ANTENNA PRODUCTS 2012 Ceramic Chip Antenna for Bluetooth/WLAN Application Feb, 2007 V1 Print date 07/06/05 Feb, 2007 2012 Ceramic Chip Antenna for Bluetooth/WLAN Application Justin Liu spec.doc C.T.Lee Yageo Taiwan CAN4311714XX2454K Page 1 sheet 190-1 A4 2012 Ceramic Chip Antenna for Bluetooth/WLAN Application Quick Reference Data Centre Frequency 2.45 GHz* Bandwidth at least 70 MHz* VSWR 2.5 (Max.)* Polarization Linear Azimuth Beamwidth Peak Gain 4.0 dBi* Impedance 50 Operating Temperature Termination Maximum Power 2 -55~125 oC Ni / Sn (Environmentally-Friendly Leadless) Resistance to soldering heats 1 Omni-directional 260 , 10sec. 1W All the technical data and information contained herein are subject to change without prior notice Testing under evaluation board of page 4 Print date 07/06/05 Feb, 2007 2012 Ceramic Chip Antenna for Bluetooth/WLAN Application Justin Liu spec.doc C.T.Lee Yageo Taiwan CAN4311714XX2454K Page 2 sheet 190-2 A4 1. Mechanical Data (2.0 x 1.25 x 1.1 mm) 2.0+/-0.2mm 1.25+/-0.2mm Unit: mm 2. Layout of Soldering Pads 1.0 +/-0.1mm 1.7 +/-0.1mm 0.4 +/-0.1mm 1.4 +/-0.1mm Print date 07/06/05 Feb, 2007 2012 Ceramic Chip Antenna for Bluetooth/WLAN Application Justin Liu spec.doc C.T.Lee Yageo Taiwan CAN4311714XX2454K Page 3 sheet 190-3 A4 3. Dimension and Outlook of Evaluation Board 18 0.5 10 2 30 50 ohm Line Unit:mm Unit: mm Print date 07/06/05 Feb, 2007 2012 Ceramic Chip Antenna for Bluetooth/WLAN Application Justin Liu spec.doc C.T.Lee Yageo Taiwan CAN4311714XX2454K Page 4 sheet 190-4 A4 4. Measurement of S-parameter Print date 07/06/05 Feb, 2007 2012 Ceramic Chip Antenna for Bluetooth/WLAN Application Justin Liu spec.doc C.T.Lee Yageo Taiwan CAN4311714XX2454K Page 5 sheet 190-5 A4 5.The Environment of Antenna Radiation Pattern Anechoic Chamber Dimension=8(m) x 4(m) x 4(m) Print date 07/06/05 Feb, 2007 2012 Ceramic Chip Antenna for Bluetooth/WLAN Application Justin Liu spec.doc C.T.Lee Yageo Taiwan CAN4311714XX2454K Page 6 sheet 190-6 A4 6. 3D Radiation Pattern ( 40x18 mm demo board) 7. Layout Recommendation in Application Print date 07/06/05 Feb, 2007 2012 Ceramic Chip Antenna for Bluetooth/WLAN Application Justin Liu spec.doc C.T.Lee Yageo Taiwan CAN4311714XX2454K Page 7 sheet 190-7 A4 Ant Empty area Feed Ground 100mm 40mm 12.5*5 mm clearance Ground 50 ohm Line Dimension of Demo Board 100*40 mm Unit:mm Print date 07/06/05 Feb, 2007 2012 Ceramic Chip Antenna for Bluetooth/WLAN Application Justin Liu spec.doc C.T.Lee Yageo Taiwan CAN4311714XX2454K Page 8 sheet 190-8 A4 IEC 384-10/ CECC 32 100 CLAUSE 4.4 IEC 60068-2 TEST METHOD TEST Mounting 4.5 4.6.1 Visual inspection and dimension check Antenna 4.8 Adhesion 4.9 Bond strength of plating on end face 4.10 20(Tb) PROCEDURE REQUIREMENTS The antenna can be mounted on printed-circuit boards or ceramic substrates by applying wave soldering, reflow soldering (including vapour phase soldering) or conductive adhesive Any applicable method using x 10 magnification No visible damage Central Frequency at 20 oC In accordance with specification (chip off 4mm) Standard test board in page 4 A force of 3 N applied for 10 s to the line joining the terminations and in a plane parallel to the substrate Mounted in accordance with CECC 32 100, paragraph 4.4 No visible damage Conditions: bending 0.5 mm at a rate of 1mm/s, radius jig. 340 mm, 2mm warp on FR4 board of 90 mm length No visible damage Resistance to soldering heat 260 5 C for 10 0.5 s in a static solder bath Resistance to leaching 260 5 C for 30 1 s in a static solder bath The terminations shall be well tinned after recovery and Central Freq. Change 6% Using visual enlargement of x 10, dissolution of the termination shall not exceed 10% No visible damage Print date 07/06/05 Feb, 2007 2012 Ceramic Chip Antenna for Bluetooth/WLAN Application Justin Liu spec.doc C.T.Lee Yageo Taiwan CAN4311714XX2454K Page 9 sheet 190-9 A4 IEC 384-10/ CECC 32 100 CLAUSE 4.11 IEC 60068-2 TEST METHOD TEST 20(Ta) Solderability 4.12 4(Na) Rapid change of temperature 4.14 3(Ca) Damp heat 4.15 Endurance PROCEDURE REQUIREMENTS Zero hour test, and test after storage (20 to 24 months) in original atmosphere; un-mounted chips completely immersed for 2 0.5 s in 235 5C. -25 C (30 minutes) to +85 C (30 minutes); 100 cycles 500 12 hours at 60 C; 90 to 95 % RH The termination must be well tinned, at least 75% is well tinned at termination 500 12 hours at 85 C; No visible damage Central Freq. Change 6% No visible damage 2 hours recovery Central Freq. Change 6% No visible damage 2 hours recovery Central Freq. Change 6% Print date 07/06/05 Feb, 2007 2012 Ceramic Chip Antenna for Bluetooth/WLAN Application Justin Liu C.T.Lee spec.doc Yageo Taiwan CAN4311714XX2454K Page 10 sheet 19010 A4 Ordering Information The antennas may be ordered by using the Yageo ordering code. These code numbers can be determined by the following rules: CAN43 11 7 14 XX 245 4K Family Code CAN 43 = Yageo Part No. for Antenna Packing Type Code 11 = 180 mm/ 7" reel , blister taping Materials Code 7 = High Frequency Material Size Code 11 = 3.2 * 2.5 14 = 2.0 * 1.2 15 = 1.6 * 0.8 12 = 3.2 * 1.6 13 = 2.5 * 2.0 Antenna type 00 = normal type 02 = Type 2 03 = Type 3 04 = Type 4 05 = Type 5 06 = Type 6 07 = Type 7 08 = Type 8 09 = Type 9 Working Frequency 245 = 2.45 GHz Packing Type Code Print date 07/06/05 Feb, 2007 2012 Ceramic Chip Antenna for Bluetooth/WLAN Application Justin Liu C.T.Lee spec.doc Yageo Taiwan CAN4311714XX2454K Page 11 sheet 19011 A4 4K = 4000 pcs for taping per reel Taping Blister Tape DIMENSION: Serial no 1 2 3 4 5 6 7 8 9 10 11 12 13 Cecking note Sprocket hole Pocket hole Distance sprocket hole/sprocket hole Distance pocket/pocket Distance sprocket hole/pocket Tape width Distance sprocket hole/outside Distance sprocket hole/pocket Pocket length nominal clearance Pocket length nominal clearance Pocket depth minimum clearance Thickness of tape 10x sprocket hole pitch Index Do D1 Po P1 P2 W E F Ao Bo Ko T 10Po Spec(mm) 1.500.10 1 4.00.10 4.00.10 2.00.10 8.10.20 1.750.10 3.50.0.05 1.420.10 2.240.10 1.20.10 0.220.05 40.00.20 Print date 07/06/05 Feb, 2007 2012 Ceramic Chip Antenna for Bluetooth/WLAN Application Justin Liu C.T.Lee spec.doc Yageo Taiwan CAN4311714XX2454K Page 12 sheet 19012 A4 Print date 07/06/05 Feb, 2007 2012 Ceramic Chip Antenna for Bluetooth/WLAN Application Justin Liu C.T.Lee spec.doc Yageo Taiwan CAN4311714XX2454K Page 13 sheet 19013 A4 7"(180mm) Reel Specifications Product size code Units per Reel Tape Width (mm) Antenna 4000 8 C (mm) D (mm) W1 (mm) W2 (mm) 180.01.0 621.5 8.4+/-0.15 14.4 max Print date 07/06/05 Feb, 2007 2012 Ceramic Chip Antenna for Bluetooth/WLAN Application Justin Liu C.T.Lee spec.doc Yageo Taiwan CAN4311714XX2454K Page 14 sheet 19014 A4 Revision Control: Revision Date V1 Feb, 2007 Content Remark New Issued Print date 07/06/05 Feb, 2007 2012 Ceramic Chip Antenna for Bluetooth/WLAN Application Justin Liu C.T.Lee spec.doc Yageo Taiwan CAN4311714XX2454K Page 15 sheet 19015 A4