Print date 07/06/05
Feb, 2007
2012 Ceramic Chip Antenna
for Bluetooth/WLAN Application
CAN4311714XX2454K
Justin Liu C.T.Lee Page 9 sheet 190-9
A4
spec.doc Yageo Taiwan
IEC
384-10/
CECC 32
100
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
4.4 Mounting The antenna can be
mounted on printed-circuit
boards or ceramic
substrates by applying
wave soldering, reflow
soldering (including
vapour phase soldering) or
conductive adhesive
No visible damage
4.5 Visual inspection
and dimension
check
Any applicable method
using × 10 magnification In accordance with
specification (chip off
4mm)
4.6.1 Antenna Central Frequency
at 20 oC Standard test board in
page 4
4.8 Adhesion A force of 3 N applied for
10 s to the line joining the
terminations and in a
plane parallel to the
substrate
No visible damage
Bond strength of
plating on end face Mounted in accordance
with CECC 32 100,
paragraph 4.4
No visible damage 4.9
Conditions: bending 0.5
mm at a rate of 1mm/s,
radius jig. 340 mm, 2mm
warp on FR4 board of 90
mm length
No visible damage
4.10 20(Tb) Resistance to
soldering heat 260 ± 5 °C for 10 ± 0.5 s
in a static solder bath The terminations shall
be well tinned after
recovery and
Central Freq. Change
± 6%
Resistance to
leaching 260 ± 5 °C for 30 ± 1 s in
a static solder bath Using visual
enlargement of × 10,
dissolution of the
termination shall not
exceed 10%