Data Sheet 10 Rev. 1.2, 2014-07-03
TLE42794
General Product Characteristics
4.3 Thermal Resistance
Table 3 Thermal Resistance
Parameter Symbol Values Unit Note / Test Condition Number
Min. Typ. Max.
TLE42794G (PG-DSO-8)
Junction to Soldering Point1)
1) not subject to production test, specified by design
RthJSP – 80 – K/W measured to pin 5 P_4.3.1
Junction to Ambient1) RthJA – 113 – K/W FR4 2s2p board2)
2) Specified RthJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The Product
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm³ board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).
Where applicable a thermal via array under the exposed pad contacted the first inner copper layer.
P_4.3.2
Junction to Ambient1) RthJA – 172 – K/W FR4 1s0p board,
footprint only3)
3) Specified RthJA value is according to JEDEC JESD 51-3 at natural convection on FR4 1s0p board; The Product
(Chip+Package) was simulated on a 76.2 × 114.3 × 1.5 mm3 board with 1 copper layer (1 x 70µm Cu).
P_4.3.3
Junction to Ambient1) RthJA – 142 – K/W FR4 1s0p board,
300mm2 heatsink area
on PCB3)
P_4.3.4
Junction to Ambient1) RthJA – 136 – K/W FR4 1s0p board,
600mm2 heatsink area
on PCB3)
P_4.3.5
TLE42794GM (PG-DSO-14)
Junction to Soldering Point1) RthJSP – 27 – K/W measured to group of
pins 3, 4, 5, 10, 11, 12
P_4.3.6
Junction to Ambient1) RthJA – 63 – K/W FR4 2s2p board2) P_4.3.7
Junction to Ambient1) RthJA – 104 – K/W FR4 1s0p board,
footprint only3)
P_4.3.8
Junction to Ambient1) RthJA – 73 – K/W FR4 1s0p board,
300mm2 heatsink area
on PCB3)
P_4.3.9
Junction to Ambient1) RthJA – 65 – K/W FR4 1s0p board,
600mm2 heatsink area
on PCB3)
P_4.3.10
TLE42794E (PG-SSOP-14 exposed pad)
Junction to Case1) RthJC – 10 – K/W measured to Exposed
Pad
P_4.3.11
Junction to Ambient1) RthJA – 47 – K/W FR4 2s2p board2) P_4.3.12
Junction to Ambient1) RthJA – 145 – K/W FR4 1s0p board,
footprint only3)
P_4.3.13
Junction to Ambient1) RthJA – 63 – K/W FR4 1s0p board,
300mm2 heatsink area
on PCB3)
P_4.3.14
Junction to Ambient1) RthJA – 53 – K/W FR4 1s0p board,
600mm2 heatsink area
on PCB3)
P_4.3.15