INTEGRATED CIRCUITS DATA SHEET PACKAGE INFORMATION Page Index ---- CDIP CLCC CQFP DBS DIP HDIP PLCC QFP SIL SO SSOP ---------------------------------- Soldering ---- Package outlines Package information 1995 Oct 25 File under Integrated Circuits, IC18 Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION CDIP (ceramic dual in-line package) CDIP24 ceramic dual in-line package; 24 leads (300 mil) 0586B CDIP28 ceramic dual in-line package; 28 leads (600 mil) 0589B CDIP40 ceramic dual in-line package; 40 leads (600 mil) 0590B CLCC (ceramic leaded chip carrier) CLCC44 ceramic leaded chip carrier; 44 leads; j-bent 1472A CLCC68 ceramic leaded chip carrier (window); 68 leads NO330 CQFP (ceramic quad flat package) CQFP80 ceramic quad flat package; 80 leads SOT351-1 DBS (DIL-bent-SIL) DBS13P plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) SOT141-6 DIP (dual in-line package) DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 DIP14 plastic dual in-line package; 14 leads (300 mil) SOT27-1 DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4 DIP20 plastic dual in-line package; 20 leads (300 mil) SOT146-1 DIP24 plastic dual in-line package; 24 leads (300 mil) SOT222-1 DIP28 plastic dual in-line package; 28 leads (600 mil) SOT117-1 DIP28 plastic dual in-line package; 28 leads (600 mil); long body SOT117-2 DIP40 plastic dual in-line package; 40 leads (600 mil) SOT129-1 HDIP (heat-dissipating dual in-line package) HDIP18 plastic heat-dissipating dual in-line package; 18 leads SOT398-1 PLCC (plastic leaded chip carrier) PLCC28 plastic leaded chip carrier; 28 leads; pedestal SOT261-3 PLCC44 plastic leaded chip carrier; 44 leads SOT187-2 PLCC68 plastic leaded chip carrier; 68 leads SOT188-2 QFP (quad flat package) QFP44 plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm SOT307-2 QFP80 plastic quad flat package; 80 leads (lead length 1.95 mm); body 14 x 20 x 2.7 mm; high stand-off height SOT318-1 SIL (single in-line) SIL9MPF 1995 Oct 25 plastic single in-line medium power package with fin; 9 leads 2 SOT110-1 PAGE Philips Semiconductors Package information NAME Package outlines DESCRIPTION VERSION SO (small outline) SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 SSOP (shrink small outline package) SSOP24 plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1 SSOP28 plastic shrink small outline package; 28 leads; body width 5.3 mm SOT341-1 1995 Oct 25 3 PAGE Philips Semiconductors Package information Package outlines CDIP CDIP24: ceramic dual in-line (F) package (with window (FA) package); 24 leads (300 mil) 0.098 (2.49) 0.030 (0.76) 0586B 0.098 (2.49) 0.030 (0.76) SEE NOTE 6 0.306 (7.77) 0.285 (7.24) E PIN # 1 0.100 (2.54) BSC 1.280 (32.51) 1.240 (31.40) D 0.070 (1.78) 0.050 (1.27) 0.200 (5.08) 0.165 (4.19) T SEATING PLANE 0.165 (4.19) 0.125 (3.18) 0.023 (0.58) 0.015 (0.38) T E D 0.010 (0.254) 0.320 (8.13) 0.290 (7.37) (NOTE 4) NOTES: 1. Controlling dimension: Inches. Millimeters are shown in parentheses. 0.175 (4.45) 0.145 (3.68) 2. Dimension and tolerancing per ANSI Y14. 5M-1982. 3. TMT, TMD, and TME are reference datums on the body and include allowance for glass overrun and meniscus on the seal line, and lid to base mismatch. 4. These dimensions measured with the leads constrained to be perpendicular to plane T. 0.035 (0.89) 0.020 (0.51) 0.015 (0.38) 0.010 (0.25) 1995 Oct 25 BSC 0.300 (7.62) (NOTE 4) 5. Pin numbers start with Pin #1 and continue counterclockwise to Pin #24 when viewed from the top. 0.395 (10.03) 0.300 (7.62) 6. Denotes window location for EPROM products. 4 Philips Semiconductors Package information Package outlines CDIP28: ceramic dual in-line (F) package (with window (FA) package); 28 leads (600 mil) 0.098 (2.49) 0.040 (1.02) SEE NOTE 6 0.098 (2.49) 0.040 (1.02) 0.598 (15.19) 0.514 (13.06) E PIN # 1 0589B 0.100 (2.54) BSC 1.485 (37.72) 1.440 (36.58) D 0.070 (1.78) 0.050 (1.27) 0.225 (5.72) MAX. T SEATING PLANE 0.165 (4.19) 0.125 (3.18) 0.023 (0.58) 0.015 (0.38) T E D 0.010 (0.254) NOTES: 1. Controlling dimension: Inches. Millimeters are shown in parentheses. 0.620 (15.75) 0.590 (14.99) (NOTE 4) 2. Dimension and tolerancing per ANSI Y14. 5M-1982. 3. TMT, TMD, and TME are reference datums on the body and include allowance for glass overrun and meniscus on the seal line, and lid to base mismatch. 4. These dimensions measured with the leads constrained to be perpendicular to plane T. 0.175 (4.45) 0.145 (3.68) 0.055 (1.40) 0.020 (0.51) 0.015 (0.38) 0.010 (0.25) 1995 Oct 25 BSC 0.600 (15.24) (NOTE 4) 5. Pin numbers start with Pin #1 and continue counterclockwise to Pin #28 when viewed from the top. 0.695 (17.65) 0.600 (15.24) 6. Denotes window location for EPROM products. 5 Philips Semiconductors Package information Package outlines CDIP40: ceramic dual in-line (F) package (with window (FA) package); 40 leads (600 mil) 0.098 (2.49) 0.040 (1.02) SEE NOTE 6 0.098 (2.49) 0.040 (1.02) 0.598 (15.19) 0.571 (14.50) E PIN # 1 0590B 0.100 (2.54) BSC 2.087 (53.01) 2.038 (51.77) D 0.070 (1.78) 0.050 (1.27) 0.225 (5.72) MAX. T SEATING PLANE 0.165 (4.19) 0.125 (3.18) 0.023 (0.58) 0.015 (0.38) T E D 0.010 (0.254) NOTES: 1. Controlling dimension: Inches. Millimeters are shown in parentheses. 0.620 (15.75) 0.590 (14.99) (NOTE 4) 2. Dimension and tolerancing per ANSI Y14. 5M-1982. 3. TMT, TMD, and TME are reference datums on the body and include allowance for glass overrun and meniscus on the seal line, and lid to base mismatch. 4. These dimensions measured with the leads constrained to be perpendicular to plane T. 0.175 (4.45) 0.145 (3.68) 0.055 (1.40) 0.020 (0.51) 0.015 (0.38) 0.010 (0.25) 1995 Oct 25 BSC 0.600 (15.24) (NOTE 4) 5. Pin numbers start with Pin #1 and continue counterclockwise to Pin #40 when viewed from the top. 0.695 (17.65) 0.600 (15.24) 6. Denotes window location for EPROM products. 6 Philips Semiconductors Package information Package outlines CLCC CLCC44: ceramic leaded chip carrier; 44 leads; j-bent 1472A 17.65 (0.695) 17.40 (0.685) 16.89 (0.665) 16.00 (0.630) 3 1.02 (0.040) X 45 CHAMFER 45 3.05 (0.120) 2.29 (0.090) 0.38 (0.015) 6 0.51 (0.02) X 45 6 17.65 (0.695) 17.40 (0.685) 16.89 (0.665) 16.00 (0.630) 3 2 SEATING PLANE 4.83 (0.190) 3.94 (0.155) 3 X 0.63 (0.025) R MIN. 17.65 (0.656) 17.40 (0.685) 1.27 (0.050) NOTES: 1. All dimensions and tolerances to conform to ANSI Y14.51982. 40X 4.83 (0.190) 3.94 (0.155) 2. UV window is optional. SEE DETAIL A SEATING PLANE 12.7 (0.500) NOMINAL SEE DETAIL B 8.13 (0.320) 7.37 (0.290) 3. Dimensions do not include glass protrusion. Glass protrusion to be 0.005 inches maximum on each side. 4. Controlling dimension millimeters. 5. All dimensions and tolerances include lead trim offset and lead plating finish. 6. Backside solder relief is optional and dimensions are for reference only. 8.13 (0.320) 7.37 (0.290) 0.73 + 0.08 (0.029 + 0.003) 90 + 5 10 1.27 (0.050) TYP. 0.25 (0.010) R MIN. 45 TYP. 4 PLACES 1.52 (0.060) REF. 0.15 (0.006) MIN. 0.076 (0.003) MIN. BASE PLANE 1.02 + 0.25 (0.040 + 0.010) 1995 Oct 25 0.508 (0.020) R MIN. 0.25 (0.010) 0.15 (0.006) 0.482 (0.019 + 0.002) SEATING PLANE DETAIL A TYP. ALL SIDES mm/(inch) DETAIL B mm/(inch) 7 Philips Semiconductors Package information Package outlines CLCC68: ceramic leaded chip carrier (window); 68 leads 1.02 (3x) 44 61 pin 1 index 45 o 60 43 68 1 17.27 9 24.43 23.83 24.13 23.11 25.45 24.85 27 10 0.51 B 0.48 0.2 B seating plane 25.45 24.85 1.27 (64 x) 45 o NO330 26 9.98 17.27 X 0.2 A 24.43 23.83 A 0.35 0.25 4.25 3.75 MBC655 detail X 1995 Oct 25 8 Philips Semiconductors Package information Package outlines CQFP CQFP80: ceramic quad flat package; 80 leads SOT351-1 c y X A 64 65 41 40 j e A2 E HE A1 wM b detail X pin 1 index 25 24 80 1 wM b e v M A D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A1 A2 b c D E e HD HE j v w y mm 0.5 0.2 3.9 3.1 0.45 0.30 0.25 0.14 20.2 19.8 14.2 13.9 0.8 24.2 23.6 18.2 17.6 9.00 8.75 0.2 0.2 0.15 7 0o OUTLINE VERSION REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 93-11-02 SOT351-1 1995 Oct 25 o 9 Philips Semiconductors Package information Package outlines DBS DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) SOT141-6 non-concave Dh x D Eh view B: mounting base side d A2 B j E A L3 L Q c 1 v M 13 e1 Z e bp e2 m w M 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 bp c D (1) d Dh E (1) e e1 e2 Eh j L L3 m Q v w x Z (1) mm 17.0 15.5 4.6 4.2 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 12.2 11.8 3.4 1.7 5.08 6 3.4 3.1 12.4 11.0 2.4 1.6 4.3 2.1 1.8 0.8 0.25 0.03 2.00 1.45 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-03-11 97-12-16 SOT141-6 1995 Oct 25 EUROPEAN PROJECTION 10 Philips Semiconductors Package information Package outlines DIP DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b MH b2 5 8 pin 1 index E 1 4 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.14 0.53 0.38 1.07 0.89 0.36 0.23 9.8 9.2 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 1.15 inches 0.17 0.020 0.13 0.068 0.045 0.021 0.015 0.042 0.035 0.014 0.009 0.39 0.36 0.26 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.045 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT97-1 050G01 MO-001AN 1995 Oct 25 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-02-04 11 Philips Semiconductors Package information Package outlines DIP14: plastic dual in-line package; 14 leads (300 mil) SOT27-1 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b MH 8 14 pin 1 index E 1 7 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.13 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 2.2 inches 0.17 0.020 0.13 0.068 0.044 0.021 0.015 0.014 0.009 0.77 0.73 0.26 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.087 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT27-1 050G04 MO-001AA 1995 Oct 25 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-03-11 12 Philips Semiconductors Package information Package outlines DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b b2 MH 9 16 pin 1 index E 1 8 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.30 0.53 0.38 1.25 0.85 0.36 0.23 19.50 18.55 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 0.76 inches 0.17 0.020 0.13 0.068 0.051 0.021 0.015 0.049 0.033 0.014 0.009 0.77 0.73 0.26 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.030 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-01-14 SOT38-4 1995 Oct 25 EUROPEAN PROJECTION 13 Philips Semiconductors Package information Package outlines DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 11 20 pin 1 index E 1 10 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c mm 4.2 0.51 3.2 1.73 1.30 0.53 0.38 0.36 0.23 26.92 26.54 inches 0.17 0.020 0.13 0.068 0.051 0.021 0.015 0.014 0.009 1.060 1.045 D e e1 L ME MH w Z (1) max. 6.40 6.22 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 2.0 0.25 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.078 (1) E (1) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT146-1 1995 Oct 25 REFERENCES IEC JEDEC EIAJ SC603 14 EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-05-24 Philips Semiconductors Package information Package outlines seating plane DIP24: plastic dual in-line package; 24 leads (300 mil) SOT222-1 ME D A2 L A A1 c e Z w M b1 (e 1) MH b 13 24 pin 1 index E 1 12 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.70 0.38 3.94 1.63 1.14 0.56 0.43 0.36 0.25 31.9 31.5 6.73 6.48 2.54 7.62 3.51 3.05 8.13 7.62 10.03 7.62 0.25 2.05 inches 0.185 0.015 0.155 0.064 0.045 0.022 0.017 0.014 0.010 1.256 1.240 0.265 0.255 0.100 0.300 0.138 0.120 0.32 0.30 0.395 0.300 0.01 0.081 Note 1. Plastic or metal protrusions of 0.01 inches maximum per side are not included. OUTLINE VERSION SOT222-1 1995 Oct 25 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 95-03-11 MS-001AF 15 Philips Semiconductors Package information Package outlines seating plane handbook, full pagewidthdual in-line package; 28 leads (600 mil) DIP28: plastic SOT117-1 ME D A2 L A A1 c e Z w M b1 (e 1) b MH 15 28 pin 1 index E 1 14 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 5.1 0.51 4.0 1.7 1.3 0.53 0.38 0.32 0.23 36.0 35.0 14.1 13.7 2.54 15.24 3.9 3.4 15.80 15.24 17.15 15.90 0.25 1.7 inches 0.20 0.020 0.16 0.066 0.051 0.020 0.014 0.013 0.009 1.41 1.34 0.56 0.54 0.10 0.60 0.15 0.13 0.62 0.60 0.68 0.63 0.01 0.067 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT117-1 051G05 MO-015AH 1995 Oct 25 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-01-14 16 Philips Semiconductors Package information Package outlines seating plane DIP28: plastic dual in-line package; 28 leads (600 mil); long body SOT117-2 ME D A2 L A A1 c e Z w M b1 b 28 (e 1) MH 15 pin 1 index E 1 14 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A max. A1 min. A2 max. b b1 c mm 5.08 0.51 3.94 1.63 1.14 0.56 0.43 0.38 0.25 37.08 35.94 inches 0.200 0.020 0.155 0.064 0.045 0.022 0.017 0.015 0.010 1.460 1.415 D e e1 L ME MH w Z (1) max. 14.22 13.84 2.54 15.24 3.51 3.05 15.75 15.24 17.65 15.24 0.25 2.10 0.560 0.545 0.100 0.600 0.138 0.120 0.62 0.60 0.695 0.600 0.01 0.083 (1) E (1) Note 1. Plastic or metal protrusions of 0.01 inches maximum per side are not included. OUTLINE VERSION SOT117-2 1995 Oct 25 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 95-03-11 MS-011AB 17 Philips Semiconductors Package information Package outlines seating plane DIP40: plastic dual in-line package; 40 leads (600 mil) SOT129-1 ME D A2 L A A1 c e Z w M b1 (e 1) b MH 21 40 pin 1 index E 1 20 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c mm 4.7 0.51 4.0 1.70 1.14 0.53 0.38 0.36 0.23 52.50 51.50 inches 0.19 0.020 0.16 0.067 0.045 0.021 0.015 0.014 0.009 2.067 2.028 D (1) e e1 L ME MH w Z (1) max. 14.1 13.7 2.54 15.24 3.60 3.05 15.80 15.24 17.42 15.90 0.254 2.25 0.56 0.54 0.10 0.60 0.14 0.12 0.62 0.60 0.69 0.63 0.01 0.089 E (1) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT129-1 051G08 MO-015AJ 1995 Oct 25 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-01-14 18 Philips Semiconductors Package information Package outlines HDIP HDIP18: plastic heat-dissipating dual in-line package; 18 leads SOT398-1 D seating plane ME A2 A A1 L e Z c w M b1 (e 1) b2 b 10 18 MH pin 1 index E 9 1 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.67 0.50 1.05 0.75 0.47 0.38 21.85 21.35 6.5 6.2 2.54 7.62 3.9 3.1 8.32 8.02 8.7 7.7 0.25 1.0 inches 0.19 0.02 0.15 0.06 0.04 0.03 0.02 0.04 0.03 0.02 0.01 0.87 0.84 0.26 0.24 0.10 0.30 0.15 0.12 0.33 0.32 0.34 0.30 0.01 0.04 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 94-04-13 95-01-25 SOT398-1 1995 Oct 25 EUROPEAN PROJECTION 19 Philips Semiconductors Package information Package outlines PLCC PLCC28: plastic leaded chip carrier; 28 leads; pedestal SOT261-3 eD eE y X j bp A 19 25 18 26 b1 ZE w M 28 E 1 HE pin 1 index e A4 A1 12 4 A (A 3) k 5 11 Lp v M A ZD e detail X D B HD v M B 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A A1 min. A3 A4 max. bp b1 mm 4.57 4.19 0.13 0.25 3.05 0.53 0.33 0.81 0.66 0.180 inches 0.005 0.01 0.165 D (1) E (1) e eD eE HD HE k 11.58 11.58 10.92 10.92 12.57 12.57 1.22 1.27 11.43 11.43 9.91 9.91 12.32 12.32 1.07 Oj Lp v w y 5.69 5.54 1.44 1.02 0.18 0.18 0.10 Z D(1) Z E (1) max. max. 2.06 2.06 45 o 0.430 0.430 0.495 0.495 0.048 0.224 0.057 0.021 0.032 0.456 0.456 0.05 0.007 0.007 0.004 0.081 0.081 0.12 0.390 0.390 0.485 0.485 0.042 0.218 0.040 0.013 0.026 0.450 0.450 Note 1. Plastic or metal protrusions of 0.01 inches maximum per side are not included. OUTLINE VERSION SOT261-3 1995 Oct 25 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 95-02-25 97-12-16 MO-047AB 20 Philips Semiconductors Package information Package outlines PLCC44: plastic leaded chip carrier; 44 leads SOT187-2 eD eE y X 39 A 29 28 40 bp ZE b1 w M 44 1 E HE pin 1 index A A4 A1 e (A 3) 6 18 k 1 Lp k 7 detail X 17 e v M A ZD D B HD v M B 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) k1 max. Lp v w y 0.51 1.44 1.02 0.18 0.18 0.10 Z D(1) Z E (1) max. max. UNIT A A1 min. A3 A4 max. bp b1 mm 4.57 4.19 0.51 0.25 3.05 0.53 0.33 0.81 0.66 0.180 0.020 0.01 0.165 0.12 0.630 0.630 0.695 0.695 0.048 0.057 0.021 0.032 0.656 0.656 0.020 0.05 0.007 0.007 0.004 0.085 0.085 0.590 0.590 0.685 0.685 0.042 0.040 0.013 0.026 0.650 0.650 inches D (1) E (1) e eD eE HD HE k 16.66 16.66 16.00 16.00 17.65 17.65 1.22 1.27 16.51 16.51 14.99 14.99 17.40 17.40 1.07 2.16 2.16 45 o Note 1. Plastic or metal protrusions of 0.01 inches maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT187-2 112E10 MO-047AC 1995 Oct 25 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-02-25 97-12-16 21 Philips Semiconductors Package information Package outlines PLCC68: plastic leaded chip carrier; 68 leads SOT188-2 eD eE y X 60 A 44 43 Z E 61 bp b1 w M 68 1 HE E pin 1 index A e A4 A1 (A 3) 9 k1 27 Lp k detail X 10 26 e v M A ZD D B HD v M B 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) k1 max. Lp v w y 0.51 1.44 1.02 0.18 0.18 0.10 Z D(1) Z E (1) max. max. UNIT A A1 min. A3 A4 max. bp b1 mm 4.57 4.19 0.51 0.25 3.30 0.53 0.33 0.81 0.66 0.180 0.020 0.01 0.165 0.13 0.930 0.930 0.995 0.995 0.048 0.057 0.021 0.032 0.958 0.958 0.020 0.05 0.007 0.007 0.004 0.085 0.085 0.890 0.890 0.985 0.985 0.042 0.040 0.013 0.026 0.950 0.950 inches D (1) E (1) e eD eE HD HE k 24.33 24.33 23.62 23.62 25.27 25.27 1.22 1.27 24.13 24.13 22.61 22.61 25.02 25.02 1.07 2.16 2.16 45 o Note 1. Plastic or metal protrusions of 0.01 inches maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT188-2 112E10 MO-047AC 1995 Oct 25 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-03-11 22 Philips Semiconductors Package information Package outlines QFP QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm SOT307-2 c y X A 33 23 34 22 ZE e E HE A A2 wM (A 3) A1 bp Lp pin 1 index L 12 44 1 detail X 11 wM bp e ZD v M A D B HD v M B 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HD HE L Lp v w y mm 2.10 0.25 0.05 1.85 1.65 0.25 0.40 0.20 0.25 0.14 10.1 9.9 10.1 9.9 0.8 12.9 12.3 12.9 12.3 1.3 0.95 0.55 0.15 0.15 0.1 Z D (1) Z E (1) 1.2 0.8 1.2 0.8 o 10 0o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-02-04 97-08-01 SOT307-2 1995 Oct 25 EUROPEAN PROJECTION 23 Philips Semiconductors Package information Package outlines QFP80: plastic quad flat package; 80 leads (lead length 1.95 mm); body 14 x 20 x 2.7 mm; high stand-off height SOT318-1 c y X 64 A 41 65 40 ZE e E HE A A2 (A 3) A1 wM pin 1 index Lp bp L 25 80 detail X 24 1 wM bp e ZD v M A D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HD HE L Lp v w y mm 3.3 0.36 0.10 2.87 2.57 0.25 0.45 0.30 0.25 0.13 20.1 19.9 14.1 13.9 0.8 24.2 23.6 18.2 17.6 1.95 1.0 0.6 0.2 0.2 0.1 Z D (1) Z E (1) 1.0 0.6 1.2 0.8 o 7 0o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-02-04 97-08-01 SOT318-1 1995 Oct 25 EUROPEAN PROJECTION 24 Philips Semiconductors Package information Package outlines SIL SIL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110-1 D D1 q P A2 P1 A3 q1 q2 A A4 seating plane E pin 1 index c L 1 9 b e Z Q b2 w M b1 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 max. A3 A4 b b1 b2 c D (1) D1 E (1) e L P P1 Q q q1 q2 w Z (1) max. mm 18.5 17.8 3.7 8.7 8.0 15.8 15.4 1.40 1.14 0.67 0.50 1.40 1.14 0.48 0.38 21.8 21.4 21.4 20.7 6.48 6.20 2.54 3.9 3.4 2.75 2.50 3.4 3.2 1.75 1.55 15.1 14.9 4.4 4.2 5.9 5.7 0.25 1.0 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-02-25 SOT110-1 1995 Oct 25 EUROPEAN PROJECTION 25 Philips Semiconductors Package information Package outlines SO SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.244 0.039 0.028 0.050 0.041 0.228 0.016 0.024 inches 0.010 0.057 0.069 0.004 0.049 0.01 0.01 0.028 0.004 0.012 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03S MS-012AA 1995 Oct 25 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-02-04 97-05-22 26 o 8 0o Philips Semiconductors Package information Package outlines SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE v M A Z 8 14 Q A2 A (A 3) A1 pin 1 index Lp 1 L 7 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.010 0.057 0.004 0.049 0.01 0.019 0.0100 0.35 0.014 0.0075 0.34 0.16 0.15 0.050 0.028 0.024 0.01 0.01 0.004 0.028 0.012 inches 0.069 0.244 0.039 0.041 0.228 0.016 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT108-1 076E06S MS-012AB 1995 Oct 25 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-23 97-05-22 27 o 8 0o Philips Semiconductors Package information Package outlines SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index Lp 1 L 8 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.069 0.010 0.057 0.004 0.049 0.01 0.019 0.0100 0.39 0.014 0.0075 0.38 0.16 0.15 0.050 0.039 0.016 0.028 0.020 0.01 0.01 0.004 0.028 0.012 inches 0.244 0.041 0.228 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT109-1 076E07S MS-012AC 1995 Oct 25 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-23 97-05-22 28 o 8 0o Philips Semiconductors Package information Package outlines SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 11 20 Q A2 A (A 3) A1 pin 1 index Lp L 1 10 e bp detail X w M 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 inches 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.51 0.49 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 Z (1) 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS-013AC 1995 Oct 25 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 29 Philips Semiconductors Package information Package outlines SO28: plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 D E A X c y HE v M A Z 15 28 Q A2 A (A 3) A1 pin 1 index Lp L 1 14 e bp 0 detail X w M 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 18.1 17.7 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.71 0.69 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 inches 0.10 Z (1) Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT136-1 075E06 MS-013AE 1995 Oct 25 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 30 o 8 0o Philips Semiconductors Package information Package outlines SSOP SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm D SOT340-1 E A X c HE y v M A Z 24 13 Q A2 A (A 3) A1 pin 1 index Lp L 1 12 bp e detail X w M 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 2.0 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 8.4 8.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 0.8 0.4 8 0o Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT340-1 1995 Oct 25 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 93-09-08 95-02-04 MO-150AG 31 o Philips Semiconductors Package information Package outlines SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm D SOT341-1 E A X c HE y v M A Z 28 15 Q A2 A (A 3) A1 pin 1 index Lp L 1 14 bp e detail X w M 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 2.0 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 10.4 10.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 1.1 0.7 8 0o Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT341-1 1995 Oct 25 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 93-09-08 95-02-04 MO-150AH 32 o