RT9193
1
DS9193-12 February 2009 www.richtek.com
300mA, Ultra-Low Noise, Ultra-Fast CMOS LDO Regulator
Marking Information
For marking information, contact our sales representative
directly or through a Richtek distributor located in your
area, otherwise visit our website for detail.
Ordering Information
General Description
The RT9193 is designed for portable RF and wireless
applications with demanding performance and space
requirements. The RT9193 performance is optimized for
battery-powered systems to deliver ultra low noise and
low quiescent current. A noise bypass pin is available for
further reduction of output noise. Regulator ground current
increases only slightly in dropout, further prolonging the
battery life. The RT9193 also works with low-ESR ceramic
capacitors, reducing the amount of board space necessary
for power applications, critical in hand-held wireless
devices. The RT9193 consumes less than 0.01μA in
shutdown mode and has fast turn-on time less than 50μs.
The other features include ultra low dropout voltage, high
output accuracy, current limiting protection, and high ripple
rejection ratio. Available in the SC-70-5, SOT-23-5,
TSOT-23-5, WDFN-6L 2x2 and MSOP-8 packages.
Features
zz
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zUltra Low Noise for RF Application
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zUltra Fast Response in Line/Load Transient
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zQuick Start-Up (T ypically 50us)
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z< 0.01uA Standby Current When Shutdown
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zLow Dropout : 220mV @ 300mA
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zWide Operating Voltage Ranges : 2.5V to 5.5V
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zTTL-Logic-Controlled Shutdown Input
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zLow Temperature Coefficient
zz
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zCurrent Limiting Protection
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zThermal Shutdown Protection
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zOnly 1μμ
μμ
μF Output Capacitor Required for Stability
zz
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zHigh Power Supply Rejection Ratio
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zCustom Voltage Available
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zRoHS Compliant and 100% Lead (Pb)-Free
Applications
zCDMA/GSM Cellular Handsets
zBattery-Powered Equipment
zLaptop, Palmtops, Notebook Computers
zHand-Held Instruments
zPCMCIA Cards
zPortable Information Appliances
Note :
Richtek Pb-free and Green products are :
` RoHS compliant and compatible with the current require-
ments of IPC/JEDEC J-STD-020.
` Suitable for use in SnPb or Pb-free soldering processes.
Typical Application Circuit
VIN
GND
VOUT
RT9193
COUT
1uF/X7R
CIN
1uF/X7R
VIN VOUT
EN BP
CBP
22nF
Chip Enable
RT9193-
Package Type
U5 : SC-70-5
B : SOT-23-5
J5 : TSOT-23-5
QW : WDFN-6L 2x2 (W-Type)
F : MSOP-8
Output Voltage
15 : 1.5V
16 : 1.6V
:
49 : 4.9V
50 : 5.0V
1H : 1.85V
2H : 2.85V
4G : 4.75V
Operating Temperature Range
P : Pb Free with Commercial Standard
G : Green (Halogen Free with Commer-
cial Standard)
RT9193
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DS9193-12 February 2009www.richtek.com
Function Block Diagram
Functional Pin Description
Pin Name Pin Func t i o n
EN Chip Enable (Active High). Note that this pin is high impedance. There should be a pull low 100kΩ
resistor connected to GND when the control signal is floating.
BP Reference Noise Bypass.
GND Ground.
VOUT Output Voltage.
VIN Power Input Voltage.
Current-Limit
and
Thermal
Protection
MOS Driver
+
-
VOUT
Shutdown
and
Logic Control
VIN
Error
Amplifier
VREF
BP
EN
GND
Quick
Start
Pin Configurations
(TOP VIEW)
SC-70-5/SOT-23-5/TSOT-23-5
WDFN-6L 2x2 MSOP-8
5
6
7
8
4
3
2
NC NC
EN
BP
GND
VOUT
NC
VIN
EN
GND
BP
NC
VOUTVIN
5
4
1
2
3
6
7
VIN GND EN
VOUT BP
4
23
5
RT9193
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DS9193-12 February 2009 www.richtek.com
Electrical Characteristics
(VIN = VOUT + 1V, CIN = COUT = 1uF, CBP = 22nF, TA = 25°C, unless otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Unit
Output Voltage Accurac y ΔVOUT I
OUT = 1mA −2 -- 2 %
Current Limit ILIM R
LOAD = 1Ω 360 400 -- mA
Quiescent Current IQ V
EN ≥ 1.2V, IOUT = 0mA -- 90 130 μA
IOUT = 200mA, VOUT > 2.8V 170 200
Dropout Voltage (Note 5) VDROP IOUT = 300mA, VOUT > 2.8V -- 220 300 mV
Line Regulation ΔVLINE VIN = (VOUT + 1V) to 5.5V,
IOUT = 1mA -- -- 0.3 %
Load Regulation ΔVLOAD 1mA < IOUT < 300mA -- -- 0.6 %
Standby Current ISTBY V
EN = GND, Shutdown -- 0.01 1 μA
EN Input Bias Current IIBSD V
EN = GND or VIN -- 0 100 nA
Logic-Low VIL V
IN = 3V to 5.5V, Shutdown -- -- 0.4
EN Threshold Voltage Logic-High VIH V
IN = 3V to 5.5V, Start-Up 1.2 -- -- V
Absolute Maximum Ratings (Note 1)
zSupply Input Voltage ------------------------------------------------------------------------------------------------------ 6V
zPower Dissipation, PD @ TA = 25°C
SC-70-5 ---------------------------------------------------------------------------------------------------------------------- 300mW
TSOT-23-5/SOT-23-5 ------------------------------------------------------------------------------------------------------ 400mW
WDFN-6L 2x2 -------------------------------------------------------------------------------------------------------------- 606mW
MSOP-8 --------------------------------------------------------------------------------------------------------------------- 625mW
zPackage Thermal Resistance (Note 2)
SOT-70-5, θJA --------------------------------------------------------------------------------------------------------------- 333°C/W
TSOT-23-5/SOT-23-5, θJA ------------------------------------------------------------------------------------------------ 250°C/W
TSOT-23-5/SOT-23-5, θJC ----------------------------------------------------------------------------------------------- 25°C/W
WDFN-6L 2x2, θJA --------------------------------------------------------------------------------------------------------- 165°C/W
WDFN-6L 2x2, θJC -------------------------------------------------------------------------------------------------------- 20°C/W
MSOP-8 θJA ---------------------------------------------------------------------------------------------------------------- 160°C/W
MSOP-8 θJC ---------------------------------------------------------------------------------------------------------------- 55°C/W
zJunction Temperature ----------------------------------------------------------------------------------------------------- 150°C
zLead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------------- 260°C
zStorage Temperature Range -------------------------------------------------------------------------------------------- −65°C to 150°C
zESD Susceptibility (Note 3)
HBM (Human Body Mode) ---------------------------------------------------------------------------------------------- 2kV
MM (Machine Mode) ------------------------------------------------------------------------------------------------------ 200V
Recommended Operating Conditions (Note 4)
zSupply Input Voltage ------------------------------------------------------------------------------------------------------ 2.5V to 5.5V
zEN Input Voltage ----------------------------------------------------------------------------------------------------------- 0V to 5.5V
zJunction Temperature Range -------------------------------------------------------------------------------------------- −40°C to 125°C
zAmbient Temperature Range -------------------------------------------------------------------------------------------- −40°C to 85°C
To be continued
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DS9193-12 February 2009www.richtek.com
Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. θJA is measured in the natural convection at TA = 25°C on a low effective thermal conductivity test board
(Single Layer, 1S) of JEDEC 51-3 thermal measurement standard.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. The dropout voltage is defined as VIN − VOUT, which is measured when VOUT is VOUT(NORMAL) − 100mV.
Parameter Symbol Test Conditions Min Typ Max Unit
Output Noise Voltage eNO 10Hz to 100kHz, IOUT = 200mA
COUT = 1uF -- 100 -- uVRMS
f = 100Hz -- −70 -- Power Supply
Rejection Rate f = 10kHz PSRR COUT = 1uF, IOUT = 10mA -- −50 -- dB
Thermal Shutdown Temperature TSD -- 165 -- °C
Thermal Shutdown Temperature ΔTSD -- 30 -- °C
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DS9193-12 February 2009 www.richtek.com
Dropout Voltage vs. Load Current
0
50
100
150
200
250
300
0 0.05 0.1 0.15 0.2 0.25 0.3
Load Current (A)
Dropout Voltage (mV)
RT9193-33xB
CIN = COUT = 1uF
TJ = 125°C
TJ = 25°C
TJ = -40°C
Typical Operating Characteristics
PSRR
-80
-60
-40
-20
0
20
0.01 0.1 1 10 100 1000
Frequency (kHz)
PSRR (dB)
ILoad = 10mA
ILoad = 100mA
10 100 1K 10K 100K 1M
(Hz)
VIN = 4V to 5V
CIN = COUT = 1uF, X7R
EN Pin Shoutdown Threshold vs . Tem perature
0.5
0.75
1
1.25
1.5
1.75
-50 -25 0 25 50 75 100 125
Temperature
EN Pin Shoutdown Threshold (V)
(°C)
RT9193-15xU5
VIN = 3.3V
CIN = COUT = 1uF X7R
Quiescent Current vs. Temperature
60
65
70
75
80
85
90
95
-50-250 255075100125
Temperature
Quiescent Current (uA)
(°C)
RT9193-15xU5
VIN = 3.3V
CIN = COUT = 1uF X7R
Output Voltage vs. Tem pe rature
1.2
1.3
1.4
1.5
1.6
1.7
1.8
-50 -25 0 25 50 75 100 125
Temperature
Output Voltage (V)
(°C)
RT9193-15xU5
VIN = 3.3V
CIN = COUT = 1uF X7R
Time (500μs/Div)
VIN = 5V
CIN = COUT = 1uF
EN Pin Shutdown Response
EN Pin Voltage
(V)
Output Voltage
(V)
RT9193-28xU5
No Load
10
5
0
2
1
0
RT9193
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DS9193-12 February 2009www.richtek.com
Time (10ms/Div)
VIN = 4.5V
CIN = COUT = 1uF, X7R
Noise
Noise (μV)
200
100
0
-100
-200
RT9193-15xU5
ILoad = 50mA
f = 10Hz to 100kHz
Time (10ms/Div)
VIN = 4.5V
CIN = COUT = 1uF, X7R
Noise
Noise (μV)
200
100
0
-100
-200
RT9193-30xB
ILoad = 50mA
f = 10Hz to 100kHz
Time (100μs/Div)
Line Transient Response
Output Voltage
Deviation (mV)
Input Voltage
Deviation (V)
6
5
4
10
0
-10
VIN = 4V to 5V
COUT = 1uF
RT9193-25xB
ILoad = 100mA
Time (50μs/Div)
VIN = 4V to 5V
COUT = 1uF
Line Transient Response
Output Voltage
Deviation (mV)
Input Voltage
Deviation (V)
RT9193-25xB
ILoad = 1mA
6
5
4
10
0
-10
Time (500μs/Div)
VIN = 5V, VOUT = 2.8V
CIN = COUT = 1uF
Load Transient Response
Output Voltage
Deviation (mV)
Load Current
(mA)
ILoad = 1mA to 60mA
100
50
0
20
0
-20
Time (500μs/Div)
Load Transient Response
Output Voltage
Deviation (mV)
Load Current
(mA)
ILoad = 1mA to 250mA
400
200
0
50
0
-50
VIN = 5V, VOUT = 2.8V
CIN = COUT = 1uF
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DS9193-12 February 2009 www.richtek.com
Time (10μs/Div)
VIN = 5V
CIN = COUT = 1uF
Start Up
EN Pin Voltage
(V)
Output Voltage
(V)
10
5
0
2
1
0
RT9193-28xU5
No Load
RT9193
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DS9193-12 February 2009www.richtek.com
Applications Information
Like any low dropout regulator, the external capacitors
used with the RT9193 must be carefully selected for
regulator stability and performance. Using a capacitor
whose value is > 1μF on the RT9193 input and the amount
of capacitance can be increased without limit. The input
capacitor must be located a distance of not more than 0.5
inch from the input pin of the IC and returned to a clean
analog ground. Any good quality ceramic or tantalum can
be used for this capacitor. The capacitor with larger value
and lower ESR (equivalent series resistance) provides
better PSRR and line-transient response. The output
capacitor must meet both requirements for minimum
amount of capacitance and ESR in all LDOs application.
The RT9193 is designed specifically to work with low ESR
ceramic output capacitor in space-saving and performance
consideration. Using a ceramic capacitor whose value is
at least 1μF with ESR is > 25mΩ on the RT9193 output
ensures stability. The RT9193 still works well with output
capacitor of other types due to the wide stable ESR range.
Figure 1 shows the curves of allowable ESR range as a
function of load current for various output capacitor values.
Output capacitor of larger capacitance can reduce noise
and improve load transient response, stability, and PSRR.
The output capacitor should be located not more than 0.5
inch from the VOUT pin of the RT9193 and returned to a
clean analog ground.
Figure 1
Bypass Ca pacitor and Low Noise
Connecting a 22nF between the BP pin and GND pin
significantly reduces noise on the regulator output, it is
critical that the capacitor connection between the BP pin
and GND pin be direct and PCB traces should be as short
as possible. There is a relationship between the bypass
capacitor value and the LDO regulator turn on time. DC
leakage on this pin can affect the LDO regulator output
noise and voltage regulation performance.
Enable Function
The RT9193 features an LDO regulator enable/disable
function. To assure the LDO regulator will switch on, the
EN turn on control level must be greater than 1.2 volts.
The LDO regulator will go into the shutdown mode when
the voltage on the EN pin falls below 0.4 volts. For to
protecting the system, the RT9193 have a quick-discharge
function. If the enable function is not needed in a specific
application, it may be tied to VIN to keep the LDO regulator
in a continuously on state.
Thermal Considerations
Thermal protection limits power dissipation in RT9193.
When the operation junction temperature exceeds 165°C,
the OTP circuit starts the thermal shutdown function turn
the pass element off. The pass element turn on again
after the junction temperature cools by 30°C.
For continue operation, do not exceed absolute maximum
operation junction temperature 125°C. The power
dissipation definition in device is :
PD = (VIN − VOUT) x IOUT + VIN x IQ
The maximum power dissipation depends on the thermal
resistance of IC package, PCB layout, the rate of
surroundings airflow and temperature difference between
junction to ambient. The maximum power dissipation can
be calculated by following formula :
PD(MAX) = ( TJ(MAX) − TA ) /θJA
Where TJ(MAX) is the maximum operation junction
temperature 125°C, TA is the ambient temperature and
the θJA is the junction to ambient thermal resistance.
Region of Stable COUT ESR vs. Load Current
0.00
0.01
0.10
1.00
10.00
100.00
0 50 100 150 200 250 300
Load Current (mA)
COUT ESR (Ω)
Simulation Verify
Instable
Stable
100
10
1
RT9193-15xU5
CIN = COUT = 1uF, X7R
RT9193
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DS9193-12 February 2009 www.richtek.com
For recommended operating conditions specification of
RT9193, where TJ(MAX) is the maximum junction
temperature of the die (125°C) and TA is the maximum
ambient temperature. The junction to ambient thermal
resistance (θJA is layout dependent) for TSOT-23-5/
SOT-23-5 package is 250°C/W, SC-70-5 package is
333°C/W, WDFN-6L 2x2 package is 165°C/W and MSOP-
8 package is 160°C/W on standard JEDEC 51-3 thermal
test board. The maximum power dissipation at TA = 25°C
can be calculated by following formula :
PD(MAX) = (125°C − 25°C) / 333 = 300mW for
SC-70-5
PD(MAX) = (125°C − 25°C) / 250 = 400mW for
TSOT-23-5/SOT-23-5
PD(MAX) = (125°C − 25°C) / 165 = 606mW for
WDFN-6L 2x2
PD(MAX) = (125°C −25°C) / 160 = 625mW for
MSOP-8
The maximum power dissipation depends on operating
ambient temperature for fixed TJ(MAX) and thermal
resistance θJA. For RT9193 packages, the Figure 2 of
derating curves allows the designer to see the effect of
rising ambient temperature on the maximum power
allowed.
Figure 2. Derating Curve for Packages
0
100
200
300
400
500
600
700
0 25 50 75 100 125
Ambient Temperature (°C)
Power Dissipation (mW)
TSOT-23-5/
SOT-23-5
SC 70-5
WDFN-6L 2x2
MSOP-8
RT9193
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DS9193-12 February 2009www.richtek.com
AA1
e
b
B
D
C
H
L
SC-70-5 Surface Mount Package
Dimensions In Millimeters Dimensions In Inches
Symbol Min Max Min Max
A 0.800 1.100 0.031 0.044
A1 0.000 0.100 0.000 0.004
B 1.150 1.350 0.045 0.054
b 0.150 0.400 0.006 0.016
C 1.800 2.450 0.071 0.096
D 1.800 2.250 0.071 0.089
e 0.650 0.026
H 0.080 0.260 0.003 0.010
L 0.210 0.460 0.008 0.018
Outline Dimension
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DS9193-12 February 2009 www.richtek.com
TSOT-23-5 Surface Mount Package
Dimensions In Millimeters Dimensions In Inches
Symbol Min Max Min Max
A 0.700 1.000 0.028 0.039
A1 0.000 0.100 0.000 0.004
B 1.397 1.803 0.055 0.071
b 0.300 0.559 0.012 0.022
C 2.591 3.000 0.102 0.118
D 2.692 3.099 0.106 0.122
e 0.838 1.041 0.033 0.041
H 0.080 0.254 0.003 0.010
L 0.300 0.610 0.012 0.024
AA1
e
b
B
D
C
H
L
RT9193
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DS9193-12 February 2009www.richtek.com
AA1
e
b
B
D
C
H
L
SOT-23-5 Surface Mount Package
Dimensions In Millimeters Dimensions In Inches
Symbol Min Max Min Max
A 0.889 1.295 0.035 0.051
A1 0.000 0.152 0.000 0.006
B 1.397 1.803 0.055 0.071
b 0.356 0.559 0.014 0.022
C 2.591 2.997 0.102 0.118
D 2.692 3.099 0.106 0.122
e 0.838 1.041 0.033 0.041
H 0.080 0.254 0.003 0.010
L 0.300 0.610 0.012 0.024
RT9193
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Dimensions In Millimeters Dimension s In Inches
Symbol Min Max Min Max
A 0.700 0.800 0.028 0.031
A1 0.000 0.050 0.000 0.002
A3 0.175 0.250
0.007 0.010
b 0.200 0.350 0.008 0.014
D 1.950 2.050 0.077 0.081
D2 1.000 1.450 0.039 0.057
E 1.950 2.050 0.077 0.081
E2 0.500 0.850 0.020 0.033
e 0.650 0.026
L 0.300 0.400
0.012 0.016
W-Type 6L DFN 2x2 Package
D
1
E
A3
A
A1
eb
L
D2
E2
SEE DETAIL A
11
2
2
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
DETAIL A
Pin #1 ID and Tie Bar Mark Options
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DS9193-12 February 2009www.richtek.com
Richtek Technology Corporation
Headquarter
5F, No. 20, Taiyuen Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789 Fax: (8863)5526611
Richtek Technology Corporation
Taipei Office (Marketing)
8F, No. 137, Lane 235, Paochiao Road, Hsintien City
Taipei County, Taiwan, R.O.C.
Tel: (8862)89191466 Fax: (8862)89191465
Email: marketing@richtek.com
Information that is provided by Richtek Technology Corporation is believed to be accurate and reliable. Richtek reserves the right to make any change in circuit
design, specification or other related things if necessary without notice at any time. No third party intellectual property infringement of the applications should be
guaranteed by users when integrating Richtek products into any application. No legal responsibility for any said applications is assumed by Richtek.
L
D
EE1
e
A
bA1 A2
Dimensions In Millimeters Dimensions In Inches
Symbol Min Max Min Max
A 0.810 1.100 0.032 0.043
A1 0.000 0.150 0.000 0.006
A2 0.750 0.950 0.030 0.037
b 0.220 0.380 0.009 0.015
D 2.900 3.100 0.114 0.122
e 0.650 0.026
E 4.800 5.000 0.189 0.197
E1 2.900 3.100 0.114 0.122
L 0.400 0.800
0.016 0.031
8-Lead MSOP Plastic Package
