© Semiconductor Components Industries, LLC, 2016
September, 2019 Rev. 2
1Publication Order Number:
NCP140/D
NCP140
LDO Voltage Regulator -
Capacitor Free, Low Noise
150 mA
The NCP140 is a 150 mA very low dropout regulator which offers
excellent voltage accuracy and clean output voltage for power
sensitive application. The NCP140 is very suitable for battery
powered application due to very low quiescent current and virtually
zero current at disable mode. This device is stable with or without
output capacitors and allows minimize footprint and BOM. The
XDFN4 package is optimized for use in space constrained
applications.
Features
Stable Operation with or without Capacitors
Operating Input Voltage Range: 1.6 V to 5.5 V
Available in Fixed Voltage Options: 1.5 V to 5 V
Contact Factory for Other Voltage Options
±1% Typical Accuracy @ 25°C
Very Low Quiescent Current of Typ. 45 mA
Standby Current: 0.1 mA
Very Low Dropout: 125 mV for 3.3 V @ 150 mA
High PSRR: 55 dB @ 1 kHz
Available in XDFN4 0.8 mm x 0.8 mm x 0.4 mm Package
XDFN4 1.0 mm x 1.0 mm x 0.4 mm Package
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
Batterypowered Equipment
Smartphones, Tablets
Cameras, DVRs, STB and Camcorders
Figure 1. Typical Application Schematic
NCP140
IN
EN
GND
OUT
OFF
ON
VIN VOUT
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See detailed ordering and shipping information on page 13 of
this data sheet.
ORDERING INFORMATION
MARKING
DIAGRAMS
XDFN4, 0.8x0.8
CASE 711BF
PIN CONNECTIONS
T
X = Specific Device Code
MM = Date Code
1
XM
M
1
(Bottom View)
1
XDFN4, 1.0x1.0
CASE 711AJ
XX M
1
XX = Specific Device Code
M = Date Code
EN IN
GND OUT
34
21
NCP140
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*Active output discharge is available only for NCP140Axxx options.
Figure 2. Simplified Schematic Block Diagram
IN
THERMAL
SHUTDOWN
MOSFET
DRIVER WITH
CURRENT LIMIT
INTEGRATED
SOFTSTART
BANDGAP
REFERENCE
ENABLE
LOGIC
EN
OUT
GND
EN
*ACTIVE DISCHARGE
PIN FUNCTION DESCRIPTION
Pin No. Pin Name Description
1 OUT Regulated output voltage pin. A small ceramic capacitor can be connected to improve fast load transient.
2 GND Ground pin
3 EN Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V puts the regulator into shutdown mode.
4 IN Input pin
EPAD Expose pad must be connect to GND pin as short as possible. Soldered to a large ground copper plane al-
lows for effective heat removal.
ABSOLUTE MAXIMUM RATINGS
Rating Symbol Value Unit
Input Voltage (Note 1) VIN 0.3 V to 6 V
Output Voltage VOUT 0.3 V to VIN + 0.3 V or 6 V V
Chip Enable Input VCE 0.3 V to 6 V V
Output Short Circuit Duration tSC unlimited s
Maximum Junction Temperature TJ150 °C
Storage Temperature TSTG 55 to 150 °C
ESD Capability, Human Body Model (Note 2) ESDHBM 2000 V
ESD Capability, Machine Model (Note 2) ESDMM 200 V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per EIA/JESD22A114
ESD Machine Model tested per EIA/JESD22A115
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
THERMAL CHARACTERISTICS
Rating Symbol Value Unit
Thermal Characteristics, XDFN4 0.8 mm x 0.8 mm Thermal Resistance, JunctiontoAir (Note 3) RqJA 252 °C/W
Thermal Characteristics, XDFN4 1.0 mm x 1.0 mm Thermal Resistance, JunctiontoAir (Note 3) RqJA 265 °C/W
3. Measured according to JEDEC board specification. Detailed description of the board can be found in JESD517
NCP140
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ELECTRICAL CHARACTERISTICS 40°C TJ 85°C; VIN = VOUT(NOM) + 0.5 V; IOUT = 1 mA, CIN = COUT = none, unless
otherwise noted. VEN = 0.9 V. Typical values are at TJ = +25°C. Min/Max values are for 40°C TJ 85°C (Note 3)
Parameter Test Conditions Symbol Min Typ. Max Unit
Operating Input Voltage VIN 1.6 5.5 V
Output Voltage Accuracy VOUT 1.8 V, TJ = 25°CVOUT ±1 %
VOUT < 1.8 V, TJ = 25°C±20 mV
VOUT 1.8 V, 40°C TJ 85°C2 +2 %
VOUT < 1.8 V, 40°C TJ 85°C50 +50 mV
Line Regulation VOUT(NOM) + 0.5 V VIN 5.5 V LineReg 1.0 5.0 mV
Load Regulation IOUT = 0 mA to 150 mA LoadReg 10 30 mV
Dropout Voltage (Note 5)
IOUT = 150 mA VOUT(NOM) = 1.8 V VDO 255 390 mV
VOUT(NOM) = 3.3 V 125 220
Output Current Limit VOUT = 90% VOUT(NOM) ICL 230 mA
Short Circuit Current VOUT = 0V ISC 250 mA
Quiescent Current IOUT = 0 mA IQ45 75 mA
Shutdown Current VEN 0.4 V, VIN = 5.5 V IDIS 0.1 1.0 mA
EN Pin Threshold Voltage EN Input Voltage “H” VENH 0.9 V
EN Input Voltage “L” VENL 0.4
EN Pin Current VEN = 5.5 V IEN 0.01 1.0 mA
TurnOn Time COUT = 1 mF, IOUT=150 mA,
From assertion of VEN to VOUT = 98%VOUT(NOM)
TON 100 ms
Power Supply Rejection Ratio VIN = 3.5 V, VOUT(NOM) = 2.5 V,
IOUT = 10 mA
f = 100 Hz PSRR 62 dB
f = 1 kHz 55
Output Noise Voltage VIN = 2.3 V, VOUT(NOM) = 1.8 V,
IOUT = 10 mA f = 100 Hz to 100 kHz
VN17 mVRMS
Thermal Shutdown Temperature Temperature increasing from TJ = +25°C TSD 160 °C
Thermal Shutdown Hysteresis Temperature falling from TSD TSDH 20 °C
Output Discharge PullDown VEN 0.4 V, A options only RDISCH 100 W
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Performance guaranteed over the indicated operating temperature range by design and/or characterization. Production tested at TA = 25°C.
Low duty cycle pulse techniques are used during the testing to maintain the junction temperature as close to ambient as possible.
5. Dropout voltage is characterized when VOUT falls 100 mV below VOUT(NOM).
NCP140
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TYPICAL CHARACTERISTICS
Figure 3. Output Voltage vs. Temperature
VOUT = 1.8 V
Figure 4. Output Voltage vs. Temperature
VOUT = 3.3 V
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
12010080602002040
1.760
1.765
1.770
1.800
1.785
1.790
1.805
1.810
12010080604002040
3.24
3.25
3.26
3.28
3.29
3.31
3.33
3.34
Figure 5. Line Regulation vs. Temperature
VOUT = 1.8 V
Figure 6. Line Regulation vs. Temperature
VOUT = 3.3 V
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
806550205102540
0
0.5
1.0
2.0
2.5
3.5
4.0
5.0
12010080604002040
0
0.25
0.50
0.75
1.25
1.75
2.25
2.50
Figure 7. Load Regulation vs. Temperature
VOUT = 1.8 V
Figure 8. Load Regulation vs. Temperature
VOUT = 3.3 V
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
806535205102540
0
1.5
3.0
4.5
7.5
10.5
12.0
15.0
12010080602002040
0
1.5
4.5
6.0
7.5
10.5
13.5
15.0
VOUT
, OUTPUT VOLTAGE (V)
VOUT
, OUTPUT VOLTAGE (V)
REGLINE, LINE REGULATION (mV)
REGLINE, LINE REGULATION (mV)
REGLOAD, LOAD REGULATION (mV)
REGLOAD, LOAD REGULATION (mV)
40 140
1.780
IOUT = 1 mA
IOUT = 150 mA
VIN = 2.3 V
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
20 140
3.30
IOUT = 1 mA
IOUT = 150 mA
VIN = 3.8 V
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
VIN = 2.3 to 5.5 V
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
3.0
35 95 20 140
1.50
50 95
VIN = 2.3 V
VOUT = 1.8 V
IOUT = 0 to 150 mA
CIN = 1 mF
COUT = 1 mF
9.0
40 140
3.0
9.0
12.0
VIN = 3.8 V
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
1.775
1.795
3.27
3.32
1.5
4.5 VIN = 4.3 to 5.5 V
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
1.00
2.00
6.0
13.5 VIN = 3.8 V
VOUT = 3.3 V
IOUT = 0 to 150 mA
CIN = 1 mF
COUT = 1 mF
NCP140
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TYPICAL CHARACTERISTICS
Figure 9. Ground Current vs. Load Current
VOUT = 1.8 V
Figure 10. Ground Current vs. Load Current
VOUT = 3.3 V
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
12010590754530150
37
38
40
41
43
44
46
47
12010590604530150
37
38
39
40
43
44
45
47
Figure 11. Quiescent Current vs. Input Voltage
VOUT = 1.8 V
Figure 12. Quiescent Current vs. Input Voltage
VOUT = 3.3 V
VIN, INPUT VOLTAGE (V) TJ, JUNCTION TEMPERATURE (°C)
543210
0
5
15
20
25
35
40
50
54210
0
5
15
20
25
35
40
50
Figure 13. Dropout Voltage vs. Load Current
VOUT = 1.8 V
Figure 14. Dropout Voltage vs. Load Current
VOUT = 3.3 V
IOUT
, OUTPUT CURRENT (mA) IOUT
, OUTPUT CURRENT (mA)
13510590754530150
0
35
105
140
210
245
315
350
13510590756045150
0
20
60
80
120
140
180
200
IGND, GROUND CURRENT (mA)IQ, QUIESCENT CURRENT (mA)
IQ, QUIESCENT CURRENT (mA)
VDROP
, DROPOUT VOLTAGE (mV)
VDROP
, DROPOUT VOLTAGE (mV)
60 150
39
42
45
VIN = 2.3 V
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
75 150
41
42
46
VIN = 3.8 V
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
6
10
30
45
VIN = 2.3 V
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
IOUT = 0 mA
36
10
30
45
VIN = 3.8 V
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
IOUT = 0 mA
60 150
70
175
280
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
40
100
160
30 120 150
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mFTJ = 85°C
TJ = 25°C
TJ = 40°C
IGND, GROUND CURRENT (mA)
135
TJ = 85°C
TJ = 25°C
TJ = 40°C
TJ = 85°C
TJ = 25°C
TJ = 40°C
135
TJ = 85°C
TJ = 25°C
TJ = 40°C
TJ = 85°C
TJ = 25°C
TJ = 40°C
TJ = 85°C
TJ = 25°C
TJ = 40°C
120
NCP140
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TYPICAL CHARACTERISTICS
Figure 15. Dropout Voltage vs. Temperature
VOUT = 1.8 V
Figure 16. Dropout Voltage vs. Temperature
VOUT = 3.3 V
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
805035205102540
0
35
105
140
210
1245
315
350
80653520102540
0
20
60
80
120
140
180
200
Figure 17. Current Limit vs. Temperature Figure 18. Short Circuit Current vs.
Temperature
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
8065355102540
150
165
195
210
240
255
285
300
806535205102540
150
165
195
210
225
270
300
Figure 19. Enable Threshold Voltage vs.
Temperature
Figure 20. Enable Current vs. Temperature
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
12010060402002040
0
0.1
0.3
0.4
0.6
0.7
0.9
1.0
806550355102540
0
50
150
200
300
350
450
500
VDROP
, DROPOUT VOLTAGE (mV)
VDROP
, DROPOUT VOLTAGE (mV)
ICL, CURRENT LIMIT (mA)
ISC, SHORT CIRCUIT CURRENT (mA)
VEN, ENABLE VOLTAGE THRESHOLD (V)
IEN, ENABLE CURRENT (nA)
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
IOUT = 150 mA
IOUT = 75 mA
IOUT = 10 mA
65 95
70
175
280
55095
40
100
160
VIN = VOUT(nom) + 0.5 V
VOUT = 90% VOUT(nom)
CIN = 1 mF
COUT = 1 mF
VOUT = 3.3 V
VOUT = 1.8 V
180
225
270
20 50 95 50 95
180
255
285
240
80 140
0.2
0.5
0.8
VIN = 4.3 V
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
OFF > ON
ON > OFF
20 95
100
250
400
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mFIOUT = 150 mA
IOUT = 75 mA
IOUT = 10 mA
VIN = VOUT(nom) + 0.5 V
VOUT = 0 V (short)
CIN = 1 mF
COUT = 1 mF
VOUT = 3.3 V
VOUT = 1.8 V
VIN = 4.3 V
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
NCP140
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TYPICAL CHARACTERISTICS
Figure 21. Disable Current vs. Temperature Figure 22. Discharge Resistivity vs.
Temperature
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
12010080602002040
100
80
40
20
20
40
80
100
12010080604002040
50
70
80
90
110
120
140
150
Figure 23. Output Voltage Noise Spectral Density VOUT = 1.8 V
FREQUENCY (kHz)
1M100K10K1K10010
1
10
100
1K
10K
IDIS, DISABLE CURRENT (nA)
RDIS, DISCHARGE RESISTIVITY (W)
OUTPUT VOLTAGE NOISE (nV/Hz)
60
0
60
40 140
VIN = 4.3 V
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
20 140
60
100
130
VIN = 4.3 V
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
10 mA 26.21 17.94
150 mA 27.51 19.11
10 Hz 100 kHz 100 Hz 100 kHz
RMS Output Noise (mV)
IOUT
VIN = 2.8 V
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
IOUT = 150 mA
IOUT = 10 mA
Figure 24. PSRR for Various Output Currents,
VOUT = 1.8 V
Figure 25. PSRR for Various Output Currents,
VOUT = 3.3 V
FREQUENCY (kHz) FREQUENCY (kHz)
10M1M100K10K1K10010
0
20
30
40
60
70
80
10M1M100K10K1K10010
0
20
40
50
60
80
90
RR, RIPPLE REJECTION (dB)
RR, RIPPLE REJECTION (dB)
VIN = 2.3 V+100mVpp
VOUT = 1.8 V
CIN = none
COUT = 1 mF MLCC 1206
IOUT = 1 mA
IOUT = 150 mA
IOUT = 10 mA
IOUT = 75 mA
IOUT = 1 mA
IOUT = 150 mA
IOUT = 75 mA
IOUT = 10 mA
50
10
VIN = 3.8 V+100mVpp
VOUT = 3.3 V
CIN = none
COUT = 1 mF MLCC 1206
70
30
10
NCP140
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TYPICAL CHARACTERISTICS
Figure 26. PSRR for Different Output Capacitor,
VOUT = 3.3 V
Figure 27. PSRR for Different Output VIN,
VOUT = 3.3 V
FREQUENCY (kHz) FREQUENCY (kHz)
10M1M100K10K1K10010
0
20
30
40
60
70
80
10M1M100K10K1K10010
0
20
30
40
60
70
80
Figure 28. Enable Turnon Response
COUT = None, IOUT = 10 mA
Figure 29. Enable Turnon Response
COUT = None, IOUT = 150 mA
200 ms/div 100 ms/div
RR, RIPPLE REJECTION (dB)
RR, RIPPLE REJECTION (dB)
500 mV/div
COUT = 4.7 mF
COUT = none
COUT = 470 nF
VEN
IINPUT
VOUT
500 mV/div
10 mA/div
50 mA/div
VIN = 2.3 V
VOUT = 1.8 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
VEN
IINPUT
VOUT
Figure 30. Enable Turnon Response
COUT = 470 nF, IOUT = 10 mA
Figure 31. Enable Turnon Response
COUT = 470 nF, IOUT = 150 mA
200 ms/div 200 ms/div
500 mV/div
VEN
IINPUT
VOUT
500 mV/div
10 mA/div
50 mA/div
VEN
IINPUT
VOUT
50
10
COUT = 1 mF
VIN = 3.8 V+100mVpp
VOUT = 3.3 V
CIN = none
COUT = MLCC 1206
VRIPPLE = 100mVpp
VOUT = 3.3 V
IOUT = 10 mA
CIN = none
COUT = none
VIN = 2.3 V
50
10
VIN = 3.3 V
VIN = 3.8 V
VIN = 5.5 V
500 mV/div
500 mV/div
VIN = 2.3 V
VOUT = 1.8 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
VIN = 2.3 V
VOUT = 1.8 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
500 mV/div
500 mV/div
VIN = 2.3 V
VOUT = 1.8 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
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TYPICAL CHARACTERISTICS
Figure 32. Line Transient Response
COUT = None
Figure 33. Line Transient Response
COUT = 470 nF
20 ms/div 20 ms/div
Figure 34. Load Transient Response
1 mA to 150 mA COUT = None
Figure 35. Load Transient Response
150 mA to 1 mA COUT = None
5 ms/div 5 ms/div
Figure 36. Load Transient Response
1 mA to 150 mA COUT = 1 mF
Figure 37. Load Transient Response
150 mA to 1 mA COUT = 1 mF
5 ms/div 50 ms/div
500 mV/div
VOUT = 1.8 V, IOUT = 10 mA
CIN = none, COUT = none
VIN
3.3 V
VOUT
50 mV/div
2.3 V
500 mV/div50 mV/div
VOUT = 1.8 V, IOUT = 10 mA
CIN = none, COUT = 470 nF (MLCC)
3.3 V
2.3 V
50 mA/div50 mA/div200 mV/div
50 mA/div
VIN = 3.8 V
VOUT = 3.3 V
CIN = none
COUT = none
IOUT
VOUT
200 mV/div50 mA/div200 mV/div
VIN = 3.8 V, VOUT = 3.3 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
IOUT
VOUT
tRISE = 1 ms
VIN = 3.8 V, VOUT = 3.3 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
IOUT
VOUT
VIN
VOUT
tRISE = 1 ms
VIN = 3.8 V
VOUT = 3.3 V
CIN = none
COUT = none
IOUT
VOUT
tFALL = 1 ms
200 mV/div
tFALL = 1 ms
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TYPICAL CHARACTERISTICS
Figure 38. Load Transient Response
1 mA to 150 mA tRISE = 2 ms
Figure 39. Load Transient Response
150 mA to 1 mA tFALL = 2 ms
5 ms/div 5 ms/div
Figure 40. Over Temperature Protection TSD Figure 41. Enable TurnOff
10 ms/div 100 ms/div
Figure 42. Slow VIN Ramp
20 ms/div
50 mA/div200 mV/div
VIN = 3.8 V, VOUT = 1.8 V
CIN = none, COUT = none
IOUT
VOUT
tRISE = 2 ms
50 mA/div200 mV/div
IOUT
VOUT
tFALL = 2 ms
500 mV/div1 V/div
VIN = 3.8 V
VOUT = 3.3 V
CIN = 1 mF (MLCC)
VEN
VOUT
COUT = 1 mF
500 mV/div50 mA/div
VIN = 5.5 V
VOUT = 1.8 V
CIN = none
COUT = none
IOUT
VOUT
Overheating
500 mV/div
VIN = 4.3 V
VOUT = 3.3 V
CIN = none
COUT = none
VIN
VOUT
VIN = 3.8 V, VOUT = 1.8 V
CIN = none, COUT = none
Thermal
Shutdown
TSD cycling
COUT = none
COUT = 470 nF
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APPLICATIONS INFORMATION
General
The NCP140 is high performance low dropout regulator
capable of supplying 150 mA and providing very stable
output voltage with or without capacitors. The device is
designed to remain stable with any type of capacitor or even
without input and output capacitor. The NCP140 also offers
low quiescent current and very small packages suitable for
space constrains application. In connection with no
capacitor requirements the regulator is very useful in
wearable application, smartphones and everywhere where is
high power density required.
Input and Output Capacitor Selection
In spite of the NCP140 is designed as capless device
capacitors can be added to improve dynamic behavior such
as fast load transient or PSRR. Recommendation for
selection input and output capacitor is very similar as for
high performance LDO. Low ESR ceramic capacitor is the
most beneficial for improvement load transient and PSRR
but suitable is almost any type of capacitor. The NCP140
remains stable with electrolytic and tantalum capacitor too.
Enable Operation
The NCP140 uses the EN pin to enable/disable its device
and to deactivate/activate the active discharge function.
If the EN pin voltage is <0.4 V the device is guaranteed to
be disabled. The pass transistor is turnedoff so that there is
virtually no current flow between the IN and OUT. The
active discharge transistor is active (only A option) so that
the output voltage VOUT is pulled to GND through a 100 W
resistor. In the disable state the device consumes as low as
typ. 10 nA from the VIN.
If the EN pin voltage >0.9 V the device is guaranteed to
be enabled. The NCP140 regulates the output voltage and
the active discharge transistor is turnedoff.
The EN pin has internal pulldown current source with
typ. value of 100 nA which assures that the device is
turnedoff when the EN pin is not connected. In the case
where the EN function isn’t required the EN should be tied
directly to IN.
Output Current Limit
Output Current is internally limited within the IC to a
typical 230 mA. The NCP140 will source this amount of
current measured with a voltage drops on the 90% of the
nominal VOUT. If the Output Voltage is directly shorted to
ground (VOUT = 0 V), the short circuit protection will limit
the output current to approximately 250 mA. The current
limit and short circuit protection will work properly over
whole temperature range and also input voltage range. There
is no limitation for the short circuit duration.
Thermal Shutdown
When the die temperature exceeds the Thermal Shutdown
threshold (TSD 160°C typical), Thermal Shutdown event
is detected and the device is disabled. The IC will remain in
this state until the die temperature decreases below the
Thermal Shutdown Reset threshold (TSDU 140°C typical).
Once the IC temperature falls below the 140°C the LDO is
enabled again. The thermal shutdown feature provides the
protection from a catastrophic device failure due to
accidental overheating. This protection is not intended to be
used as a substitute for proper heat sinking.
Power Dissipation
As power dissipated in the NCP140 increases, it might
become necessary to provide some thermal relief. The
maximum power dissipation supported by the device is
dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material, and the
ambient temperature affect the rate of junction temperature
rise for the part.
The maximum power dissipation the NCP140 can handle
is given by:
PD(MAX) +ƪ85°C*TAƫ
qJA
(eq. 1)
The power dissipated by the NCP140 for given
application conditions can be calculated from the following
equation:
PD[VINǒIGND@IOUTǓ)IOUTǒVIN *VOUTǓ(eq. 2)
NCP140
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12
Figure 43. qJA and PD (MAX) vs. Copper Area (XDFN4 0.8 x 0.8 mm)
0.35
0.40
0.45
0.50
0.55
0.60
0.65
0.70
0
50
100
150
200
250
300
350
0 100 200 300 400 500 600 700
PCB COPPER AREA (mm2)
qJA, JUNCTION TO AMBIENT THERMAL RESISTANCE (°C/W)
PD(MAX), MAXIMUM POWER DISSIPATION (W)
qJA, 2 oz Cu
qJA, 1 oz Cu
PD(MAX), TA = 25°C, 1 oz Cu
PD(MAX), TA = 25°C, 2 oz Cu
Figure 44. qJA and PD (MAX) vs. Copper Area (XDFN4 1 x 1 mm)
0.25
0.30
0.35
0.40
0.50
0.45
0.55
0.60
0
50
100
150
200
250
300
350
0 100 200 300 400 500 600 700
PCB COPPER AREA (mm2)
qJA, JUNCTION TO AMBIENT THERMAL RESISTANCE (°C/W)
PD(MAX), MAXIMUM POWER DISSIPATION (W)
qJA, 2 oz Cu
qJA, 1 oz Cu
PD(MAX), TA = 25°C, 1 oz Cu
PD(MAX), TA = 25°C, 2 oz Cu
Reverse Current
The PMOS pass transistor has an inherent body diode
which will be forward biased in the case that VOUT > VIN.
Due to this fact in cases, where the extended reverse current
condition can be anticipated the device may require
additional external protection.
TurnOn Time
The turnon time is defined as the time period from EN
assertion to the point in which VOUT will reach 98% of its
nominal value. This time is dependent on various
application conditions such as VOUT(NOM), COUT, TA.
PCB Layout Recommendations
Larger copper area connected to the pins will improve the
device thermal resistance and improve maximum power
dissipation. The actual power dissipation can be calculated
from the equation above (Equation 2). Expose pad should be
tied the shortest path to the GND pin.
NCP140
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13
ORDERING INFORMATION
Device
Nominal
Output
Voltage Description Marking Package Shipping
NCP140AMXC180TCG 1.8 V
Active Output Discharge
GA
XDFN4
(PbFree)
CASE 711BF
3000 / Tape & Reel
NCP140AMXC280TCG 2.8 V GC
NCP140AMXC300TCG 3.0 V GE
NCP140AMXC330TCG 3.3 V GD
NCP140BMXC330TCG 3.3 V Without Active Output Discharge G2
NCP140AMXD180TCG 1.8 V
Active Output Discharge
GA
XDFN4
(PbFree)
CASE 711AJ
3000 / Tape & Reel
NCP140AMXD280TCG 2.8 V GC
NCP140AMXD300TCG 3.0 V GE
NCP140AMXD330TCG 3.3 V GD
NCP140BMXD330TCG 3.3 V Without Active Output Discharge G2
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NCP140
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14
PACKAGE DIMENSIONS
XDFN4 0.8x0.8, 0.48P
CASE 711BF
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINALS.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
ÉÉ
ÉÉ
A
B
E
D
D2
BOTTOM VIEW
b
e
4X
NOTE 3
2X 0.05 C
PIN ONE
REFERENCE
TOP VIEW
2X 0.05 C
A
A1
(A3)
0.05 C
0.05 C
CSEATING
PLANE
SIDE VIEW
L
4X
12
DIM MIN MAX
MILLIMETERS
A0.33 0.43
A1 0.00 0.05
A3 0.127 REF
b0.17 0.27
D0.80 BSC
D2 0.20 0.30
E0.80 BSC
e0.48 BSC
L0.17 0.27
L1 −−− 0.10
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MOUNTING FOOTPRINT*
DETAIL A
RECOMMENDED
L2
NOTE 4
e/2
45 5
43
ÉÉ
ÇÇ
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTION
0.06 REF
DETAIL B
DETAIL A
L2
L2
DETAIL A
L2
L2
L1
DETAIL C
0.19
4X
0.32
0.12
4X
ALTERNATE
CONSTRUCTION
1.00
0.29 0.36
4X
DIMENSIONS: MILLIMETERS
0.32
DETAIL C 0.48
PITCH
4X
A
M
0.10 BC
M
0.05 C
E2
E2 0.20 0.30
NCP140
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15
PACKAGE DIMENSIONS
XDFN4 1.0x1.0, 0.65P
CASE 711AJ
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.20 mm FROM THE TERMINAL TIPS.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
ÉÉ
ÉÉ
A
B
E
D
D2
BOTTOM VIEW
b
e
4X
NOTE 3
2X 0.05 C
PIN ONE
REFERENCE
TOP VIEW
2X 0.05 C
A
A1
(A3)
0.05 C
0.05 C
CSEATING
PLANE
SIDE VIEW
L
4X
12
DIM MIN MAX
MILLIMETERS
A0.33 0.43
A1 0.00 0.05
A3 0.10 REF
b0.15 0.25
D1.00 BSC
D2 0.43 0.53
E1.00 BSC
e0.65 BSC
L0.20 0.30
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MOUNTING FOOTPRINT*
1.20
0.26
0.24 4X
DIMENSIONS: MILLIMETERS
0.39
RECOMMENDED
PACKAGE
OUTLINE
NOTE 4
e/2
D2
45 5
A
M
0.05 BC
43
0.65
PITCH
DETAIL A
4X
b2 0.02 0.12
L2 0.07 0.17
4X
0.52
2X
0.11
4X
L24X
DETAIL A
b24X
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