description of the charge pump current gain control.

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

tCES tCS

D27 D26 D25 D24

tCH tCWH tCWL

D23 D0 A3 A2 A1 A0

MSB LSB

DATAuWire

CLKuWire

LEuWire

tES

tEWH

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

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SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

Fout

The buffered output of the internal VCO is available at the Fout pin. This is a single-ended output (sinusoid).

Each time the PLL2_N counter value is updated via the uWire interface, an internal algorithm is triggered that

optimizes the VCO performance.

Digital Lock Detect 1 Bypass

The VCO coarse tuning algorithm requires a stable OSCin clock (reference clock to PLL2) to frequency calibrate

the internal VCO correctly. In order to ensure a stable OSCin clock, the first PLL must achieve lock status. A

digital lock detect is used in PLL1 to monitor its lock status. After lock is achieved by PLL1, the coarse tuning

circuitry is enabled and frequency calibration for the internal VCO begins.

The (DLD_BYP) pin is provided to allow an external bypass cap to be connected to the digital lock detect 1. This

capacitor will eliminate potential glitches at initial startup of PLL1 due to unknown phase relationships between

the Ncntr1 and Rcntr1.

Bias

Proper bypassing of this pin by a 1 µF capacitor connected to VCC is important for low noise performance.

General Programming Information

LMK040xx devices are programmed using several 32-bit registers. Each register consists of a 4-bit address field

and 28-bit data field. The address field is formed by bits 0 through 3 (LSBs) and the data field is formed by bits 4

through 31 (MSBs). The contents of each register are clocked in MSB first (bit 31), and the LSB (bit 0) last.

During programming, the LE signal should be held LOW. The serial data is clocked in on the rising edge of the

CLK signal. After the LSB (bit 0) is clocked in the LE signal should be toggled LOW-to-HIGH-to-LOW to latch the

contents into the register selected in the address field. Registers R0-R4, R7, and R8-R15 must be programmed

in order to achieve proper device operation. Figure 12 illustrates the serial data timing sequence.

Figure 12. uWire Timing Diagram

To achieve proper frequency calibration, the OSCin port must be driven with a valid signal before programming

activate the frequency calibration process.

Recommended Programming Sequence

The recommended programming sequence involves programming R7 with the reset bit set to 1 (Reg. 7, bit 4) to

ensure the device is in a default state. If R7 is programmed again, the reset bit should be set to 0. Registers are

programmed in order with R15 being the last register programmed. An example programming sequence is

shown below:

• Program R7 with the RESET bit = 1 (b4 = 1). This ensures that the device is configured with default settings.

When RESET = 1, all other R7 bits are ignored.

– - If R7 is programmed again during the initial configuration of the device, the RESET bit should be cleared

(b4 = 0)

• Program R0 through R4 as necessary to configure the clock outputs as desired. These registers configure

clock channel functions such as the channel multiplexer output selection, divide value, delay value, and

enable/disable bit.

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• Program R5 and R6 with the default values shown in the register map on the following pages.

• Program R7 with RESET = 0.

• Program R8 through R10 with the default values shown in the register map on the following pages.

• Program R11 to configure the reference clock inputs (CLKin0 and CLKin1).

– - type, LOS timeout, LOS type, and mode (manual or auto-switching)

• Program R12 to configure PLL1.

– - Charge pump gain, polarity, R counter and N counter

• Program R13 through R15 to configure PLL2 parameters, crystal mode options, and certain globally asserted

functions.

The following table provides the register map for device programming:

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Table 3. Register Map 31-16

Data [31:16] CLKout0 EN_CLK

R0 0 0 0 0 0 0 0 1 _PECL_ 0 0 0 0 CLKout0_MUX out0

LVL

CLKout1 CLKout1B_STATE CLKout1A_STATE EN_CLK

R1 0 0 0 0 0 0 0 1 _PECL_ CLKout1_MUX [1:0]

[1:0] [1:0] out1

LVL

CLKout2 CLKout2B_STATE CLKout2A_STATE EN_CLK

R2 0 0 0 0 0 0 0 1 _PECL_ CLKout2_MUX [1:0]

[1:0] [1:0] out2

LVL

CLKout3 CLKout3B_STATE CLKout3A_STATE EN_CLK

R3 0 0 0 0 0 0 0 1 _PECL_ CLKout3_MUX [1:0]

[1:0] [1:0] out3

LVL

CLKout4 EN_CLK

R4 0 0 0 0 0 0 0 1 _PECL_ 0 0 0 0 CLKout4_MUX [1:0] out4

LVL

R50000000000000000

R60000100000000000

R70000000000000000

R80000000000000000

R90000000010100010

RC_DLD

R10 0 0 0 0 0 0 1 0 1 0 1 0 0 0 0

1_Start

R110000000001100101

PLL1_C

R12 PLL1_CP_GAIN [2:0] PLL1_R Counter [11:0]

P_POL EN_CLK POWER EN_PLL

EN_PLL out_Glob DOWN,

R13 0 0 0 0 1 0 1 0 0 0 EN_Fout 0 2_REF2

2_XTAL al, default = X

default=1 0

R14 0 0 0 OSCin_FREQ [7:0] PLL_MUX [4:0]

PLL2_CP_GAIN

R15 0 0 0 1 VCO_DIV [3:0] PLL2_N Counter [17:0]

[1:0]

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Data [15:4] A3 A2 A1 A0

R0 CLKout0_DIV [7:0] CLKout0_DLY [3:0] 0 0 0 0

R1 CLKout1_DIV [7:0] CLKout1_DLY [3:0] 0 0 0 1

R2 CLKout2_DIV [7:0] CLKout2_DLY [3:0] 0 0 1 0

R3 CLKout3_DIV [7:0] CLKout3_DLY [3:0] 0 0 1 1

R4 CLKout4_DIV [7:0] CLKout4_DLY [3:0] 0 1 0 0

R50000000000000101

R60000000001110110

R7 0 0 0 0 0 0 0 0 0 0 0 RESET 0 1 1 1

R80000000000001000

R90010101000001001

R100000000000001010

CLKin1_ CLKin0_

R11 0 0 0 0 BUFTYP BUFTYP LOS_TIMEOUT [1:0] LOS_TYPE [1:0] CLKin_SEL [1:0] 1 0 1 1

E E

R12 PLL1_N Counter [11:0] 1 1 0 0

PLL2 CP PLL1 CP

R13 TRI- TRI- PLL2_R4_LF [2:0] PLL2_R3_LF [2:0] PLL2_C3_C4_LF [3:0] 1 1 0 1

STATE STATE

R14 PLL2_R Counter [11:0] 1 1 1 0

R15 PLL2_N Counter [17:0] 1 1 1 1

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Default Device Register Settings After Power On/Reset

Table 4 illustrates the default register settings programmed in silicon for the LMK040xx after power on or

asserting the reset bit.

Table 4. Default Device Register Settings after Power On/Reset

Field Name Default Default State Field Description Register Bit Location

Value (MSB:LSB)

(decimal)

CLKoutX_PECL_LVL 0 2VPECL disabled This bit sets LVPECL clock level. Valid when R0 to R4 23

the clock channel is configured as

LVPECL/2VPECL; otherwise, not relevant.

CLKoutXB_STATE 0 Inverted This field sets the state of output B of an R1 to R3 22:21

LVCMOS Clock channel.

CLKoutXA_STATE 1 Non-Inverted This field sets the state of output A of an R1 to R3 20:19

LVCMOS Clock channel.

EN_CLKoutX 0 OFF Clock Channel enable bit. Note: The state of R0 to R4 16

CLKout2 is ON by default.

Reserved Registers (1) (1) R5,R6,R8 NA

R9,R10

RC_DLD1_Start 1 Enabled Forces the VCO tuning algorithm state R10 29

machine to wait until PLL1 is locked.

CLKin1_BUFTYPE 1 MOS mode CLKin1 Input Buffer Type R11 11

CLKin0_BUFTYPE 1 MOS mode CLKin0 Input Buffer Type R11 10

LOS_TIMEOUT 1 3 MHz (min.) Selects Lower Reference Clock input R11 9:8

frequency for LOS Detection.

LOS_TYPE 3 CMOS Selects LOS output type (2) R11 7:6

CLKin_SEL 0 CLKin0 Selects Reference Clock source R11 5:4

PLL1 CP Polarity 1 Positive polarity Selects the charge pump output polarity, i.e., R12 31

the tuning slope of the external VCXO

PLL1_CP_GAIN 6 100 µA Sets the PLL1 Charge Pump Gain R12 30:28

PLL1_R Counter 1 Divide = 1 Sets divide value for PLL1_R Counter R12 27:16

PLL1_N Counter 1 Divide = 1 Sets divide value for PLL1_N Counter R12 15:4

EN_PLL2_REF2X 0 Disabled Enables or disables the OSCin frequency R13 16

doubler path for the PLL2 reference input

EN_PLL2_XTAL 0 OFF Enables or Disables internal circuits that R13 21

support an external crystal driving the OSCin

pins

EN_Fout 0 OFF Enables or disables the VCO output buffer R13 20

CLK Global Enable 1 Enabled Global enable or disable for output clocks R13 18

POWER DOWN 0 Disabled (device is Device power down control R13 17

active)

PLL2 CP TRI-STATE 0 TRI-STATE Enables or disables TRI-STATE for PLL2 R13 15

disabled Charge Pump

PLL1 CP TRI-STATE 0 TRI-STATE Enables or disables TRI-STATE for PLL1 R13 14

disabled Charge Pump

OSCin_FREQ 200 200 MHz Source frequency driving OSCin port R14 28:21

PLL_MUX 31 Reserved Selects output routed to LD pin R14 20:16

PLL2_R Counter 1 Divide = 1 Sets Divide value for PLL2_R Counter R14 15:4

PLL2_CP_GAIN 2 1600 µA Sets PLL2 Charge Pump Gain R15 27:26

VCO_DIV 2 Divide = 2 Sets divide value for VCO output divider R15 25:22

PLL2_N Counter 1 Divide = 1 Sets PLL2_N Counter value R15 21:4

(1) These registers are reserved. The Power On/Reset values for these registers are shown in the register map and should not be changed

during programming.

(2) If the CLKin_SEL value is set to either [0,0] or [0,1], the LOS_TYPE field should be set to [0,0].

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Registers R0 through R4 control the five clock outputs. Register R0 controls CLKout0, Register R1 controls

CLKout1, and so on. Aside from this, the functions of the bits in these registers are identical. The X in

CLKoutX_MUX, CLKoutX_DIV, CLKoutX_DLY, and CLKoutX_EN denote the actual clock output which may be

from 0 to 4.

CLKoutX_DIV: Clock Channel Divide Registers

Each of the five clock output channels (0 though 4) has a dedicated 8-bit divider followed by a fixed divide by 2

that is used to generate even integer related versions of the distribution path clock frequency (VCO Divider

output). If the VCO Divider value is even then the Channel Divider may be bypassed (See CLK Output Mux),

giving an effective divisor of 1 while preserving a 50% duty cycle output waveform.

Table 5. CLKoutX_DIV: Clock Channel Divide Values

CLKoutX_DIV [ 7:0 ] Total Divide Value

b7 b6 b5 b4 b3 b2 b1 b0

0 0 0 0 0 0 0 0 invalid

0 0 0 0 0 0 0 1 2

0 0 0 0 0 0 1 0 4

0 0 0 0 0 0 1 1 6

0 0 0 0 0 1 0 0 8

0 0 0 0 0 1 0 1 10

- - - - -- - - - -

1 1 1 1 1 1 1 1 510

EN_CLKoutX: Clock Channel Output Enable

Each Clock Output Channel may be either enabled or disabled via the Clock Output Enable control bits. Each

output enable control bit is gated with the Global Output Enable input pin (GOE) and Global Output Enable bit

(EN_CLKout_Global). The GOE pin provides an internal pull-up so that if it is unterminated externally, the clock

output states are determined by the Clock Output Enable Register bits. All clock outputs can be set to the low

state simultaneously if the GOE pin is pulled low by an external signal. If EN_CLKout_Global is programmed to 0

all outputs are turned off. If both GOE and EN_CLKout_Global are low the clock outputs are turned off.

Table 6. EN_CLKoutX: Clock Channel Output Enable Control Bits

BIT NAME BIT = 1 BIT = 0 DEFAULT

EN_CLKout0 ON OFF OFF

EN_CLKout1 ON OFF OFF

EN_CLKout2 ON OFF ON

EN_CLKout3 ON OFF OFF

EN_CLKout4 ON OFF OFF

EN_CLKout_Global According to individual channel All EN_CLKout X = OFF -

settings

Note the default state of CLKout2 is ON after power on or RESET assertion. The nominal frequency is 62 MHz

(LMK040x1) or 81 MHz (LMK040x3). This is based on a channel divide value of 12 and default VCO_DIV value

of 2. If an active CLKout2 at power on is inappropriate for the user’s application, the following method can be

employed to shut off CLKout2 during system initialization:

When the device is powered on, holding the GOE pin LOW will disable all clock outputs. The device can be

programmed while the GOE is held LOW. The state of CLKout2 can be altered during device programming

according to the user’s specific application needs. After device configuration is complete, the GOE pin should

be set HIGH to enable the active clock channels.

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CLKoutX_DLY: Clock Channel Phase Delay Adjustment

Each output channel has an output delay register that can be used to introduce a lag relative to the distribution

path frequency (VCO Divider output). These registers support a 150 ps stepsize and range from 0 to 2.25 ns of

total delay. When the channel phase delay registers are enabled, a nominal fixed delay of 300 ps of delay is

incurred in addition to the programmed delay. The Channel Phase Delay Adjustment Registers are 4 bits wide

and are programmed as follows:

Table 7. CLKoutX_DLY: Clock Channel Delay Control Bit Values

CLKoutX_DLY [ 3:0 ] DELAY (ps)

b3 b2 b1 b0

00000

0 0 0 1 150

0 0 1 0 300

0 0 1 1 450

0 1 0 0 600

0 1 0 1 750

0 1 1 0 900

0 1 1 1 1050

1 0 0 0 1200

1 0 0 1 1350

1 0 1 0 1500

1 0 1 1 1650

1 1 0 0 1800

1 1 0 1 1950

1 1 1 0 2100

1 1 1 1 2250

CLKoutX/CLKoutX* LVCMOS Mode Control

For clock outputs that are configured as LVCMOS, the LVCMOS CLKoutX/CLKoutX* outputs can be

independently configured by uWire CLKoutXA_STATE and CLKoutXB_STATE bits. The following choices are

available for LVCMOS outputs:

Table 8. CLKoutXA_STATE, CLKoutXB_STATE Control Bits for LVCMOS Modes

CLKoutXA_STATE CLKoutXB_STATE LVCMOS Modes

b1 b0 b1 b0

0 0 0 0 Inverted

0 1 0 1 Normal

1 0 1 0 Low

1 1 1 1 TRI-STATE

CLKoutX/CLKoutX* LVPECL Mode Control

Clock outputs designated as LVPECL can be configured in one of two possible output levels. The default mode

is the common LVPECL swing of 800 mVp-p single-ended (1.6 Vp-p differential). A second mode, 2VPECL, can

be enabled in which the swing is increased to 1000 mVp-p single-ended (2 Vp-p differential).

Table 9. LVPECL Output Format Control

CLKoutX_PECL_LVL Output Format

0 LVPECL (800 mVpp)

1 2VPECL (1000 mVpp)

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X ÀFOSCin

(VCO_DIV À CLK_DIV)

FCLK error = À

FOSCin

(VCO_DIV À CLK_DIV)

FCLK = À

LMK04000, LMK04001, LMK04002, LMK04010

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CLKoutX_MUX: Clock Output Mux

The output of each CLKoutX channel pair is controlled by its' channel multiplexer (mux). The mux can select

between several signals: bypassed, divided only, divided and delayed, or delayed only.

Table 10. CLKoutX_MUX: Clock Channel Multiplexer Control Bits

CLKout_MUX [1:0] Clock Mode

b1 b0

0 0 Bypassed

0 1 Divided

1 0 Delayed

1 1 Divided and Delayed

Registers 5, 6

These registers are reserved. These register values should not be modified from the values shown in the register

map.

Reset bit

This bit is only in register R7. The use of this bit is optional and it should be set to '0' if not used. Setting this bit

to a '1' forces all registers to their power on reset condition and therefore automatically clears this bit.

Registers 8, 9

These registers are reserved. These register values should not be modified from the values shown in the register

map.

RC_DLD1_Start: PLL1 Digital Lock Detect Run Control bit

This bit is used to control the state machine for the PLL2 VCO tuning algorithm. The following table describes the

function of this bit.

Table 11. RC_DLD1_Start bit States

RC_DLD1_Start Description

1 The PLL2 VCO tuning algorithm trigger is delayed until PLL1 Digital Lock Detect is valid.

0 The PLL2 VCO tuning algorithm runs immediately after any PLL2_N counter update, despite the state of PLL1

Digital Lock Detect.

If the user is unsure of the state of the reference clock input at startup of the LMK040xx device, setting

RC_DLD1_Start = 0 will allow PLL2 to tune and lock the internal VCO to the oscillator attached to the OSCin

port. This ensures that the active clock outputs will start up at frequencies close to their desired values. The error

in clock output frequency will depend on the open loop accuracy of the oscillator driving the OSCin port. The

frequency of an active clock output is normally given by:

If the open loop frequency accuracy of the external oscillator (either a VCXO or crystal based oscillator) is "X"

ppm, then the error in the output clock frequency (FCLK error) will be:

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Setting this bit to 0 does not prevent PLL1 from locking the external oscillator to the reference clock input after

the latter input becomes valid.

CLKinX_BUFTYPE: PLL1 CLKinX/CLKinX* Buffer Mode Control

The user may choose between one of two input buffer modes for the PLL1 reference clock inputs: either bipolar

junction differential or MOS. Both CLKinX and CLKinX* input pins must be AC coupled when driven differentially.

In single ended mode, the CLKinX* pin must be coupled to ground through a capacitor. The active CLKinX buffer

mode is selected by the CLKinX_TYPE bits programmed via the uWire interface.

Table 12. PLL1 CLKinX_BUFTYPE Mode Control Bits

b1 b0 CLKin1_TYPE CLKin0_TYPE

0 0 BJT Differential BJT Differential

0 1 BJT Differential MOS

1 0 MOS BJT Differential

1 1 MOS MOS

CLKin_SEL: PLL1 Reference Clock Selection and Revertive Mode Control Bits

This register allows the user to set the reference clock input that is used to lock PLL1, or to select an auto-

switching mode. The automatic switching modes are revertive or non-revertive. In either revertive or non-

revertive mode, CLKin0 is the initial default reference source for the auto-switching mode. When revertive mode

is active, the switching control logic will always select CLKin0 as the reference if it is active, otherwise it selects

CLKin1. When non-revertive mode is active, the switching logic will only switch the reference input if the currently

selected input fails.

Table 13 illustrates the control modes. Modes [1,0] and [1,1] are the auto-switching modes. The behavior of both

modes is tied to the state of the LOS signals for the respective reference clock inputs.

If the reference clock inputs are active prior to configuration of the device, then the normal programming

sequence described under General Programming Information can be used without modification. If it cannot be

guaranteed that the reference clocks are active prior to device programming, then the device programming

sequence should be modified in order to ensure that CLKin0 is selected as the default. Under this scenario, the

device should be programmed as described in General Programming Information, with CLKin_SEL bits

programmed to [0,0] in register R11. The other R11 fields for clock type and LOS timeout should be programmed

with the appropriate values for the given application. After the reference clock inputs have started, register R11

should be programmed a second time with the CLKin_SEL field modified to the set the desired mode. The clock

type field and LOS field values should remain the same.

Table 13. CLKin_SEL: Reference Clock Selection Bits

CLKin_SEL [1:0] Function

b1 b0

0 0 Force CLKin0 / CLKin0* as PLL1 reference

0 1 Force CLKin1 / CLKin1* as PLL1 reference

1 0 Non-revertive. Auto-switching. CLKin0 is the default reference clock. If CLKin0 fails, CLKin1

is automatically selected if active. If CLKin0 restarts, CLKin1 remains as the selected

reference clock unless it fails, then CLKin0 is re-selected.

1 1 Revertive. Auto-switching. CLKin0 is the preferred reference clock and is selected when

active.

CLKinX_LOS

The CLKin0_LOS and CLKin1_LOS pins indicate the state of the respective PLL1 CLKinX reference input when

the CLKin_SEL bits are set set to either [1,0] or [1,1]. The detection logic that determines the state of the

reference inputs is sensitive to the frequency of the reference inputs and must be configured to operate with the

appropriate frequency range of the reference inputs, as described in the next section.

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PLL1 Reference Clock LOS Timeout Control

This register is used to tune the LOS timeout based upon the frequency of the reference clock input(s). The

LOS_TIMEOUT register represents the minimum input frequency for which loss of signal can be detected. For

example, if the reference input frequency is 12.288 MHz, then either register values (0,0) or (0,1) will result in

valid loss of signal detection. If the reference input frequency is 1 MHz, then only the register value (0,0) will

result in valid detection of signal loss.

Table 14. Reference Clock LOS Timeout Control Bits

b1 b0 Corresponding Minimum Input Frequency

0 0 1 MHz

0 1 3.0 MHz

1 0 13 MHz

1 1 32 MHz

LOS Output Type Control

The output format of the LOS pins may be selected as active CMOS, open drain NMOS and open drain PMOS,

as shown in the following table.

Table 15. Loss of Signal (LOS) Output Pin Format Type

LOS_TYPE [1:0] Functional Description

b1 b0

0 0 Reserved

0 1 NMOS open drain

1 0 PMOS open drain

1 1 Active CMOS

The LOS output signal is valid only when CLKin_SEL bits are set to either [1,0] or [1,1]. If the CLKin_SEL field is

programmed to either of the fixed inputs, [0,0] or [0,1], the LOS_TYPE bits should be set to [0,0].

PLL1_N: PLL1_N Counter

The size of the PLL1_N counter is 12 bits. This counter will support a maximum divide ratio of 4095 and

minimum divide ratio of 1. The 12 bit resolution is sufficient to support minimum phase detector frequency

resolution of approximately 50 kHz when the VCXO frequency is 200 MHz.

For a 200 MHz external VCXO, the minimum phase detector rate will be PDmin = 200 MHz/4095 = 48.84 kHz

Table 16. PLL1_N Counter Values

N [17:0] VALUE

b11 b10 ... b6 b5 b4 b3 b2 b1 b0

0 0 0 0 0 0 0 0 0 Not Valid

0 0 0 0 0 0 0 0 1 1

0 0 0 0 0 0 0 1 0 2

. . . . . . . ...

1 1 1 4095

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PLL1_R: PLL1_R Counter

The size of the PLL1_R counter is 12 bits. This counter will support a maximum divide ratio of 4095 and

minimum divide ratio of 1.

Table 17. PLL1_R Counter Values

R [11:0] VALUE

b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1 b0

0 0 0 0 0 0 0 0 0 0 0 0 Not Valid

0 0 0 0 0 0 0 0 0 0 0 1 1

. . . . . . . . . . . . ...

1 1 1 1 1 1 1 1 1 1 1 1 4095

PLL1 Charge Pump Current Gain (PLL1_CP_GAIN) and Polarity Control (PLL1_CP_POL)

The Loop Band Width (LBW) on PLL1 should be narrow to suppress the noise from the system or input clocks at

CLKinX/CLKinX* port. This configuration allows the noise of the external VCXO to dominate at low offset

frequencies. Given that the noise of the external VCXO is far superior than the noise of PLL1, this setting

produces a very clean reference clock to PLL2 at the OSCin port.

In order to achieve a LBW as low as 10 Hz at the supported VCXO frequency (1 MHz to 200 MHz), a range of

charge pump currents in PLL1 is provided. The table below shows the available current gains. A small charge

pump current is required to obtain a narrow LBW at high phase detector rate (small N value).

Table 18. PLL1 Charge Pump Current Selections (PLL1_CP_GAIN)

PLL1_CP_GAIN [2:0] PLL1 Charge Pump Current Magnitude (µA)

b2 b1 b0

0 0 0 RESERVED

0 0 1 RESERVED

0 1 0 20

0 1 1 80

1 0 0 25

1 0 1 50

1 1 0 100

1 1 1 400

The PLL1_CP_POL bit sets the PLL1 charge pump for operation with a positive or negative slope VCO/VCXO. A

positive slope VCO/VCXO increases frequency with increased tuning voltage. A negative slope VCO/VCXO

increases frequency with decreased tuning voltage.

Table 19. PLL1 Charge Pump Polarity Control Bits (PLL1_CP_POL)

PLL1_CP_POL DESCRIPTION

0 Negative Slope VCO/VCXO

1 Positive Slope VCO/VCXO

EN_PLL2_XTAL: Crystal Oscillator Option Enable

If an external crystal is being used to implement a discrete VCXO, the internal feedback amplifier must be

enabled in order to complete the oscillator circuit.

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Table 20. EN_PLL2_XTAL: External Crystal Option

EN_PLL2_XTAL Oscillator Amplifier State

0 OFF

1 ON

EN_Fout: Fout Power Down Bit

The EN_Fout bit allows the Fout port to be enabled or disabled. By default EN_Fout = 0.

CLK Global Enable: Clock Global enable bit

In addition to the external GOE pin, an internal Register 13 bit (b18) can be used to globally enable/disable the

clock outputs via the uWire programming interface. The default value is 1. When CLK Global Enable = 1, the

active output clocks are enabled. The active output clocks are disabled if this bit is 0.

POWERDOWN Bit -- Device Power Down

This bit can power down the entire device. Enabling this bit powers down the entire device and all functional

blocks, regardless of the state of any of the other bits or pins.

Table 21. Power Down Bit Values

POWERDOWN Bit Mode

0 Normal Operation

1 Entire device powered down

EN_PLL2 REF2X: PLL2 Frequency Doubler control bit

When FOSCin is below 50 MHz, the PLL2 frequency doubler can be enabled by setting EN_PLL2_REF2X = 1. The

default value is 0. When EN_PLL2_REF2X = 1, the signal at the OSCin port bypasses the PLL2_R counter and

is passed through a frequency doubler circuit. The output of this circuit is then input to the PLL2 phase

comparator block. This feature allows the phase comparison frequency to be increased for lower frequency

OSCin sources (< 50 MHz), and can be used with either VXCOs or crystals. For instance, when using a pullable

crystal of 12.288 MHz to drive the OSCin port, the PLL2 phase comparison frequency is 24.576 MHz when

EN_PLL2_REF2X = 1. A higher PLL phase comparison frequency reduces PLL2 in-band phase noise and RMS

jitter. The PLL in-band phase noise can be reduced by approximately 2 to 3 dB. The on-chip loop filter typically is

enabled to reduce PLL2 reference spurs when EN_PLL2_REF2X is enabled. Suggested values in this case are:

R3 = 600 Ω,C3=50pF,R4=10kΩ, C4 = 60 pF.

PLL2 Internal Loop Filter Component Values

Internal loop filter components are available for PLL2, enabling the user to implement either 3rd or 4th order loop

filters without requiring external components. The user may select from a fixed set of values for both the resistors

and capacitors. Internal loop filter resistance values for R3 and R4 can be set individually according to Table 22

and Table 23.

Table 22. PLL2 Internal Loop Filter Resistor Values, PLL2_R3_LF

PLL2_R3_LF [2:0] RESISTANCE

b2 b1 b0

0 0 0 < 600 Ω

0 0 1 10 kΩ

0 1 0 20 kΩ

0 1 1 30 kΩ

1 0 0 40 kΩ

1 0 1 Invalid

1 1 0 Invalid

1 1 1 Invalid

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Table 23. PLL2 Internal Loop Filter Resistor Values, PLL2_R4_LF

PLL2_R4_LF [2:0] RESISTANCE

b2 b1 b0

0 0 0 < 200 Ω

0 0 1 10 kΩ

0 1 0 20 kΩ

0 1 1 30 kΩ

1 0 0 40 kΩ

1 0 1 Invalid

1 1 0 Invalid

1 1 1 Invalid

Internal loop filter capacitors for C3 and C4 can be set individually according to the following table.

Table 24. PLL2 Internal Loop Filter Capacitor Values

PLL2_C3_C4_LF [3:0] Loop Filter Capacitance(pF)

b3 b2 b1 b0

0 0 0 0 C3 = 0, C4 = 10

0 0 0 1 C3 = 0, C4 = 60

0 0 1 0 C3 = 50, C4 = 10

0 0 1 1 C3 = 0, C4 = 110

0 1 0 0 C3 = 50, C4 = 110

0 1 0 1 C3 = 100, C4 = 110

0 1 1 0 C3 = 0, C4 = 160

0 1 1 1 C3 = 50, C4 = 160

1 0 0 0 C3 = 100, C4 = 10

1 0 0 1 C3 = 100, C4 = 60

1 0 1 0 C3 = 150, C4 = 110

1 0 1 1 C3 = 150, C4 = 60

1 1 0 0 Reserved

1 1 0 1 Reserved

1 1 1 0 Reserved

1 1 1 1 Reserved

PLL1 CP TRI-STATE and PLL2 CP TRI-STATE

The charge pump output of either CPout1 or CPout2 may be placed in a TRI-STATE mode by setting the

appropriate PLLx CP TRI-STATE bit.

Table 25. PLL1 Charge Pump TRI-STATE bit values

PLL1 CP TRI-STATE Description

1 PLL1 CPout1 is at TRI-STATE

0 PLL1 CPout1 is active

Table 26. PLL2 Charge Pump TRI-STATE bit values

PLL2 CP TRI-STATE Description

1 PLL2 CPout2 is at TRI-STATE

0 PLL2 CPout2 is active

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OSCin_FREQ: PLL2 Oscillator Input Frequency Register

The frequency of the PLL2 reference input to the PLL2 Phase Detector (OSCin/OSCin* port) must be

programmed in order to support proper operation of the internal VCO tuning algorithm. This is an 8-bit register

that sets the frequency to the nearest 1-MHz increment.

Table 27. OSCin_FREQ Register Values

OSCin_FREQ [7:0] VALUE

b7 b6 b5 b4 b3 b2 b1 b0

0 0 0 0 0 0 0 0 Not Valid

0 0 0 0 0 0 0 1 1 MHz

0 0 0 0 0 0 1 0 2 MHz

. . . . . . . ...

1 1 1 1 1 0 1 0 250 MHz

1 1 0 0 1 0 0 1 Not Valid

. . . . . . . . .

1 1 1 1 1 1 1 1 Not Valid

PLL2_R: PLL2_R Counter

The PLL2 R Counter is 12 bits wide. It divides the PLL2 OSCin/OSCin* clock and is connected to the PLL2

Phase Detector.

Table 28. PLL2_R: PLL2_R Counter Values

R [11:0] VALUE

b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1 b0

0 0 0 0 0 0 0 0 0 0 0 0 Not Valid

0 0 0 0 0 0 0 0 0 0 0 1 1

. . . . . . . . . . ...

1 1 1 1 1 1 1 1 1 1 1 1 4095

PLL_MUX: LD Pin Selectable Output

The signal appearing on the LD pin is programmable via the uWire interface and provides access to several

internal signals which may be valuable for either status monitoring during normal operation or for debugging

during the hardware development phase. This pin may be forced to either a HIGH or LOW state, and may also

be configured as specified in Table 29.

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Table 29. PLL_MUX: LD Pin Selectable Outputs

PLL_MUX [4:0] LD Output

b4 b3 b2 b1 b0

0 0 0 0 0 HiZ

0 0 0 0 1 Logic High

0 0 0 1 0 Logic Low

0 0 0 1 1 PLL2 Digital Lock Detect Active High

0 0 1 0 0 PLL2 Digital Lock Detect Active Low

0 0 1 0 1 PLL2 Analog Lock Detect Push Pull

0 0 1 1 0 PLL2 Analog Lock Detect Open Drain NMOS

0 0 1 1 1 PLL2 Analog Lock Detect Open Drain PMOS

0 1 0 0 0 Reserved

0 1 0 0 1 PLL2_N Divider Output / 2

0 1 0 1 0 Reserved

0 1 0 1 1 PLL2_R Divider Output / 2

0 1 1 0 0 Reserved

0 1 1 0 1 Reserved

0 1 1 1 0 PLL1 Digital Lock Detect Active HIGH

0 1 1 1 1 PLL1 Digital Lock Detect Active LOW

1 0 0 0 0 Reserved

1 0 0 0 1 Reserved

1 0 0 1 0 Reserved

1 0 0 1 1 Reserved

1 0 1 0 0 PLL1_N Divider Output / 2

1 0 1 0 1 Reserved

1 0 1 1 0 PLL1_R Divider Output / 2

1 0 1 1 1 PLL1 and PLL2 Digital Lock Detect

1 1 0 0 0 Inverted PLL1 and PLL2 Digital Lock Detect

1 1 0 0 1 Reserved

1 1 0 1 0 Reserved

1 1 0 1 1 Reserved

1 1 1 0 0 Reserved

1 1 1 0 1 Reserved

1 1 1 1 0 Reserved

1 1 1 1 1 Reserved

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PLL2_N: PLL2_N Counter

The PLL2_N Counter is 18 bits wide. It divides the output of the VCO Divider and is connected to the PLL2

Phase Detector. Each time the PLL2_N Counter value is updated via the uWire interface, an internal algorithm is

triggered that optimizes the VCO performance.

Table 30. PLL2_N: PLL2_N Counter Values

N [17:0] VALUE

b17 b16 ... b6 b5 b4 b3 b2 b1 b0

0 0 ... 0 0 0 0 0 0 0 Not Valid

0 0 0 0 0 0 0 0 1 1

0 0 0 0 0 0 0 1 0 2

. . . . . . . ...

1 1 1 1 1 1 1 1 1 262143

PLL2_CP_GAIN: PLL2 Charge Pump Current and Output Control

The PLL2 charge pump output current level is controlled with the PLL2_CP_GAIN register. The following table

presents the charge pump current control values.

Table 31. PLL2_CP_GAIN: PLL2 Charge Pump Current Selections

PLL2_CP_GAIN [1:0] CP_TRI Charge Pump Current (µA)

b1 b0

X X 1 Hi-Z

0 0 0 100

0 1 0 400

1 0 0 1600

1 1 0 3200

VCO_DIV: PLL2 VCO Divide Register

A divider is provided on the output of the PLL2 VCO to enable a wide range of output clock frequencies. The

output of this divider is placed on the input path for the clock distribution section, which feeds each of the

individual clock channels. The divider provides integer divide ratios from 2 to 8.

Table 32. VCO_DIV: PLL2 VCO Divider Values

VCO_DIV [3:0] Divide Value

b3 b2 b1 b0

0 0 0 0 Invalid

0 0 0 1 Invalid

00102

00113

01004

01015

01106

01117

10008

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

CPout1

LEuWire

CLKuWire

DATAuWire

GOE

(optional)

To Host

CLKout0

CLKout0*

CLKout1*

CLKout1

CLKout2B

CLKout2A

CLKout3*

CLKout3

CLKout4*

CLKout4

System

SYNC*

CLKin0

CLKin0*

Bias

Vcc

LDObyp1

LDObyp2

10 PF0.1 PF

1 PF

0.1 PF

LMK040xx

100Ö

VCXO

OSCin

OSCin*

100 Ö

0.1 uF

CLKin1*

CLKin1

0.1 PF

System

To Host

CPout2

100 pF100 pF

System Fout

Reference Clock #1

(Primary)

Reference Clock #2

(Secondary)

PLL1 Loop Filter

PLL2 Loop Filter

Rterm

0.1 PF

120Ö

System

51Ö

0.1 PF

120Ö

System

0.47 PF

DLD_BYP

33 pF

0.1 PF

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

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APPLICATION INFORMATION

System Level Diagram

The following diagram illustrates the typical interconnection of the LMK040xx in a clocking application.

Figure 13. Typical Application

Figure 13 shows an LMK04000 family device with external circuitry. The primary reference clock input is at

CLKin0/0*. A secondary reference clock is driving CLKin1/1*. Both clocks are depicted as AC coupled differential

drivers. The VCXO attached to the OSCin/OSCin* port is configured as an AC coupled single-ended driver. Any

of the input ports (CLKin0/0*, CLKin1/1*, or OSCin/OSCin*) may be configured as either differential or single-

ended. These options are discussed later in the data sheet.

The diagram shows an optional connection between the LD pin and GOE. With this arrangement, the LD pin can

be programmed to output a lock detect signal that is active HIGH (see Table 29 for optional LD pin outputs). If

lock is lost, the LD pin will transition to a LOW, pulling GOE low and causing all clock outputs to be disabled.

This scheme should be used only if disabling the clock outputs is desirable when lock is lost.

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The loop filter for PLL2 consists of three external components that implement two lower order poles, plus optional

internal integrated components if 3rd or 4th order poles are needed. The loop filter components for PLL1 must be

external components.

The VCO output buffer signal that appears at the Fout pin when enabled (EN_Fout = 1) should be AC coupled

using a 100 pF capacitor. This output is a single-ended signal by default. If a differential signal is required, a 50

Ωbalun may be connected to this pin to convert it to differential.

The clock outputs are all AC coupled with 0.1 µF capacitors. CLKout1 and CLKout3 are depicted as LVPECL,

with 120 Ωemitter resistors as source termination. However, the output format of the clock channels will vary by

device part number, so the designer should use the appropriate source termination for each channel. Later

sections of this data sheet illustrate alternative methods for AC coupling, DC coupling and terminating the clock

outputs.

LDO Bypass And Bias Pin

The LDObyp1 and LDObyp2 pins should be connected to GND through external capacitors, as shown in the

diagram. Furthermore, the Bias pin should be connected to VCC through a 1 µF capacitor in series.

Loop Filter

Each PLL of the LMK04000 family requires a dedicated loop filter. The loop filter for PLL1 must be connected to

the CPout1 pin. Figure 14 shows a simple 2-pole loop filter. The output of the filter drives an external VCXO

module or discrete implementation of a VCXO using a crystal resonator. Higher order loop filters may be

implemented using additional external R and C components. It is recommended the loop filter for PLL1 result in a

total closed loop bandwidth in the range of 10 Hz to 200 Hz. The design of the loop filter is application specific

and highly dependent on parameters such as the phase noise of the reference clock, VCXO phase noise, and

phase detector frequency for PLL1. National’s Clock Conditioner Owner’s Manual covers this topic in detail and

National’s Clock Design Tool can be used to simulate loop filter designs for both PLLs. These resources may be

found: http://www.national.com/timing/.

As shown in the diagram, the charge pump for PLL2 is directly connected to the optional internal loop filter

components, which are normally used only if either a third or fourth pole is needed. The first and second poles

are implemented with external components. The loop must be designed to be stable over the entire application-

specific tuning range of the VCO. The designer should note the range of KVCO listed in the table of Electrical

Characteristics and how this value can change over the expected range of VCO tuning frequencies. Because

loop bandwidth is directly proportional to KVCO, the designer should model and simulate the loop at the expected

extremes of the desired tuning range, using the appropriate values for KVCO.

When designing with the integrated loop filter of the LMK04000 family, considerations for minimum resistor

thermal noise often lead one to the decision to design for the minimum value for integrated resistors, R3 and R4.

Both the integrated loop filter resistors and capacitors (C3 and C4) also restrict the maximum loop bandwidth.

However, these integrated components do have the advantage that they are closer to the VCO and can therefore

filter out some noise and spurs better than external components. For this reason, a common strategy is to

minimize the internal loop filter resistors and then design for the largest internal capacitor values that permit a

wide enough loop bandwidth. In situations where spurs requirements are very stringent and there is margin on

phase noise, it might make sense to design for a loop filter with integrated resistor values larger than their

minimum value.

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

PLL2

Phase

Detector

R2 C1

C3 C4

R3 R4

LMK040xx

PLL2 Internal Loop Filter

PLL2 External Loop

Filter

PLL1

Phase

Detector

CPout1

LMK040xx

PLL1 External Loop

Filter

CPout2

External VCXO

Internal VCO

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

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Figure 14. Loop Filter

Table 33. Typical Current Consumption for Selected Functional Blocks

Power

Typical ICC Power Dissipated in

(Temp = 25 °C, Dissipated in LVPECL/2VPECL

Block Condition VCC = 3.3 V) device Emitter

(mA) (mW) Resistors

(mW)

Single input clock (CLKIN_SEL = 0 or 1); LOS disabled;

Entire device, PLL1 and PLL2 locked; All CLKouts are off; No LVPECL 115 380 -

core current emitter resistors connected

REFMUX Enable auto-switch mode (CLKIN_SEL = 2 or 3) 4.3 14 -

LOS Enable LOS (LOS_TYPE = 1, or 2, or 3) 3.6 12 -

Low Channel The low channel internal buffer is enabled when CLKout0 is 10 33 -

Internal Buffer enabled

High Channel The high channel internal buffer is enabled when one of 10 33 -

Internal Buffer CLKout1 through CLKout4 is enabled

Divider bypassed (CLKout_MUX = 0, 2) 0 0 -

Divide circuitry Divider enabled, divide = 2 (CLKout_MUX = 1, 3) 5.3 17 -

per output Divider enabled, divide > 2 (CLKout_MUX = 1, 3) 8.5 28 -

Delay bypassed (CLKout_MUX = 0, 1) 0 0 -

Delay circuitry per Delay enabled, delay < 8 (CLKout_MUX = 2, 3) 5.8 19 -

output Delay enabled, delay > 7 (CLKout_MUX = 2, 3) 9.9 33 -

Fout Buffer EN_Fout = 1 14.5 48 -

LVDS Buffer LVDS buffer, enabled 19.3 64 -

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Table 33. Typical Current Consumption for Selected Functional Blocks (continued)

Power

Typical ICC Power Dissipated in

(Temp = 25 °C, Dissipated in LVPECL/2VPECL

Block Condition VCC = 3.3 V) device Emitter

(mA) (mW) Resistors

(mW)

LVPECL/2VPECL buffer (enabled and with 120 Ωemitter 40 82 50

resistors)

LVPECL/2VPECL LVPECL/2VPECL buffer (disabled and with 120 Ωemitter

Buffer 21.7 47 25

resistors)

LVPECL/2VPECL (disabled and with no emitter resistors) 0 0 -

LVCMOS buffer static ICC, CL= 5 pF 4.5 15 -

LVCMOS Buffer LVCMOS buffer dynamic ICC, CL= 5 pF, CLKout = 100

(1) 16 53 -

MHz

Entire device LMK0400x (2) (3) 379.5 1102 150

(Single input clock LMK0401x (2) (3) 377.5 996 250

(CLKIN_SEL = 0 LMK0403x (2) (3)

or 1); LOS

disabled; PLL1

and PLL2 locked;

Fout disabled; All 337.1 1012 100

CLKouts are on;

No delay); Divide

> 2 on each

output.

(1) Dynamic power dissipation of LVCMOS buffer varies with output frequency and can be found in the LVCMOS dynamic ICC vs frequency

plot, as shown in Typical Performance Characteristics. Total power dissipation of the LVCMOS buffer is the sum of static and dynamic

power dissipation. CLKoutXa and CLKoutXb are each considered an LVCMOS buffer.

(2) Assuming ThetaJ = 27.4 °C/W, the total power dissipated on chip must be less than 40/27.4 = 1450 mW to guarantee a junction

temperature is less than 125 °C.

(3) Worst case power dissipation can be estimated by multiplying typical power dissipation with a factor of 1.2.

Current Consumption / Power Dissipation Calculations

Due to the myriad of possible configurations the following table serves to provide enough information to allow the

user to calculate estimated current consumption of the device. Unless otherwise noted VCC = 3.3 V, TA= 25 °C.

From Table 33 the current consumption can be calculated in any configuration. For example, the current for the

entire device with 1 LVDS (CLKout0) & 1 LVPECL (CLKout1) output in bypassed mode can be calculated by

adding up the following blocks: core current, clock buffer, one LVDS output buffer current, and one LVPECL

output buffer current. There will also be one LVPECL output drawing emitter current, but some of the power from

the current draw is dissipated in the external 120 Ωresistors which doesn't add to the power dissipation budget

for the device. If delays or divides are switched in, then the additional current for these stages needs to be added

as well.

For power dissipated by the device, the total current entering the device is multiplied by the voltage at the device

minus the power dissipated in any emitter resistors connected to any of the LVPECL outputs. If no emitter

resistors are connected to the LVPECL outputs, this power will be 0 watts. For example, in the case of 1 LVDS

(CLKout0) & 1 LVPECL (CLKout1) operating at 3.3 V, we calculate 3.3 V × (115 + 10 + 10 + 19.3 + 40) mA = 3.3

V × 194.3 mA = 641.2 mW. Because the LVPECL output (CLKout1) has the emitter resistors hooked up and the

power dissipated by these resistors is 50 mW, the total device power dissipation is 641.2 mW - 50 mW = 591.2

mW.

When the LVPECL output is active, ~1.7 V is the average voltage on each output as calculated from the LVPECL

VOH & VOL typical specification. Therefore the power dissipated in each emitter resistor is approximately (1.7 V)2/

120 Ω= 25 mW. When the LVPECL output is disabled, the emitter resistor voltage is ~1.07 V. Therefore the

power dissipated in each emitter resistor is approximately (1.07 V)2/ 120 Ω= 9.5 mW.

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

0.33 mm, typ

1.2 mm, typ

5.0 mm, min

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

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Power Supply Conditioning

The recommended technique for power supply management is to connect the power pins for the clock outputs

(pins 13, 37, 40, 43, and 46) to a dedicated power plane and connect all other power pins on the device (pins 3,

8, 18, 19, 22, 24, 30, 31, and 33) to a second power plane. Note: the LMK04000 family has internal voltage

regulators for the PLL and VCO blocks to provide noise immunity.

Thermal Management

Power consumption of the LMK04000 family of devices can be high enough to require attention to thermal

management. For reliability and performance reasons the die temperature should be limited to a maximum of

125 °C. That is, as an estimate, TA(ambient temperature) plus device power consumption times θJA should not

exceed 125 °C.

The package of the device has an exposed pad that provides the primary heat removal path as well as excellent

electrical grounding to a printed circuit board. To maximize the removal of heat from the package a thermal land

pattern including multiple vias to a ground plane must be incorporated on the PCB within the footprint of the

package. The exposed pad must be soldered down to ensure adequate heat conduction out of the package. A

recommended land and via pattern is shown in Figure 15. More information on soldering WQFN packages can

be obtained: http://www.national.com/analog/packaging/.

Figure 15. Recommended Land and Via Pattern

To minimize junction temperature it is recommended that a simple heat sink be built into the PCB (if the ground

plane layer is not exposed). This is done by including a copper area of about 2 square inches on the opposite

side of the PCB from the device. This copper area may be plated or solder coated to prevent corrosion but

should not have conformal coating (if possible), which could provide thermal insulation. The vias shown in

Figure 15 should connect these top and bottom copper layers and to the ground layer. These vias act as “heat

pipes” to carry the thermal energy away from the device side of the board to where it can be more effectively

dissipated.

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

CL = 6 + 6 + 4= 14 pF

CSTRAY

CL = CTUNE + CIN +

CPout1

LMK040xx

OSCin

OSCin*

Copt

PLL1 Loop Filter

XTAL

CC1 = 2.2 nF

CC2 = 2.2 nF

R1 = 4.7k

R3 = 10k

Copt

1 nF

R2 = 4.7k

SMV1249-074LF

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

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Figure 16. Reference Design Circuit for Crystal Oscillator Option

Optional Crystal Oscillator Implementation (OSCin/OSCin*)

The LMK04000 family features supporting circuitry for a discretely implemented oscillator driving the OSCin port

pins. Figure 16 illustrates a reference design circuit for a crystal oscillator:

This circuit topology represents a parallel resonant mode oscillator design. When selecting a crystal for parallel

resonance, the total load capacitance, CL, must be specified. The load capacitance is the sum of the tuning

capacitance (CTUNE), the capacitance seen looking into the OSCin port (CIN), and stray capacitance due to PCB

parasitics (CSTRAY), and is given by:

CTUNE is provided by the varactor diode shown in Figure 16, Skyworks model SMV1249-074. A dual diode

package with common cathode and provides the variable capacitance for tuning. The single diode capacitance

ranges from approximately 31 pF at 0.3 V to 3.4 pF at 3 V. The capacitance range of the dual package (anode to

anode) is approximately 15.5 pF at 3 V to 1.7 pF at 0.3 V. The desired value of VTUNE applied to the diode should

be VCC/2, or 1.65 V for VCC = 3.3 V. The typical performance curve from the data sheet for the SMV1249-074

indicates that the capacitance at this voltage is approximately 6 pF (12 pF/2).

The nominal input capacitance (CIN) of the LMK04000 family OSCin pins is 6 pF. The stray capacitance (CSTRAY)

of the PCB should be minimized by arranging the oscillator circuit layout to achieve trace lengths as short as

possible and as narrow as possible trace width (50 Ωcharacteristic impedance is not required). As an example,

assume that CSTRAY is 4 pF. The total load capacitance is nominally:

Consequently the load capacitance specification for the crystal in this case should be nominally 14 pF.

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

(C0 + CL1)-1

(C0 + CL2)=2

1À

FFCL1

FCL1 - FCL2 =2À

'FC0

C1¸

§CL2

C1¸

§CL1

2(C0 + CL1)+ 1 C0

C1¸

§CL

1+ 1

FL = FS À = FS À

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

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The 2.2 nF capacitors shown in the circuit are coupling capacitors that block the DC tuning voltage applied by the

4.7 k and 10 k resistors. The value of these coupling capacitors should be large, relative to the value of CTUNE

(CC1 = CC2 >> CTUNE), so that CTUNE becomes the dominant capacitance.

For a specific value of CL, the corresponding resonant frequency (FL) of the parallel resonant mode circuit is:

FS= Series resonant frequency

C1= Motional capacitance of the crystal

CL= Load capacitance

C0= Shunt capacitance of the crystal, specified on the crystal datasheet

The normalized tuning range of the circuit is closely approximated by:

CL1, CL2 = The endpoints of the circuit’s load capacitance range, assuming a variable capacitance element is one

component of the load. FCL1, FCL2 = parallel resonant frequencies at the extremes of the circuit’s load

capacitance range.

A common range for the pullability ratio, C0/C1, is 250 to 280. The ratio of the load capacitance to the shunt

capacitance is ~(n * 1000), n < 10. Hence, picking a crystal with a smaller pullability ratio supports a wider tuning

range because this allows the scale factors related to the load capacitance to dominate.

Examples of the phase noise and jitter performance of the LMK04031 with a crystal oscillator are shown in

Table 34. This table illustrates the clock output phase noise when a 12.288 MHz crystal is paired with PLL1.

Table 34. Example RMS Jitter and Clock Output Phase Noise for LMK04031 with a

12.288 MHz Crystal Driving OSCin (T = 25 °C, VCC = 3.3 V) (1)

RMS Jitter (ps)

Integration Bandwidth Clock Output Type PLL2 PDF = 12.288 MHz PLL2 PDF = 24.576 MHz

(EN_PLL2_REF2X = 0) (EN_PLL2_REF2X = 1)

FCLK = 122.88 MHz FCLK = 153.6 MHz FCLK = 122.88 MHz

100 Hz – 20 MHz LVPECL 0.279 0.263 0.300

LVCMOS 0.244 0.248 0.218

LVDS 0.272 0.269 0.245

10 kHz – 20 MHz LVPECL 0.251 0.234 0.284

LVCMOS 0.211 0.215 0.193

LVDS 0.236 0.235 0.217

Phase Noise (dBc/Hz)

Offset Clock Output Type PLL2 FPD = 12.288 MHz PLL2 FPD = 24.576 MHz

(EN_PLL2_REF2X = 0) (EN_PLL2_REF2X = 1)

FCLK = 122.88 MHz FCLK = 153.6 MHz FCLK = 122.88 MHz

100 Hz LVPECL -107 -106 -106

LVCMOS -105 -103 -104

LVDS -105 -104 -106

(1) Performance data and crystal specifications contained in this section are based on Ecliptek model ECX-6465, 12.288 MHz.

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

VTUNE (VDC)

ppm

180

140

100

-20

-60

-100

-140

-180

0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

www.ti.com

Table 34. Example RMS Jitter and Clock Output Phase Noise for LMK04031 with a

12.288 MHz Crystal Driving OSCin (T = 25 °C, VCC = 3.3 V) (1) (continued)

1 kHz LVPECL -126 -124 -130

LVCMOS -125 -124 -127

LVDS -126 -123 -126

10 kHz LVPECL -125 -124 -131

LVCMOS -127 -125 -128

LVDS -126 -124 -131

100 kHz LVPECL -134 -133 -134

LVCMOS -135 -133 -134

LVDS -134 -132 -134

1 MHz LVPECL -155 -154 -154

LVCMOS -157 -155 -155

LVDS -155 -153 -154

10 MHz LVPECL -158 -158 -158

LVCMOS -160 -159 -159

LVDS -158 -158 -157

Example crystal specifications are presented in Table 35.

Table 35. Example Crystal Specifications

Parameter Value

Nominal Frequency (MHz) 12.288

Frequency Stability, T = 25 °C ± 10 ppm

Operating temperature range -40 °C to +85 °C

Frequency Stability, -40 °C to +85 °C ± 15 ppm

Load Capacitance 14 pF

Shunt Capacitance (C0) 5 pF Maximum

Motional Capacitance (C1) 20 fF ± 30%

Equivalent Series Resistance 25 ΩMaximum

Drive level 2 mWatts Maximum

C0/C1ratio 225 typical, 250 Maximum

See Figure 17 for a representative tuning curve.

Figure 17. Example Tuning Curve, 12.288 MHz Crystal

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

= 0.00164, MHz

(2.03 - 0.814) À 106

12.288 À 81.4 - (-81.4)

( )

'V À 106

FNOM À ('ppm2 - 'ppm1)

KVCO =

= 0.00164 MHz

2.03 - 0.814

0.001 - (-0.001)

KVCO = 'F

'V,MHz

=¸

§'F2 - 'F1

VTUNE2 - VTUNE1

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

www.ti.com

SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

The tuning curve achieved in the user's application may differ from the curve shown above due to differences in

PCB layout and component selection.

This data is measured on the bench with the crystal integrated with the LMK04000 family. Using a voltmeter to

monitor the VTUNE node for the crystal, the PLL1 reference clock input frequency is swept in frequency and the

resulting tuning voltage generated by PLL1 is measured at each frequency. At each value of the reference clock

frequency, the lock state of PLL1 should be monitored to ensure that the tuning voltage applied to the crystal is

valid.

The curve shows over the tuning voltage range of 0.17 VDC to 3.0 VDC, the frequency range is ± 163 ppm; or

equivalently, a crystal frequency range of ± 2000 Hz. The measured tuning voltage at the nominal crystal

frequency (12.288 MHz) is 1.4 V. Using the diode data sheet tuning characteristics, this voltage results in a

tuning capacitance of approximately 6.5 pF.

The tuning curve data can be used to calculate the gain of the oscillator (KVCO). The data used in the calculations

is taken from the most linear portion of the curve, a region centered on the crossover point at the nominal

frequency (12.288 MHz). For a well designed circuit, this is the most likely operating range. In this case, the

tuning range used for the calculations is ± 1000 Hz (± 0.001 MHz), or ± 81.4 ppm. The simplest method is to

calculate the ratio:

ΔF2 and ΔF1 are in units of MHz. Using data from the curve this becomes:

A second method uses the tuning data in units of ppm:

FNOM is the nominal frequency of the crystal and is in units of MHz. Using the data, this becomes:

In order to ensure startup of the oscillator circuit, the equivalent series resistance (ESR) of the selected crystal

should conform to the specifications listed in the table of Electrical Characteristics. It is also important to select a

crystal with adequate power dissipation capability, or drive level. If the drive level supplied by the oscillator

exceeds the maximum specified by the crystal manufacturer, the crystal will undergo excessive aging and

possibly become damaged. Drive level is directly proportional to resonant frequency, capacitive load seen by the

crystal, voltage and equivalent series resistance (ESR). For more complete coverage of crystal oscillator design,

see Application Note AN-1939 at http://www.national.com/analog/timing/clocking or

http://www.national.com/appnotes.

Termination and use of Clock Output (Drivers)

When terminating clock drivers keep in mind these guidelines for optimum phase noise and jitter performance:

• Transmission line theory should be followed for good impedance matching to prevent reflections.

• Clock drivers should be presented with the proper loads. For example:

– LVDS drivers are current drivers and require a closed current loop.

– LVPECL drivers are open emitters and require a DC path to ground.

• Receivers should be presented with a signal biased to their specified DC bias level (common mode voltage)

for proper operation. Some receivers have self-biasing inputs that automatically bias to the proper voltage

level. In this case, the signal should normally be AC coupled.

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

CLKoutX

CLKoutX*

LVPECL

Receiver

120:

100:Trace

(Differential)

120:

Vcc

LVPECL

Driver

82:82:

CLKoutX

CLKoutX*

LVPECL

Receiver

50:

100:Trace

(Differential)

50:

Vcc - 2 V

LVPECL

Driver

CLKoutX

CLKoutX*

LVDS

Receiver

100:

100:Trace

(Differential)

LVDS

Driver

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

www.ti.com

It is possible to drive a non-LVPECL or non-LVDS receiver with an LVDS or LVPECL driver as long as the above

guidelines are followed. Check the datasheet of the receiver or input being driven to determine the best

termination and coupling method to be sure that the receiver is biased at its optimum DC voltage (common mode

voltage). For example, when driving the OSCin/OSCin* input of the LMK04000 family, OSCin/OSCin* should be

AC coupled because OSCin/OSCin* biases the signal to the proper DC level (See Figure 13) This is only slightly

different from the AC coupled cases described in Driving CLKin Pins with a Single-Ended Source because the

DC blocking capacitors are placed between the termination and the OSCin/OSCin* pins, but the concept remains

the same. The receiver (OSCin/OSCin*) sets the input to the optimum DC bias voltage (common mode voltage),

not the driver.

Termination for DC Coupled Differential Operation

For DC coupled operation of an LVDS driver, terminate with 100 Ωas close as possible to the LVDS receiver as

shown in Figure 18.

Figure 18. Differential LVDS Operation, DC Coupling, No Biasing of the Receiver

For DC coupled operation of an LVPECL driver, terminate with 50 Ωto VCC - 2 V as shown in Figure 19.

Alternatively terminate with a Thevenin equivalent circuit (120 Ωresistor connected to VCC and an 82 Ωresistor

connected to ground with the driver connected to the junction of the 120 Ωand 82 Ωresistors) as shown in

Figure 20 for VCC = 3.3 V.

Figure 19. Differential LVPECL Operation, DC Coupling

Figure 20. Differential LVPECL Operation, DC Coupling, Thevenin Equivalent

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

CLKoutX

CLKoutX*

120:120:

0.1 PF

0.1 PFLVPECL

Receiver

100:Trace

(Differential)

LVPECL

Driver

82:

120:

Vcc

82:

120:

Vcc

0.1 PF

LVDS

Receiver

100:Trace

(Differential)

LVDS

Driver

100:

CLKoutX

CLKoutX*

0.1 PF

LVDS

Receiver

50:

100:Trace

(Differential)

LVDS

Driver

50:

Vbias

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

www.ti.com

SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

Termination for AC Coupled Differential Operation

AC coupling allows for shifting the DC bias level (common mode voltage) when driving different receiver

standards. Since AC coupling prevents the driver from providing a DC bias voltage at the receiver it is important

to ensure the receiver is biased to its ideal DC level.

When driving non-biased LVDS receivers with an LVDS driver, the signal may be AC coupled by adding DC

blocking capacitors, however the proper DC bias point needs to be established at the receiver. One way to do

this is with the termination circuitry in Figure 21.

Figure 21. Differential LVDS Operation, AC Coupling, External Biasing at the Receiver

Some LVDS receivers may have internal biasing on the inputs. In this case, the circuit shown in Figure 21 is

modified by replacing the 50 Ωterminations to Vbias with a single 100 Ωresistor across the input pins of the

receiver, as shown in Figure 22. When using AC coupling with LVDS outputs, there may be a startup delay

observed in the clock output due to capacitor charging. The previous figures employ a 0.1 µF capacitor. This

value may need to be adjusted to meet the startup requirements for a particular application.

Figure 22. LVDS Termination for a Self-Biased Receiver

LVPECL drivers require a DC path to ground. When AC coupling an LVPECL signal use 120 Ωemitter resistors

close to the LVPECL driver to provide a DC path to ground as shown in Figure 23. For proper receiver operation,

the signal should be biased to the DC bias level (common mode voltage) specified by the receiver. The typical

DC bias voltage for LVPECL receivers is 2 V. A Thevenin equivalent circuit (82 Ωresistor connected to VCC and

a 120 Ωresistor connected to ground with the driver connected to the junction of the 82 Ωand 120 Ωresistors) is

a valid termination as shown in Figure 23 for VCC = 3.3 V. Note this Thevenin circuit is different from the DC

coupled example in Figure 20.

Figure 23. Differential LVPECL Operation, AC Coupling, Thevenin Equivalent, External Biasing at the

Receiver

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

CLKoutX

CLKoutX*

120:

0.1 PF

50:Trace

50:

Load

50:

LVPECL

Driver

CLKoutX

CLKoutX*

50:Trace

120:

Load

Vcc

82:

120:

Vcc

LVPECL

Driver

CLKoutX

CLKoutX* 50:

50:Trace

50:

Load

Vcc - 2V

LVPECL

Driver

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

www.ti.com

Termination for Single-Ended Operation

A balun can be used with either LVDS or LVPECL drivers to convert the balanced, differential signal into an

unbalanced, single-ended signal.

It is possible to use an LVPECL driver as one or two separate 800 mVpp signals. When using only one LVPECL

driver of a CLKoutX/CLKoutX* pair, be sure to properly terminated the unused driver. When DC coupling one of

the LMK04000 family clock LVPECL drivers, the termination should be 50 Ωto VCC - 2 V as shown in Figure 24.

The Thevenin equivalent circuit is also a valid termination as shown in Figure 25 for Vcc = 3.3 V.

Figure 24. Single-Ended LVPECL Operation, DC Coupling

Figure 25. Single-Ended LVPECL Operation, DC Coupling, Thevenin Equivalent

When AC coupling an LVPECL driver use a 120 Ωemitter resistor to provide a DC path to ground and ensure a

50 Ωtermination with the proper DC bias level for the receiver. The typical DC bias voltage for LVPECL

receivers is 2 V (See Driving CLKin Pins with a Single-Ended Source). If the companion driver is not used it

should be terminated with either a proper AC or DC termination. This latter example of AC coupling a single-

ended LVPECL signal can be used to measure single-ended LVPECL performance using a spectrum analyzer or

phase noise analyzer. When using most RF test equipment no DC bias point (0 VDC) is required for safe and

proper operation. The internal 50 Ωtermination of the test equipment correctly terminates the LVPECL driver

being measured as shown in Figure 26.

Figure 26. Single-Ended LVPECL Operation, AC Coupling

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

0.1 PF

0.1 PFLMK040XX

Input

100:

100:Trace

(Differential)

Differential

Sinewave Clock

Source

CLKinX

CLKinX*

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

www.ti.com

SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

DRIVING CLKin AND OSCin INPUTS

Driving CLKin Pins with a Differential Source

Both CLKin ports can be driven by differential signals. It is recommended that the input mode be set to bipolar

(CLKinX_TYPE = 0) when using differential reference clocks. The LMK04000 family internally biases the input

pins so the differential interface should be AC coupled. The recommended circuits for driving the CLKin pins with

either LVDS or LVPECL are shown in Figure 27 and Figure 28.

Figure 27. CLKinX/X* Termination for an LVDS Reference Clock Source

Figure 28. CLKinX/X* Termination for an LVPECL Reference Clock Source

Finally, a reference clock source that produces a differential sinewave output can drive the CLKin pins using the

following circuit. Note: the signal level must conform to the requirements for the CLKin pins listed in the Electrical

Characteristics table.

Figure 29. CLKinX/X* Termination for a Differential Sinewave Reference Clock Source

Driving CLKin Pins with a Single-Ended Source

The CLKin pins of the LMK04000 family can be driven using a single-ended reference clock source, for example,

either a sinewave source or an LVCMOS/LVTTL source. Either AC coupling or DC coupling may be used. In the

case of the sinewave source that is expecting a 50 Ωload, it is recommended that AC coupling be used as

shown in the circuit below with a 50 Ωtermination..

NOTE

The signal level must conform to the requirements for the CLKin pins listed in the

Electrical Characteristics table. CLKinX_TYPE in Register 11 is recommended to be set to

bipolar mode (CLKinX_TYPE = 0).

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

0.1 PF

50:Trace

50:

LMK040XX

Clock Source

CLKinX

CLKinX*

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

www.ti.com

Figure 30. CLKinX/X* Single-ended Termination

If the CLKin pins are being driven with a single-ended LVCMOS/LVTTL source, either DC coupling or AC

coupling may be used. If DC coupling is used, the CLKinX_TYPE should be set to MOS buffer mode

(CLKinX_TYPE = 1) and the voltage swing of the source must meet the specifications for DC coupled, MOS-

mode clock inputs given in the table of Electrical Characteristics. If AC coupling is used, the CLKinX_TYPE

should be set to the bipolar buffer mode (CLKinX_TYPE = 0). The voltage swing at the input pins must meet the

specifications for AC coupled, bipolar mode clock inputs given in the table of Electrical Characteristics. In this

case, some attenuation of the clock input level may be required. A simple resistive divider circuit before the AC

coupling capacitor is sufficient.

Figure 31. DC Coupled LVCMOS/LVTTL Reference Clock

Additional Outputs with an LMK04000 Family Device

The number of outputs on a LMK04000 family device can be expanded in many ways. The first method is to use

the differential outputs as two single-ended outputs. For CMOS outputs, both the positive and negative outputs

can be programmed to be in phase, or 180 degrees out of phase. LVDS/LVPECL positive and negative outputs

are always 180 degrees out of phase. LVDS single-ended is not recommended.

In addition to this technique, the number of outputs can be expanded with a LMK01000 family device. To do this,

one of the clock outputs of a LMK04000 can drive the LMK01000 device.

For more information on phase synchronization with multiple devices, please refer to application note AN-1864:

http://www.national.com/an/AN/AN-1864.pdf.

Output Clock Phase Noise Performance VS. VCXO Phase Noise

The jitter cleaning capability of the LMK04000 family is highly dependent on the phase noise performance of the

VCXO (or crystal) that is integrated with PLL1. The VCXO is the reference for PLL2 which provides the clock for

the output distribution path. Consequently, the designer must choose a VCXO (or crystal) that supports the

required performance at the clock outputs.

An example of the difference in performance that can be obtained from various VCXOs is illustrated in the

following plots. Figure 32 compares the phase noise of two different VCXOs: VCXO “A” and VCXO “B”. Both

VCXOs have a center frequency of 100 MHz. The figure of merit, RMS jitter, is measured over the bandwidth

100 Hz to 200 kHz. This is the most relevant integration bandwidth for the VCXO because it will have the most

impact inside the loop bandwidth of PLL2.

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

100 1000 10000 100000

OFFSET (Hz)

-170

-160

-150

-140

-130

-120

-110

-100

-90

-80

dBc

1000000 10000000 100000000

syK^_, RMS jitter = 224 fs

syK^_, RMS jitter = 167 fs

100 1000 10000 100000

OFFSET (Hz)

-170

-160

-150

-140

-130

-120

-110

-100

-90

-180

dBc

1000000 10000000 100000000

syK^_

syK^_

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

www.ti.com

SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

Figure 32. VCXO Phase Noise Comparison, 100 MHz

This plot shows that VCXO “B” exhibits superior phase noise when compared to VCXO “A”. Both VCXOs offer

excellent jitter performance from 100 Hz to 200 kHz. VCXO “A” exhibits RMS jitter of 151 femtoseconds (fs),

while VCXO “B” has RMS jitter of 90 fs.

Figure 33 Figure 34 Figure 35 present a side-by-side comparison of clock output phase noise at 250 MHz,

organized by output format and associated VCXO. The total RMS jitter listed on the plots is integrated from 100

Hz to 20 MHz. Examining these plots, the clock output phase noise associated with VCXO “B” is superior in all

cases. The average improvement in RMS jitter due to VCXO “B” is approximately 47 fs. The plots show the

primary difference in clock output phase noise is in the band from 100 Hz to approximately 4 kHz. Across this

range, the VCXO phase noise dominates that of the PLL, given the loop bandwidth of this design, which is 152

kHz. Above 4 kHz, the PLL noise dominates (inside the loop bandwidth), so it is basically the same for either

VCXO. Comparing the jitter of two VCXOs in the 100 Hz to 4 kHz band, it can be shown that VCXO “A” exhibits

jitter of 142 fs, and VCXO “B” exhibits jitter of 90 fs. The difference, 52 fs, accounts for the majority of the

average difference in RMS jitter at the clock outputs when comparing VCXOs.

The PLL configurations listed below were the same for both VCXOs/LMK040xx pair:

• PLL1 loop filter components: C1 = 100 nF, C2 = 680 nF, R2 = 39 kΩ

• PLL1 fPD = 1 MHz, CP gain = 100 µA, loop BW = 20 Hz

• PLL2 loop filter components: C1 = 0, C2 = 12 nF, R2 = 1.8 kΩ

• PLL2 fPD = 25 MHz, CP gain = 3200 µA, loop BW = 152 kHz

Figure 33. LVDS Clock Output Phase Noise Comparison, 250 MHz

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

100 1000 10000 100000

OFFSET (Hz)

-170

-160

-150

-140

-130

-120

-110

-100

-90

-80

dBc

1000000 10000000 100000000

syK^_, RMS jitter = 209 fs

syK^_, RMS jitter = 166 fs

100 1000 10000 100000

OFFSET (Hz)

-170

-160

-150

-140

-130

-120

-110

-100

-90

-80

dBc

1000000 10000000 100000000

syK^_, RMS jitter = 211 fs

syK^_, RMS jitter = 171 fs

LMK04000, LMK04001, LMK04002, LMK04010

LMK04011, LMK04031, LMK04033

SNOSAZ8J –SEPTEMBER 2008–REVISED SEPTEMBER 2011

www.ti.com

Figure 34. LVPECL Clock Output Phase Noise Comparison, 250 MHz

Figure 35. LVCMOS Clock Output Phase Noise Comparison, 250 MHz

Product Folder Links: LMK04000 LMK04001 LMK04002 LMK04010 LMK04011 LMK04031 LMK04033

PACKAGE OPTION ADDENDUM

www.ti.com 11-Apr-2013

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

(3)

Op Temp (°C) Top-Side Markings

(4)

Samples

LMK04000BISQ/NOPB ACTIVE WQFN RHS 48 1000 Green (RoHS

& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K04000BI

LMK04000BISQE/NOPB ACTIVE WQFN RHS 48 250 Green (RoHS

& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K04000BI

LMK04000BISQX/NOPB ACTIVE WQFN RHS 48 2500 Green (RoHS

& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K04000BI

LMK04001BISQ/NOPB ACTIVE WQFN RHS 48 1000 Green (RoHS

& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K04001BI

LMK04001BISQE/NOPB ACTIVE WQFN RHS 48 250 Green (RoHS

& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K04001BI

LMK04001BISQX/NOPB ACTIVE WQFN RHS 48 2500 Green (RoHS

& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K04001BI

LMK04002BISQ/NOPB ACTIVE WQFN RHS 48 1000 Green (RoHS

& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K04002BI

LMK04002BISQE/NOPB ACTIVE WQFN RHS 48 250 Green (RoHS

& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K04002BI

LMK04002BISQX/NOPB ACTIVE WQFN RHS 48 2500 Green (RoHS

& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K04002BI

LMK04010BISQ/NOPB ACTIVE WQFN RHS 48 1000 Green (RoHS

& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K04010BI

LMK04010BISQE/NOPB ACTIVE WQFN RHS 48 250 Green (RoHS

& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K04010BI

LMK04010BISQX/NOPB ACTIVE WQFN RHS 48 2500 Green (RoHS

& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K04010BI

LMK04011BISQ/NOPB ACTIVE WQFN RHS 48 1000 Green (RoHS

& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K04011BI

LMK04011BISQE/NOPB ACTIVE WQFN RHS 48 250 Green (RoHS

& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K04011BI

LMK04011BISQX/NOPB ACTIVE WQFN RHS 48 2500 Green (RoHS

& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K04011BI

LMK04031BISQ/NOPB ACTIVE WQFN RHS 48 1000 Green (RoHS

& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K04031BI

LMK04031BISQE/NOPB ACTIVE WQFN RHS 48 250 Green (RoHS

& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K04031BI

PACKAGE OPTION ADDENDUM

www.ti.com 11-Apr-2013

Addendum-Page 2

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

(3)

Op Temp (°C) Top-Side Markings

(4)

Samples

LMK04031BISQX/NOPB ACTIVE WQFN RHS 48 2500 Green (RoHS

& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K04031BI

LMK04033BISQ/NOPB ACTIVE WQFN RHS 48 1000 Green (RoHS

& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K04033BI

LMK04033BISQE/NOPB ACTIVE WQFN RHS 48 250 Green (RoHS

& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K04033BI

LMK04033BISQX/NOPB ACTIVE WQFN RHS 48 2500 Green (RoHS

& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K04033BI

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a

continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

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TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LMK04000BISQ/NOPB WQFN RHS 48 1000 330.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1

LMK04000BISQE/NOPB WQFN RHS 48 250 178.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1

LMK04000BISQX/NOPB WQFN RHS 48 2500 330.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1

LMK04001BISQ/NOPB WQFN RHS 48 1000 330.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1

LMK04001BISQE/NOPB WQFN RHS 48 250 178.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1

LMK04001BISQX/NOPB WQFN RHS 48 2500 330.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1

LMK04002BISQ/NOPB WQFN RHS 48 1000 330.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1

LMK04002BISQE/NOPB WQFN RHS 48 250 178.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1

LMK04002BISQX/NOPB WQFN RHS 48 2500 330.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1

LMK04010BISQ/NOPB WQFN RHS 48 1000 330.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1

LMK04010BISQE/NOPB WQFN RHS 48 250 178.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1

LMK04010BISQX/NOPB WQFN RHS 48 2500 330.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1

LMK04011BISQ/NOPB WQFN RHS 48 1000 330.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1

LMK04011BISQE/NOPB WQFN RHS 48 250 178.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1

LMK04011BISQX/NOPB WQFN RHS 48 2500 330.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1

LMK04031BISQ/NOPB WQFN RHS 48 1000 330.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1

LMK04031BISQE/NOPB WQFN RHS 48 250 178.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1

LMK04031BISQX/NOPB WQFN RHS 48 2500 330.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 20-Sep-2016

Pack Materials-Page 1

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LMK04033BISQ/NOPB WQFN RHS 48 1000 330.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1

LMK04033BISQE/NOPB WQFN RHS 48 250 178.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1

LMK04033BISQX/NOPB WQFN RHS 48 2500 330.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LMK04000BISQ/NOPB WQFN RHS 48 1000 367.0 367.0 38.0

LMK04000BISQE/NOPB WQFN RHS 48 250 210.0 185.0 35.0

LMK04000BISQX/NOPB WQFN RHS 48 2500 367.0 367.0 38.0

LMK04001BISQ/NOPB WQFN RHS 48 1000 367.0 367.0 38.0

LMK04001BISQE/NOPB WQFN RHS 48 250 210.0 185.0 35.0

LMK04001BISQX/NOPB WQFN RHS 48 2500 367.0 367.0 38.0

LMK04002BISQ/NOPB WQFN RHS 48 1000 367.0 367.0 38.0

LMK04002BISQE/NOPB WQFN RHS 48 250 210.0 185.0 35.0

LMK04002BISQX/NOPB WQFN RHS 48 2500 367.0 367.0 38.0

LMK04010BISQ/NOPB WQFN RHS 48 1000 367.0 367.0 38.0

LMK04010BISQE/NOPB WQFN RHS 48 250 210.0 185.0 35.0

LMK04010BISQX/NOPB WQFN RHS 48 2500 367.0 367.0 38.0

LMK04011BISQ/NOPB WQFN RHS 48 1000 367.0 367.0 38.0

LMK04011BISQE/NOPB WQFN RHS 48 250 210.0 185.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 20-Sep-2016

Pack Materials-Page 2

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LMK04011BISQX/NOPB WQFN RHS 48 2500 367.0 367.0 38.0

LMK04031BISQ/NOPB WQFN RHS 48 1000 367.0 367.0 38.0

LMK04031BISQE/NOPB WQFN RHS 48 250 210.0 185.0 35.0

LMK04031BISQX/NOPB WQFN RHS 48 2500 367.0 367.0 38.0

LMK04033BISQ/NOPB WQFN RHS 48 1000 367.0 367.0 38.0

LMK04033BISQE/NOPB WQFN RHS 48 250 210.0 185.0 35.0

LMK04033BISQX/NOPB WQFN RHS 48 2500 367.0 367.0 38.0

PACKAGE MATERIALS INFORMATION

www.ti.com 20-Sep-2016

Pack Materials-Page 3

www.ti.com

PACKAGE OUTLINE

SEE TERMINAL

DETAIL

48X 0.30

0.18

5.1 0.1

48X 0.5

0.3

0.8

0.7

(A) TYP

0.05

0.00

44X 0.5

5.5

2X 5.5

A7.15

6.85 B

7.15

6.85

0.30

0.18

0.5

0.3

(0.2)

WQFN - 0.8 mm max heightRHS0048A

PLASTIC QUAD FLATPACK - NO LEAD

4214990/B 04/2018

DIM A

OPT 1 OPT 2

(0.1) (0.2)

PIN 1 INDEX AREA

0.08 C

SEATING PLANE

12 25

13 24

48 37

(OPTIONAL)

PIN 1 ID 0.1 C A B

0.05

EXPOSED

THERMAL PAD

49 SYMM

SYMM

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 1.800

DETAIL

OPTIONAL TERMINAL

TYPICAL

www.ti.com

EXAMPLE BOARD LAYOUT

0.07 MIN

ALL AROUND

0.07 MAX

ALL AROUND

48X (0.25)

48X (0.6)

( 0.2) TYP

VIA

44X (0.5)

(6.8)

(1.25) TYP

( 5.1)

(R0.05)

TYP

(1.25)

TYP

(1.05) TYP

(1.05)

TYP

WQFN - 0.8 mm max heightRHS0048A

PLASTIC QUAD FLATPACK - NO LEAD

4214990/B 04/2018

SYMM

13 24

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:12X

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

DEFINED

EXPOSED

METAL

METAL EDGE

SOLDER MASK

OPENING

SOLDER MASK DETAILS

NON SOLDER MASK

DEFINED

(PREFERRED)

EXPOSED

METAL

www.ti.com

EXAMPLE STENCIL DESIGN

48X (0.6)

48X (0.25)

44X (0.5)

(6.8)

16X

( 1.05)

(0.625) TYP

(R0.05) TYP

(1.25)

TYP

(1.25)

TYP

(0.625) TYP

WQFN - 0.8 mm max heightRHS0048A

PLASTIC QUAD FLATPACK - NO LEAD

4214990/B 04/2018

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

SYMM

METAL

TYP

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

EXPOSED PAD 49

68% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE

SCALE:15X

SYMM

13 24

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LMK04011BISQ/NOPB LMK04011BISQE/NOPB LMK04011BISQX/NOPB