Product Description Features Product Potential Uses Application Methods Cure1,2
Silicone Encapsulants Silicone Encapsulants
Sylgard® 160 Silicone
Elastomer
Low cost; good thermal conductivity Two part; 1:1 mix; RT/HA cure; minimal shrinkage; no
exotherm during cure; no solvents or cure byproducts;
repairable; good dielectric properties; deep section cure;
exible elastomer
Sylgard® 160 Silicone
Elastomer
General potting applications: power supplies,
connectors, sensors, industrial controls,
transformers, ampliers, high voltage resistor
packs, relays
Supplied as two-part liquid component kits
comprised of Part A/Part B to be mixed in a
1:1 ratio by weight or volume; automated
mixing and dispensing; manual mixing
24 hours at 25°C (77°F)
10 minutes at 100°C (212°F)
5 minutes at 150°C (302°F)
Sylgard® 165 Silicone
Elastomer
Fast cure; low cost; good thermal conductivity Sylgard® 165 Silicone
Elastomer
Supplied as two-part liquid component kits
comprised of Part A/Part B to be mixed in a
1:1 ratio by weight or volume; automated
mixing and dispensing
5 minutes at 25°C (77°F)
Sylgard® 170 Silicone
Elastomer
Low viscosity Sylgard® 170 Silicone
Elastomer
Supplied as two-part liquid component kits
comprised of Part A/Part B to be mixed in a
1:1 ratio by weight or volume; automated
mixing and dispensing; manual mixing
24 hours at 25°C (77°F)
20 minutes at 70°C (158°F)
15 minutes at 85°C (185°F)
10 minutes at 100°C (212°F)
Sylgard® 170 Fast Cure
Silicone Elastomer
Fast cure; low viscosity Sylgard® 170 Fast Cure
Silicone Elastomer
Supplied as two-part liquid component kits
comprised of Part A/Part B to be mixed in a
1:1 ratio by weight or volume; automated
mixing and dispensing
10 minutes at 25°C (77°F)
Dow Corning® 96-082 A & B
Encapsulant
Very low viscosity; ame retardant; nonmelting; self-
extinguishing; extremely long pot life; wide temperature range
Dow Corning® 96-082
A & B Encapsulant
Applications requiring the thorough
impregnation possible only with a very low
viscosity resin
Supplied as two-part liquid component kits
comprised of Part A/Part B to be mixed in a
1:1 ratio by weight or volume; automated
mixing and dispensing; manual mixing
30 minutes at 150°C (302°F)
Sylgard® 182 Silicone
Elastomer
Transparent; long pot life; heat cure Two part; 10:1 mix; minimal shrinkage; no exotherm during
cure; no solvents or cure byproducts; deep section cure;
repairable; good dielectric properties; exible elastomer
Sylgard® 182 Silicone
Elastomer
General potting applications: power supplies,
connectors, sensors, industrial controls,
transformers, ampliers, high voltage resistor
packs, relays; adhesive/encapsulant for solar
cells; adhesive handling beam lead integrated
circuits during processing
Supplied as two-part liquid component kits
comprised of Base/Curing Agent to be mixed
in a 10:1 ratio by weight or volume; automated
mixing and dispensing; manual mixing
45 minutes at 100°C (212°F)
20 minutes at 125°C (257°F)
10 minutes at 150°C (302°F)
Sylgard® 184 Silicone
Elastomer
Transparent; RT/HA cure Sylgard® 184 Silicone
Elastomer
~48 hours at room temp
45 minutes at 100°C (212°F)
20 minutes at 125°C (257°F)
10 minutes at 150°C (302°F)
Sylgard® 186 Silicone
Elastomer
Clear; RT/HA cure; high tear strength Sylgard® 186 Silicone
Elastomer
~48 hours at room temp
30 minutes at 100°C (212°F)
15 minutes at 150°C (302°F)
Dow Corning® 3-6121
Encapsulating Elastomer
Low-temperature performance below -65°C (-85°F); clear;
high tear and tensile strength; RT/HA cure; high refractive
index
Dow Corning®
3-6121 Encapsulating
Elastomer
Low-temperature encapsulating applications;
optical applications requiring high refractive
index
~48 hours at room temp
20 minutes at 100°C (212°F)
10 minutes at 150°C (302°F)
Primerless Silicone Encapsulants Primerless Silicone Encapsulants
Dow Corning® 3-8264
Primerless Silicone Adhesive
Excellent unprimed adhesion; heat cure; elastomeric Two part; 1:1 mix; heat cure; minimal shrinkage; no
exotherm during cure; no solvents or cure byproducts;
repairable; good dielectric properties
Dow Corning® 3-8264
Primerless Silicone
Adhesive
Encapsulating applications requiring good
primerless adhesion and lower heat cure
temperatures
Supplied as two-part liquid component kits
comprised of Part A/Part B to be mixed in a
1:1 ratio by weight or volume; automated or
manual mixing and dispensing can be used
150 minutes at 70°C (158°F)
30 minutes at 115°C (239°F)
Dow Corning® 567 Primerless
Silicone Encapsulant
Heat cure; unprimed adhesion; elastomeric Dow Corning® 567
Primerless Silicone
Encapsulant
Low cost primerless adhesion encapsulation
applications
Supplied as two-part liquid component kits
comprised of Part A/Part B to be mixed in a
1:1 ratio by weight or volume; automated or
manual mixing and dispensing can be used
90 minutes at 100°C (212°F)
60 minutes at 125°C (257°F)
15 minutes at 150°C (302°F)
Two-Part Room-Temperature Condensation-Cure Encapsulants Two-Part Room-Temperature Condensation-Cure Encapsulants
Dow Corning® 255 Primerless
Elastomer
Rapid room temperature and deep-section cure; self-priming
adhesion; good room-temperature adhesion to most substrates;
adhesion increases with time
Two part; 10:1 mix; noncorrosive; good dielectric properties;
exible elastomer; non-heat curable; refrigerate curing
agent for maximum shelf life; tin catalyst cannot be
inhibited; reversion possible with heat and pressure in sealed
environments
Dow Corning® 255
Primerless Elastomer
General potting applications: power supplies,
connectors, sensors, industrial controls,
transformers, ampliers, high voltage resistor
packs, relays
Supplied as two-part liquid component kits
comprised of Base/Curing Agent to be mixed
in a 10:1 ratio by weight or volume; automated
mixing and dispensing; manual mixing
~4 hours at room temp
24 hours for adhesion
1These data were collected on 50-100 gram samples of a lot believed to be typical and should be used as initial estimates of cure times. Times will vary slightly
from batch to batch and can be longer or shorter due to thermal mass of your parts and your heating ramp rate. Pretesting is recommended to conrm adequate
cure for your application.
2For primerless adhesion products, cure time is based on time to reach durometer. Full adhesion may take more time at the cure temperature.
PRODUCT INFORMATION