TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 SINGLE-CELL Li-ION BATTERY- AND POWER-MANAGEMENT IC 1 APPLICATIONS 49 48 47 GPIO1 50 PGND1 52 51 SM1 53 VIN_SM1 54 L1 PGND2 L2 55 VIN_SM2 GPIO2 56 SM2 AGND1 GPIO3 PDAs Smart Phones MP3s Internet Appliances Handheld Devices GREEN * * * * * 46 45 44 43 BLUE 1 42 SM3 SCLK 2 41 FB3 SDAT 3 40 SM3SW RTC_OUT 4 39 L3 SIM 5 38 PGND3 USB 6 37 LDO1 36 LED_PWM AC 7 OUT 8 35 VIN_LDO02 OUT 9 34 PWM LDO_PM 10 33 LDO2 ISET1 11 32 LDO0 GROUND PAD SYS_IN 30 LDO35_REF DPPM 14 29 VIN_LDO35 24 ANLG1 23 25 26 AGND2 LDO5 21 22 ANLG2 20 ADC_REF 18 19 INT 16 17 BAT 15 27 28 LDO3 31 13 LDO4 12 RESPWRON TS TMR TRSTPWON * HOST INTERFACE - Host can set system parameters and access system status using I2C interface - Interrupt function with programmable masking signals system status modifiction to host - 3 GPIO ports, programmable as drivers, integrated A/D trigger or buck converters standby mode control BAT * * RED * BATTERY CHARGER - Complete charge management solution for single Li-Ion/Li-Pol cell with thermal foldback, dynamic power management and pack temperature sensing, supporting up to 1.5-A max charge current - Programmable charge parameters for AC adapter and USB port operation INTEGRATED POWER SUPPLIES - A total of 9 LDOs are integrated: - Six adjustable output LDOs (1.25-V to 3.3-V) - Two fixed-voltage LDOs (3.3-V) - One fixed-voltage, always-on LDO (3.3-V) - One RTC backup supply with low leakage (3.1-V) - Two 600-mA output current, 0.6-V to 3.4-V programmable dc/dc buck converters with enable, standby mode operation, and automatic low-power mode setting DISPLAY FUNCTIONS - Two open-drain PWM outputs with programmable frequency and duty cycle. Can be used to control keyboard backlight, vibrator, or other external peripheral functions - RGB LED driver with programmable flashing period and individual R/G/B brightness control - Constant-current white LED driver, with programmable current level, brightness control, and overvoltage protection can drive up to 6 LEDs in series configuration SYSTEM MANAGEMENT - Dual input power path function with input current limiting and OVP protection - POR function with programmable masking monitors all integrated supplies outputs - Software and hardware reset functions - 8-channel integrated A/D samples system parameters with single conversion, peak detection, or averaging operating modes AGND0 * HOT_RST FEATURES 1 QFN 56-Pin, 7 x 7 mm Package (Top View - Not To Scale) spacer Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. spacer PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2006-2008, Texas Instruments Incorporated TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. DESCRIPTION The TPS65820 provides an easy to use, fully integrated solution for handheld devices, integrating charge management, multiple regulated power supplies, system management and display functions, in a small thermally-enhanced 7-mm x 7-mm package. The high level of integration enables typical board area space savings of 70% when compared to equivalent discrete solutions, while implementing a high-performance and flexible solution, portable across multiple platforms. If required, an external host may control the TPS65820 via I2C interface, with access to all integrated systems. The I2C enables setting output voltages, current thresholds, and operation modes. Internal registers have a complete set of status information, enabling easy diagnostics, and host-controlled handling of fault conditions. The TPS65820 can operate in stand-alone mode, with no external host control, if the internal power-up defaults are compatible with the system requirements AVAILABLE OPTIONS (1) TJ -40C to 125C (1) (2) (3) (4) 2 DEVICES (2) (3) (4) TPS65820RSH MARKING TPS65820 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. The RSH package is available in tape and reel. Add suffix R (TPS65820RSHR) to order quantities of 2000 parts per reel. Add suffix T (TPS65820RSHT) to order quantities of 250 parts per reel. This product is RoHS compatible, including a lead concentration that does not exceed 0.1% of total product weight, and is suitable for use in specified lead-free soldering processes. In addition, this product uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight. Other power-up sequences and default power-up states for the supplies can be implemented upon request. Consult factory for available options Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 FUNCTIONAL BLOCK DIAGRAM TPS65820 AC OUT OUT USB BAT LDO_PM LDO_PM 3.3V 10 mA AGND1 OUT 1.8V/3V 8 mA OUT RTC_OUT BAT BAT ON/OFF SIM,RTC LDOS SIM OUT POWER PATH CONTROL LINEAR CHARGER SYSTEM POWER CHARGE MANAGEMENT AGND1 TS DPPM TMR ISET1 OUT AGND1 2.6V/3.1V 8 mA AGND1 VIN_LDO12 LDO0 LDO0,1,2 3.3V 150 mA PWM DRIVER PWM RGB DRIVER RED GREEN BLUE GPIO'S GPIO1 GPIO2 GPIO3 AGND1 LDO1 1.25V-3.3V 150 mA LDO2 1.25V-3.3V 150 mA LDO3 LDO4 LED_PWM DISPLAY AND I /O OUT L3 SM3 SM3_SW WHITE LED DRIVER AGND1 VIN_LDO35 FB3 PGND3 CONTROL LOGIC LDO3,4,5 1.224V-4.4V 100 mA VIN_SM1 DC/DC 0.6-1.8V 600 mA 1.224V-4.4V 100 mA L1 SM1 PGND1 VIN_SM2 LDO35_REF LDO5 1.224V-4.4V 100 mA L2 1.0V-3.4V 600 mA AGND2 SM2 OUT PGND2 6 INTERNAL CHANNELS HOST INTERFACE AND SEQUENCING SCLK SDAT INT SYS_IN HOT_RST RESPWRON TRSTPWON I2C INTERFACE AND INTERRUPT CONTROLLER AGND1 OUT AGND 1 ADC INTERNAL BIAS RESET CONTROLLER AGND0 DISPLAY AND I /O OUT REFERENCE SYSTEM 8 CHANNEL MUX ANLG1 A/D CONVERTER ADC_REF AGND1 ANLG2 AGND2 AGND 0, AGND 1 AND AGND 2PINS SHORTED TO EACH OTHER INSIDE TPS 65800 . ALL AGND PINS ARE INTERNALLY CONNECTED TO THE TPS 65800 THERMAL PAD AND SUBSTRATE . PGND 1, PGND 3 AND PGND 3PINS ARE NOT CONNECTED TO EACH OTHER OR TO THE TPS 65800 SUBSTRATE / POWER PAD Figure 1. TPS65820 Simplified Block Diagram Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 3 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) VALUE AC and USB with respect to AGND1 ANLG1, ANLG2 with respect to AGND2 -0.3 to V(OUT) V(OUT) with respect to AGND1 5 VIN_LDO12, VIN_LDO35, LDO3, LDO4, LDO5 with respect to AGND2 -0.3 to smaller of: 3.6 or V(OUT) SIM, RTC_OUT with respect to AGND1 -0.3 to smaller of: 3.6 or V(OUT) SM1, L1, VIN_SM1 with respect to PGND1 -0.3 to V(OUT) SM2, L2, VIN_SM2 with respect to PGND2 -0.3 to V(OUT) SM3, L3 with respect to PGND3 -0.3 to 29 SM3SW with respect to PGND3 -0.3 to V(OUT) FB3 with respect to PGND3 -0.3 to V(OUT) AGND2, AGND0, PGND1, PGND2, PGND3 with respect to AGND1 -0.3 to +0.3 Input Current, AC pin 2750 Input Current, USB pin 600 Output continuous current, OUT pin 3000 Output conitnuous current, BAT pin -3000 Continuous current at L1, PGND1, L2, PGND2 1800 Operating free-air temperature TJ Maximum junction temperature TSTG Storage temperature V -0.3 to 0.5 All other pins (except AGND and PGND), with respect to AGND1 (1) -0.3 to V(OUT) LDO35_REF, ADC_REF with respect to AGND2 TA UNIT -0.3 to 18 mA -40 to 85 125 -65 to 150 Lead temperature 1,6 mm (1/16-inch) from case for 10 seconds 260 ESD rating, all pins 1.5 C kV Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. DISSIPATION RATINGS PACKAGE RSH (1) (2) 4 (1) (2) JA TA 55C POWER RATING DERATING FACTOR ABOVE TA = 55C 21.7C/W 3.22 W 0.046 W/C This data is based on using the JEDEC High-K board and the exposed die pad is connected to a Cu pad on the board. This is connected to the ground plane by a via matrix. The RSH package MSL Level : HIR3 at 260C Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 RECOMMENDED OPERATING CONDITIONS MIN MAX 4.35 (1) V 0 2.6 V Greater of : 3.6 V OR minimum input voltage required for LDO/converter operation outside dropout region 4.7 AC and USB with respect to AGND1 ANLG1,ANLG2 with respect to AGND2 VIN_LDO35 with respect to AGND2 VIN_LDO12 with respect to AGND1 16.5 4.7 VIN_SM1 with respect to PGND1 4.7 VIN_SM2 with respect to PGND2 4.7 SM3 with respect to PGND3 UNIT V 28 V TA Operating free-air temperature -40 85 C TJ(op) Junction temperature, functional operation assured -40 125 C TJ Junction temperature, electrical characteristics assured 0 125 C (1) Thermal operating restrictions are reduced or avoided if input voltage does not exceed 5 V. Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 5 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com ELECTRICAL CHARACTERISTICS - I2C INTERFACE Over recommended operating conditions (typical values at TJ = 25C), application circuit as in figure (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT I2C TIMING CHARACTERISTICS tR SCLK/SDATA rise time 300 tF SCLK/SDATA fall time tW(H) SCLK pulse width high 600 tW(L) SCLK Pulse Width Low 1.3 tSU(STA) Setup time for START condition 600 tH(STA) START condition hold time after which first clock pulse is generated 600 tSU(DAT) Data setup time 100 tH(DAT) Data hold time tSU(STOP) Setup time for STOP condition 600 t(BUF) Bus free time between START and STOP condition 1.3 FSCL Clock Frequency 300 ns s ns 0 s 400 kHz I2C INTERFACE LOGIC LEVELS VIH High level input voltage 1.3 6 VIL Low level input voltage 0 0.6 IH Input bias current A 0.01 tsu(STA) V tw(L) tw(H) tf tr SCL tr tf SDA START th(STA) SCL th(DAT) th(DAT) tsu(DAT) 1 2 3 STOP 7 8 9 ACK SDA START tsu(STOP) SCL 1 2 3 7 8 9 ACK SDA t(BUF) STOP Figure 2. I2C Timing 6 Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 ELECTRICAL CHARACTERISTICS - SYSTEM SEQUENCING AND OPERATING MODES Over recommended operating conditions (typical values at TJ = 25C), application circuit as in Figure 3 (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT QUIESCENT CURRENT IBAT(SLEEP) BAT pin current, sleep mode set Input power not detected, V(BAT) = 4.2 V, Sleep mode set IBAT(DONE) BAT pin current, charge terminated Charger function enabled by I2C, termination detected, input power detected and selected IBAT(CHGOFF) BAT pin current, charge function OFF 2 Charger function disabled by I C, termination not detected, input power detected and selected IINP(CHGOFF) AC or USB pin current, charge function OFF Charger function disabled by I2C, termination not detected, input power detected and selected. All integrated supplies and drivers OFF, no load at OUT pin. 370 A 3 A 3 A 200 A 3% V UNDER-VOLTAGE LOCKOUT VUVLO Internal UVLO detection threshold NO POWER mode set at V(OUT) < VUVLO, V(OUT) decreasing VUVLO_HYS UVLO detection hysteresis V(OUT) increasing tDGL(UVLO) UVLO detection deglitch time Falling voltage only -3% 2.5 120 mV 5 ms SYSTEM LOW VOLTAGE THRESHOLD VLOW_SYS Minimum system voltage System voltage V(SYS_IN) decreasing, SLEEP mode set if detection threshold V(SYS_IN) < VLOW_SYS VHYS(LOWSYS) Minimum system voltage V(SYS_IN) increasing detection hysteresis 0.97 Minimum system voltage V(SYS_IN) decreasing, valid only for initial power-up, see tDGL(HOTPLUG) detection hotplug state machine diagram deglitch time tDGL(LOWSYS) Minimum system voltage V(SYS_IN) decreasing, hotplug deglitch time expired detection deglitch time 1 1.03 V 50 mV 650 ms 5 ms THERMAL FAULT TSHUT Thermal shutdown Increasing junction temperature 165 C THYS(SHUT) Thermal shudown hysteresis Decreasing junction temperature 30 C INTEGRATED SUPPLY POWER FAULT DETECTION VPGOOD Power good fault detection threshold Falling output voltage, applies to all integrated supply outputs. Referenced to the programmed output voltage value 84% 90% 96% VHYS(PGOOD) Power good fault detection hysteresis Rising output voltage, applies to all integrated supply outputs. Referenced to VPGOOD threshold 3% 5% 7% HOT RESET FUNCTION VHRSTON Low level input voltage RESET mode set at V(HOT_RESET) < VHRSTON VHRSTOFF High level input voltage HOT reset not active at V(HOT_RESET) > VHRSTOFF tDGL(HOTRST) Hot reset input deglitch 0.4 1.3 V V s 5000 SYSTEM RESET - OPEN DRAIN OUTPUT RESPWRON VRSTLO Low level output voltage IIL = 10 mA, V(RESPWRON ) < VRSTLO ITRSTPWON Pullup current source Internally connected to TRSTPWRON pin KRESET Reset timer constant TRESET = KRESET CTRSTPWON 0 0.9 0.3 1 1.2 1 V A ms/nF SEQUENCING DELAYS tDLY(D1) Sequencing delay See sequencing timing diagram 0.24 ms tDLY(D1) Sequencing delay See sequencing timing diagram 12 ms Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 7 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com ELECTRICAL CHARACTERISTICS - POWER PATH AND CHARGE MANAGEMENT Over recommended operating conditions (typical values at TJ = 25C), application circuit as in Figure 3 (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VOLTAGE DETECTION THRESHOLDS VIN(DT) Input voltage detection threshold AC detected at V(AC) - V(BAT) > VIN(DT) ; USB detected at V(USB) - V(BAT) > VIN(DT) VIN(NDT) Input Voltage removal threshold AC not detected at V(AC) - V(BAT) < VIN(NDT) ; USB not detected at V(USB) - V(BAT) < VIN(NDT) tDGL(NDT) Power not detected deglitch VSUP(DT) Supplement detection threshold VSUP(NDT) Supplement not detected threshold 190 mV 125 mV 22.5 ms Battery switch ON at V(BAT) - V(OUT) > VSUP(DT) 60 mV Battery switch OFF at V(BAT) - V(OUT) < VSUP(NDT) 20 mV POWER PATH INTEGRATED MOSFETs CHARACTERISTICS AC switch dropout voltage VACDO VACDO = V(AC) - V(OUT); V(AC) = 4.75-V AC input current limit set to 2.75 A (typ), IO(OUT) = 1 A 350 375 mV I(OUT) + I(BAT)= 0.5 A 175 190 mV I(OUT) + I(BAT)= 0.1 A 35 45 mV VUSBDO USB switch dropout voltage VUSBDO = V(USB) - V(OUT); V(USB) = 4.6 V USB input current limit set to 2.75 A (typ) VBATDODCH Battery switch dropout voltage, discharge V(BAT): 3 V VCH(REG), I(BAT) = -1 A 60 100 mV VBATDOCH Battery switch dropout voltage, charge Charger on, V(BAT): 3 V 4.2 V, I(BAT) = 1 A 60 100 mV 80 100 mA 400 500 mA 2.75 A 4.7 V POWER PATH INPUT CURRENT LIMIT IINP(LIM1) Selected Input current limit, applies to USB input only Selected input switch not in dropout, I2C settings : ISET2 = LO, PSEL = LO IINP(LIM2) Selected Input current limit, applies to USB input only Selected input switch not in dropout, I2C settings: ISET2 = HI, PSEL = LO IINP(LIM3) Selected Input current limit, applies to either AC or USB input Selected input switch not in dropout, I2C settings: ISET2 = HI OR LO, PSEL = HI SYSTEM REGULATION VOLTAGE VSYS(REG) Output regulation voltage VSYS(REG) = V(OUT), DPPM loop not active, selected input current limit not reached. Selected input voltage (AC or USB) > 5.1 V 4.6 POWER PATH PROTECTION AND RECOVERY FUNCTIONS VINOUTSH Input-to-output short-circuit detection threshold AC and USB switches set to OFF if V(OUT) < VINOUTSH 0.6 V RSH(USBSH) OUT short-circuit recovery pullup resistor V(OUT) < 1 V, internal resistor connected from USB to OUT 500 RSH(ACSH) OUT short-circuit recovery pullup resistor V(OUT) < 1 V, internal resistor connected from AC to OUT 500 Overvoltage detection threshold Rising voltage, overvoltage detected when V(AC) > VOVP or V(USB) > VOVP Overvoltage detection hysteresis Falling voltage, relative to detection threshold 0.1 V VBATOUTSH Battery-to-output short-circuit detection threshold BAT switch set to OFF if V(BAT) - V(OUT)> VBATOUTSH 200 mV KBLK(SHBAT) Battery-to-ouput short-circuit blanking time constant V(DPPM) < 1V, tBLK(SHBAT) = KBLK(SHBAT) x CDPPM, CDPPM capacitor is connected from DPPM pin to AGND1 ISH(BAT) OUT short-circuit recovery pullup current source V(BAT) - V(OUT) > VBATOUTSH, Internal current source connected between OUT and BAT RSHBAT) BAT short-circuit recovery resistor V(BAT) < 1V, Internal resistor connected from OUT to BAT RDCH(BAT) BAT pulldown resistor Internal resistor connected from BAT to AGND1 when battery is not detected by ANLG1 VOVP 8 Submit Documentation Feedback 6 6.5 6.8 V 1 mS/nF 10 mA 1 k 500 Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 ELECTRICAL CHARACTERISTICS - POWER PATH AND CHARGE MANAGEMENT (Continued) Over recommended operating conditions (typical values at TJ = 25C), application circuit as in Figure 3 (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 120 200 POWER PATH TIMING CHARACTERISTICS, DPPM AND THERMAL LOOPS NOT ACTIVE, RTMR = 50 k tBOOT Boot-up time Measured from input power detection 300 ms tSW(ACBAT) Switching from AC to BAT No USB: measured from V(AC) - V(BAT) < VIN(NDT), USB detected: CE = LO (after CE hold-off time) 50 s tSW(USBBAT) Switching from USB to BAT No AC: measured from V(USB) - V(BAT) < VIN(NDT), USB detected: CE = LO (after CE hold-off time) 50 s 50 s 100 s 2 tSW(PSEL) Switching from USB to AC Toggling I C PSEL bit tSW(ACUSB) Switching from AC to USB or USB to AC AC power removed or USB power removed BATTERY REMOVAL DETECTION VNOBATID Battery ID resistor detection tDGL(NOBAT) Deglitch time for battery removal detection ID resistor not detected at V(OUT) - V(ANLG1) < VNOBATID 0.6 00, V(OUT): 2.5 V to 4.4 V IO(ANLG1) ANLG1 pullup current 0.5 1.2 ms V(OUT) * 1.2 500 kW Set via I2C bits (BATID1, 01 BATID2) ADC_WAIT register 10 10 11 60 Total accuracy V A 50 25% 25% 100 1500 FAST CHARGE CURRENT, V(OUT) > V(BAT) + 0.1 V, V(BAT) > VLOWV IO(BAT) VSET KSET Charge current range Battery charge current set voltage Battery charge current set factor K(SET) IO(BAT) + V(SET) RSET VSET = V(ISET1), (ISET1_1, ISET1_0) = 11, 100% scaling 2.475 2.5 2.525 10, 75% scaling 1.875 1.9 1.925 01, 50% scaling 1.225 1.25 1.275 00, 25% scaling 0.625 0.575 0.6 100 mA < IO(BAT) 1 A 350 400 450 1 mA < IO(BAT) 100 mA 100 400 1000 mA V PRECHARGE CURRENT, V(OUT) > V(BAT) + 0.1 V, VBATSH < V(BAT) < VLOWV, t < t(PRECHG) V(PRECHG) K(SET) IO(PRECHG) Precharge current range IO(PRECHG) + VPRECHG Precharge set voltage VPRECHG = V(ISET1) 220 VLOWV Precharge to fast-charge transition Fast charge at V(BAT) > VLOWV 2.8 tDGL(PRE) Deglitch time for fast charge to precharge transition Decreasing battery voltage, RTMR = 50 k RSET 10 150 mA 250 270 mV 3 3.2 V 22.5 ms CHARGE REGULATION VOLTAGE, V(OUT) > VO(BATREG) + 0.1V 4.2 Voltage options, selection via I2C VO(BATREG) Battery charge voltage Accuracy, TA = 25C Total accuracy V 4.356 -0.5% 0.5% -1% 1% 10 150 CHARGE TERMINATION, V(BAT) > VRCH, VOLTAGE REGULATION MODE SET V(TERM) K(SET) ITERM Charge termination current range I(TERM) + VTERM Battery termination detection set voltage VTERM = V(ISET1), (ISET1_1, SET1_0) = tDGL(TERM) Deglitch time for termination detection V(ISET1) < VTERM, RTMR = 50 k RSET 11, 100% scaling 240 260 280 10, 75% scaling 145 160 175 01, 50% scaling 90 110 130 00, 25% scaling 40 60 75 22.5 Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 mA mV ms 9 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com ELECTRICAL CHARACTERISTICS - POWER PATH AND CHARGE MANAGEMENT (Continued) Over recommended operating conditions (typical values at TJ = 25C), application circuit as in Figure 3 (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 80 100 130 mV BATTERY RECHARGE DETECTION VRCH Recharge threshold voltage New charge cycle starts if V(BAT) < VO(BATREG) - VRCH, after termination was detected tDGL(RCH) Deglitch time for recharge detection RTMR = 50 k 22.5 ms DPPM FUNCTION VDPPM DPPM regulation point range V(DPPM) = RDPPM x KDPPMM x IO(DPPM) 2.6 4.4 V IO(DPPM) DPPM pin current source AC or USB present 95 100 105 A KDPPM DPPM scaling factor 1.139 1.15 1.162 tDGL(DPPM) DPPM de-glitch time Status bit set indicating DPPM loop active after deglitch time, RTMR = 50 k s 500 PACK TEMPERATURE SENSING VLTF Low temperture threshold Pack low temperature fault at V(TS) > VLTF 2.465 2.500 2.535 VHTF High temperture threshold Pack low temperature fault at V(TS) < VHTF 0.485 0.500 0.515 V IO(TS) Temperature sense current source Thermistor bias current 18.8 20 21.2 A tDLG(TFAULT) Deglitch time for temperature fault detection R(TMR) = 50 k, V(TS) > VLTF OR V(TS) < VHTF 22.5 V ms CHARGE AND PRECHARGE SAFETY TIMER tCHG Charge safety timer programmed value KTMR Charge timer set factor tCHGADD Total elapsed time when DPPM or thermal loop are active fast charge on, tCHGADD is the maximum add-on time added to tCHG tPRECHG Precharge safety timer programmed value Pre charge safety timer range, thermal/DPPM loop not active, tPRECHG = KPRE x RTMR x KTMR KPRE Precharge timer set factor tPCHGADD Total elapsed time when DPPM or thermal loop are active RTMR External timer resistor limits RTMR(FLT) Timer fault recovery pullup resistor Safety timer range, thermal/DPPM loop not active, tCHG = RTMR x KTMR 3 5 10 0.313 0.360 0.414 2 tCHG 18 0.09 30 60 0.1 0.11 30 min hours tPRECHG Internal resistor connected from OUT to BAT after safety timer timeout s/ hours 2x Precharge on, tPCHGADD is the maximum add-on time added to tPRECHG hours 100 1 k k THERMAL REGULATION LOOP TTHREG Temperature regulation limit Charge current decreasesd and timer extended when TJ > TTHREG 115 135 C CHARGER THERMAL SHUTDOWN TTHCHG Charger thermal shutdown TTHCHGHYS Charger thermal shutdown hysteresis 10 Charger turned off when TJ> TTHCHG Submit Documentation Feedback 150 C 30 C Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 ELECTRICAL CHARACTERISTICS - LINEAR REGULATORS Over recommended operating conditions (typical values at TJ = 25C), application circuit as in Figure 3 (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT SELECTABLE OUTPUT VOLTAGE LDO'S : LDO1, LDO2 IQ(LDO12) Quiescent current, either LDO1 or LDO2 enabled, LDO0 disabled IO(LDO1,2) Output current range IQ(LDO12) = I(VIN_LDO02) I(LDO1,2) = -1 mA 15 I(LDO1,2) = -150 mA 150 Output voltage, selectable via I2C. Available output voltages: VO(LDO1,2) TYP = 1.25, 1.5, 1.8, 2.5, 2.85, 3, 3.2, 3.3 Dropout voltage, 150 mA load VO(LDO1,2) LDO1, LDO2 output voltage A 160 V 300 Total accuracy, V(VIN_LDO02) = 3.65 V -3% 3% Line regulation, 100 mA load, V(VIN_LDO02): V(LDO1,2)TYP + 0.5 V 4.7 V -1% 1% -1.5% 1.5% Load regulation, load: 10 mA 150 mA V(VIN_LDO02) > VO(LDO1,2) TYP + 0.5V PSR(LDO12) PSRR at 20 kHz 150-mA load at output, V(VIN_LDO02) - VO(LDO1,2) = 1 V ISC(LDO1,2) LDO1 and -2 short-circuit current limit Output grounded 2 RDCH(LDO1,2) Discharge resistor LDO disabled by I C command ILKG(LDO1,2) Leakage current LDO off mA mV 40 dB 300 mA 300 2 A SIM LINEAR REGULATOR IQ(SIM) Quiescent current IO(SIM) Output current range Internally connected to OUT pin 8 Output voltage, selectable via I2C. Available output voltages: VO(SIM)TYP = 1.8 or 3 Dropout voltage, 8-mA load VO(SIM) SIM LDO output voltage A 20 0.2 Total accuracy, V(OUT): 3.2 V to 4.7 V, 8 mA -5% 5% Load regulation, load: 1 mA 8 mA, V(OUT) > VO(SIM) TYP + 0.5 V -3% 3% Line regulation, 5 mA load, V(OUT): VO(SIM) TYP + 0.5 V 4.7 V -2% 2% ISC(SIM) Short-circuit current limit Output grounded ILKG(SIM) Leakage current LDO off mA V V 20 mA 1 A 70 A PROGRAMMABLE OUTPUT VOLTAGE LDO'S: LDO3, LDO4, LDO5 IQ(LDO35) Quiescent current, only one of LDO3, LDO4, LDO5 is enabled IO(LDO35) Output current range IQ(LDO35) = I(VIN_LDO35) 100 Output voltage, selectable via I2C Available output voltages : VO(LDO35)TYP = 1.224 V to 4.46 V, 25 mV steps Dropout voltage, 100-mA load VO(LDO35) LDO3, LDO4, LDO5 output voltage 240 Total accuracy, 100 mA load V(VIN_LDO35) = 5 V -3% 3% Load regulation, V(VIN_LDO35) > VO(LDO35)TYP + load: 1 mA 50 mA 0.5 V -1% 1% Line regulation, 10 mA load, V(VIN_LDO35): VO(LDO35)TYP + 0.5 V 4.7 V -1% 1% ISC(LDO35) Short-circuit current limit Output grounded PSR(LDO35) PSRR at 10 kHz V(VIN_LDO35) > VO(LDO3,5) + 1 V, 50 mA load at output RDCH(LDO35) Discharge resistor LDO is disabled by I C command ILKG(LDO35) Leakage current LDO off 2 Product Folder Link(s): TPS65820 V mV 250 mA 40 dB 400 1 A Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated mA 11 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com ELECTRICAL CHARACTERISTICS - LINEAR REGULATORS (continued) Over recommended operating conditions (typical values at TJ = 25C), application circuit as in Figure 3 (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT RTC_OUT LINEAR REGULATOR IQ(RTC_OUT) Quiescent current for RTC LDO IO(RTC_OUT) Output current range Internally connected to OUT pin 8 Available output voltages: 2.6 V or 3.1 V Output voltage value, selectable via I2C. Dropout voltage, I(RTC_OUT) = -8 mA VO(RTC_OUT) ISH(RTC_OUT) ILKG(RTC_OUT) RTC_OUT output voltage A 20 200 Total accuracy, V(OUT): 2 V to 4.7 V, 8 mA load, sleep mode not set -5% 5% Load regulation, load: 1 mA 8 mA, 2 V < V(OUT) < 4.7 V -3% 3% Line regulation, 5 mA load V(OUT): 2 V 4.7 V -2% 2% Short-circuit current limit V(RTC_OUT) = 0 V Leakage current V(RTC_OUT) = 1.5 V, V(OUT) = 0 V TJ = 85C 880 20 TJ = 25C 250 Internally connected to VIN_LDO12 pin I(LDO0) = -1 mA mA V mV mA nA LDO0 LINEAR REGULATOR IQ(LDO0) Quiescent current IO(LDO0) Output current range 15 I(LDO0) = -150 mA Fixed output voltage value Output voltage 150 mA 300 mV 3.3 Dropout voltage, I(LDO0) = -150 mA VO(LDO0) A 160 V Total accuracy -3% 3% Line regulation, V(OUT): VO(LDO0)+ 0.5 4.7 V, I(LDO0) = -100 mA -1% 1% Load regulation, I(LDO0) = -10 mA -150 mA PSR(LDO0) PSRR at 20 kHz 150-mA load at output, V(VIN_LDO12) - VO(LDO1,2) = 1 V ISC(LDO0) Short-circuit current limit V(LDO0) = 0 V ILKG(LDO0) Leakage current LDO off -1.5% 1.5% 40 dB 300 mA 1 A LDO_PM LINEAR REGULATOR IQ(LD0_PM) Output current range VO(LDO_PM) Output voltage 20 Fixed output voltage value, V(OUT) > 4 V 3.3 Dropout voltage, I(LDOPM) = -12 mA 0.5 Total accuracy ILKG(LDOPM) 12 Leakage current LDO off Submit Documentation Feedback -5% mA V 0.7 V 5% 1 A Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 ELECTRICAL CHARACTERISTICS - SWITCHED MODE SM1 STEP-DOWN CONVERTER Over recommended operating conditions (typical values at TJ = 25C), VO(SM1) = 1.24 V, application circuit as in Figure 3 (unless otherwise noted). PARAMETER IQ(SM1) Quiescent current for SM1 IO(SM1) Output current range TEST CONDITIONS IQ(SM1) = I(VIN_ SM1), no output load MIN Not switching 10 SM1 OFF, set via I2C 600 mA Output voltage, selectable via I C, standby OFF Available output voltages: VO(SM1)TYP = 0.6 V to 1.8 V, adjustable in 40 mV steps VO(SM1) = VSBY(SM1), output voltage range, standby ON Available output voltages: VSBY(SM1) = 0.6 V to 1.8 V, adjustable in 40 mV steps Output voltage, PWM mode Total accuracy, VO(SM1)TYP = VSBY(SM1) = 1.24 V, V(VIN_SM1) = 3 V to 4.7 V; 0 mA IO(SM1) 600 mA -3% UNIT A 0.1 2 VO(SM1) TYP MAX V 3% Line regulation, V(VIN_SM1): 3 V 4.7 V, IO(SM1) = 10 mA 0.027 %/V Load regulation, V(VIN_SM1) = 4.7 V, IO(SM1): 60 mA 540 mA 0.139 %/A RDSON(PSM1) P-channel MOSFET on-resistance ILKG(PSM1) P-channel leakage current RDSON(NSM1) N-channel MOSFET on-resistance ILKG(PSM1) N-channel leakage current ILIM(SM1) P- and N-channel current limit 3 V < V(VIN_SM1) < 4.7 V 900 fS(SM1) Oscillator frequency PWM mode set 1.3 EFF(SM1) Efficiency V(VIN_SM1) = 4.2 V, PWM mode, IO(SM1) = 300 mA, VO(SM1) = 3 V 90% tSS(SM1) Soft start ramp time Converter OFFON, VO(SM1) : 5% 95% of target value 750 s tDLY(SM1) Converter turn-on delay GPIO1 pin programmed as SM1 converter enable control. Measured from V(GPIO1): LO HI 170 s V(VIN_SM1) = 3.6 V, 100% duty cycle set 310 500 A 0.1 V(VIN_SM1) = 3.6 V, 0% duty cycle set 220 330 1050 1200 1.7 Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 m A 5 1.5 m mA MHz 13 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com ELECTRICAL CHARACTERISTICS - SWITCHED MODE SM2 STEP-DOWN CONVERTER Over recommended operating conditions (typical values at TJ = 25C), VO(SM1) = 1.24 V, application circuit as in Figure 3 (unless otherwise noted). PARAMETER IQ(SM2) Quiescent current for SM2 TEST CONDITIONS IQ(SM2) = I(VIN_ SM2), no output load MIN TYP MAX Not switching A SM2 OFF, set via I2C IO(SM2) 0.1 Output current range VO(SM2) Output voltage UNIT 10 600 Output voltage, selectable via I2C, standby OFF Available output voltages: VO(SM2)TYP = 1 V to 3.4 V, adjustable in 80 mV steps VO(SM2) = VSBY(SM2), output voltage range, standby ON Available output voltages: VSBY(SM2) = 1 V to 3.4 V, adjustable in 80 mV steps Total accuracy, VO(SM2)TYP = VSM2(SBY) = 1.8 V, V(VIN_SM2) = greater of [3 V or (VO(SM2) + 0.3 V)] to 4.7 V; 0 mA IO(SM2) 600 mA -3% mA V 3% Line regulation, V(VIN_SM2) = greater of [3 V or (VO(SM2) + 0.3 V)] to 4.7 V; 0 mA IO(SM2) 600 mA 0.027 %/V Load regulation, V(VIN_SM2) = 4.7 V, IO(SM2): 60 mA 540 mA 0.139 RDSON(PSM2) P-channel MOSFET on-resistance ILKG(PSM2) P-channel leakage current RDSON(NSM2) N-channel MOSFET on-resistance ILKG(PSM2) N-channel leakage current ILIM(SM2) P- and N-channel current limit 3 V < V(VIN_SM2) < 4.7 V, TPS65820 900 fS(SM2) Oscillator frequency PWM mode set 1.3 EFF(SM2) Efficiency V(VIN_SM2) = 4.2 V, IO(SM2) = 300 mA, VO(SM2) = 3 V tSS(SM2) Soft start ramp time Converter OFFON, VO(SM2) : 5% 95% of target value tDLY(SM2) Converter turn-on delay V(VIN_SM2) = 3.6 V, 100% duty cycle set 310 %/A 500 A 0.1 V(VIN_SM2) = 3.6 V, 0% duty cycle set 220 m 330 m 1050 1200 mA A 5 1.5 1.7 MHz 90% GPIO2 pin programmed as SM2 converter enable control. Measured from V(GPIO2): LO HI 750 s 170 s ELECTRICAL CHARACTERISTICS - GPIOs Over recommended operating conditions (typical values at TJ = 25C), application circuit as in Figure 3 (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT GPIO1-3 VOL Low level output voltage GPIO0 IOL = 20 mA IOGPIO Low level sink current into GPIO1, 2, 3 V(GPIOn) = V(OUT) VIL Low level input voltage ILKG(GPIO) Input leakage current 14 0.5 20 0.4 V(GPIOn) = V(OUT) Submit Documentation Feedback V mA 1 V A Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 ELECTRICAL CHARACTERISTICS - ADC Over recommended operating conditions (typical values at TJ = 25C), V(ADC_REF) =2.535v if external reference voltage is used,application circuit as in Figure 3 (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ANALOG INPUTS VRNG(CH1_5) Full scale input range Ch1 to Ch5 Positive inputs (active clamp), full scale ~ 2.535 V 0 V(ADC _REF) V VRNG(CH6_8) Full scale input range Ch6 to Ch8 Positive inputs (active clamp), full scale ~4.7 V 0 VINTREF x 1.854 V CIN(ADC) Input capacitance (all channels) RINADC(CH1_5) Input resistance (Ch1 to Ch5) ILKGADC(CH1_5) Leakage current (Ch1 to Ch5) RINADC(CH6_8) Input resistance (Ch6 to Ch8) ILKGADC(CH6_8) Leakage current (Ch6 to Ch8) Internal voltage proportional to junction temperature TJ = 25C, ADC channel 5 input voltage VCH5(ADC) 15 pF 1 M 100 430 540 10 1.895 Temperature coefficient nA k A V 6.5 mV/ C 10 Bits DC ACCURACY RES(ADC) Resolution MCD(ADC) No missing codes SAR ADC INL(ADC) Integral linearity error 3 LSB DNL(ADC) Differential non-linearity error 1 LSB SPECIFIED Difference between the first code transition (00...00 to 00...01) from the ideal AGND + 1 LSB OFFZERO(ADC) Offset error OFFCH(ADC) Offset error match between channels GAINADC Gain error Deviation in code from the ideal full scale code (11...111) for the full scale voltage GAINCH(ADC) Gain error match Any two channels 5 LSB 5 LSB 8 LSB 2 LSB THROUGHPUT SPEED ADCCLK Sampling clock ADCTCONV Conversion time 600 750 900 kHz Sampling, convertion and setting Rs 200 K for CH1, CH2, CH3; Rs 500 for CH6, CH7, CH8 44 59 68 s 2.53 2.535 2.54 V REFERENCE VOLTAGES VINTREF Internal ADC reference voltage TA = 25C, V(ADC_REF) = VINTREF when internal ADC reference is selected ISHRT(INTREF) Internal reference short-circuit limit V(ADC_REF) = AGND1, internal reference enabled via I2C VREF(DRIFT) ADC internal reference temperature drift IQ(ADC) ADC Internal reference quiescent current Measured at OUT pin (internal reference) or ADC_REF pin (external reference) ANLG2 pin internal pullup current source ADC channel 2 bias current, set via I2C register ADC_WAIT bits (ADC_CH2I_D1_1, ADC_CH2I _D2) I(ANLG2) 6 50 0 01 10 10 50 11 00 I(ANLG1) ANLG1 pin internal pullup current source ADC channel 1 bias current, set via I2C register ADC_WAIT bits (BATIDI_D1, BATIDI _D2) A A 60 -25% 25% V(OUT) * 1.2 500 kW 01 10 10 50 11 Total accuracy 100 ppm/C 40 00 Total accuracy, relative to selected value mA A 60 10% 10% Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 15 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com ELECTRICAL CHARACTERISTICS - ADC (continued) Over recommended operating conditions (typical values at TJ = 25C), V(ADC_REF) =2.535v if external reference voltage is used,application circuit as in Figure 3 (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT INTERNAL REFERENCE POWER CONSUMPTION PDACTIVE Power dissipation Conversion active PDARMED Power dissipation Not converting 2.3 mW 0.43 mW TRIGGER TIMING CHARACTERISTICS tDELAY(TRG) Trigger delay time accuracy Time range, set via I2C register ADC_DELAY Relative to typical value set via I2C tWAIT(TRG) Trigger wait time accuracy Time range, set via I2C register ADC_WAIT Relative to typical value set via I2C 0 750 -20% 20% 0 20.48 -20% 20% uS mS ELECTRICAL CHARACTERISTICS - LED AND PWM DRIVERS Over recommended operating conditions (typical values at TJ = 25C), application circuit as in Figure 3 (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT SM3 BOOST CONVERTER, WHITE LED CONSTANT CURRENT DRIVER VVIN(SM3) Input Voltage range V(OUT) = 3.3 V VOVP3 Output overvoltage trip OVP detected at V(SM3) > VOVP3 VHYS(OVP3) Output overvoltage hysteresis OVP not detected at V(SM3) < VOVP3 - VHYS(OVP3) VSM3REF LED current sense threshold LED current below regulation point at V(FB3) < VSM3REF IO(SM3) LED current Current range, Vin = 3.3 V, 3 IO(SM3) + 26.5 V(SM3REF) RFB3 LED switch duty cycle Duty cycle range FREP_SM3 LED switch duty cycle pattern repetition rate 256 pulses within repetition SM3_LF_OSC = 0 rate time SM3_LF_OSC = 1 LED switch MOSFET leakage RDSON(L3) Power stage MOSFET on-resistance ILKG(L3) Power stage MOSFET leakage IMAX(L3) Power stage MOSFET current limit V 30 V 252 V 260 mV 0 25 mA -10% 10% DSM3SW = 0% to 99.6%, set via I2C, 256 steps 0.4% minimum step DSM3SW ILKG(SM3SW) 4.7 1.8 244 Total accuracy, IO(SM3) = 10 mA RDSON(SM3SW LED switch MOSFET on-resistance ) 29 122 Hz 183 V(OUT) = 3.6 V; I(SM3SW) = 20 mA 1 2 A 1 V(OUT) = 3.6 V; I(L3) = 200 mA 300 600 400 500 m A 1 3 V < V(OUT) < 4.7 V 600 mA 0.5 V PWM DRIVER, PWM OPEN DRAIN OUTPUT VOL(PWM) Low level output voltage I(PWM)= 150 mA 2 FPWM PWM driver frequency Set via I C, FPWM = 0.5/1/1.5/2/3/4.5/7.8/15.6 Frequency range Total accuracy, relative to selected value DPWM PWM driver duty cycle -20% Hz 20% DPWM = 6.25% to 100%, set via I2C, 6.25% minimum step Duty cycle range LED_PWM DRIVER, LED_PWM OPEN DRAIN OUTPUT DLEDPWM = 0% to 99.6%, set via I2C, 256 steps 0.4% minimum step DLEDPWM LED_PWM driver duty cycle Duty cycle range FREP(LEDPWM) LED_PWM driver duty cycle pattern repetition rate 256 pulses within repetition SM3_LF_OSC = 0 rate time SM3_LF_OSC = 1 16 Submit Documentation Feedback 122 180 Hz Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 ELECTRICAL CHARACTERISTICS - LED AND PWM DRIVERS (continued) Over recommended operating conditions (typical values at TJ = 25C), application circuit as in Figure 3 (unless otherwise noted) PARAMETER TEST CONDITIONS VOL(LEDPWM) Low level output voltage VOH(LEDPWM) High level output voltage MIN TYP I(LED_PWM) = 150 mA MAX UNIT 0.5 V 6 V RGB DRIVER, RED/GREEN/BLUE OPEN DRAIN OUTPUTS tFLASH(RGB) tFLASH(RGB) = 1 to 8 s, set via I2C, 0.5 s minimum step, 8 steps Flashing period range Flashing period Total accuracy tFLASH(ON) -20% Total accuracy, relative to selected value -20% s 20% DRGB = 0% to 99.98%, set via I2C, 3.23% minimum step Duty cycle Duty cycle range, value selectable via I2C RGB output sink current V(RED) = V(GREEN) = V(BLUE) = 2 V, set via I2C RGB_ISET1,0 VOL(RGB) Low-level output voltage Output low voltage, 8-mA load, RED/GREEN/BLUE PINS ILKG(RGB) Output off leakage current V(RED)=V(GREEN)=V(BLUE) = 4.7 V, all drivers disabled DRGB 20% Set via I2C, tFLASH(ON) = 0.1/0.15/0.2/0.25/0.3/0.4/ 0.5/0.6 s Flash on time range, value selectable by I2C Flash on time s 00 (Driver set to OFF) ISINK(RGB) 01 2.4 4 5.6 10 4.8 8 11.2 11 7 12 16.6 0.3 mA V 1 A L2 VIN_SM2 SM2 AGND1 VIN_SM1 L1 PGND1 SM1 GPIO1 49 48 47 46 45 44 43 PGND2 50 GPIO2 52 51 RED 56 GPIO3 GREEN PIN ASSIGNMENT 55 54 53 BLUE 1 42 SM3 SCLK 2 41 FB3 SDA T 3 40 SM3SW R TC_OUT 4 39 L3 5 38 PGND3 6 37 LDO1 SIM USB 36 LED_PWM OUT 8 35 VIN_LDO02 OUT AC 7 GROUND PAD 11 32 LDO0 TS 12 TMR 13 DPPM 14 24 ANLG1 23 25 26 AGND2 LDO5 21 22 RESPWRON 20 INT TRSTPWON 18 19 BA T BA T 16 17 AGND0 HOT_RST 15 27 28 LDO3 LDO2 ISET1 LDO4 PWM 33 ANLG2 34 10 ADC_REF 9 LDO_PM 31 SYS_IN 30 LDO35_REF 29 VIN_LDO35 Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 17 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com PIN DESCRIPTION, REQUIRED EXTERNAL COMPONENTS NAME PIN I/O AC 7 I ADC_REF 22 I/O AGND0 16 - AGND1 AGND2 ANLG1 24 ANLG2 BAT DESCRIPTION EXTERNAL REQUIRED COMPONENTS (SEE APPLICATION DIAGRAM) Adapter charge input voltage, connect to AC_DC adapter positive output terminal (dc voltage) 1-F (minimum) capacitor to AGND1 pin to minimize overvoltage transients during AC power hot-plug events. ADC internal reference filter or ADC external reference input 4.7-F (minimum) to 10-F (maximum) capacitor connected to AGND2 pin Analog ground connection Connect to analog ground plane 48 Analog ground pin Connect to analog ground plane 25 Analog ground pin Connect to analog ground plane I Analog input to ADC, programmable current source output Can be used to monitor additional system or pack parameters 23 I Analog input to ADC, programmable current source output Can be used to monitor additional system or pack parameters 17, 18 I/O Battery power Connect to battery positive terminal. Connect 10-F capacitor (minimum) from BAT pin to AGND1 pin BLUE 1 O Programmable blue driver, open drain output, current sink output when active. Connect to BLUE input of RGB LED DPPM 14 I Dynamic power path management set-point External resistor from DPPM pin to AGND1 pin sets the DPPM regulation threshold. 1 nF (minimum) capacitor to from DPPM to AGND1 sets BAT to OUT short-circuit blanking delay when battery is hot-plugged into system FB3 41 I/O White LED duty cycle switch output, LED current setting External resistor from FB3 pin to PGND3 pin sets LED peak current. Connect 100-pF (minimum) filter capacitor to PGND3 pin. HOT_RST 15 I/O Hardware reset input, reset generated when connected to ground Connect to an external push-button switch GPIO1 43 I/O General purpose programmable I/O Example: External interrupt request to host (INT: HILO) GPIO2 53 I/O General purpose programmable I/O example: Set SM1 and SM2 converters in standby mode GPIO3 54 I/O General purpose programmable I/O Example: ADC conversion start trigger GREEN 56 O Programmable LED driver, open-drain output, current sink output when active Connect to GREEN input of RGB LED INT 19 O Interruption pin, open-drain output Connect 100-k external pullup resistor between INT and OUT. INT pin is LO when interrupt is requested by TPS65820. ISET1 11 I Current set point when charging in auto External resistor from ISET1 pin to AGND1 pin sets charge mode with AC selected. Precharge and current value charge termination set point for all charge modes L1 46 O SM1 synchronous buck converter power stage output 3.3-H inductor to SM1 pin L2 51 O SM2 synchronous buck converter power stage output 3.3-H inductor to SM2 pin L3 39 O Drain of the integrated boost power stage switch 4.7-H inductor to OUT pin, external Schottky diode to SM3 pin LDO_PM 10 O General-purpose LDO output 1-F (minimum) capacitor to AGND1 pin LDO0 32 O LDO0 output, fixed voltage 1-F (minimum) capacitor to AGND1 LDO1 37 O LDO1 output 1-F (minimum) capacitor to AGND1 LDO2 33 O LDO2 output 1-F (minimum) capacitor to AGND1 LDO3 28 O LDO3 output 2.2-F (minimum) capacitor to AGND2 LDO35_REF 30 I Linear regulators LDO3-5 reference filter 100-nF capacitor to AGND2 LDO4 27 O LDO4 output 2.2-F (minimum) capacitor to AGND2 LDO5 26 O LDO5 output 2.2-F (minimum) capacitor to AGND2 LED_PWM 36 O PWM driver output, open-drain Can be used to drive a keyboard backlight LED OUT 8, 9 O Power path output. Connect to system main power rail (system power bus) 10-F capacitor to AGND1 pin 18 Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 NAME PIN I/O DESCRIPTION EXTERNAL REQUIRED COMPONENTS (SEE APPLICATION DIAGRAM) PGND1 45 - SM1 synchronous buck converter power ground Connect to power ground plane PGND2 52 - SM1 synchronous buck converter power ground Connect to power ground plane PGND3 38 - White LED driver power ground input Connect to a power ground plane PWM 34 O PWM driver output, open-drain Can be used to drive a vibrator or other external functions RED 55 O Programmable LED driver, open drain output, current sink output when active. Connect to RED input of RGB LED RESPWRON 21 O System reset, open-drain output 100-k external pullup resistor to OUT. RESPWRON pin is LO when TPS65820 is resetting the system. RTC_OUT 4 O Low-leakage LDO output. Can be connected to a super-capacitor or secondary cell, if used as a RTC backup output. 1-F (minimum) capacitor to AGND1 pin or supercap SCLK 2 I I2C interface clock line 2-k pullup resistor to OUT pin SDAT 3 I/O I2C interface data line 2-k pullup resistor to OUT pin SIM 5 O General-purpose LDO output 1-F (minimum) capacitor to AGND1 pin SM1 44 I SM1 synchronous buck converter output voltage sense LC filter: 10-F capacitor to PGND1 pin SM2 49 I SM2 synchronous buck converter output voltage sense LC filter: 10-F capacitor to PGND2 pin SM3 42 I White LED driver output overvoltage detection Connect 1-F capacitor to PGND3 pin. Connect SM3 pin to the positive side of white LED ladder. SM3SW 40 I Integrated white LED duty cycle switch input Connect to negative side of external LED ladder SYS_IN 31 I System power bus low-voltage detection External resistive divider sets minimum system operational voltage. TPS65820 enters sleep mode when voltage below minimum system voltage threshold is detected. 1-nF filter capacitor to AGND1 recommended. TMR 13 I Charge safety timer program input External resistor from TMR pin to AGND1 pin sets the charge safety timer time-out value TRSTPWON 20 I System reset pulse duration setting 100-nF (minimum) capacitor to AGND1. External capacitor from TRSTPWON pin to AGND1 pin sets RESPWRON pulse width. TS 12 I/O Temperature sense input, current source output Connect to battery pack thermistor to sense battery pack temperature USB 6 I USB charge input voltage, connect to USB port positive power output 1-F (minimum) capacitor to AGND1 pin, to minimize overvoltage transients during USB power hot-plug events. VIN_LDO35 29 - Input to LDOs 3 to 5 1-F (minimum) decoupling capacitor to AGND2 VIN_LDO02 35 - Positive supply input for LDO0, LDO1, LDO2 1-F (minimum) decoupling capacitor to AGND1 VIN_SM1 47 - SM1 synchronous buck converter positive 10-F capacitor to PGND1 pin supply input VIN_SM2 50 - SM2 synchronous buck converter positive 10-F capacitor to PGND2 pin supply input Exposed thermal pad 57 - There is an internal electrical connection between the exposed thermal pad and AGNDn pins of the IC. The exposed thermal pad must be connected to the same potential as the AGND1 pin on the printed circuit board. Do not use the thermal pad as the primary ground input for the IC. AGNDn pins must be connected to a clean ground plane at all times. Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 19 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com APPLICATION DIAGRAM + VSIM VRTC_OUT VL DO_PM VLDO0 VLDO1 VLDO2 AC_DC ADAPTER OUTPUT - GND USB POWER + C1 10uF - 7 AC C2 10uF GND C4 C5 VOUT VOUT 6 USB C3 2.2uF Supercap TPS65820 OUT 9 5 SIM ISET1 11 4 RTC_OUT 1uF BAT 17 A1 C6 C7 1uF 1uF C8 4.7uF C9 4.7uF VOUT DPPM 14 33 LDO2 C11 1uF C12 0.1uF C13 2.2uF VLDO 3 V LDO5 C14 2.2uF C15 2.2uF A2 R1 VOUT C16 1nF A1 C17 210K R6 100K R5 100K 4.7uF VOUT LSM2 VSM2 3.3uH C19 10uF P2 LSM3 L3 39 4.7uH VOUT D1 C28 1 uF P3 SM3 42 2 SCLK WHITE LEDS 3 SDAT FB3 41 19 INT PGND3 38 21 RESPWRON C18 100 pF RFB3 24 ANLG1 C27 100pF 10 P3 PWM 34 LED_PWM 36 23 ANLG2 EXTERNAL PERIPHERALS RED 55 43 GPIO1 VOUT GREEN 56 BLUE 1 53 GPIO2 54 GPIO3 GND C22 10uF C21 10uF PGND2 52 22 ADC_REF A2 VOUT VSM1 3.3uH SM3SW 40 31 SYS_IN R4 A1 LSM1 L2 51 SM2 49 20 TRSTPWON 2K Battery P1 15 HOT_RST 2K 37.4K VIN_SM2 50 26 LDO5 25 AGND2 R3 49.9K SM1 44 PGND1 45 28 LDO3 27 LDO4 R2 RTMR RDPPM VIN_SM1 47 L1 46 30 LDO35_REF 100K C25 10uF C23 47nF 29 VIN_LDO35 CTRSTPWON 0.1uF 1K C24 0.22uF TS 12 TMR 13 32 LDO0 37 LDO1 48 AGND1 VLDO4 SYSTEM POWER BUS RSET BAT 18 35 VIN_LDO02 10 LDO_PM C10 4.7uF C26 22uF OUT 8 PWRGND 57 AGND0 16 RGB LED A0 A1 NOTES: RESET ADC EXTERNAL ANALOG INPUTS I2C CONFIGURABLE GPIO'S 1) RESISTOR VALUES IN OHMS 2) THE FOLLOWING PARAMETERS ARE PROGRAMMED : ALARM EXTERNAL HOST DATA CLOCK - RTMR =49. 9K: 6 HOUR CHARGE SAFETY TIMER , 30 MIN PRE -CHARGE SAFETY TIMER - RSET =1K: 1A CHARGE CURRENT (NO SCALING, INPUT LIMIT=2.5A), 100mA TERMINATION AND PRE -CHARGE CURRENTS - R FB3=10 OHMS: 25mA WHITE LED CURRENT - C TRSTPWON =100nF : 100mSEC RESET PULSE WIDTH - R DPPM =37.4K: V (DPPM ) =4.3V 3) THE CAPACITOR VALUES SHOWN IN THE APPLICATION DIAGRAM MAY BE LARGER THAN THE MINIMUM REQUIRED VALUES INDICATED IN THE PIN DESCRIPITON TABLE 4) THE VALUES SHOWN IN THE APPLICATION DIAGRAM MATCH THE COMPONENT VALUES USED IN THE HPA 129 EVM, SEE DESIGN NOTES SECTION FOR COMPONENT SELECTION DETAILS GND A1 A2 A3 P1 P2 P3 Figure 3. TPS65820 Application Diagram, Recommended External Components 20 Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 TYPICAL CHARACTERISTICS - POWER PATH MANAGEMENT Measured with Application Circuit shown in Figure 3, unless otherwise noted SWITCHING FROM AC TO BATTERY ON AC REMOVAL SWITCHING FROM USB TO BATTERY ON AC REMOVAL USB = 5 V, BAT = 3.3 V AC = 5 V, BAT = 3.3 V IBAT IBAT VAC VUSB VOUT VBAT VOUT Figure 4. VBAT Figure 5. Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 21 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com TYPICAL CHARACTERISTICS - LINEAR REGULATORS 0, 1, 2 Measured with Application Circuit shown in Figure 3, unless otherwise noted LOAD REGULATION vs JUNCTION TEMPERATURE LINE REGULATION vs JUNCTION TEMPERATURE -0.500 0.25 VIN_LDO02 = 3.65 V, Load = 10 mA to 150 mA, CO(LDO02) = 1 mF 0.2 -0.600 Line Regulation - % Load Regulation - % -0.550 -0.650 -0.700 0.15 0.1 -0.750 VIN_LDO02 = 3.8 V to 4.7 V, Load = 10 mA, CO(LDO02) = 1 mF 0.05 -0.800 -0.850 0 0 20 40 60 80 100 120 0 140 20 40 60 80 100 120 140 120 140 TJ - Junction Temperature - C TJ - Junction Temperature - C Figure 6. Figure 7. OUTPUT VOLTAGE vs JUNCTION TEMPERATURE DROPOUT VOLTAGE vs JUNCTION TEMPERATURE 140 3.5 LDO 0 VIN_LDO 02 = 3.3 V, Load = 150 mA, CO(LDO02) = 1 mF 130 Dropout Voltage - mV VO - Output Voltage - V 3 2.5 VIN_LDO 02 = 3.65 V, Load = 10 mA, VO(LDO 0) = 3.3 V, VO(LDO 1,2) = 1.225 V 2 120 110 100 90 LDO 1 LDO 2 1.5 80 70 1 0 20 40 60 80 100 120 140 0 Figure 8. 22 20 40 60 80 100 TJ - Junction Temperature - C TJ - Junction Temperature - C Figure 9. Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 TYPICAL CHARACTERISTICS - LINEAR REGULATORS 3, 4, 5 Measured with Application Circuit shown in Figure 3, unless otherwise noted LOAD REGULATION vs JUNCTION TEMPERATURE LINE REGULATION vs JUNCTION TEMPERATURE -0.010 -0.5 VIN_LDO 35 = 3 V, Load = 10 mA to 150 mA, CO(LDO 35) = 1 mF -0.55 -0.012 Line Regulation - % Load Regulation - % -0.6 VIN_LDO 35 = 3.3 V to 4.7 V, Load = 100 mA, CO(LDO 35) = 1 mF -0.011 -0.65 -0.70 -0.75 -0.80 -0.013 -0.014 -0.015 -0.85 -0.016 -0.90 -0.017 -0.95 -1 -0.018 0 20 40 60 80 100 TJ - Junction Temperature - C 120 140 0 40 60 80 100 TJ - Junction Temperature - C Figure 10. Figure 11. OUTPUT VOLTAGE vs JUNCTION TEMPERATURE DROPOUT VOLTAGE vs JUNCTION TEMPERATURE 1.2325 120 140 140 VIN_LDO35 = 4.7 V, Load = 10 mA, VO (LDO35) = 1.228 V, 1.232 130 CO(LDO35) = 1 mF 1.2315 1.231 Dropout - mV VO - Output Voltage - V 20 1.2305 1.23 VIN_LDO35 = 3.3 V, Load = 150 mA, CO(LDO35) = 1 mF 120 110 1.2295 100 1.229 1.2285 0 20 40 60 80 100 120 140 90 0 TJ - Junction Temperature - C 20 40 60 80 100 120 140 TJ - Junction Temperature - C Figure 12. Figure 13. Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 23 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com TYPICAL CHARACTERISTICS - SM1 AND SM2 BUCK CONVERTERS Measured with Application Circuit shown in Figure 3, unless otherwise noted PWM MODE EFFICIENCY vsOUTPUT CURRENT EFFICIENCY IN AUTOMATIC PWM/PFM MODE 92 100 90 90 80 70 Efficiency - % Efficiency - % 88 86 84 82 60 50 40 30 VIN_SM2 = 4.6 V, VO (SM2) = 1.8 V, L = 3.3 mH. CO(SM2) = 10 mF 80 78 20 VIN_SM1 = 4 V, VO(SM1) = 1.24 V, 10 L = 3.3 mH, CO(SM1) = 10 mF 0 76 0 0.1 0.2 0.4 0.3 0.5 IO - Output Current - A 0.6 0.7 0 0.1 0.5 Figure 14. Figure 15. PFM OPERATION PFM LOW RIPPLE OPERATION AC = 5 V, VIN_SM2 = 4.6 V, VO(SM2 = 1.8 V 0.6 AC = 5 V, VIN_SM2 = 4.6 V, VO(SM2 = 1.8 V IO(SM2) L = 3.3 mF, CO(SM2) = 10 mF IO(SM2) L = 3.3 mF, CO(SM2) = 10 mF Figure 16. 24 0.2 0.3 0.4 IO - Output Current - A Figure 17. Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 TYPICAL CHARACTERISTICS - DRIVERS Measured with Application Circuit shown in Figure 3, unless otherwise noted LINE TRANSIENT LOAD TRANSIENT VIN_SM2 VO(SM2) VO_SM2 AC = 5 V, VIN_SM2 = 3 V (DC) + 1 V (AC), VO(SM2) = 1.8 V, IO(SM2) = 100 mA, L = 3.3 mF, CO(SM1) = 10 mF, CH1 = VIN_SM2, CH2 = VO(SM2) AC = 5 V, VIN_SM2 = 4 V, VO(SM2) = 1.8 V, IO(SM2) = 0 mA to 600 mA, IO(SM2) L = 3.3 mF, CO(SM1) = 10 mF, CH1 = VO_SM2, CH3 = IO(SM2) Figure 18. Figure 19. TRANSIENT - SM1 STARTUP TRANSIENT - SM2 STARTUP AC = 5 V, VIN_SM2/SM2 = 4 V, VO(SM2) = 1.8 V, IO(SM2) = 600 mA, SM2 Voltage SM1 Voltage AC = 5 V, VIN_SM2/SM2 = 4 V, VO(SM2) = 1.8 V, IO(SM2) = 600 mA, L = 3.3 mF, CO(SM1) = 10 mF L = 3.3 mF, CO(SM1) = 10 mF SM1 Current SM2 Current Figure 20. Figure 21. SM3 WHITE LED DRIVER SOFT START SM3 LED CURRENT vs PWM DUTY CYCLE BAT = 4 V, DC = 0% L3 = 4.7 mF, CO(SM3) = 10 mF, CH1 = L3, CH4 = SM3 BAT = 4 V, DC = 0% L3 = 4.7 mF, CO(SM3) = 10 mF, CH1 = L3, CH4 = SM3 Figure 22. Figure 23. Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 25 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com SERIAL INTERFACE Overview The TPS65820 is compatible with a host-controlled environment, with internal parameters and status information accessible via an I2C interface. An I2C communication port provides a simple way for an I2C compatible host to access system status information and reset fault modes, functioning as a SLAVE port enabling I2C compatible hosts to WRITE to or to READ from internal registers. The TPS65820 I2C port is a 2-wire bidirectional interface using SCL (clock) and SDA (data) pins; the SDA pin is open drain and requires an external pullup. The I2C is designed to operate at SCL frequencies up to 400 kHz. The standard 8 bit command is supported, the CMD part of the sequence is the 8 bit register address to READ from or to WRITE to. Register Default Values The internal TPS65820 registers are loaded during the initial power-up from an internal, non-volatile memory bank. The power-up default values are described in the sections detailing the registers functionality. The register contents remain intact as long as OUT pin voltage remains above the internal UVLO threshold, VUVLO When the OUT pin voltage falls below the VUVLO threshold all register bits are reset to the internal power up default. I2C Address The I2C specification contains several global addresses, which the slaves on the bus are required to respond to. The TPS65820 only responds (ACK) to addresses: 0x90 and 0x91 and does not respond (NACK) to any other address. Table 1. TPS65820 I2C Read/Write Address BYTE TPS65820 I2C WRITE ADDRESS 2 TPS65820 I C READ ADDRESS I/O DATA BUS BIT MSB 6 5 4 3 2 1 LSB 1 0 0 1 0 0 0 0 1 0 0 1 0 0 0 1 B7 B6 B5 B4 B3 B2 B1 B0 Incremental Read The TPS65820 does not support incremental read operations. Each register must be accessed in a single read operation. I2C Bus Release The TPS65820 I2C engine does not create START or STOP states on the I2C bus during normal operation. Sleep Mode Operation When the sleep mode is set SDAT is held LO by the TPS65820. The overall system operation is not affected, as in sleep mode all TPS65820 integrated supplies are disabled and no power is available for any external devices connected to the TPS65820 SDAT pin. When sleep mode ends the SDAT pin is released before the TPS65820 integrated regulated supplies are enabled. See section on System Sequencing and TPS65820 Operating Modes for additional details on sleep mode operation. I2C Bus Error Recovery The I2C bus specification does not define a method to be used when recovering from a host side bus error. During a read operation the SDA pin can be left in a LO state if the host has not sent enough SCL pulses to complete a transaction (i.e., host side bus error). The TPS65820 clears any SDA LO condition if 10 SCL pulses are sent by the host, enabling recovery from host side bus error events. I2C Communication Protocol The following conventions are used when describing the communication protocol: 26 Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 Table 2. I2C Naming Conventions Used CONDITION CODE START sent from host S STOP sent from host P TPS65820 I2C slave address sent from host, bus direction set from host to TPS65820 (WRITE) hA0 TPS65820 register address sent from TPS65820, bus direction is from TPS65820 to host (READ) hA1 2 Non-valid I C slave address sent from host hA_N Valid TPS65820 register address sent from host HCMD Non-valid TPS65820 register address sent from host HCMD_N I/O data byte (8 bits) sent from host to TPS65820 hDATA I/O data byte (8 bits) sent from TPS65820 to host bqDATA Acknowledge (ACK) from host hA Not acknowledge (NACK) from host hN Acknowledge (ACK) from TPS65820 bqA Not acknowledge (NACK) from TPS65820 bqN STOP CONDITION (P) START CONDITION (S) STOP CONDITION (P) START CONDITION (S) BIT 7 MSB BIT0 LSB BIT 6 ACKNOWLEDGE STOP CONDITION (hA or bqA ) (P) SCL STOP CONDITION (P) START CONDITION (S) BIT 7 MSB BIT 6 SDA DATA CHANGE ALLOWED SCL BIT 7 MSB BIT 6 BIT 5-1 BIT 0 LSB NOT STOP ACKNOWLEDGE CONDITION (hN or bqN) (P) SDA SCL DATA LINE STABLE SDA Figure 24. I2C operation waveforms For normal data transfers, SDA is allowed to change only when SCL is low, and one clock pulse is used per bit of data. The SDA line must remain stable whenever the SCL line is high, as SDA changes when SCL is high are reserved for indicating the start and stop conditions. Each data transfer is initiated with a start condition and terminated with a stop condition. When addressed, the TPS65820 device generates an acknowledge bit after the reception of each byte by pulling the SDA line Low. The master device (microprocessor) must generate an extra clock pulse that is associated with the acknowledge bit. After the acknowledge/not acknowledge bit the TPS65820 leaves the data line high, enabling a STOP condition generation. I2C Read and Write Operations The TPS65820 supports the standard I2C one-byte write. The basic I2C read protocol has the following steps: * Host sends a start and sets TPS65820 I2C slave address in write mode * TPS65820 ACKs that this is a valid I2C address and that the bus is configured for write * Host sends TPS65820 register address * TPS65820 ACKs that this is a valid register and stores the register address to be read * Host sends a repeated start and TPS65820 I2C slave address, reconfiguring the bus for read * TPS65820 ACKs that this is a valid address and that bus is reconfigured * Bus is in read mode, TPS65820 starts sending data from selected register Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 27 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com The I2C write protocol is similar to the read, without the need for a repeated start and bus being set in write mode. In a WRITE it is not necessary to end each 1 byte WRITE command with a STOP, a START has the same effect (repeated start). SCLK SDAT ... A6 ... .. A0 R/W ACK 0 Start R7 0 Slave Address hA0 .. ... R0 Register Address hCMD bqA ACK A6 .. ... A0 R/W ACK 1 0 0 bqA Slave Address hA1 S D7 .. D0 Slave Drives the Data bqDATA bqA ACK Master Drives ACK and Stop hA P Repeated Start, can be replaced by a STOP and START ... SCLK SDAT Start A6 A5 ... A4 ... A0 R/W ACK 0 0 Slave Address hA0 R7 R6 R5 ... ... R0 ACK 0 Register Address hCMD bqA D7 D6 D5 ... Host Sends Data hDATA bqA D0 ACK 0 bqA P Figure 25. I2C read and write operations The host can complete a READ or a WRITE sequence with either a STOP or a START. Valid Write Sequences The TPS65820 always ACKs its own address. If the CMD points to an allowable READ or WRITE address, the bq writes the address into its RAM address register and sends an ACK. If the CMD points to a non-allowed address, bq does NOT write the address into its RAM address register, and sends an NACK. S S S hA0 hA0 hA0 bqA bqA bqA hCMD hCMD_N bqA bqN One-Byte Write The data is written to the addressed register when the bq ACK ending the one-byte write sequence is received. The host can cancel a WRITE by sending a STOP or START before the trailing edge of the bq ACK clock pulse. S 28 hA0 bqA hCMD bqA hDATA Submit Documentation Feedback bqA Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 Valid Read Sequences The TPS65820 always ACKs its own address. S hA1 bqA Upon receiving hA1, TPS65820 starts at wherever the RAM address register is pointing. The START and the STOP both act as priority interrupts. If the host has been interrupted and is not sure where it left off it can send a STOP and reset the TPS65820 state machine to the WAIT state; once in WAIT state TPS65820 ignores all activity on the SCL and SDA lines until it receives a START. A repeated START and START in the I2C specification are both treated as a START. S S S hA0 hA0 hA1 bqA bqA bqA hCMD hCMD bqDATA bqA bqA hN P S P hA1 bqA bqDATA hN P Non-Valid Sequences Incremental read sequences S hA1 bqA bqDATA hA bqDATA hA bqDATA hA bqDATA hA ... bqDATA hA P START and non-hA0 or non-hA1 Address A START followed by an address which is not bqA0 or bqA1 is NACKED S hA_N bqN Attempt to Specify Non-Allowed READ Address If the CMD points to a non-allowed READ address (reserved registers), bq sends a NACK back to the host and it does not load the address in the RAM address register. Note that TPS65820 NACKS whether a stop is sent or not. S S hA0 hA0 bqA bqA hCMD_N hCMD_N bqN bqN P Attempt to Specify Non-Allowed WRITE Address If the host attempts to WRITE to a READ-ONLY or non-accessible address TPS65820 ACKS the CMD containing the allowed READ address, loads the address into the address register and NACKS after the host sends the next data byte. After issuing the NACK TPS65820 returns to WAIT state. A subsequent hA1 READ could read this address. S hA0 bqA hCMD bqA hDATA bN Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 29 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com TPS65820 INTERNAL REGISTER MAP hex NAME DESCRIPTION ADDITIONAL DETAILS 0 RESERVED_01 RESERVED FACTORY ONLY 1 RESERVED_02 RESERVED FACTORY ONLY 2 PGOOD Output voltage status for linear regulators and dc/dc buck converters 3 INTMASK1 Interrupt request masking settings 4 INTMASK2 Interrupt request masking settings 5 INT_ACK1 Masked interrupt request register, latched 6 INT_ACK2 Masked interrupt request register, latched 7 PGOODFAULT_MASK System reset masking settings 8 SOFT_RESET Generates a software reset 9 CHG_CONFIG Battery charger configuration A CHG_STAT Battery charger status B EN_LDO Linear regulator ON/OFF control C LDO12 LDO1 and LDO2 output voltage setting D LDO3 LDO3 output voltage settings E LDO4 LDO4 output voltage settings F LDO5 LDO5 output voltage settings 10 SM1_SET1 SM1 buck converter ON/OFF control and output voltage setting, normal mode 11 SM1_SET2 SM1 buck converter configuration 12 SM1_STANDBY SM1 buck converter standby mode ON/OFF and standby output voltage setting 13 SM2_SET1 SM2 buck converter ON/OFF control and output voltage setting, normal mode 14 SM2_SET2 SM2 buck converter configuration 15 SM2_STANDBY SM2 buck converter standby mode ON/OFF and standby output voltage setting 16 SM3_SET SM3 white LED driver ON/OFF control and settings 17 RGB_FLASH Overall RGB driver timing settings 18 RGB_RED RGB driver: RED duty cycle and output current setting 19 RGB_GREEN RGB driver: GREEN duty cycle and output current setting 1A RGB_BLUE RGB driver: BLUE duty cycle and output current setting 1B GPIO12 GPIO1 and GPIO2 configuration 1C GPIO3 GPIO2 and GPIO3 configuration, battery charge voltage selection 1D PWM PWM output configuration 1E ADC_SET ADC ON/OFF control, ADC configuration 1F ADC reading_hi ADC data output 20 ADC reading_lo ADC data output 21 DHILIM1 ADC maximum threshold setting 22 DHILIM2 ADC maximum threshold setting 23 DLOLIM1 ADC minimum threshold setting 24 DLOLIM2 ADC minimum threshold setting 25 ADC_DELAY ADC configuration: conversion delay 26 ADC_WAIT ADC configuration: wait and repeat operation 27 LED_PWM LED_PWM configuration 2E RESERVED_03 RESERVED 30 FACTORY ONLY Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 FUNCTIONALITY REFERENCE GUIDE - HOST INTERFACE AND SYSTEM SEQUENCING INTERRUPT CONTROLLER, OPEN-DRAIN OUTPUT (INT) System Parameters Monitored by Interrupt Controller Supply Output Power Good Fault Detection (1) System Status Modification SM1, SM2, SM3, LDO1, LDO2, LDO3, LDO4, LDO5 Thermal fault or GPIO1 ,2 configured as external interrupt request Can be masked Individually via I2C. Blanked during initial power up (1) Power up default Charger Status Transition ADC status Input and Output Power Transition Charge: Pre Fast ADC conversion end Done AC detected: yes no ADC DPPM:on off USB detected: yes no Input out of range Charge suspend: on Input OVP: yes no External resistive off System power: AC load connected to Thermal foldback: on USB ANLG1 off Can be masked individually via I2C All interrupt controller inputs set to non-masked Can be masked as a group via a single I2C mask register bit For all supplies (except) for SM3 an output fault is detected if the output voltage is below 90% of the programmed regulation voltage. In the SM3 converter an output fault indicates that the output OVP threshold was reached. EVENTS TRIGGERING TPS65820 OPERATING MODE CHANGES EVENT POWER GOOD FAULT DETECTION (1) THERMAL FAULT HARDWARE RESET SOFTWARE RESET How transition is triggered Integrated regulator output voltage below target value: SM1, SM2, SM3, LDO1, LDO2, LDO3, LDO4, LDO5 Internal IC junction temperature Using HOT_RST control pin I2C register control bit Operating mode change Sets Sleep mode or starts a new power-up cycle when power good fault is detected (see state machine diagram). Sets sleep mode when thermal fault is detected Generates external host reset pulse at pin RESPWON when HOT_RST=LO. Generates external host reset pulse at pin RESPWON when I2C control bit is set. Power good fault detection Input and Battery power comparators are blanked during cycling required to exit initial power-up. sleep Pulse duration set by external capacitor. Pulse duration set by external capacitor. Can be masked individually via I2C. External input Set via I2C Controls 100 kW 2 kW R2 R4 R3 R5 2 kW For all supplies (except) for SM3 an output fault is detected if the output voltage is below 90% of the programmed regulation voltage. In the SM3 converter an output fault indicates that the output OVP threshold was reached. 100 kW (1) Fixed internal threshold TPS65820 HOST INTERFACE AND SEQUENCING SCLK I2C ENGINE INTERRUPT CONTROLLER INT HOST TRSTPWON STATE MACHINE AND RESET CONTROLLER CTRSTPWON 0.1 mF SYS_IN OUT A1 R6 R1 210 kW C16 100 nF 100 kW A1 A1 Figure 26. Required External Components, Recommended Values, External Connections Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 31 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com INTERRUPT CONTROLLER AND SYSTEM SEQUENCING Overview The TPS65820 has two dedicated internal controllers that execute the host interface and system sequencing tasks: a sequencing controller and an interrupt controller. The sequencing controller monitors internal and system parameters and defines the sequencing of the internal power supplies during power up and power down / power fault events, and executes specific internal power supply reset operations under external hardware control or host software commands. The following parameters are monitored by the sequencing controller : * System power bus voltage (at SYS_IN pin), input supply voltage, battery pack voltage * TPS65820 thermal fault status * Integrated supply status The interrupt controller monitors multiple system status parameters and signals to the host when one of the monitored parameters toggled, as a result of a system status change. The interrupt controller inputs include all the parameters monitored by the sequencing controller plus: * Charger status * Battery pack status * ADC status Internal I2C registers enable masking of all the monitored parameters. Using those registers the host can select which parameters trigger an interrupt or a power good fault. Power good faults trigger a change in the TPS65820 operating mode, as detailed in the next sections. TPS65820 HOST INTERFACE AND SEQUENCING R4 R2 R3 R5 A simplified block diagram for the TPS65820 sections that interface to the external host is shown in Figure 27. SCLK SDAT INT I 2C ENGINE INTERRUPT CONTROLLER 2.5 V I2C REGISTERS AND NON-VOLATILE MEMORY AC/USB/BAT (HIGHER VOLTAGE) 2.5 V HOST RESPWRON TRSTPWON CTRSTPWON SEQUENCING AND OPERATING MODE SETTING VSYS CONTROL LOGIC 1V HOT_ RST SYS _IN A1 OUT R1 R6 C 16 A1 Figure 27. Simplified Block Diagram 32 Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 SYSTEM SEQUENCING AND TPS65820 OPERATING MODES The TPS65820 has a state machine that controls the device power up and power down sequencing. The main operating modes are shown in the state diagram below: POWER UP OFF V(OUT) < VUVLO LOAD POWER UP DEFAULTS IN I2C REGISTERS CONNECT AC , USB OR BAT PIN TO OUT PIN V(AC) > VUVLO DISABLE POWER GOOD FAULT OR DETECTION V(USB) > VUVLO INT PIN = HIGH IMPEDANCE OR POR_FLAG= HI V(BAT ) > VUVLO ANY STATE HOTPLUG DEGLITCH START SYS_IN INITIAL DEGLITCH TIMER TINSYS SYS_IN INITIAL DEGLITCH TIMER TINSYS EXPIRED AND V(SYS_IN) < V(LOW_SYS) FOR 5 msec OR ENABLE STATE THERMAL FAULT RESPWRON=LO, START BOOT - UP TIMER RESET I2C ENGINE OR I2C SOFT_RESET REGISTER POWER UP DEFAULTS LOADED IN ALL I2C REGISTERS (Except INT_ACKn) BIT SLEEP_MODE = HI (SELF - CLEARED) POWER CYCLE AND SLEEP NOT SET BY THERMAL FAULT V(SYS_IN) > V(LOW_SYS) AND V(OUT) > VUVLO SEQUENCE STATE START INTEGRATED SUPPLY START - UP SEQUENCE RESPWRON = LO RESETI2C I2CENGINE ENGINE RESET V(HOT_RESET)=HI OR I2C SOFT_RESET REGISTER BIT SOFT_RESET = LO (SELF CLEARED ) SLEEP STATE RESET I2C ENGINE ONLY RTC_LDO IS ON POWER PATH ACTIVE RESPWRON = 0 REGISTER CONTENTS NOT RESET INTERRUPT CLEARED PGOOD FAULT RESET STATE RESPWRON=LO RESPWRON=LO START SYSTEM RESET PULSE TIMER WHEN HOT_RESET=HI RESET I2C ENGINE RESET TIMER EXPIRES POWER GOOD CHECK STATE PGOOD FAULT : A NON- MASKED BIT OF THE POWER _GOOD I2C REGISTER TOGGLES FROM LO TO HI POWER DOWN RAILS, WAIT 5 msec V(HOT_RESET)=LO OR I2C SOFT_RESET REGISTER BIT SOFT_RST= HI ENABLE I2C ENGINE RESPWRON=HI ENABLE POWER GOOD COMPARATORS INT PIN MODE SET BY INTERRUPT CONTROLLER STANDBY ON : SM1 AND SM2 SET IN STANDBY MODE BY GPIO OR I 2C COMMAND STANDBY OFF : SM1 AND SM2 EXIT STANDBY MODE BY GPIO OR I2C COMMAND NO PGOOD FAULT RESET TIMER : VALUE SET BY CAPACITOR CONNECTED TO TRSTPWON PIN I2C SOFT_RESET BIT LOCATED IN SOFT_RESET REGISTER , BIT B0 V(HOT_RESET)=LO OR I2C SOFT_RESET REGISTER BIT SOFT_RST = HI PROCESSOR STANDBY STATE RESPWRON = HI PG FOR SM1&SM2 is masked STANDBY ON STANDBY OFF NORMAL MODE RESPWRON=HI PGOOD FAULT Figure 28. TPS65820 State Diagram POWER-UP - If the AC, USB and BAT pin voltages are below the internal UVLO threshold VUVLO (2.5 V typ) all IC blocks are disabled and the TPS65820 is not operational, with all functions OFF. When an external power source or battery with voltage greater than the VUVLO voltage threshold is applied to AC/USB or BAT pins the internal TPS65820 references are powered up, biasing internal circuits. When all the main internal supply rails are active the TPS65820 I2C registers are set to the power-up default values, shown in Table 3: Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 33 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com Table 3. Integrated Supply and Drivers Power-Up Defaults SUPPLY POWER-UP DEFAULT OTHER BLOCKS POWER-UP DEFAULT LDO0 OFF, 3.3 V POWER PATH INPUT TO SYSTEM LDO1 2.85V, ON PWM OFF LDO2 3.3 V, ON PWM_LED OFF LDO3 1.25 V, ON GPIO1 INPUT LDO4 2.75 V, ON GPIO2 INPUT LD05 2.81 V, ON GPIO3 INPUT SIM 1.8 V, OFF ADC OFF RTC_OUT ON, 3.1 V SM3 (WHITE LED) OFF LDO_PM 3.3 V, ON @ OUT POWERED RGB DRIVER OFF SM1 ON, 1.24 V INTERRUPT MASK NONE MASKED SM2 ON, 1.8 V POWER GOOD MASK ALL MASKED CHARGER ON After the internal I2C register power-up defaults are loaded the power path control logic is enabled, connecting the external power source to the OUT pin. A status flag (nRAMLOAD) is set to LO in the SOFT_RESET register, indicating that the I2C registers were loaded with the power-up defaults, and the TPS65820 enters the HOTPLUG mode. HOTPLUG: In the HOTPLUG state an independent timer, TDGL(HOTPLUG) is started. The hotplug deglitch timer, when active (not expired), prevents the TPS65820 from entering the SLEEP mode. This functionality avoids potential system lockup conditions caused by contact bouncing events, when the TPS65820 is initially powered by a battery pack insertion. After the hotplug deglitch timer is started the TPS65820 enters the ENABLE mode. ENABLE: In the ENABLE mode the RESPWRON output is set to the LO level, the INT pin mode is set to high impedance and all the power good comparators that monitor the integrated supply outputs are disabled. The ENABLE mode is used by the TPS65820 to detect when the main system power rail (OUT pin) is powered and ready to be used on the internal supply power-up. The OUT pin voltage is sensed by an internal low system voltage comparator which holds the IC in the ENABLE mode until the system power bus voltage (OUT pin) has reached a minimum operating voltage, defined by the user. The internal comparator senses the system voltage at pin SYS_IN, and the threshold for the minimum system operating voltage at the OUT pin is set by the external divider connected from OUT pin to SYS_IN pin. The threshold voltage is calculated as follows: V(OUT) + V (LOW_SYS) 1 ) R6 : R1 where R6 and R1 are external resistors, V (LOW_SYS) + 1 V typical (1) The minimum system operating voltage should always be set above the internal UVLO threshold VUVLO. In normal application conditions the minimum system operating voltage is usually set to a value that assures that the TPS65820 integrated regulators are not operating in the dropout region. When the voltage at the SYS_IN pin exceeds the internal threshold V(LOW_SYS) the TPS65820 is ready to start the system power sequencing, and the SEQUENCING mode is entered. SEQUENCING - The sequencing state starts immediately after the enable state. In this mode of operation the integrated supplies are turned ON, according to the sequencing steps loaded from the internal non-volatile memory during the power-up phase. The TPS65820 sequencing timing diagram shown in figure details the internal timing delays and supply sequencing. At the end of the sequencing state the user-programmable reset timer is started, and the TPS65820 enters the reset state. The startup sequence for the TPS65820 device is controlled by an internal (not user-programmable) EEPROM configuration byte location that is set at the time of manufacturing. A limited number of variations are possible according to the configuration table below. The TPS65820 configuration is programmed as 0x02 (or bits 0000 0010). The corresponding startup sequence for the TPS65820 is illustrated in Table 4,Table 5, and Figure 29. For alternate startup sequences, a new configuration is required (contact TI factory). 34 Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 Table 4. Startup Sequence EEPROM Byte (Factory-Programmable Only) Bit B7 Function B6 B5 Choose 1 of 8 sequences; see Table 5. B4 B3 B2 Choose 1 of 4 initial delays; see Table 5. B1 B0 Choose 1 of 8 secondary delays; see Table 5. Table 5. Startup Conditions D1 B7 B6 B5 0 0 0 0 0 0 0 Startup Sequence D2 B4 B3 Delay (ms) B2 B1 B0 Delay (ms) [LDO1, LDO4, LDO5] {D1} [SM1, LDO3] {D2} [SM2, LDO2] 0 0 0.24 0 0 0 4.8 1 [SM1, LDO3] {D1}[LDO1, LDO4, LDO5] {D2} [SM2, LDO2] 0 1 0.48 0 0 1 9.6 1 0 All together 1 0 0.96 0 1 0 12 1 1 [SM1] {D1} [SM2] {D2} LDOs 1 1 1.2 0 1 1 19.2 1 0 0 [SM2] {D1} [SM1] {D2} [LDOs] 1 0 0 26.4 1 0 1 [LDOS] {D1} [SM1] {D2} [SM2] 1 0 1 62.4 1 1 0 [LDOS] {D1} [SM2] {D2} [SM1] 1 1 0 79.2 1 1 1 Disabled 1 1 1 100.8 Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 35 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com Power Applied AC, USB, OR BAT VUVLO OUT VUVLO SYS_IN VLOW_SYS RTC_OUT LDO1 LDO2 LD04 LDO5 LDO3 SM1 SM2 INT HI-Z HI-Z HI-Z RESPWRON tDLY(D1) tDLY(D2) RESET DELAY PROGRAMMED BY EXTERNAL CAPACITOR CONNECTED TO PIN TRSTPWON NO POWER SEQUENCING ENABLE RESET NORMAL 2 I C Registers Loaded From 2 E PROM Figure 29. TPS65820 Supply Sequencing Timing RESET - When the reset state starts the RESPWRON output is LO. The user can program the reset timer value selecting the value of the external capacitor connected to pin TRSTPWON, as shown below: T(RESET) = KRESET x CTRSTPWON ; where KRESET is the reset timer constant (1 ms/nF typ) The TPS65820 RESPWRON pin should be used to reset the external host. During the external host reset (RESPWRON = LO) the I2C SDA and SCL pins are not used to access TPS65820 internal registers. If a non-standard configuration is used to reset the system the SDA and SCL lines should not be used to communicate with the TPS65820 until RESPWRON = HI. The TPS65820 I2C engine is kept in reset as long as RESPWRON = LO, avoiding false detection of start/stop conditions when the SDA and SCL pullup resistors are initially powered. The power good comparators are masked during the reset mode. The reset mode ends when the reset timer expires, and the TPS65820 goes into the power good check mode. 36 Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 The RESPWRON signal set to a high level is the proper signal to use as an indicator that the device has transitioned out of the reset state. During the power-up sequence the RESPWRON pin is asserted LOW until the RESET TIMER expires. The RESET TIME (treset = 1ms/nF x CTRSTPWON) can be programmed via a capacitor between the TRSTPWON pin and ground. When the RESPWRON signal is LO, all internal and external interrupts are ignored. As a result, the open-drain output that asserts the INT pin LO during a NORMAL MODE interrupt request is disabled. The INT pin is then asserted HI via a pullup resistor that is typically connected to VOUT. After the RESPWRON signal goes HI, the interrupt controller is given control of the INT pin. Finally, the rising edge of the RESPWRON pin should be used to indicate the PMIC has transitioned from the RESET STATE to the POWER GOOD CHECK STATE. At that point, the interrupt controller asserts an interrupt if necessary. POWER GOOD CHECK - In the power good check mode the power good comparators are enabled, providing status on the integrated supplies output voltages. An output voltage is considered as out of regulation and generates a fault condition if the output voltage is below 90% of the target output voltage regulation value. If a power good fault is detected the SLEEP mode is set, if a power good fault is not detected the NORMAL mode is set. The individual supply power good status can be masked via an I2C register PGOODFAULT_MASK. Supplies that have their power-good fault status masked do not generate a power good fault. However, the status bit for the supply indicates that the output voltage is out of regulation. The power good mask register bits default to masked upon power up. NORMAL MODE - If a power good fault is not present at the end of the power good check mode the NORMAL mode starts. In this mode of operation the I2C registers define the TPS65820 operation, and the host has full control on operation modes, parameter settings, etc. The normal state operation ends if a thermal fault, system low voltage fault ( V(SYS_IN) < VLOW_SYS ) or power good fault is detected. A thermal fault or system low voltage fault sets the SLEEP mode operation, a power good fault sets the NO POWER operation mode. From the normal mode the converters SM1 and SM2 can be set in the STANDBY mode, with reduced output voltages. In NORMAL mode either an I2C register bit (SOFT_RESET register bit SOFT_RST) or a hardware input ( HOT_RESET pin set to LO) can trigger a transition to the RESET state, enabling implementation of a host reset function. In NORMAL mode an I2C register bit (SOFT_RESET register bit SLEEP_MODE) can trigger a transition to SLEEP mode. SLEEP MODE - The SLEEP mode is set when a thermal fault or system low voltage fault is detected, under NORMAL operation mode set. This operation mode is also set when a power good fault is detected during the power good check state or via the I2C bit SLEEP_MODE. In the SLEEP mode the RESPWRON output is set to LO, and the I2C registers keep the same contents as in the state preceding SLEEP mode, with the exception of the following control bits, which are reset to the default power-up values: 1. 2. 3. 4. LDO1,2,3,4,5 and RTC_OUT are enabled, SIM LDO is disabled: EN_LDO register set to default values LDO0 disabled, all GPIOs with no control function assigned: GPIO12, GPIO3 registers set to default values White LED driver is set to OFF: SM3_SET register has all bits set to LO RGB drivers are set to OFF: RGB_FLASH, RGB_RED, RGB_GREEN, RGB_BLUE registers are set to default values 5. PWM, PWM_LED drivers OFF: PWM, LED_PWM registers are set to default values 6. ADC engine reset to power up default: ADC_SET, ADC_DELAY, ADC_WAIT registers are set to default values In SLEEP mode, the power path and main internal blocks are still active, but the internal integrated supply sequencing is disabled. As a result of that, during SLEEP mode ALL integrated supplies (ALL LDO's, ALL Buck Converters) are disabled, with exception of the RTC_LDO. The RTC_LDO is ON during sleep mode if the RTC_EN bit (register EN_LDO) is set to HI. The RTC_LDO is OFF during sleep mode if the RTC_EN bit (register EN_LDO) is set to LO. At the end of the SLEEP mode, the sequencer block uses the I2C control register values (which were reset to the default power-up values) to sequence the integrated power supplies. The SLEEP mode ends when one of the three following events happens: 1. If SLEEP was set by thermal fault: The SLEEP mode ends only when all external input supplies and battery pack are removed and a UVLO condition is detected by the TPS65820, setting the NO POWER mode. Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 37 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com 2. If SLEEP was set by a system low voltage detection, or I2C bit SLEEP_MODE, only with battery present: Input power must be connected, setting the TPS65820 in the ENABLE mode. If no input power is inserted, the battery discharges until the TPS65820 detects a UVLO condition and enters the NO POWER mode. 3. If sleep was set by a system low voltage detection, power good fault or SLEEP_MODE, with battery and input power present: all external input supplies connected to AC and USB pins must be removed, and then at least one of them reconnected to the system. The input power cycling triggers a transition from SLEEP mode to the ENABLE mode. PROCESSOR STANDBY STATE - This state is set using a I2C register or a GPIO configured as SM1/SM2 standby control. In standby mode operation the SM1 and SM2 voltages are set to value distinct than the normal mode output voltage, and SM1/SM2 are set to PFM mode. The standby output voltage is defined in I2C registers SM1_STANDBY and SM2_STANDBY. TPS65820 OPERATING MODE CONTROLS HARDWARE RESET: A dedicated control pin, HOT_RESET, enables implementation of a hardware reset function. The system reset pin RESPWRON is set to LO when HOT_RESET = LO for a period longer than the internal deglitch (5 ms, typical). The RESET mode is started when the HOT_RESET pin transitions from LO to HI, as shown in the state diagram. SOFTWARE RESET: The external host can set the TPS65820 in RESET mode using the I2C register SOFT_RESET, bit B0 (SOFT_RST). SOFTWARE SLEEP: The external host can set the TPS65820 in SLEEP mode using the I2C register SOFT_RESET, bit B6 (SLEEP_MODE). A hardware or software reset does not affect the contents of the I2C registers. SEQUENCING AND OPERATING MODES - I2C REGISTERS The I2C registers that control sequencing-related functions are shown below. The HEX address for each register is shown by the register name, together with the R or W functionality for the register bits. Shaded values indicate default initial power-up values. SOFT_RESET, ADDRESS=08, ALL BITS R/W, BITS B7/B6/B1/B0 APPLY TO SEQUENCING. B7 B6 B5 B4 B3 B2 B1 B0 Bit name STBY MODE SLEEP MODE NOT USED NOT USED SM3_LF_OSc NOT USED nRAMLOAD SOFT RST Function SET SM1 AND SM2 IN STANDBY MODE SET TPS65820 IN SLEEP MODE NOT USED NOT USED NOT USED RAM RESET FLAG SOFTWARE RESET CONTROL When 0 NOT ACTIVE NOT ACTIVE NOT USED NOT USED NOT RELATED TO SEQUENCING, SEE SM3 Control Logic Overview SECTION NOT USED RAM DEFAULTS LOADED NOT ACTIVE When 1 When 1 SET SM1 AND SM2 IN STANDBY SET SLEEP MODE (reset to LO internally) NOT USED NOT USED NOT USED RAM DEFAULTS NOT LOADED SET RESET MODE (reset to LO internally) Some host algorithms need to identify when the power-up defaults are loaded in the RAM, in order to start routines that initialize specific RAM registers. If that functionality is required the nRAMLOAD bit should be set to HI by the host when entering hte NORMAL operation mode. The nRAMLOAD bit is reset to LO by the TPS65820 when the power-up defaults are loaded in the I2C registers (V(OUT)<VUVLO OR PGOOD fault detected), enabling the host algorithm to detect that the RAM registers need to be initialized. The integrated supplies status is available in a dedicated register, shown below. The host can select which integrated supply outputs trigger a power good fault condition using the PGOODFAULT_MASK register. When a non-masked power good status register bit toggles state, the sequence controller generates a transition in the TPS65820 state machine, indicated as a PGOOD FAULT in TPS65820 state diagram. 38 Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 The power-good status register and mask register are shown below: SYSTEM STATUS MONITORED BY SEQUENCING CONTROLLER B7 B6 B5 B4 B3 B2 B1 B0 PGOOD, ADDRESS=02, ALL BITS READ ONLY - POWER UP DEFAULTS SHOW SYSTEM STATUS WHEN EXITING POWER DOWN Bit name PGOOD SM1 PGOOD SM2 PGOOD SM3 Function SM1 OUTPUT STATUS SM2 OUTPUT STATUS SM3 OVP STATUS PGOOD LDO1 PGOOD LDO2 PGOOD LDO3 PGOOD LDO4 PGOOD LDO5 When 0 OK OK OK OK OK OK OK OK When 1 FAULT FAULT FAULT FAULT FAULT FAULT FAULT FAULT LDO1 OUTPUT LDO2 OUTPUT LDO3 OUTPUT LDO4 OUTPUT LDO5 OUTPUT STATUS STATUS STATUS STATUS STATUS PGOODFAULT_MASK, ADDRESS=07, ALL BITS R/W Bit name MASK_PSM1 MASK_PSM2 MASK_PSM3 MASK_PLDO1 MASK_PLDO2 MASK_PLDO3 MASK_PLDO4 MASK_PLDO5 Function MASK PGOOD FAULT BY SM1 MASK PGOOD FAULT BY SM2 MASK PGOOD FAULT BY SM3 MASK PGOOD FAULT BY LDO1 MASK PGOOD FAULT BY LDO2 MASK PGOOD FAULT BY LDO3 MASK PGOOD FAULT BY LDO4 MASK PGOOD FAULT BY LDO5 When 0 UNMASKED UNMASKED UNMASKED UNMASKED UNMASKED UNMASKED UNMASKED UNMASKED When 1 MASKED MASKED MASKED MASKED MASKED MASKED MASKED MASKED INTERRUPT CONTROLLER The TPS65820 has internal block and overall system status information stored in I2C status registers. The following subsystems and system parameters are monitored : * External power supply status: AC or USB supply detected, AC or USB connected to system, AC/USB OVP * Charger status: on/off/suspend, fast charge/precharge, termination detected, DPPM on, thermal loop ON * Battery pack status: temperature, discharge on/off * TPS65820 Thermal shutdown * ADC status: conversion status, input out of range, ANLG1 high impedance detection * Integrated supplies status: output out of regulation (power good fault) The GPIO1 and GPIO2 pins can be configured as inputs, generating an interrupt request to the host ( INT:HILO) at the GPIO rising or falling edge. The host can use internal the INT_MASK I2C registers to define which of the monitored status variables trigger an interrupt. When a non-masked system status bit toggles state, the interrupt controller issues an interrupt, following the steps below: 1. system status bits that caused the interruption are set to HI in registers INT_ACK1 and INT_ACK2 2. An interrupt is sent to the host ( INT:HILO) Once an interrupt is sent to the host, INT is kept in the LO state and the INT_ACK registers contents are latched, holding the system status that generated the currently issued interrupt request. When an interrupt request is active (INT = LO) additional changes in non-masked status registers and control signals are ignored, and the INT_ACK registers are not updated. The host must write a 0 to the INT_ACK register bit that generated the interrupt in order to set INT = HI and enable new updates to the INT_ACK registers. If the host stops in the middle of a WRITE or READ operation, the INT pin stays at the LO level. The TPS65820 has no reset timeout; it is assumed that the host does not leave INT = LO and the status registers unread for a long time. The non-masked I2C register bits and internal control signals generate a new interrupt only after INT is set to HI. The non-masked power good fault register bits generate a power good fault when any of the non-masked bits detects that the monitored output voltage is out of regulation, independently of the INT pin level. Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 39 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com SYSTEM STATUS -- I2C REGISTERS The I2C registers that have system status data are shown below. The HEX address for each register is shown by the register name, together with the R or W functionality for the register bits. Those registers are valid, after an initial power up, when the TPS65820 enters the normal operation mode. SYSTEM STATUS MONITORED BY INTERRUPT CONTROLLER B7 B6 B5 B4 B3 B2 B1 B0 PGOOD, ADDRESS=02, ALL BITS READ ONLY - POWER UP DEFAULTS SHOW SYSTEM STATUS WHEN EXITING POWER DOWN Bit name PGOOD SM1 PGOOD SM2 PGOOD SM3 Function SM1 OUTPUT STATUS SM2 OUTPUT STATUS SM3 OVP STATUS PGOOD LDO1 PGOOD LDO2 PGOOD LDO3 PGOOD LDO4 PGOOD LDO5 LDO1 OUTPUT LDO2 OUTPUT LDO3 OUTPUT LDO4 OUTPUT LDO5 OUTPUT STATUS STATUS STATUS STATUS STATUS When 0 OK OK OK OK OK OK OK OK When 1 FAULT FAULT FAULT FAULT FAULT FAULT FAULT FAULT ADC STATUS REGISTER ADC_READING_HI, B7: CONVERSION COMPLETE ; INTERNAL STATUS BITS (NO I2C REGISTER BIT AVAILABLE: INPUT OUT OF RANGE (HI OR LO), ANLG1 PIN IMPEDANCE TO AGND2 EXCEEDS 1 m. See additional details in the Analog-to-Digital Converter section. OTHER SYSTEM STATUS: THERMAL FAULT DETECTED 40 Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 INTERRUPT CONTROLLER - I2C REGISTERS The I2C registers that control an interrupt generation (INT: HILO) are shown below. The HEX address for each register is shown by the register name, together with the R or W functionality for the register bits. Shaded values indicate default initial power-up values. INTERRUPT AND POWER GOOD FAULT MANAGEMENT REGISTERS B7 B6 B5 B4 B3 B2 B1 B0 INTMASK1, ADDRESS=03, ALL BITS R/W Bit name MASK_ISM1 MASK_ISM2 MASK_ISM3 MASK_ILDO1 MASK_ILDO2 MASK_ILDO3 MASK_ILDO4 MASK_ILDO5 Function MASK INT by SM1 PGOOD FAULT MASK INT by SM2 PGOOD FAULT MASK INT by SM3 PGOOD FAULT MASK INT by LDO1 PGOOD FAULT MASK INT by LDO2 PGOOD FAULT Mask INT by LDO3 PGOOD FAULT MASK INT by LDO4 PGOOD FAULT MASK INT by LDO5 PGOOD FAULT When 0 UNMASKED UNMASKED UNMASKED UNMASKED UNMASKED UNMASKED UNMASKED UNMASKED When 1 MASKED MASKED MASKED MASKED MASKED MASKED MASKED MASKED MASK_IGPIO2 MASK_IGPIO1 MASK_ITHSHU T MASK_ICHGS T MASK_IADC_H I MASK_IADC_L O MASKS INT BY MASKS INT BY MASKS INT BY MASKS INT BY MASKS INT BY ADC END OF ANLG1 HIGH GPIO2 EDGE GPIO1 EDGE THERMAL CONVERSION IMPEDANCE TRANSITION TRANSITION FAULT MASK INT BY CHG_STAT REGISTER BITS MASK INT BY ADC INPUT ABOVE HI LIMIT MASK INT BY ADC INPUT BELOW LO LIMIT INTMASK2, ADDRESS=04, ALL BITS R/W Bit name Function MASK_IADC MASK_IANLG1 When 0 UNMASKED UNMASKED UNMASKED UNMASKED UNMASKED UNMASKED UNMASKED UNMASKED When 1 MASKED MASKED MASKED MASKED MASKED MASKED MASKED MASKED INT_ACK1, ADDRESS=05, ALL BITS R/W Bit name ACK_SM1 ACK_SM2 ACK_SM3 ACK_LDO1 ACK_LDO2 ACK_LDO3 ACK_LDO4 ACK_LDO5 Function SM1 INT REQUEST SM2 INT REQUEST SM3 INT REQUEST LDO1 INT REQUEST LDO2 INT REQUEST LDO3 INT REQUEST LDO4 INT REQUEST LDO5 INT REQUEST When 0 CLEAR FLAG CLEAR FLAG CLEAR FLAG CLEAR FLAG CLEAR FLAG CLEAR FLAG CLEAR FLAG CLEAR FLAG When 1 SM1 PGOOD FAULT GENERATED INT SM2 PGOOD FAULT GENERATED INT SM3 OVP FAULT GENERATED INT LDO1 PGOOD FAULT GENERATED INT LDO2 PGOOD FAULT GENERATED INT LDO3 PGOOD FAULT GENERATED INT LDO4 PGOOD FAULT GENERATED INT LDO5 PGOOD FAULT GENERATED INT INT_ACK2, ADDRESS=06, ALL BITS READ ONLY Bit name ACK_ADC ACK_ANLG1 ACK_GPIO2 ACK_GPIO1 ACK_THSHUT ACK_CHGSTA T ACK_ADC_HI ACK_ADC_LO Function ADC INT REQUEST 1 ANLG1 COMPARATO R INT REQUEST GPIO2 INT REQUEST GPIO1 INT REQUEST THERMAL FAULT INT REQUEST CHARGER INT REQUEST ADC INT REQUEST 2 ADC INT REQUEST 3 When 0 CLEAR FLAG CLEAR FLAG CLEAR FLAG CLEAR FLAG CLEAR FLAG CLEAR FLAG CLEAR FLAG CLEAR FLAG When 1 ADC DONE GENERATED INT REQUEST ANLG1 HIGH IMPEDANCE DETECTION GENERATED INT REQUEST GPIO2 EDGE GENERATED INT REQUEST GPIO1 EDGE GENERATED INT REQUEST THERMAL FAULT GENERATED INT REQUEST CHARGER STATUS CHANGE GENERATED INT REQUEST ADC INPUT ABOVE HI LIMIT GENERATED INT REQUEST ADC INPUT BELOW LO LIMIT GENERATED INT REQUEST PGOODFAULT_MASK, ADDRESS=07, ALL BITS R/W Bit name PGOOD SM1 PGOOD SM2 PGOOD SM3 PGOOD LDO1 PGOOD LDO2 PGOOD LDO3 PGOOD LDO4 PGOOD LDO5 Function MASK PGOOD FAULT BY SM1 MASK PGOOD FAULT BY SM2 MASK PGOOD FAULT BY SM3 MASK PGOOD FAULT BY LDO1 MASK PGOOD FAULT BY LDO2 MASK PGOOD FAULT BY LDO3 MASK PGOOD FAULT BY LDO4 MASK PGOOD FAULT BY LDO5 When 0 UNMASKED UNMASKED UNMASKED UNMASKED UNMASKED UNMASKED UNMASKED UNMASKED When 1 MASKED MASKED MASKED MASKED MASKED MASKED MASKED MASKED Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 41 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com FUNCTIONALITY GUIDE -- SYSTEM POWER AND CHARGE MANAGEMENT CHARGE MANAGEMENT Fast Charge (1) Charge Current Value Charge Current Scaling IO(BAT), Programmable, 1.5A max 25%, 50%, 75%, 100% of IO(BAT) Set via external resistor Set via I2C (1) Precharge Current Termination Charge Voltage Precharge Voltage SafetyTimer Timeout Power Up Default 25%, 50%, 75%, 100% of I(TERM) value 4.2 V or 4.36 V 3V Programmable Charger ON Set via I2C Set via I2C Fixed Set via external resistor Current Current Scaling 10% of IO(BAT) I(TERM), 10% of IO(BAT) Fixed ratio Fixed ratio The input current limit (see system power management below ) regulates the input current, effectively limiting the charge current if the input current limit is lower than the fast charge current value programmed. POWER PATH MANAGEMENT INPUT CURRENT LIMIT AC PIN 2.5 A typ INPUT CONNECTED TO OUT PIN POWER UP DEFAULT USB PIN INPUT POWER TO SYSTEM BATTERY TO SYSTEM 100 mA max or 500 mA max or 2.5 A typ #1 - AC #2 - USB #3 - Battery (when AC pin power and USB pin power are not detected ) Battery connected to system, independently of battery voltage Set via I2C Internal fixed current limit Set via I2C, overrides internal algorithm Automatic internal algorithm TPS 65820 AC _DC Adapter Output AC AC SWITCH SYSTEM POWER BUS OUT OUT USB Power C1 10 mF USB USB SWITCH C26 22 mF BATTERY SWITCH C2 10 mF A1 Battery BAT BAT A1 Input power to system, USB mode selected, 100 mA max A1 POWER PATH CONTROL LINEAR CHARGER TS DPPM TMR ISET1 C25 10 mF RSET 1 kW System Power Selection Input Current Limit Selection Charge Voltage Fast Charge Current Scaling Charge Suspend I2C REGISTERS + C24 0.22 mF RTMR 49.9 kW RDPPM 37.4 kW 50 kW NTC C23 47 nF GND A1 With the above components the following system parameters are set : Fast Charge Current = 1A (100% scaling, input limit=2. 5A) Safety Timer = 5hours, 30 min pre-charge DPPM threshold = 4. 3V Temp hot: 65C Temp Cold : 5C Figure 30. Required External Components, Recommended Values, External Connections POWER PATH AND CHARGE MANAGEMENT Overview The TPS65820 has an integrated charger with power path integrated MOSFETs. This topology, shown in the simplified block diagram below, enables using an external input power to run the system and charge the battery simultaneously. The power path has dual inputs that can be used to select either an external AC_DC adapter (AC pin) or an USB port power (USB pin) to power the end equipment main power rail (OUT pin, also referred to as the system power bus) and charge the battery pack (connected to BAT pin). 42 Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 OUTSHORT 500 AC OUT I(AC) AC SWITCH OUTSHORT I(AC) / K INTAC BATSHORT 500 I(USB) ACOFF USB SWITCH AC Control Loops I(USB) / K INTUSB V(OUT) 1 k USB BATOFF VO(REG) System Voltage Regulation Loop USBOFF BATTERY SWITCH I (BAT ) AC Input Current Limit Loop V (ACOC) V(USB1) V(USB2) BAT USB Control Loops BAT DISCHARGE CIRCUIT USB Input Current Limit Loop INPUT_LIM V(OUT) I(OUT) / K (SET) VO(REG) System Voltage Regulation Loop ISET1 V(ISET1) V (SET) V(BAT) Charge Current Loop SCALING CHMODE DPPM Charge Voltage Loop V (PRECHG) VREF V O(REG) V (DPPM) ATTENUATION TJ DPPM Loop VREF Charger Control Loops TMR VREF Dynamically Controlled Oscillator Timer Fault TJ(REG) Thermal Loop CONTROL SIGNALS On, Reset CHARGE CONTROL AND POWER PATH MANAGEMENT TS BAT ISET1 BATTERY STATUS DETECTION BATTERY STATUS CE CHG_UVLO LATCH SYSTEM STATUS SYSTEM STATUS DETECTION USB AC OUT CE System Power Selection Input Current Limit Selection I2C REGISTERS Charger Status Input Power Status Charge Voltage Fast Charge Current Scaling Charge Suspend TPS65820 Figure 31. TPS65820 Charger and Power Path Section Simplified Block Diagram The power path has three integrated power MOSFETs: the battery to system MOSFET (battery switch), the AC input to system MOSFET (AC switch) and the USB input to system MOSFET (USB switch). Each of those power MOSFETs can be operated either as an ON/OFF switch or as a linear pass element under distinct operating conditions, as defined by the control circuits that set the power MOSFET gate voltage. Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 43 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com The TPS65820 regulates the voltage at the OUT pin to 4.6 V, when one of the external supplies connected to pins AC or USB is powering the OUT pin. The selected input (AC or USB pin) current is limited to a value defined by I2C register settings. The input current limit function assures compatibility with USB standard requirements, and also implements a protection function by limiting the maximum current supplied by an external AC_DC adapter or USB port power terminal. The AC power MOSFET and USB power MOSFET operating modes are set by integrated control loops. Each of the power MOSFETs is controlled by two loops: one system voltage regulation loop and one input current limiting loop. The integrated loops modulate the AC or USB power MOSFETs drain to source resistance to regulate either the OUT pin voltage or to limit the input current. If no input power is present (AC and USB input power not detected) the AC and USB power MOSFETs are turned OFF, and the battery MOSFET is turned ON, connecting the BAT pin to the OUT pin. The battery switch is turned ON when the AC or USB input power is detected and the charger function is enabled, charging the battery pack. During charge the battery MOSFET switch operation mode is defined by the charger control loops. The battery MOSFET switch drain-to-source resistance is modulated by the charge current loop and charge voltage loop in order to implement the battery charging algorithm. In addition ot that multiple safety functions are activated (thermal shutdown, safety timers, short-circuit recovery), and additional functions (thermal loop and DPPM loop) optimize the charging process. POWER PATH MANAGEMENT FUNCTION Detecting the System Status The power path and charge management block operate independently of the other TPS65820 circuits. Internal circuits check battery parameters (pack temperature, battery voltage, charge current) and system parameters (AC and USB voltage, battery voltage detection), setting the power path MOSFETs operating modes automatically. The TPS65820 has integrated comparators that monitor the battery voltage, AC pin voltage, USB pin voltage and the OUT pin voltage. The data generated by those comparators is used by the power path control logic to define which of the integrated power path switches is active. A simplified block diagram for the system status detection is shown below. AC AC DETECTED BAT DPPM NO BATT SHORT AC OVP VOVP USB 1V USB DETECTED BAT USB OVP VOVP VOUTSH POWER PATH CONTROL LOGIC OUT SHORTED OUT VBATSH BAT SHORTED BAT BAT OUT LOWER THAN BAT OUT Figure 32. TPS65820 Systems Status Detection, Charger and Power Path Section 44 Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 Table 6 lists the system power detection conditions. VIN(DT), VOUTSH, VBATSH, VOVP are TPS65820 internal references, refer to the electrical characteristics for additional details. Table 6. System Status Detection, Charger and Power Path Section AC input voltage detected V(AC) - V(BAT) > VIN(DT) USB input voltage detected V(USB) - V(BAT) > VIN(DT) AC overvoltage detected V(AC) > VOVP USB overvoltage detected V(USB) > VOVP AC PIN TO OUT pin OR USB TO OUT PIN short detected V(OUT) < VINOUTSH BAT pin to OUT pin short detected V(BAT) - V(OUT) > VBATOUTSH Battery supplement mode need detected V(BAT) - V(OUT) > VSUP Blank BAT to OUT short-circuit detection V(DPPM) < 1V Power Path Logic: Priority Algorithm The system power bus supply is automatically selected by the power path control logic, following an internal algorithm. The power path function detects an external input power connection when the input voltage exceeds the battery pack voltage. It also detects a supplement mode need (battery switch must be turned ON) when the system voltage (OUT pin) is below the battery voltage. A connected and non-selected external supply or the battery is automatically switched to the system bus, following the priority algorithm, when the external supply currently selected is disconnected from the system. The input power priority is hard-wired internally, with the AC input having the higher priority, followed by the USB input (2nd) and the battery pack (3rd). Using the I2C CHG_CONFIG register control bit CE the user can override the power path algorithm, connecting the battery to the system power bus. Care must be taken when using the battery to system connection option, as the system power bus is not connected back to the AC or USB inputs (even if those are detected) when the battery is removed. Table 7 describes the priority algorithm. Table 7. Power Path Control Logic Priority Algorithm CE BIT (I C CHG_CONFIG Register) 2 HI LO EXTERNAL SUPPLY DETECTED SWITCH MODE SYSTEM POWER SOURCE AC USB AC USB YES NO ON OFF Battery AC NO YES OFF ON USB YES YES ON OFF NO NO OFF OFF XX XX OFF OFF ON if supplement mode is required, OFF otherwise AC BATTERY ON BATTERY The power path status is stored in register CHG_STAT. Input Current Limit The USB input current is limited to the maximum value programmed by the host, using the I2C interface. If the system current requirements exceed the input current limit, the output voltage collapses, the charge current is reduced, and finally, the supplement mode is set. The input current limit value is set with the I2C charge control register bits PSEL and ISET2, and it is applied to the USB input ONLY. The AC input current limit is fixed to the internal short-circuit limit value. Table 8. Charge Current Scaling via I2C INPUT CURRENT LIMIT PSEL (I2C) ISET2 (I2C) USB AC LO LO 100 mA 2.75 A LO HI 500 mA 2.75 A HI LO 2.75 A 2.75 A HI HI 2.75 A 2.75 A Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 45 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com System Voltage Regulation The system voltage is regulated to a fixed voltage when one of the input power supplies is connected to the system. The system voltage regulation is implemented by a control loop that modulates the selected switch Rds(on). The typical system regulation voltage is 4.6 V. Input Overvoltage Detection The AC and USB input voltages are monitored by voltage comparators that identify an overvoltage condition. If an overvoltage condition is detected a status register bit is set, indicating a potential fault condition. When an overvoltage condition is detected the AC or USB switches state is not modified. If any of those switches was ON, it is kept in the ON state. During overvoltage conditions the system voltage is still regulated, and no major safety issues are observed when not modifying the input switch state. If the input overvoltage condition results in excessive power dissipation, the thermal shutdown circuit is activated, the AC and USB switches are turned OFF and the BAT switch is turned ON. Output Short-Circuit Detection If the OUT pin voltage falls below an internal threshold VINOUTSH the AC and USB switches are turned off and internal pullup resistors are connected from AC pin to OUT pin and USB pin to OUT pin. When the short circuit is removed those resistors enable the OUT pin voltage to rise above the VINOUTSH threshold, returning the system to normal operation. Battery Short-Circuit Detection If the OUT pin voltage falls below the BAT pin voltage by more than an internal threshold VBATOUTSH the battery switch is turned off and internal pullup resistor is connected between the OUT pin and the BAT pin. This resistor enables detection of the short removal, returning the system to normal operation. Boot-Up Algorithm During the initial TPS65820 power-up the contents of the ISET2, CE and SUSPEND bits on the control register are ignored for a time period tBOOT. During that time the charger is enabled, and the selected input current limit is set internally to 100 mA max. At the end of tBOOT period the control register settings are implemented. No-Battery Detection Circuit The ANLG1 pin may be used to detect the connection of an external resistor that is embedded in a battery pack and is used as a pack ID function. The ANLG1 pin has an internal current source connected between OUT and ANLG1, which is automatically enabled when the TPS65820 is not in SLEEP mode. The current levels for ANLG1 pin can be programmed via I2C register ADC_WAIT, bits BATID_n, as shown below: OUT BAT 2 IC V(OUT) - V(NOBATID) _ + TPS65820 ANLG 1 PACK ID Resistor Battery Figure 33. Battery Removal Detection, ANLG1 Pin 46 Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 An internal comparator with a fixed deglitch time, t DGL(NOBAT) monitors the ANLG1 pin voltage, if V(ANLG1) > V(OUT) - VNOBATID a battery removed condition is detected and an internal discharge switch is activated, connecting an internal resistor from BAT pin to AGND1. Note that ANLG1 can also be used as an analog input for the ADC converter, in this case the voltage at pin ANLG1 must never exceed the V(OUT) - VNOBATID threshold to avoid undesired battery discharge. Using the Input Power to Run the System and Charge the Battery Pack The external supply connected to AC or USB pins must be capable of supplying the system power and the charger current. If the external supply power is not sufficient to run the system and charge the battery pack the TPS65820 executes a two-stage algorithm that prevents a low voltage condition at the system power bus: 1. The charge current is reduced, until the total (charger + system current) is at a level that can be supplied by the external input supply. This function is implemented by a dedicated charger control loop (see DPPM section in charger functional description for additional details). 2. The battery switch is turned ON if the charge current is reduced to zero and the input current is not enough to run the system. In this mode of operation both the battery and the external input power supply the system power ( supplement operation mode). The supplement operation mode is automatically set by the TPS65820 when the input power is switched to the OUT pin, and the OUT pin voltage falls below the battery voltage. BATTERY CHARGE MANAGEMENT FUNCTION Operating Modes The TPS65820 supports charging of single-cell Li-Ion or Li-Pol battery packs. The charge process is executed in three phases: precharge (or preconditioning), constant current and constant voltage. The charge parameters are selectable via I2C interface and using external components. The charge process starts when external input power is connected to the system, the charger is enabled by the I2C register CHG_CONFIG bits CE=HI and CHGON=HI, and the battery voltage is below the recharge threshold, V(BAT) < V(RCH). When the charge cycle starts a safety timer is activated. The safety timer timeout value is set by an external resistor connected to TMR pin. When the charger is enabled two control loops modulate the battery switch drain to source impedance to limit the BAT pin current to the programmed charge current value (charge current loop) or to regulate the BAT pin voltage to the programmed charge voltage value (charge voltage loop). If V(BAT) < 3 V (typ) the BAT pin current is internally set to 10% of the programmed charge current value. A typical charge profile is shown below, for an operation condition that does not cause the IC junction temperature to exceed 125C (typ). Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 47 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com VO(BATREG) Preconditioning Phase Current Regulation Phase Voltage Regulation and Charge Termination Phase DONE IO(BAT) Battery Current, I(BAT) FAST-CHARGE CURRENT Charge Complete Status, Charger Off Battery voltage, V(BAT) V(LOWV) IO(PRECHG) , I(TERM) PRE-CHARGE CURRENT AND TERMINATION THRESHOLD T(PRECHG) T(CHG) DONE Figure 34. Typical Charge Cycle, Thermal Loop not Active If the operating conditions cause the IC junction temperature to exceed 125C the charge cycle is modified, with the activation of the integrated thermal control loop. The thermal control loop is activated when an internal voltage reference, which is inversely proportional to the IC junction temperature, is lower than a fixed, temperature-stable internal voltage. The thermal loop overrides the other charger control loops and reduces the charge current until the IC junction temperature returns to 125C, effectively regulating the IC junction temperature. OUT VREF Thermal Loop VTJ Battery Switch I(BAT) BAT I(OUT)/K(SET) Charge Voltage Loop V(OUT) VO(REG) ISET 1 V(BAT) VO(REG) System Voltage Regulation Loop Figure 35. Voltage and Thermal Regulation Loops 48 Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 A modified charge cycle, with the thermal loop active, is shown here: VO(BATREG) Preconditioning Phase Current Thermal Regulation Regulation Phase Phase Voltage Regulation and Charge Termination Phase DONE IO(BAT) Battery Current, I(BAT) FAST-CHARGE CURRENT Battery Voltage, V(BAT ) PRE-CHARGE CURRENT AND TERMINATION THRESHOLD Charge Complete Status, Charger Off V(LOWV) IO(PRECHG) , I(TERM) T(THREG) IC Junction Temperature, Tj T(PRECHG) T(CHG) DONE Figure 36. Typical Charge Cycle, Thermal Loop Active Battery Preconditioning The TPS65820 applies a precharge current Io(PRECHG) to the battery if the battery voltage is below the V(LOWV) threshold, preconditioning deeply discharged cells. The charge current loop regulates the ISET1 pin voltage to an internal reference value, VPRECHG. The resistor connected between the ISET1 and AGND pins, RSET, determines the precharge rate. The precharge rate programmed by RSET is always applied to a deeply discharged battery pack, independently of the input power selection (AC or USB). The precharge current can be calculated as follows: V KSET I O(PRECHG) + PRECHG RSET (2) where: KSET is the charge current scaling factor and VPRECHG is the precharge set voltage. CONSTANT-CURRENT CHARGING The constant charge current mode (fast charge) is set when the battery voltage is higher than the precharge voltage threshold. The charge current loop regulates the ISET1 pin voltage to an internal reference value, VSET. The fast charge current regulation point is defined by the external resistor connected to the ISET1 pin, RSET, as shown in the following: V KSET I O(BAT) + SET RSET (3) where: VSET (2.5 V typ) is the voltage at ISET1 pin during charge current regulation and KSET = Charge Current Scaling Factor. The reference voltage VSET can be reduced via I2C register CHG_CONFIG bits ISET1_1 and ISET1_0. VSET can be selected as a percentage (75%, 50% or 25%) of the original 2.5 V typ, non-attenuated VSET value, effectively scaling down the charge current. Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 49 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com The ISET1 resistor always sets the maximum charge current, if the AC input is selected. When the USB input is selected, the maximum charge current is defined by the USB input current limit and the programmed charge current. If the USB input current limit is lower than the IO(OUT) value, the battery switch is set in the dropout region and the charge current is defined by the input current limit value and system load, as shown in the following curves: I(USB) 2 .75 A INPUT CURRENT BATTERY CHARGE CURRENT 500 mA 750 mA 800 mA (800 mA DEFINED BY RSET VALUE) 300 mA I(OUT ) SYSTEM LOAD 200 mA BATTERY CHARGING, USB INPUT LIMIT SET TO 2.75 A -250 mA BATTERY DISCHARGING, SUPPLEMENT MODE SET BATTERY CHARGING, INPUT LIMIT SET TO 500 mA Figure 37. Input Current Limit Impact on Effective Charge Current CHARGE TERMINATION AND RECHARGE The TPS65820 monitors the charging current during the voltage regulation phase. Charge is terminated when the charge current is lower than an internal threshold, set to 10% (typ) of the fast charge current rate. The termination point applies to both AC and USB charging, and it can be calculated as follows: V KSET I TERM + TERM R SET (4) where VTERM is the termination detection voltage reference. The voltage at ISET1 pin is monitored to detect termination, and termination is detected when V(SET1) < VTERM (0.25 V typ). The voltage reference VTERM is internally set to 10% of the VSET reference voltage, and it is modified if the reference voltage VSET is scaled via I2C register CHG_CONFIG bits ISET1_1 and ISET1_0. VTERM is reduced by the same percentage used to scale down VSET . The table below shows charge current and termination thresholds for a 1-A charge current set (1-k resistor connected to ISET1 pin), with the selected input current limit set to a value higher than the programmed charge current. The termination current is scaled for all charge current modes (AC or USB), as it is always set by the ISET1 pin external resistor value. Table 9. Charge Current and Termination Threshold Selection Example Charge Control Register Bits 50 Charge Current, (% of typical value programmed by ISET1 resistor) ISET1_1 ISET1_0 0 0 25% 0 1 50% 1 0 75% 1 1 100% Submit Documentation Feedback Vset (V) Vterm (mV) Charge Current (A) Termination Current (mA) 0.6 60 0.24 20 1.25 115 0.5 40 1.9 160 0.78 60 2.5 250 1 100 Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 Once termination is detected, a new charge cycle starts if the voltage on the BAT pin falls below the V(RCH) threshold. A new charge start is also triggered if the charger is enabled/disabled/enabled via I2C (CHG_CONFIG register bits CE or CHGON), or if both AC and USB input power are removed and then at least one of them is re-inserted. The termination is disabled when the thermal loop OR DPPM loop are active, and during supplement mode. The charge termination is also disabled when the I2C control bit TERM_OFF is set to HI, in the CHG_CONFIG register. A new charge cycle is started if the control bit TERM_OFF is set to HI after termination was detected. BATTERY VOLTAGE REGULATION, CHARGE VOLTAGE The voltage regulation feedback is Implemented by sensing the BAT pin voltage, which is connected to the positive side of the battery pack. The TPS65820 monitors the battery-pack voltage between the BAT and AGND1 pins, when the battery voltage rises to the VO(REG) threshold the voltage regulation phase begins and the charging current tapers down. The charging voltage can be selected as 4.2 V or 4.365 V (typ). The default power-up voltage is 4.2 V. As a safety measure the 4.365 V charge voltage is programmed only if two distinct bits are set via I2C: VCHG=HI in the CHG_CONFIG, and CHG_VLTG=LO in the GPIO3 register. TEMPERATURE QUALIFICATION The TPS65820 continuously monitors battery temperature by measuring the voltage between the TS and AGND1 pins. An internal current source provides the bias for a negative-temperature coefficient thermistor (NTC), and the TS pin voltage is compared to the window set by internal thresholds VLTF and VHTF to determine if charging is allowed. A voltage outside the VLTF to VHTF window is considered a temperature fault, and charge is suspended. Charge resumes when the temperature returns to the valid window range. With a 50-k (at 25C) thermistor, the valid temperature window is set between 0C to 45C. The temperature window can be enlarged by adding external resistors to the TS pin application circuit. For the TPS65820 device, the charger output is disabled whenever the TS pin is not in the valid range, whether or not the presence of a battery is detected. DYNAMIC POWER PATH MANAGEMENT Under normal operating conditions, the OUT pin voltage is regulated when the AC or USB pin is powering the OUT pin and the battery pack is being charged. If the total (system + charge current) exceeds the available input current, the system voltage drops below the regulation value. The dynamic power path management function monitors the system output voltage. A condition where the external input supply rating has been exceeded or the input current limit has been reached is detected when the OUT pin voltage drops below an user-defined threshold, VDPPM: V DPPM + RDPPM KDPPM I DPPM (5) where: RDPPM = external resistor connected to DPPM pin KDPPM = DPPM scaling factor IDPPM = DPPM pin internal current source To correct this situation the DPPM loop reduces the charge current, regulating the OUT pin voltage to the user-defined VDPPM threshold. The DPPM loop effectively identifies the maximum current that can be delivered by the selected input and dynamically adjusts the charge current to specify that the end equipment is always powered. In order to minimize OUT voltage ripple during DPPM operation, the VDPPM threshold should be set just below the system regulation voltage. If the charge current is reduced to zero by the DPPM and the input current is still lower than the OUT pin load, the output voltage falls below the DPPM threshold, decreasing until the battery supplement mode is set [V(OUT) = V(BAT) - VSUP(DT) ]. Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 51 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com CHARGER OFF MODE The TPS65820 charger circuitry enters the low-power OFF mode if both AC and USB power are not detected. This feature prevents draining the battery during the absence of input supply. PRECHARGE SAFETY TIMER The TPS65820 activates an internal safety timer during the battery pre-conditioning phase. The precharge safety timer time-out value is set by the external resistor connected to TMR pin, RTMR, and the timeout constants KPRE and KTMR : tPRECHG = KPRE x RTMR x KTMR The KPRE constant typical value is 0.1, setting the precharge timer value to 10% of the charge safety timer value. When the charger is in suspend mode, set via I2C register CHG_CONFIG bit CHGON or set by a pack temperature fault, the precharge safety timer is put on hold (i.e., charge safety timer is not reset). Normal operation resumes when the charger exits the suspend mode. If V(BAT) does not reach the internal voltage threshold VPRECHG within the precharge timer period a fault condition is detected and the charger is turned off. If the TMR pin is left floating and internal resistor, 50 k typ, is used to generate the timebase used to set the precharge timeout value. The typical precharge timeout value can be then calculated as : TPRECHG = KPRE x 50K x KTMR CHARGE SAFETY TIMER As a safety mechanism the TPS65820 has a user-programmable timer that measures the total fast charge time. This timer (charge safety timer) is started at the end of the pre-conditioning period. The safety charge timeout value is set by the value of an external resistor connected to the TMR pin (RTMR). The charge safety timer time-out value is calculated as follows: tCHG = KTMR x RTMR When the charger is in suspend mode, set via I2C register CHG_CONFIG bit CHGON or set by a pack temperature fault, the charge safety timer is put on hold (i.e., charge safety timer is not reset). Normal operation resumes when the charger exits the suspend mode. If charge termination is not reached within the timer period a fault condition is detected, and the charger is turned off. The charge safety timer is held in reset if the TMR pin is left floating or if the control bit TERM_OFF,in the CHG_EN I2C register, is set to HI. Under this mode of operation an internal resistor, 50 k typ, sets the internal charger and power path deglitch and delay times, as well as the precharge safety timer timeout value. TIMER FAULT RECOVERY The TPS65820 provides a recovery method to deal with timer fault conditions. The following summarizes this method: * Condition 1: Charge voltage above recharge threshold, VRCH, and timeout fault occurs. Recovery method: The IC waits for the battery voltage to fall below the recharge threshold. This could happen as a result of a load on the battery, self-discharge or battery removal. Once the battery falls below the recharge threshold, the IC clears the fault and starts a new charge cycle. * Condition 2: Charge voltage below recharge threshold, V(RCH), and timeout fault occurs. Recovery method: Under this scenario, the IC connects an internal pullup resistor from OUT pin to Bat pin. This pullup resistor is used to detect a battery removal condition and remains on as long as the battery voltage stays below the recharge threshold. If the battery voltage goes above the recharge threshold, the IC disables the pullup resistor connection and executes the recovery method described for condition 1. All timers are reset and all timer fault conditions are cleared when a new charge cycle is started either via I2C (toggling CHG_CONFIG bits CE, CHGON) or by cycling the input power. All timers are reset and all timer fault conditions are cleared when the TPS65820 enters the UVLO mode. 52 Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 DYNAMIC TIMER FUNCTION The charge and precharge safety timers are programmed by the user to detect a fault condition if the charge cycle duration exceeds the total time expected under normal conditions. The expected total charge time is usually calculated based on the fast charge current rate. When the thermal loop or the DPPM loops are activated the charge current is reduced, and a false safety timer fault can be observed if this mode of operation is active for a long periods. To avoid this undesirable fault condition the TPS65820 activates the dynamic timer function when the DPPM and thermal loops are active. The dynamic timer function slows down the safety timers clock, effectively adding an extra time to the programmed timeout value as follows: 1. If the battery voltage is below the battery depleted threshold: the precharge timer value is modified while the thermal loop or the DPPM loop are active 2. If the battery voltage is above the precharge threshold: the safety timer value is modified if the DPPM or the thermal loop are active AND the battery voltage is below the recharge threshold. The TPS65820 dynamic timer function circuit monitors the voltage at pin ISET1 during precharge and fast charge. When the charger is regulating the charge current, the voltage at pin ISET1 is regulated by the control loops to either VSET or VPRECHG. If the thermal loop or DPPM loops are active, the voltage at pin ISET1 is lower than VSET or VPRECHG, and the dynamic timer control circuit changes the safety timers clock period based on the VSET/V(ISET1) ratio (fast charge) or VPRECHG/V(ISET1) ratio (precharge). TIMER INTERNAL CLOCK PERIOD MULTIPLICATION FACTOR The maximum clock period is internally limited to twice the value of the programmed clock period, which is defined by the resistor connected to TMR pin, as shown in the following figure: 2 1 1 2 V(SET) V(SET 1) , V(PRECHG) V(ISET 1) Figure 38. Safety Timer Internal Clock Slowdown The effective charge safety timer value can then be expressed as follows: Effective precharge timeout = t(PRECHG) + t(PCHGADD) Effective charge safety timeout = t(CHG) + t(CHGADD) where the added timeout values, t(PCHGADD), t(CHGADD), are equal to the sum of all time periods when either the thermal loop or DPPM loop were active. The maximum added timeout value is internally limited to 2 x t(CHG) or 2 x t(PRECHG). CHARGE AND SYSTEM POWER MANAGEMENT -- I2C REGISTERS The I2C registers that control charger and power path related functions are shown below. The HEX address for each register is shown by the register name, together with the R or W functionality for the register bits. Shaded values indicate default initial power-up values. Note that the CHG_STAT register contents are valid only when either AC or USB power are applied to the TPS65820. The output of linear regulator LDO_PM can be used as an indicator of external input power detection; if LDO_PM is in regulation the CHG_STAT register contents are valid. Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 53 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com CHG_CONFIG, ADDRESS=9, ALL BITS R/W B7 B6 B5 B4 B3 B2 B1 B0 Bit name VCHG CHGON TERM_OFF ISET1_1 ISET1_0 ISET2 PSEL CE (1) Function CHARGE VOLTAGE SELECTION CHARGE ENABLE TERMINATION ENABLE CONTROL USB CURRENT LIMIT SELECTED INPUT CURRENT LIMIT SYSTEM POWER SELECTION When 0 4.36 V CHARGE SUSPENDED 100 mA USE USB CURRENT LIMIT BATTERY TO SYSTEM When 1 4.2 V CHARGE ON 500 mA INPUT CURRENT LIMIT SET TO MAXIMUM INPUT POWER TO SYSTEM (1) (1) CHARGE CURRENT SCALING FACTOR TERMINATION 00 = 0.25 10 = 0.75 ENABLED 01 = 0.5 11 = 1 Note: Relative to charge current programmed by external ISET pin TERMINATION resistor. DISABLED The CE bit state is latched inside the charger control logic (CE latch) during an OUT pin UVLO event, prior to resetting the charge control register bit CE to its power up default value. The charger CE latch controls the charger and power path state as long as the TPS65820 is in UVLO mode and an external supply is connected to the charger block. The CE latch is reset to its power-up value (CE=LO) only when the input power is removed from the charger block. The CE latch is disabled and the CE charge control register bit sets the charger and power path MOSFETs state when the TPS65820 exits the UVLO mode. This feature avoids a host software loop when the host algorithm requires a depleted (or absent) battery to be connected to the system bus while input power is present. GPIO3, ADDRESS = 1C, ALL BITS R/W. NOTE: ONLY BIT B4 CONTROLS CHARGER-RELATED FUNCTIONALITY B7 B6 B5 B4 B3 B2 B1 B0 Bit name GPIO3i/O GPIO3_LEVEL LDO0_ENABLE CHARGE _VLTG RTC_SET GPIO2 _INTSRC GPIO1 _INTSRC GPIO2 _SM2 Function SEE Table 17 SEE Table 17 SEE Table 17 CHARGE VOLTAGE SELECTION SAFETY BIT RTC_LDO OUTPUT VOLTAGE SEE Table 17 SEE Table 17 SEE Table 17 When 0 4.2 V 3.1 V When 1 4.36 V 2.6 V CHG_STAT, ADDRESS = A, ALL BITS READ-ONLY - POWER UP DEFAULTS SHOW SYSTEM STATUS WHEN EXITING POWER DOWN B7 (2) (3) B6 B5 (1) B4 B3 B2 B1 B0 INPUT _PWR THDPPM_ON ACPG USBPG STAT1 STAT2 INP_OV Bit name BAT_STAT Function BATTERY SUPPLEMENT MODE STATUS SELECTED INPUT POWER STATUS THERMAL LOOP AND DPPM STATUS AC INPUT POWER STATUS USB INPUT POWER STATUS When 0 SUPPLEMENT MODE OFF AC INPUT SELECTED BOTH OFF AC NOT DETECTED USB NOT DETECTED When 1 SUPPLEMENT MODE ON USB INPUT SELECTED DPPM ON OR THERMAL ON AC DETECTED USB DETECTED (1) (2) (3) 54 00 = 01 = 10 = 11 = CHARGE STATUS AC OR USB INPUT OVP DETECTION FAULT/SUSPEND/OFF CHARGE DONE FAST CHARGE ON PRECHARGE NO OVP OVP DETECTED The TPS65820 generates a charger status interrupt if a DPPM event occurs. The battery supplement is entered when V(BAT) - V(OUT) > 60 mV (typ), and it ends when V(BAT) - V(OUT) < 20 mV. When the system power bus current exceeds the input current limit of the external supply current capability, the supplement mode is set. An oscillatory behavior for BAT_STAT bit can happen if the battery switch dropout voltage is less than 20 mV (typ) when in supplement mode. The BAT_STAT is always masked internally, and does not generate interrupts Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 FUNCTIONALITY GUIDE -- LINEAR REGULATORS SELECTABLE OUTPUT VOLTAGE LDO Supply ON/OFF Control Output Discharge Switch LDO1 Yes, set via I2C LDO2 OUTPUT VOLTAGE (V), set via I2C IO Max (mA) Acc % Power Up Default 1.25/1.5/1.8/2.5/2.85/3/3.2/3.3 150 3 ON, 2.85 V 8 1.25/1.5/1.8/2.5/2.85/3/3.2/3.3 150 3 ON, 3.3 V No 2 1.8 / 3 8 2 OFF, 1.8 V No 2 2.6/3.1 8 5 ON, 2.6V IO Max (mA) Acc % Power Up Default # of Steps Available Values (V) Yes, enabled via I2C 8 Yes, set via I2C Yes, enabled via I2C SIM Yes, set via I2C RTC_OUT Yes, set via I2C PROGRAMMABLE OUTPUT VOLTAGE LDO Supply LDO3 ON/OFF Control OUTPUT VOLTAGE (V), set via I2C Output Discharge Switch yes, set via I2C Yes, enabled via I2C 2 2 Range # of Steps Min Step 1.224-4.46 128 25 mV 100 3 ON, 1.25 V LDO4 yes, set via I C Yes, enabled via I C 1.224-4.46 128 25 mV 100 3 ON, 2.75 V LDO5 yes, set via I2C Yes, enabled via I2C 1.224-4.46 128 25 mV 100 3 ON, 2.81 V FIXED OUTPUT VOLTAGE LDO'S Supply ON/OFF Control OUTPUT VOLTAGE (V) IO Max (mA) Acc % Power Up Default LDC0 Yes, via I2C 3.3, fixed 150 3 OFF LDO_PM NO, enabled internally 3.3, fixed 20 5 ON if AC or USB power detected ON /OFF , Output Voltage Discharge Control 3.1 V 8 mA 3.3 V 10 mA 1.25-3.3 V 150 mA 3.3 V 150 mA A2 OUT SIM C3 2.2 mF L DO_P M 100 mF RTC_O UT 1.8 V/3 V 8 mA C4 1 mF LDO0 4.7 mF C8 L DO 2 4.7 mF C10 LDO1 4.7 mF C9 VIN_L DO12 4.7 mF C6 AG ND2 2.2 mF C13 LDO3 2.2 mF C14 LDO4 2.2 mF C15 L DO5 0.1 mF L DO 35 _REF 1.224-4.4 V 100 mA C5 HI 1.224-4.4 V 100 mA C12 VIN_ LDO3 5 1 mF C11 1.25-3.3 V 150 mA AG ND1 PSRR L DO S 1.224-4.4 V 100 mA ON /OFF Output Voltage ON /OFF C7 1 mF I2 C REG ISTERS TPS65820 A1 Figure 39. Required External Components, Recommended Values, External Connections Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 55 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com LINEAR REGULATORS -- FUNCTIONAL DESCRIPTION The TPS65820 offers nine Integrated Linear Regulators, designed to be stable over the operating load range with use of external ceramic capacitors, as long as the recommended filter capacitor values (see application diagram and pinout description) are used. The output voltage can be programmed via I2C (LDO0-2, LDO3-5) or have a fixed output voltage. Simplified Block Diagram A simplified block diagram for the LDOs is shown in Figure 40. INPUT SUPPLY VREF _ I2C REGISTERS OUTPUT VOLTAGE SAMPLE ON/OFF CONTROL OUTPUT VOLTAGE + All LDOs except LDO_PM BIAS CONTROL LDO3-5 ONLY SHORT CIRCUIT PROTECTION OUTPUT VOLTAGE SETTING OUTPUT CURRENT SAMPLE Programmable LDOs only DISCHARGE CONTROL ENABLE LDO1, LDO2, LDO3-5 ONLY DISCHARGE CONTROL LDO1, LDO2, LDO3-5 ONLY Figure 40. Simplified Block Diagram Connecting the LDO Input Supply Both LDO1-2 and LDO3-5 have uncommitted input power supply pins (VIN_LDO12, VIN_LDO35), which should be externally connected to the OUT pin. Optionally the LDO0-2 and LDO3-5 input supplies can be connected to the output of the available buck converters SM1 or SM2, as long as the resulting overall power-up sequence meets the system requirements. The RTC_OUT, SIM, LDO0 and LDO_PM linear regulators are internally connected to the OUT pin. ON/OFF Control All the LDO's, with exception of LDO_PM LDO, have a ON/OFF control which can be set via I2C commands, facilitating host management of the distinct system power rails. The LDO_PM LDO On/OFF control is internally hard-wired, and it is set to ON when either AC or USB input power is detected. Output Discharge Switch LDO1, LDO2 AND LDO3-5 have integrated switches that discharge each output to ground when the LDO is set to OFF by an I2C command. The output discharge switch function can be disabled by using I2C register control bits. The discharge switches are enabled after the initial power-up Special Functions The RTC_OUT, SIM (Subscriber line interface module) and LDO_PM linear regulators are designed to support lower load currents. The SIM and RTC_LDO have low leakage in OFF mode, with the input pin voltage above or below the output pin voltage. The LDO_PM can be used for USB enumeration, or a status indication of input power connection. 56 Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 Output Voltage Monitoring Internal power good comparators monitor the LDO outputs and detect when the output voltage is below 90% of the programmed value. This information is used by the TPS65820 to generate interrupts or to trigger distinct operating modes, depending on specific I2C register settings. See interrupt and sequencing controller section for additional details. LINEAR REGULATORS -- I2C REGISTERS The I2C registers that control LDO-related functions are shown below. The HEX address for each register is shown by the register name, together with the R or W functionality for the register bits. Shaded values indicate default initial power-up values. B7 B6 B5 B4 B3 LDO3_EN LDO4_EN LDO5_EN B2 B1 B0 SIM EN1 RTC_EN EN_LDO: ADDRESS = B, ALL BITS R/W Bit name LDO1_EN LDO2_EN Function LDO1...5 ON/OFF CONTROL SIM_SET SIM LDO output voltage SIM/RTC ON/OFF CONTROL When 0 OFF OFF OFF OFF OFF 3V OFF OFF When 1 ON ON ON ON ON 1.8 V ON ON LDO1_2 SET LDO1_1 SET LDO1_0 SET LDO2_DISCH LDO2_2 SET LDO2_1 SET LDO2_0 SET LDO12: ADDRESS = C, ALL BITS R/W Bit name LDO1_DISCH Function LDO1 output discharge switch enable When 0 OFF When 1 ON LDO1 OUTPUT VOLTAGE SETTING 000 010 100 110 = = = = 1.25 V 1.8 V 2.85 V 3.2 V 001=1.5 V 011=2.5 V 110=3 V 111=3.3 Default = 2.85 V LDO2 Output discharge switch enable OFF ON LDO2 OUTPUT VOLTAGE SETTING 000 = 010 = 100 = 110 = 1.25 V 1.8 V 2.85 V 3.2 V 001 = 1.5 V 011 = 2.5 V 110 = 3 V 111 = 3.3 V Default = 3.3 V LDO3, ADDRESS = D, ALL BITS R/W Bit name LDO3_DISCH Function LDO3 output discharge switch enable When 0 OFF When 1 ON LDO3_6 SET LDO3_5 SET LDO3_4 SET LDO3_3 SET LDO3_2 SET LDO3_1 SET LDO3_0 SET LDO3 OUTPUT VOLTAGE SETTING See Table 10 for LDO3-5 output voltage setting, Power-up default = 1.25 V LDO4, ADDRESS = E, ALL BITS R/W Bit name LDO4_DISCH Function LDO4 output discharge switch enable When 0 OFF When 1 ON LDO4_6 SET LDO4_5 SET LDO4_4 SET LDO4_3 SET LDO4_2 SET LDO4_1 SET LDO4_0 SET LDO4 OUTPUT VOLTAGE SETTING See Table 10 for LDO3-5 output voltage setting, Power-up default = 2.75 V LDO5, ADDRESS = F, ALL BITS R/W Bit name LDO5_DISCH Function LDO5 output discharge switch enable When 0 OFF When 1 ON LDO5_6 SET LDO5_5 SET LDO5_4 SET LDO5_3 SET LDO5_2 SET LDO5_1 SET LDO5_0 SET LDO5 OUTPUT VOLTAGE SETTING See Table 10 for LDO3-5 output voltage setting, Power-up default = 2.81 V GPIO3, ADDRESS = 1C, ALL BITS R/W. NOTE: ONLY BIT B5 CONTROLS LDO-RELATED FUNCTIONALITY Bit name GPIO3i/O GPIO3 LEVEL LDO0 ENABLE CHARGE _VLTG RTC_SET GPIO2_INTSRC GPIO1_INTSRC GPIO2_SM2 Function SEE Table 17 SEE Table 17 LDO0 ON/OFF CONTROL SEE Battery Voltage Regulation, Charge Voltage RTC_LDO OUTPUT VOLTAGE SEE Table 17 SEE Table 17 SEE Table 17 When 0 LDO0 OFF When 1 LDO0 ON 3.1 V 2.6 V Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 57 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com Table 10. LDO 3-5 Programming Step Values 58 Step B6-B0 Vset Step B6-B0 Vset Step B6-B0 Vset Step B6-B0 Vset 0 000 0000 1.224 32 010 0000 2.04 64 100 0000 2.015 96 110 0000 2.856 1 000 0001 1.25 33 010 0001 2.066 65 100 0001 2.04 97 110 0001 2.882 2 000 0010 1.275 34 010 0010 2.091 66 100 0010 2.907 98 110 0010 3.723 3 000 0011 1.301 35 010 0011 2.117 67 100 0011 2.933 99 110 0011 3.749 4 000 0100 1.326 36 010 0100 2.142 68 100 0100 2.958 100 110 0100 3.774 5 000 0101 1.352 37 010 0101 2.168 69 100 0101 2.984 101 110 0101 3.8 6 000 0110 1.377 38 010 0110 2.193 70 100 0110 3.009 102 110 0110 3.825 7 000 0111 1.403 39 010 0111 2.219 71 100 0111 3.035 103 110 0111 3.851 8 000 1000 1.428 40 010 1000 2.244 72 100 1000 3.06 104 110 1000 3.876 9 000 1001 1.454 41 010 1001 2.27 73 100 1001 3.086 105 110 1001 3.902 10 000 1010 1.479 42 010 1010 2.295 74 100 1010 3.111 106 110 1010 3.927 11 000 1011 1.505 43 010 1011 2.321 75 100 1011 3.137 107 110 1011 3.953 12 000 1100 1.53 44 010 1100 2.346 76 100 1100 3.162 108 110 1100 3.978 13 000 1101 1.556 45 010 1101 2.372 77 100 1101 3.188 109 110 1101 4.004 14 000 1110 1.581 46 010 1110 2.397 78 100 1110 3.213 110 110 1110 4.029 15 000 1111 1.607 47 010 1111 2.423 79 100 1111 3.239 111 110 1111 4.055 16 001 0000 1.632 48 011 0000 2.448 80 101 0000 3.264 112 111 0000 4.08 17 001 0001 1.658 49 011 0001 2.474 81 101 0001 3.29 113 111 0001 4.106 18 001 0010 1.683 50 011 0010 2.499 82 101 0010 3.315 114 111 0010 4.131 19 001 0011 1.709 51 011 0011 2.525 83 101 0011 3.341 115 111 0011 4.157 20 001 0100 1.734 52 011 0100 2.55 84 101 0100 3.366 116 111 0100 4.182 21 001 0101 1.76 53 011 0101 2.576 85 101 0101 3.392 117 111 0101 4.208 22 001 0110 1.785 54 011 0110 2.601 86 101 0110 3.417 118 111 0110 4.233 23 001 0111 1.811 55 011 0111 2.627 87 101 0111 3.443 119 111 0111 4.259 24 001 1000 1.836 56 011 1000 2.652 88 101 1000 3.468 120 111 1000 4.284 25 001 1001 1.862 57 011 1001 2.678 89 101 1001 3.494 121 111 1001 4.31 26 001 1010 1.887 58 011 1010 2.703 90 101 1010 3.519 122 111 1010 4.335 27 001 1011 1.913 59 011 1011 2.729 91 101 1011 3.545 123 111 1011 4.361 28 001 1100 1.938 60 011 1100 2.754 92 101 1100 3.57 124 111 1100 4.386 29 001 1101 1.964 61 011 1101 2.78 93 101 1101 3.596 125 111 1101 4.412 30 001 1110 1.989 62 011 1110 2.805 94 101 1110 3.621 126 111 1110 4.437 31 001 1111 2.015 63 011 1111 2.831 95 101 1111 3.647 127 111 1111 4.463 Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 FUNCTIONALITY GUIDE -- SWITCHED MODE STEP-DOWN CONVERTERS BUCK CONVERTERS, I2C PROGRAMMABLE OUTPUT VOLTAGE Supply PFM Mode SM1 PFM/PWM with automatic mode selection or PWM only. SM2 Mode of operation set via I2C Standby Mode Standby mode with distinct voltage available . Standby mode set via I2C or with GPIO pin OUTPUT VOLTAGE (V), Set via I2C, Separate Settings for Normal or Standby Mode IO Max (mA) Range # of Steps Min Step Acc (%) 0.6-1.8 32 40 mV 3 600 1-3.4 32 80mV 3 600 TPS65820 PWM Freq and Phase SLEW RATE, mV/s, Set via I2C Power Up Default Range # of Steps Min Step 1.5MHz, 0 0, 0.24 to 15.36 8 0.24 ON, skip mode off, PWM only, 1.24 V(on/stby), 15.36 mV/s 1.5MHz, 0/90/180 270, with respect to SM1, set via I2C 0, 0.4830.72 8 0.48 ON, skip mode on, PWM/PFM, 1.8 V (on/stby), 180, 30.72 mV/s OUT VO(SM1) I2C REGISTERS Operating Mode Output Voltage Phase Control Discharge Control SYNC BUCK 0.6-1.8 V 600 mA VIN_ SM1 L1 SM1 LSM 1 3.3 mH C21 10 mF C22 10 mF PGND 1 VO(SM2) P1 VIN_ SM2 Operating Mode Output Voltage Phase Control Discharge Control 1.0-3.4 V 600 mA L2 SM2 LSM 2 3.3 mH C19 10 mF C20 10 mF PGND 2 P2 Figure 41. Required External Components, Recommended Values, External Connections STEP-DOWN SWITCHED MODE CONVERTERS: SM1 and SM2 The TPS65820 has two highly efficient step down synchronous converters. The integration of the power stage switching MOSFETs reduces the external component count, and only the external output inductor and filter capacitor are required. The integrated power stage supports 100% duty cycle operation. Multiple operation modes are available, enabling optimization of the overall system performance under distinct load conditions. The converters have two modes of operation: a 1.5 MHz fixed frequency pulse width modulation (PWM) mode at moderate to heavy loads, and a pulse frequency modulation (PFM) mode at light loads. The converter output voltage is programmable via I2C registers SM1_SET1 and SM2_SET1. When the SM1/SM2 converters are disabled an integrated switch automatically discharges the converter output capacitor. The discharge switch function can be disabled by setting the control bits DISCHSM1 and DISCHSM2 to LO, in I2C registers SM1_SET2 and SM2_SET2. Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 59 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com TPS65820 SM1 OUTPUT VOLTAGE SETTING SM 1 CONVERTER EN_PFM DAC OUT VIN_SM1 PWM CONTROL PWMON EN_PWM GATE CONTROL LOGIC I2C REGISTERS PFM CONTROL L1 LSM 1 I(L1) PFMON POWER STAGE CURRENT COMPARATORS RESET OUT SET SM1 OPERATING MODE : ON/OFF, PWM, PFM, STANDBY SM1 DISCHARGE SWITCH ENABLE , LOW PFM RIPPLE _ C22 10 F V ( V I N _ S M 1) 29 + V(VIN_SM1) _ 39 EN_PFM EN_PWM EN_ALL P1 SM1 CONTROL DCHGON LOGIC SM1 SM2 OUTPUT VOLTAGE SETTING SM2 OPERATING MODE : ON/OFF , PWM,PFM, PFM,STANDBY STANDBY PWM, SM1 DISCHARGE SWITCH ENABLE , LOW PFM RIPPLE C21 10 F PGND 1 I(L1) + VO(SM1) 3.3 H VIN_SM2 L2 SM2 CONVERTER SAME TOPOLOGY AS SM1 CONVERTER VO(SM2) 3.3 H LSM2 C19 10 F PGND2 C20 10 F SM2 SM1/SM2 PHASE CONTROL P2 Figure 42. SM1/SM2 Converter The TPS65820 SM1 and SM2 buck converters can be set to operate only in PWM mode or to switch automatically between PFM and PWM modes. The average load current is monitored, and the PFM mode is set if the average load current is below the threshold IPFM(ENTER). When in PFM mode the load current is also monitored, and the PWM mode is set when the load current exceeds the threshold IPFM(LEAVE). The thresholds for automatic PFM/PWM switching are calculated as shown in Equation 6 for the SM1 converter, the same thresholds apply to the SM2 converter by replacing VIN_SM1 by VIN_SM2 : V(VIN_SM3) V(VIN_SM3) I PFM(ENTER) + I PFM(LEAVE) + , 39 W 29 W (6) The automatic switching mode is enabled via the control bits PFM_SM1 and PFM_SM2 on I2C registers SM1_SET1 and SM2_SET1. Output Voltage Slew Rate I2C registers enable setting the output voltage slew rate, when transitioning from one programmed voltage to a new programmed voltage value. These events can be triggered by a new output voltage selection or by switching from a low power mode (standby) to a normal operating mode. During a transition, the output voltage is stepped from the currently programmed voltage to the new target voltage. The slew rate from the initial voltage to the final voltage can be selected using I2C registers, SM1_SET2 and SM2_SET2, ranging from 0.24 mV/s to 15.36 mV/s for the SM1 converter and 0.48 to 30.72 mV/s for the SM2 converter. If the slew rate is set to OFF, the output voltage goes from the current value to the programmed value in a single step. During the transition to standby mode the Power Good comparators are disabled. 60 Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 Soft Start SM1 and SM2 have an internal soft start circuit that limits the inrush current during start-up. An initial delay (170 s typ) from the converter enabled command to the converter effectively being operational is required, to assure that the internal circuits of the converter are properly biased. At the end of that initial delay the soft start is initiated, and the internal compensation capacitor is charged with a low value current source. The soft start time is typically 750 s, with the output voltage ramping from 5% to 95% of the final target value. Dropout Operation at 100% Duty Cycle The TPS65820 buck converters offer a low input to output voltage difference while still maintaining operation when the duty cycle is set to 100%. In this mode of operation the P-channel switch is constantly turned on, enabling operation with a low input voltage. The dropout operation starts if: V(VIN_SM1) v V(SM1) ) I(L1) RDSON(PSM1) ) RL (7) Where: I(L1) = Output current plus inductor ripple current. RL = DC resistance of the inductor Equation 7 can be also used for the SM2 converter, replacing SM1 by SM2 and L1 by L2. Output Voltage Monitoring The output voltage of converters SM1 and SM2 is monitored by internal comparators, and an output low voltage condition is detected when the output voltage is below 90% of the programmed value. The power good status for SM1 and SM2 is accessible via I2C, see interrupt controller section for more details. The power good comparators for SM1 and SM2 are disabled during the transition to standby mode operation. They are enabled when the transition to standby mode is complete. Standby Mode Using the I2C SM1 and SM2 can be set in stand-by mode. In STANDBY mode the PFM operation mode is set and the output voltage is defined by I2C registers SM1_STANDBYand SM2_STANDBY, and it can be set to a value different than the normal mode output regulation voltage. The standby mode can also be set by the GPIO pins, if those are configured as control pins that define the SM1/SM2 operating mode. PWM Operation During PWM operation the converters use a fast response voltage mode controller scheme with input voltage feed-forward, enabling the use of small ceramic input and output capacitors. At the beginning of each clock cycle the P-channel MOSFET switch is turned on, and the oscillator starts the voltage ramp. The inductor current ramps up until the ramp voltage reaches the error amplifier output voltage, when the comparator trips and the p-channel MOSFET switch is turned off. Internal adaptative break-before-make circuits turn on the integrated n-channel MOSFET switch after an internal, fixed dead-time delay, and the inductor current ramps down, until the next cycle is started. When the next cycle starts the ramp voltage is reset to its low value and the p-channel MOSFET switch is turned on again. Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 61 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com PWM CONTROL SECTION (SHOWN FOR SM1, SAME TOPOLOGY FOR SM2) ERROR AMP WITH "TYPE-3 LIKE" COMPENSATION OUT _ OUTPUT VOLTAGE SETTING VIN_SM1 + + OSC _ GATE CONTROL LOGIC RAMP PEAK-TO-PEAK VOLTAGE PROPORTIONAL TO VIN_SM1 L1 (L1) PGND1 VO(SM1) 3.3 mH LSM1 C21 10 mF C22 10 mF SM1 Figure 43. PWM Operation The integrated power MOSFETs current is monitored at all times and the power MOSFET is turned off if its internal short-circuit current limit is reached. Phase Control in PWM Mode The SM1 and SM2 converters operate synchronized to each other when both are in PWM mode, with converter SM1 as the master. I2C control register bits S1S2PHASE in register SM1_SET2 enables delaying the SM2 PWM clock with respect to SM1 PWM clock, selecting a phase shift from 0 to 270 degrees. The out-of-phase operation reduces the average current at the input node, enabling use of smaller input filter capacitors when both converters are connected to the same input supply. PFM Mode Operation When using the I2C interface, the SM1 and SM2 converters can have the automatic power-saving PFM mode enabled. When the PFM mode is set, the switching frequency is reduced and the internal bias currents are decreased, optimizing the converter efficiency under light-load conditions. In PFM mode, the output voltage is monitored by a voltage comparator, which regulates the output voltage to the programmed value, VO(SM1). If the output voltage is below VO(SM1), the PFM control circuit turns on the power stage, applying a burst of pulses to increase the output voltage. When the output voltage exceeds the target regulation voltage, VO(SM1), the power stage is disabled, and the output voltage drops until it is below the regulation voltage target, when the power stage is enabled again. 62 Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 OUT VIN_SM1 PFM CONTROL SECTION (SHOWN FOR SM1, SAME TOPOLOGY FOR SM2) GATE CONTROL LOGIC POWER STAGE PEAK CURRENT COMPARATORS _ - LSM1 + RESET + C21 10 mF C22 10 mF PGND1 I(L 1) _ VO(SM1) 3.3 mH I(L1) OUTPUT VOLTAGE COMPARATOR VO(SM1) L1 V(VIN_SM1) 29 W P1 OUT SET BIAS CONTROL + _ V(VIN_SM1) 39 W SM1 Figure 44. PFM Mode Operation During burst operation two current comparators control the power stage integrated MOSFETs. These comparators monitor the instantaneous inductor current and compare it to the internal thresholds IPFM(ENTER) and IPFM(LEAVE), turning the p-channel switch on if the inductor current is less than IPFM(LEAVE) and turning it off if the inductor current exceeds IPFM(ENTER). The n-channel switch is turned on when the p-channel MOSFET is off. The PFM output voltage comparator quiescent current may be reduced using the I2C register bits PFM_RPL1 and PFM_RPL2 in registers SM1_SET and SM2_SET. The voltage comparator quiescent current is reduced if PFM_RPL1 and PFM_RPL2 bits are set to LO, and the comparator response time (tCOMP, see Figure 45) increases. A reduction in quiescent current increases the converter efficiency at light loads, at the expense of a larger output voltage ripple when in PFM mode. The ripple is minimized if PFM_RPL1 and PFM_RPL2 bits are set to HI, at the expense of reduced efficiency under light loads. The operation under low and high ripple settings is described in Figure 45. TCOMP TCOMP TCOMP TCOMP V(OUT) OUTPUT VOLTAGE IPFM(ENTER) IPFM(LEAVE) BURST LOW RIPPLE PFM OPERATION INDUCTOR CURRENT BURST MAXIMUM EFFICIENCY PFM OPERATION Figure 45. PFM mode operation waveforms When a burst of pulses is generated, the PFM current comparators control the power stage MOSFETs to limit the inductor current to a value between the thresholds IPFM(LEAVE) and IPFM(ENTER). The number of pulses in a burst cycle is proportional to the load current, and the average current is always below IPFM(LEAVE) once PFM operation is set. The typical burst operation in PFM mode is shown in Figure 46. Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 63 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com BURST V(OUT) IPFM(ENTER) INDUCTOR CURRENT IPFM(LEAVE) IPFM(LEAVE) LOAD CURRENT Figure 46. Typical Burst Operation in PFM Mode The PFM operation is disabled and PWM operation set if one of the following events happen during PFM operation: 1. The total burst operation time exceeds 10 s, typ. 2. The output voltage falls below 2% of the target regulation voltage. The PFM mode can be disabled through the serial interface to force the individual converters to stay in fixed frequency PWM mode. 64 Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 SWITCHED MODE STEP-DOWN CONVERTERS -- I2C REGISTERS The I2C registers that control buck converter-related functions are shown below. The HEX address for each register is shown by the register name, together with the R or W functionality for the register bits. Shaded values indicate default initial power-up values. B7 B6 B5 B4 B3 B2 B1 B0 SetV4_SM1 SetV3_SM1 SetV2_SM1 SetV1_SM1 SetV0_SM1 SM1_SET1, ADDRESS=10, ALL BITS R/W Bit name SM1 EN PFM_RPL1 PFM_SM1 Function SM1 ON/OFF CONTROL SM1 PFM FUNCTION OPERATION SM1 PFM MODE ON/OFF CTRL When 0 OFF MAXIMIZE EFFICIENCY PWM/PFM When 1 ON MINIMIZE OUTPUT RIPPLE Only PWM SM1 OUTPUT VOLTAGE REGULATION VALUE, STANDBY MODE NOT SET See Table 11 for SM1, SM2 voltage setting, Power-up default = 1.24 V SM1_SET2, ADDRESS=11, ALL BITS R/W Bit name NOT USED Function STANDBY_SM 1 DISCHSM1 NOT SM1 STANDBY MODE ON SM1 output discharge switch enable SM2 PWM CLOCK DELAY, WITH RESPECT TO SM1 PWM CLOCK SM1 OUTPUT SLEW RATE SETTING NOT OFF OFF NOT ON ON 00 = 0 10 = 180 01 = 90 11 = 270 Units: degrees Default = 180 000 = 0.24 010 = 0.96 100 = 5.84 110 = 15.36 001 = 0.48 011 = 1.92 101 = 7.68 111 = IMMEDIATE Unit: mV/s Default = 15.36 SetV4_SM1SL SetV2_SM1SL USED When 0 USED When 1 S1S2PHASE_1 S1S2PHASE_0 USED SLEWSM1_2 SLEWSM1_1 SLEWSM1_0 SM1_STANDBY, ADDRESS=12, B4-B0 R/W, B7-B5 READ ONLY Bit name NOT USED NOT USED NOT USED Function NOT USED NOT USED NOT USED SM1 OUTPUT VOLTAGE REGULATION VALUE, STANDBY MODE SET SetV3_SM1SL SetV1_SM1SL SetV0_SM1SL When 0 NOT USED NOT USED NOT USED See Table 11 for SM1, SM2 voltage setting, Power-up default = 1.24 V When 1 NOT USED NOT USED NOT USED SM2_SET1, ADDRESS=13, ALL REGISTER BITS R/W Bit name SM2 EN PFM_RPL2 PFM_SM2 Function SM2 ON/OFF CONTROL SM2 PFM FUNCTION OPERATION SM2 PFM MODE ON/OFF CTRL SetV4_SM2 SM2 OUTPUT VOLTAGE REGULATION VALUE, STANDBY MODE NOT SET SetV3_SM2 SetV2_SM2 SetV1_SM2 SetV0_SM2 When 0 OFF MAXIMIZE EFFICIENCY PWM/PFM See Table 11 for SM1, SM2 voltage setting, Power-up default = 1.8 V When 1 ON MINIMIZE OUTPUT RIPPLE ONLY PWM SM2_SET2, ADDRESS=14, ALL REGISTER BITS R/W Bit name NOT USED STANDBY_SM 2 DISCHSM2 NOT USED NOT USED Function NOT USED SM2 STANDBY MODE ON SM2 output discharge switch enable NOT USED NOT USED When 0 NOT USED OFF OFF NOT USED NOT USED When 1 NOT USED ON ON NOT USED NOT USED SetV4_SM2SL SetV3_SM2SL SLEWSM2_2 SLEWSM2_1 SLEWSM2_0 SM2 OUTPUT SLEW RATE SETTING 000 = 0.48 010 = 1.92 100 = 7.68 110 = 30.72 001 = 0.096 011 = 3.84 101 = 15.36 111 = IMMEDIATE Unit: mV/s Default = 30.72 SM2_STANDBY, ADDRESS=15, ALL REGISTER BITS R/W Bit name NOT USED NOT USED NOT USED Function NOT USED NOT USED NOT USED SM1 OUTPUT VOLTAGE REGULATION VALUE, STANDBY MODE SET SetV2_SM2SL SetV1_SM2SL SetV0_SM2SL When 0 NOT USED NOT USED NOT USED See Table 11 for SM1, SM2 voltage setting, Power-up default = 1.8 V When 1 NOT USED NOT USED NOT USED Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 65 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com Table 11. Programmable Settings for SM1 and SM2 (Including STANDBY) SetV4_ SM SetV3_ SM SetV2_ SM SetV1_ SM SetV0_ SM 0 0 0 0 0 0 0 0 0 1 0 0 0 1 0 0 0 0 1 0 0 1 0 0 0 0 Vset SM1 Vset SM2 SetV4_ SM SetV3_ SM SetV2_ SM SetV1_ SM SetV0_ SM Vset SM1 Vset SM2 0.6 1 1 0 0 0 0 1.24 2.28 0.64 1.08 1 0 0 0 1 1.28 2.36 0.68 1.16 1 0 0 1 0 1.32 2.44 1 0.72 1.24 1 0 0 1 1 1.36 2.52 0 0 0.76 1.32 1 0 1 0 0 1.4 2.6 1 0 1 0.8 1.4 1 0 1 0 1 1.44 2.68 0 1 1 0 0.84 1.48 1 0 1 1 0 1.48 2.76 0 1 1 1 0.88 1.56 1 0 1 1 1 1.52 2.84 0 1 0 0 0 0.92 1.64 1 1 0 0 0 1.56 2.92 0 1 0 0 1 0.96 1.72 1 1 0 0 1 1.6 3 0 1 0 1 0 1 1.8 1 1 0 1 0 1.64 3.08 0 1 0 1 1 1.04 1.88 1 1 0 1 1 1.68 3.16 0 1 1 0 0 1.08 1.96 1 1 1 0 0 1.72 3.24 0 1 1 0 1 1.12 2.04 1 1 1 0 1 1.76 3.32 0 1 1 1 0 1.16 2.12 1 1 1 1 0 1.8 3.4 0 1 1 1 1 1.2 2.2 1 1 1 1 1 0.6 1 A SM1, SM2 PHASE S1S2_PHASE1 S1S2_PHASE0 66 SMX_SLEW RATE, SMX = SM1 OR SM2 SLEWX_2 SLEWX_1 SLEWX_0 SM1 mV/s SM2 mV/s 0 0 0 0 0.24 0.48 PHASE 0 0 0 1 90 0 0 1 0.48 0.96 1 0 180 0 1 0 0.96 1.92 1 1 270 0 1 1 1.92 3.84 1 0 0 3.84 7.68 1 0 1 7.68 15.36 1 1 0 15.36 30.72 1 1 1 Submit Documentation Feedback Immediate Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 FUNCTIONALITY GUIDE - ANALOG TO DIGITAL CONVERTER 10 BIT SUCCESSIVE APPROXIMATION ADC ADC Input Channels Trigger Mode Internal External Charge current, thermistor temperature, IC junction temperature, RTC_OUT voltage, OUT voltage, battery voltage ANLG1 and ANLG2 voltages GPIB, I2C driven, repeat Fixed internally Selectable via I2C Selectable via I2C Conversion Count Converter Mode 1, 4, 8, 16, 32, 64, 128, 256 Selectable via I2C Trigger Delay Range Min Step Single, average, find max value, find min value 0-750 s, 16 steps 50 s Selectable via I2C Selectable via I2C Power Up Default s: 20, 40, 60, 80, 160, 240, 320, 640 ADC off ms: 1.28, 1.92, 2.56, 5.12, 10.24, 15.36, 20.48 Selectable via I2C OUT 6 INTERNAL CHANNELS Wait Time, Multiple Conversions Selectable via I2C SYSTEM POWER BUS ADC ANLG 1 ADC CONTROL LOGIC AGND 2 8 CHANNEL MUX A/D CONVERTER EXTERNAL ANALOG ANLG 2 INPUT VOLTAGE ADC _ REF C17 4.7 mF A2 A2 Figure 47. Required External Components, Recommended Values, External Connections ANALOG-TO-DIGITAL CONVERTER Overview The TPS65820 has a 10 bit integrated successive approximation A/D, capable of running A/D conversions on eight distinct channels in a variety of modes. Two of the eight channels are connected to uncommitted pins ANLG1 and ANLG2, and can be used to convert external voltages. The other six channels monitor system parameters which are critical to the overall system monitoring. The channel selection is set via I2C. A dedicated set of I2C registers enables configuration of the ADC to perform a conversion cycle with either a single conversion or a multiple conversions. The ALU generates a data set containing maximum value detection, minimum value detection and average value calculation for each conversion cycle. Each cycle can be performed a single time or multiple times. Input Channels The following channels are available for selection via the I2C register ADC_SET bits CHSEL_SET bits: Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 67 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com Table 12. ADC Input Channel Oerview Channel Connection Voltage Range Under Normal Operating Conditions Parameter Sampled CH1 ANLG1 pin CH2 ANLG2 pin User defined CH3 ISET1 pin Voltage proportional to charge current CH4 TS pin CH5 User defined Special Features Full Scale Reading (Internal reference selected ) Internal pullup current source programmable via I2C : 0/10/50/60 A 2.535 V -- 2.535 V Voltage proportional to pack 0 V (short) to 4.7 V (no temperature thermistor) Internal 20-A pullup current source (ON only when AC/USB are present) 2.535 V Internal junction temperature Voltage proportional to IC junction temperature 1.85 V at TJ = 25C, -6.5 mV/C slope typ -- 2.535 V CH6 RTC_OUT pin Internal LDO output voltage 0 V to 3.3 V -- 4.7 V CH7 OUT pin System power bus voltage 0 V to 4.4 V -- 4.7 V CH8 BAT pin Battery pack positive terminal voltage 0 V to 4.4 V -- 4.7 V 0 V (charger off) to 2.525 V (fast charge) 2.535 V LSB Value Full-scale reading /1023 FUNCTIONAL OVERVIEW The TPS65820 ADC can be subdivided in four sections: 1. Input selection: The input selection section has two major blocks, the input bias control and an 8 channel MUX. The input bias control provides the bias currents that are applied to pins ANLG1 and ANLG2 and pin TS. The TS pin bias current is fixed (20 A typ), and the bias currents for pins ANLG1 and ANLG2 are set on I2C register ADC_WAIT. The TS and ANLG1 pin current sources are automatically enabled when the input power is detected, providing the required setup to measure a pack thermistor temperature (TS pin) or a battery ID resistor (ANLG1 pin). ANLG1 and ANLG2 can be used to measure external resistive loads or analog voltages. The bias current sources are always connected to the OUT pin internally. The internal MUX connects one of the monitored analog inputs to the ADC engine, following the selection defined on register ADC_SET. 2. ADC engine: The ADC engine uses an internal or external voltage reference, as defined by the ADC_REF bit on the ADC_SET control register. If the internal reference is selected ADC_REF is connected to an internal LDO that regulates the ADC_REF pin voltage to generate the ADC supply and internal voltage reference. The internal LDO maximum output current is 6 mA typical, and a conversion should be started only after the external capacitor is fully charged. If an external reference is used it should be connected to the ADC_REF pin. When an external reference is selected the internal LDO connected to ADC_REF is disabled. Care must be taken when selecting an external reference as the ADC reference voltage, as it affects the ADC LSB absolute value. 3. Trigger control and synchronization : The ADC engine starts a conversion of the selected input when the trigger control circuit sends a start command. The trigger control circuit starts the ADC conversion and transfers the ADC output data to the arithmetic logic unit (ALU) at the end of the conversion. It also synchronizes the data transfer from the ALU to the I2C ADC_READING register at the end of a conversion cycle, and generates the ADC status information sent to the ADC registers. An ADC engine conversion is triggered by the TPS65820 trigger control circuit using either an internal trigger or an external trigger. The internal trigger is automatically generated by the TPS65820 at the end of each ADC engine conversion, following the timing parameters set on I2C registers ADC_SET, ADC_DELAY and ADC_WAIT. The GPIO3 pin can be used as an external trigger if the bit ADC_TRG_GPIO3 is set HI, in the I2C register ADC_DELAY. In the external trigger mode a new conversion is started after the GPIO3 pin has an edge transition, following the timing parameters set on I2C registers ADC_SET, ADC_DELAY and ADC_WAIT. 68 Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 4. Arithmetic Logic Unit (ALU): The ALU performs mathematical operations on the ADC output data as defined by the I2C ADC_READING registers. It executes average calculations or minimum /maximum detection. The result of the calculations is stored in an 11-bit accumulator register (1 bit allocated for carry-over). The accumulator value is transferred to the I2C data register at the end of a conversion cycle. A simplified block diagram for the ADC is shown in Figure 48. TPS65820 ADC SUPPLY AND REFERENCE SELECTION ANLG 1/ ANLG 2 BIAS SELECTION I2C ADC REFERENCE AND SUPPLY SELECTION BIAS CONTROL OUT ADC_REF 4.7 mF SUPPLY ANLG1 REF 10 BIT SUCCESSIVE APROXIMATION ADC ANLG2 ISET1 START TS TJ CURRENT SAMPLE A2 DONE 8 CHANNEL MUX ARITHMETIC LOGIC UNIT RTC_OUT TRIGGER CONTROL AND SYNCHRONIZATION OUT BAT ADC CHANNEL SELECTION ADC CONFIGURATION : TRIGGER, HOLDOFF, REPEAT MODES DELAY AND WAIT TIMING ACCUMULATOR ALU MODE : SINGLE , AVERAGE , MIN,, MAX TO I2C: STATUS AND CONVERSION DATA I2C Figure 48. ADC Simplified Block Diagram ADC Conversion Cycle A conversion cycle includes all the steps required to successfully sample the selected input signal and transfer the converted data to the I2C, generating an interrupt request to the host ( pin : HILO). The number of individual conversions (samples) in a conversion cycle is defined by the I2C ADC_SET register bits READ_MODE settings, and can range from a single sample to 256 samples. The conversion cycle settings for the ALU is defined by register ADC_READING and it can be set to average, maximum value detection, minimum value detection or no processing (ADC engine output loaded in the accumulator directly). The conversion cycle starts with the first sampling and ends when: * The required ALU operations are performed on the final sample, and * The ALU accumulator data is transferred to the I2C ADC_READING register, and * The register bit ADC_STATUS in the ADC_READING register is set to LO. A conversion cycle is always started by the external host when the ADC_EN bit in the ADC_SET register is toggled from LO to HI by a I2C write operation. Resetting the ADC_EN bit to LO before the current conversion cycle ends (INT: LO HI, ADC_STATUS bit set to LO) is not recommended, as the ADC keeps its current configuration until the current conversion cycle ends. At the end of a conversion cycle the output data is stored at registers in the ALU block. The ADC_STATUS bit is set to LO ( DONE ) and an interrupt is generated (INT pin : HILO ) if the ADC_STATUS bit is unmasked, at the interrupt masking registers INT_MASK. It should be noted that the minimum, maximum and average values are ALWAYS calculated by the ALU for each conversion cycle. Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 69 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com The value loaded in the I2C registers ADC READING_HI and ADC READING_LO at the end of a conversion cycle is defined by control bits ADC_READ0 and ADC_READ1 in register ADC READING_HI. The average, minimum, maximum and last sample values for a conversion cycle can be read if the external host executes an I2C write operation, changing the values of bits ADC_READ0 and ADC_READ1, followed by an I2C read operation on registers ADC READING_HI and ADC READING_LO. The minimum, maximum, average, and last values have the same value if a conversion cycle with only one sample is executed. The ADC_READ0 and ADC_READ1 bits can not be modified during the execution of a conversion cycle. A new conversion cycle should be started only after the current conversion cycle is completed, by toggling the ADC_EN bit from HI to LO and HI again. External Trigger Operation The trigger control circuit can be programmed to use an external signal to start a conversion. The TPS65820 GPIO3 input is configurable as an ADC trigger, with ADC conversion starting on either a rising edge or falling edge. When using an external trigger the trigger delay, trigger wait time delay and trigger holdoff mode can be programmed using I2C registers. The procedure to start an externally-triggered conversion cycle has the following steps: 1. Verify that the current conversion cycle has ended (ADC_STATUS=LO, I2C register ADC_READING_HI) 2. Set ADC_EN=LO 3. Configure ADC sampling mode, ALU mode, trigger parameters, etc. 4. Set ADC_EN=HI After step 4 the ADC is armed, waiting for an external trigger detection to start a conversion cycle. Similarly to the non-triggered mode, the ADC configuration should not be modified until the current conversion cycle ends. Note that in the external trigger mode the current cycle does not end if the converter is armed and an external trigger is not detected. Detecting an External Trigger Event An external trigger event is detected when the GPIO3 input has an edge that matches the edge detection programmed in the EDGE bit, at the I2C register ADC_DELAY. The internal ADC trigger can be delayed with respect to the external trigger signal edge. The delay time value is set by the ADC_DELAY register bits DELAY_n, and can range from 0 s (no delay) to 750 s. A conversion is started only if the external trigger remains at its active level when the delay time expires, as shown in Figure 49. In a positive-edge detection the active trigger level is HI; in a negative-edge detection the active trigger level is LO. GPIO 3 INTERNAL ADC CONVERSION START CONVERTER MODE CONVERTING ARMED TDLY(TRG) TDLY(TRG) Figure 49. ADC Conversion Triggerd by GPIO3 Positive Edge Triggered Active Level Hi Executing Multiple Sample Cycles With an External Trigger When executing conversion cycles that require multiple samples it may be desirable to synchronize the input signal conversion using either an external trigger that has a periodic repetition rate or an external asynchronous trigger that indicates when the external input signal being converted is valid. The TPS65820 has additional operating modes and timing parameters that can be programmed using the I2C to configure multiple sample conversion cycles. In multiple sample cycles the host can select the wait time between samples using the bits WAITn in the ADC_WAIT register to set the wait time between samples. The wait time is measured between the end of a conversion and the start of a new conversion. 70 Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 With the default power-up settings (HOLDOFF=LO, ADC_DELAY register), the TPS65820 executes a multiple sample conversion cycle if the first sample is taken when the trigger is at its active level. Subsequent samples are converted at the end of the wait time, even if the trigger returns to the non-active level. The external trigger level edge is ignored until the current conversion cycle ends. CONVERSION CYCLE GPIO 3 ON INTERNAL ADC OFF CONVERSION STATUS tWAIT(TRG) tDLY(TRG) LAST SAMPLE FIRST SAMPLE Figure 50. ADC Conversion Triggerd by GPIO3 Positive Edge Triggered Active Level Hi; Holdoff = LC If the sample conversion needs to be synchronized with an external trigger, during multiple sample conversion cycles, the control bit HOLDOFF should be set to HI. When the holdoff mode is active, the internal trigger starts a sample conversion only if the external trigger was detected and is at its active level at the end of the wait time, as shown in Figure 51. CONVERSION CYCLE GPIO 3 ON INTERNAL ADC CONVERSION STATUS OFF TDLY(TRG) TDLY(TRG) TWAIT(TRG) FIRST SAMPLE LAST SAMPLE Figure 51. ADC Conversion Triggerd by GPIO3 Positive Edge-Triggered Active Level HI, Holdoff = HI, Four Sample Cycles When the multiple sample cycles are executed the host must configure the maximum and minimum limits for the ADC output using registers DLOLIM1, DLOLIM2, DHILIM1 and DHILIM2. A conversion cycle ends if any individual conversion result exceeds the maximum limit value or is below the minimum limit value. When an out of limit conversion is detected an interrupt is sent to the host, and the ADC_STATUS bit on register ADC READING_HI is set to DONE. Continuous Conversion Operation (Repeat Mode) The TPS65820 ADC can be set to operate in a continuous conversion mode, with back-to-back conversion cycles executed. The REPEAT mode is targeted at applications where an input is continuously monitored for a period of time, and the host must be informed if the monitored input is out of the range set by I2C registers DLOLIM1, DLOLIM2, DHILIM1 and DHILIM2. In REPEAT mode each conversion is started when the ADC trigger (internal or external) is detected, and a new conversion cycle is started when the current conversion cycle ends. All the trigger and sampling modes available for normal conversion cycles are available in repeat mode. Executing I2C read operations to get the ADC readings for average, minimum, maximum and last sample values is possible in REPEAT mode. However, this is not a recommended operation, as the REPEAT mode does not generate a DONE status flag making it difficult to synchronize the ADC data reading to the end of a conversion cycle. The recommended use of the REPEAT mode is : 1. Configure the ADC conversion cycle : trigger mode, sample mode, select input signal, etc. 2. Configure the HI and LO limits for the ADC readings 3. Set the ADC_DELAY register bit REPEAT to HI 4. Toggle ADC_DELAY register bit ADC_EN bit from LO to HI Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 71 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com 5. Monitor the INT pin. An interrupt triggered by ADC_STATUS=LO indicates that the selected input signal is out of range To exit the continuous mode the host must follow the steps below, if external trigger mode was set : 1. Exit external trigger mode 2. Set REPEAT bit to LO, effectively terminating the repeat mode. This generates an additional conversion; at the end of this conversion the ADC is ready for a new configuration. 3. Set ADC_EN to LO, after on-going conversion ends To exit the continuous mode the host must follow the steps below, if internal trigger mode was set : 1. Set REPEAT bit to LO, effectively terminating the repeat mode. 2. Set ADC_EN to LO, after on-going conversion ends ADC Input Signal Range Setting The registers DHILIMn and DLOLIMn can be used by the host to set maximum and minimum limits for the DAC engine output. At the end of each conversion the ADC output is checked for the maximum and minimum limits, and a status flag is set if the converted data exceeds the high limit or is under the low limit. In multiple sample operation the converted data range is checked when all programmed samples have been converted. The host can mask or unmask interrupts caused by the ADC range status bits using the INT_MASKn registers. 72 Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 ADC State Machine The ADC state machine with all the trigger and operation modes is shown in Figure 52. NO HOST STARTS NEW CONVERSION CYCLE BY SETTING ADC_EN=HI EXTERNAL TRIGGER ADC ENABLED (I2C) ? TPS 65800 READY FOR NEW CONVERSION CYCLE YES NO, ADC+EN=LO, NEED TO RECONFIGURE ADC PARAMETERS TRIGGER EDGE DETECT NO LOAD ADC CONFIGURATION DATA FROM I 2C YES START TRIGGER DELAY NO TRIGGER DELAY OVER NO, OPPOSITE TRIGGER EDGE HAPPENED BEFORE DELAY TIME FALLING EDGE TRIGGER EDGE MODE RISING EDGE TRIGGER VALID YES TRIGGER HI ALU RESET HOLDOFF ON TRIGGER MODE, TRIGGER DELAY SAMPLE WAIT TIME, HOLDOFF MODE REPEAT ON/OFF ALU MODE : AVG /MAX/MIN NUMBER OF SAMPLES ADC INPUT RANGE ADC CHANNEL I2C WRITE OPERATION CONFIGURES NEXT CONVERSION CYCLE ADC_EN=LO NO TRIGGER LO NO, HOST ENDS CURRENT CONVERSION CYCLE SETTING ADC_EN=LO NO YES, CURRENT CONVERSION CYCLE STILL ACTIVE, ADC_EN = HI YES, CHECK TRIGGER NO 1) SET ADC BUSY STATUS 2) START CONVERSION ADC ENABLED (I2C) ? YES ADC ENABLED (I2C) ? ADC CONVERSION COMPLETE NO, SEND DATA TO I2C 1) LOAD DATA IN ALU 2) ALU OUTPUT STORED IN ACCUMULATOR WAIT TIME 0 s to 20.5 msec ALU OUTPUT DATA READY YES N CONVERSIONS ? ALU DATA OUT OF RANGE NO NTH CONVERSION DONE REPEAT MODE YES FAULT DETECTED YES NO NO YES 1) SET ADC_HI OR ADC_LO FAULT 2) SET ADC STATUS TO DONE 3) INT SENT TO HOST IF NON-MASKED NO, SEND DATA TO I2C 1 ) LOAD I2C DATA REGISTER WITH ALU DATA 2) SET ADC STATUS TO DONE 3) INT SENT TO HOST IF NON-MASKED CURRENT CYCLE ENDS Figure 52. Trigger and Operation Modes for the ADC State Machine BATTERY DETECTION CIRCUIT The ANLG1 pin has an internal current source connected between OUT and ANLG1, which is automatically turned on when the OUT pin voltage exceeds the minimum system voltage set by the SYS_IN pin external resistive divider. The current levels for ANLG1 pin can be programmed via I2C register ADC_WAIT, bits BATID_n. An integrated switch discharges the BAT pin to AGND1 when V(ANLG1)> V(OUT) - V(NOBATID), enabling implementation of a battery removal function if an external pack resistor ID is connected between ANLG1 and ground. The ANLG1 pin may be used to monitor other parameters than a pack ID resistor. When ANLG1 pin is used as a generic ADC analog input V(ANLG1) should never exceed V(OUT) - V(NOBATID), to avoid undesired battery discharge caused by activation of the battery pin discharge circuit. Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 73 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com ADC - I2C REGISTERS The I2C registers that control ADC-related functions are shown below. The HEX address for each register is shown by the register name, together with the R or W functionality for the register bits. Default, initial power-up values are shown in bold. In the timing equations, replace Bn with 1 for HI state, and 0 for LO state. B7 B6 B5 B4 B3 B2 CHSEL1_SET CHSEL0_SET READ_MODE2 B1 B0 READ_MODE1 READ_MODE0 ADC_SET, ADDRESS=1E, ALL BITS R/W Bit Name ADC_ENABLE ADC_REF_EN Function ADC ON/OFF CONTROL ADC REFERENCE SELECTION When 0 OFF Internal When 1 ON External CHSEL2_SET ADC CHANNEL SELECTION 000 = ANLG1 011 = V(TS) 001 = ANLG2 100 = Tj 010 = V(ISET1) 101 = V(RTC_OUT) ADC SAMPLING SETTINGS 110 = V(OUT) 111 = V(BAT) Default = ANLG1 000 = 1 001= 4 010 = 8 011 = 16 100 = 32 101 = 64 110 = 128 111 = 256 Default = 1 ADC READING_HI, ADDRESS=1F, BITS B3/B4 R/W, ALL OTHER BITS READ ONLY Bit Name NOT USED NOT USED CURRENT CONVERSION STATUS NOT USED NOT USED When 0 DONE NOT USED NOT USED When 1 BUSY NOT USED NOT USED Function ADC_STATUS ADC_READ1 ADC_READ0 ALU OUTPUT DATA SELECTION D10 ADC AVERAGE CARRYOVER BIT 00=LAST 10 = MAXIMUM 01=AVERAGE 11 = MINIMUM Default= LAST D9_MSB D8 ADC CONVERSION OUTPUT BITS VALID ONLY AFTER ADC CONVERSION ENDS SEE ADC_READING_LO ADC READING_LO, ADDRESS=20, READ ONLY Bit Name D7 D6 Function Value D5 D4 D3 D2 D1 D0_LSB ADC CONVERSION OUTPUT BITS, VALID ONLY AFTER ADC CONVERSION ENDS VALUE=[B10*512 + B9*256 + B8*128 + B7*64 + B6*32 + B5*16 + B4*8 + B3*4 + B2*2 + B1] * [ VRNG(CHn) / 1023] ; Unit=Volts, The LSB bit value is proportional to the ADC reference voltage - See VRNG(CHn) in electrical parameters DHILIM1, ADDRESS=21, ALL BITS R/W Bit Name NOT USED NOT USED Function NOT USED NOT USED NOT USED RESERVED DHILIM10 DHILIM9 DHILIM8 ADC MAX INPUT LIMIT RANGE SETTING (3 MSBs) DHILIM2, ADDRESS=22, ALL BITS R/W Bit Name DHILIM7 DHILIM6 Function DHILIM5 DHILIM4 DHILIM3 DHILIM2 DHILIM1 DHILIM0_LSB DLOLIM9 DLOLIM8 ADC MAX INPUT LIMIT RANGE SETTING (8 LSBs) DLOLIM1, ADDRESS=23, ALL BITS R/W Bit Name NOT USED NOT USED Function NOT USED NOT USED NOT USED RESERVED DLOLIM10 ADC MIN INPUT LIMIT RANGE SETTING (3 MSBs) DLOLIM2, ADDRESS=24, ALL BITS R/W Bit Name DLOLIM7 DLOLIM6 Function DLOLIM5 DLOLIM4 DLOLIM3 DLOLIM2 DLOLIM1 DLOLIM0_LSB Delay_1 Delay_0 ADC MIN INPUT LIMIT RANGE SETTING (8 LSBs) ADC_DELAY, ADDRESS=25, ALL BITS R/W Bit Name ADC_TRG_GPIO3 EDGE _GPIO3 HOLDOFF REPEAT Function USE GPIO3 AS ADC TRIGGER GPIO3 TRIGGER MODE ADC HOLDOFF ON/OFF CONTROL REPEAT MODE ON/OFF Delay_3 ADC EXTERNAL TRIGGER DELAY SETTING Delay_2 When 0 OFF Falling Edge OFF OFF When 1 ON Rising Edge ON ON tDLY(TRIG)= B4*400 + B3 * 200 + B2*100 + B1* 50, Units = s Default = 0 s BATIDI_D1 BATIDI_D0 ADC_WAIT, ADDRESS=26, ALL BITS R/W Bit Name Function When 0 When 1 74 ADC_cH2I_D1 ADC_cH2I_D0 ANLG2 PULLUP CURRENT SOURCE VALUE ANLG1 PULLUP CURRENT SOURCE VALUE 11:60 A, 10:50 A, 01:10 A,00: 0 Default= 00 11:60 A, 10:50 A, 01:10 A, 00: WEAK PULLUP Default : 00 WAIT_D3 WAIT_D2 WAIT_D1 WAIT_LSB ADC SAMPLE WAIT TIME, MULTIPLE SAMPLES MODE 0000 = 0 0001 = 0.02 0010 = 0.04 0011 = 0.06 Units = ms Submit Documentation Feedback 0100 = 0.08 0101 = 0.16 0110 = 0.24 0111 = 0.32 1000 1001 1010 1011 = 0.64 = 1.28 = 1.92 = 2.56 1100 = 5.12 1101 = 10.24 1110 = 15.36 1111 = 20.48 Default = 0 Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 FUNCTIONALITY GUIDE -- LED AND PERIPHERAL DRIVERS WHITE LED CONSTANT CURRENT DRIVER Driver PWM SM3 Duty Cycle Range # of Steps Off (0%), 0.4% -99.6% Set via I2C 256 Output Voltage LED Current 5 V-25 V Io(Typ) Max Acc (%) Set by external resistor 25 mA 25 Eff (%) Power Up Default 80 Off (0%) OPEN DRAIN PWM DRIVERS Driver PWM Freq (kHz) PWM Duty Cycle Io(max) mA Power Up Default Range # of Steps Min Step PWM 0.5/1/1.5/2/3/ 4.5/7.8/15.6 Set via I2C Off (0%), 6.25% to 100 Set via I2C 8 6.25% 150 Off(0%) LED_PWM 15.625 or 23.4 , set via I2C Off(0%), 0.4% to 99.6% Set via I2C 256 0.4% 150 Off (0%) RGB OPEN DRAIN LED DRIVER Driver RED, GREEN, BLUE Flash Period (same for RGB) Flash On time (same for RGB) Brightness (Individual R/G/B Control) Range # of Steps Min Step Range # of Steps Min Step Duty (%) # of Steps Min Steps No flash, or 1-8 s Set via I2C 16 0.5 s 0.1-0.6 s Set via I2C 8 0.1 s Off (0%), 3.125 to 96.87 Set via I2C 32 3.125% Io mA Power Up Default 0/4/8/12 Flash Off, 0 mA, 0% brightness duty cycle TPS65820 OUT DISPLAY AND I/O SM3_SW 4.7 mH L3 WHITE LED DRIVER SM3 FB3 PGND3 PWM DRIVER LSM3 D1 RFB3 C18 100 pF 10 W P3 WHITE LEDS PWM EXTERNAL PERIPHERALS LED_PWM RED RGB DRIVER C27 1 mF GREEN BLUE AGND0 RGB LED A0 Figure 53. Required External Components, Recommended Values, External Connections Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 75 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com WHITE LED CONSTANT CURRENT DRIVER The TPS65820 has an integrated boost converter (SM3) that is optimized to drive white LEDs connected in a series configuration. Up to six series white LEDs can be driven, with programmable current and duty cycle adjustable via a dedicated I2C register. The SM3 boost converter (SM3) has a 30-V, 500-mA, low-side integrated power stage switch that drives the external inductor. Another integrated 30-V, 25-mA switch (LED switch) is used to modulate the brightness of the external white LEDs. A simplified block diagram is shown in Figure 54 LSM3 3.3 mH OUT TPS65820 INDUCTOR PEAK CURRENT DETECTION L3 + _ SOFT 500 mA START OFF CONTROL LOGIC AND MINIMUM OFF TIME MAXIMUM ON TIME ON EN D1 OFF C27 1 mF POWER STAGE SWITCH GATE DRIVE PGND3 OUTPUT OVP DETECTION + SM3 _ P3 SM3_SW 28V ON LED SWITCH FREQUENCY AND DUTY CYCLE I2C REGISTER DUTY CYCLE CONTROL GATE DRIVE LED SWITCH LED LOW CURRENT _ DETECTION + FB3 RFB3 250 mV 10 W P3 Figure 54. Simplified Block Diagram The SM3 converter operates like a standard boost converter. The LED current is defined by the value of the external resistor RFB3, connected from pin FB3 to AGND1. The integrated power stage switch control monitors the LED switch current (FB3) and the integrated power stage switch current, implementing a topology that effectively regulates the LED current independently of the input voltage and number of LEDs connected. The high voltage rating of the integrated switches enables driving up to six white LEDs, connected in a series configuration. The internal LED switch, in series with the external LEDs, disconnects the LEDs from ground during shutdown. In addition, the LED switch is driven by a PWM signal that sets the duty cycle, enabling adjustment to the average LED current by modifying the settings of the I2C register SM3_SET. With this control method, the LED brightness depends on the LED switch duty cycle only, and is independent of the PWM control signal. The duty cycle control used in the SM3 converter LED switch is implemented by generating a burst of high frequency pulses, with a pattern that is repeated periodically. For a duty cycle of 50%, all of the high frequency pulses have a 50% duty cycle. The duty cycle control sets individual pulses to 100% duty cycle when increasing the LED_PWM output duty cycle; for decreasing LED_PWM output duty cycles, individual pulses are set to 0% duty cycle. An example of distinct duty cycles is shown in Figure 55, the sum of the individual pulses on/off time over the repetition period are equivalent to the duty cycle obtained with traditional single-pulse duty cycle circuits. 76 Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 SM3 CONVERTER 50% DUTY CYCLE SM3 CONVERTER <50% DUTY CYCLE SM3 CONVERTER >50% DUTY CYCLE REPETITION PERIOD Figure 55. Example of Distinct Duty Cycles The repetition period can be set using the register SOFT_RESET control bit SM3_LF_OSC to either 180 Hz (HI) or 122 Hz (LO). Each repetition period has a total of 256 pulses, enabling a resolution of 0.4% when programming the duty cycle. SM3 Control Logic Overview The SM3 boost converter operates in a pulse frequency modulation (PFM) scheme with constant peak current control. This control scheme maintains high efficiency over the entire load current range and enables the use of small external components, as the switching frequency can reach up to 1 MHz depending on the load conditions. The LED current ripple is defined by the external inductor size. The converter monitors the sense voltage at pin FB3, and turns on the integrated power stage switch when V(FB3) is below the 250-mV (typ) internal reference voltage and the LED Switch is ON, starting a new cycle. The integrated power switch turns off when the inductor current reaches the internal 500-mA (typ) peak current limit, or if the switch is on for a period longer than the maximum on-time of 6 s (typ). The integrated power switch also turns off when the LED switch is set to OFF. As the integrated power switch is turned off, the external Schottky diode is forward biased, delivering the stored inductor energy to the output. The main switch remains off until the FB3 pin voltage is below the internal 250-mV reference voltage and the LED switch is turned ON, when it is turned on again. This PFM peak current control scheme sets the converter in discontinuous conduction mode (DCM), and the switching frequency depends on the inductor, input/output voltage and LED current. Lower LED currents reduce the switching frequency, with high efficiency over the entire LED current range. This regulation scheme is inherently stable, allowing a wide range for the selection of the inductor and output capacitor. Peak Current Control (Boost Converter) The SM3 integrated power stage switch is turned on until the inductor current reaches the DC current limit IMAX(L3) (500 mA, typ). Due to internal delays, typically around 100 ns, the actual current exceeds the DC current limit threshold by a small amount. The typical peak current limit can be calculated as shown in Equation 8 V(OUT) V(OUT) I P(typ) + I MAX(L3) ) 100 ns, or : I P(typ) + 500 mA ) 100 ns L L (8) The current overshoot is directly proportional to the input voltage, and inversely proportional to the inductor value. Soft Start All inductive step-up converters exhibit high in-rush current during start-up. If no special precautions are taken, voltage drops can be observed at the input supply rail during start-up, with unpredictable results in the overall system operation. The SM3 boost converter limits the inrush current during start-up by increasing the current limit in three steps: 1. 125 mA (typ), 2. 250 mA (typ) and 3. 500 mA (typ) The two initial steps (125 mA and 250 mA) are active for 256 power stage switching cycles. Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 77 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com Enabling the SM3 Converter The SM3_SET I2C register controls the SM3 LED switch duty cycle. If the register is set to all zeros SM3 is set to OFF mode. When the host writes a value other than 00 in SM3_SET the SM3 converter is enabled, entering the soft start phase and then normal operation. The SM3 converter can operate with duty cycles varying from 0.4% to 99.6%, with LED switch frequencies of 122 Hz or 180 Hz. The LED switch operating frequency is set by bit SM3_LF, in the SOFT_RESET register. Overvoltage Protection The output voltage of the boost converter is sensed at pin SM3, and the integrated power stage switch is turned OFF when V(SM3) exceeds the internal overvoltage threshold VOVP3. The converter returns to normal operation when V(SM3) < VOVP3 - VHYS(OVP3). Undervoltage Lockout Operation When the TPS65820 enters the UVLO mode, the SM3 converter is set to OFF mode with the power stage MOSFET switch and the LED switch open (off). Thermal Shutdown Operation When the TPS65820 enters the thermal shutdown mode, the SM3 converter is set to OFF mode with the power stage MOSFET switch and the LED switch open (off). PWM DRIVERS PWM Pin Driver The TPS65820 offers one low-frequency, open-drain PWM driver, capable of driving up to 150 mA. The PWM frequency and duty cycle are defined by the PWM I2C register settings. The PWM parameters are set in I2C register PWM. Available frequency values range from 500 Hz to 15 kHz, with 8 frequency values and 16 duty cycle options (6.25% each). LED_PWM Pin Driver The TPS65820 has another PWM driver output (pin LED_PWM), which is optimized to drive a backlight LED. The LED_PWM driver controls the external LED current intensity using a pulse-width control method, with duty cycle being set by the I2C register LED_PWM. The pulse width method implemented generates a burst of high frequency pulses, with a pattern that is repeated periodically. For a duty cycle of 50%, all of the high -frequency pulses have a 50% duty cycle. The duty cycle control sets individual pulses to 100% duty cycle when increasing the LED_PWM output duty cycle; for decreasing LED_PWM output duty cycles individual pulses are set to 0% duty cycle. An example of distinct duty cycles is shown in Figure 56; the sum of the individual pulses on/off time over the repetition period is equivalent to the duty cycle obtained with traditional single-pulse duty cycle circuits. LED_PWM, 50% DUTY CYCLE LED_PWM, <50% DUTY CYCLE LED_PWM, >50% DUTY CYCLE REPETITION PERIOD Figure 56. Example of Distinct Duty Cycles The repetition period can be set using the register SOFT_RESET control bit SM3_LF_OSC to either 183 Hz (HI) or 122 Hz (LO). Each repetition period has a total of 256 pulses, enabling a resoltuion of 0.4% when programming the duty cycle. The LED_SET register enables control of the duty cycle via I2C, with duty cycle ranging from 0.4% to 99.6%. Setting the LED_SET register to all zeros forces the LED_PWM pin to 0% duty cycle (OFF). 78 Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 RGB Driver The TPS65820 has a dedicated driver for an RGB external LED. Three outputs are available (pins RED, GREEN, BLUE), with common settings for operation mode (flash on/off, flash period, flash on time), LED current and phase delay between outputs. The TPS65820 RGB driver continually flashes the external LEDs connected to the RED, GREEN and BLUE pins using the flash operation parameters defined in register RGB_FLASH. The currents for the external LEDs can be programmed via I2C, and external resistors are not required to limit the LED current. However, they can be added to set the LED current if the available I2C values are not compatible with the current application, as shown in the circuit below: OUT RED RRED RGRN RBLUE FLASH CONTROL ILEDR GREEN LED CURRENT SETTINGS RGB DUTY CYCLE CONTROL LED CONTROL ILEDG LOGIC BLUE ILEDB Figure 57. Limiting the External LED Current The flashing-mode parameters defined in register RGB_FLASH enable setting the flashing period from 1 to 8 seconds in 0.5-s steps, or to continuous operation. Flashing operation is enabled by setting the FLASH_EN bit in register RGB_FLASH to HI. This bit must be set HI to enable the RGB current-sink channels. Each driver has an individual duty cycle control. The duty cycle modulation method used is similar to the PWM_LED duty cycle control, with high frequency pulses being generated when the driver (RED, GREEN, or BLUE pins) is ON. The repetition period for the RGB drivers has a total of 32 pulses, enabling a 3.125% resolution when programming the individual RED, GREEN and BLUE drivers duty cycles. The duty cycles for each driver can be set individually using control bits on registers RGB_RED, RGB_GREEN and RGB_BLUE. The RGB drivers can be programmed to sink 4, 8, or 12 mA, with no external current limiting resistor. Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 79 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com White LED, PWM Drivers -- I2C Registers The I2C registers that control LED AND PWM driver related functions are shown below. The HEX address for each register is shown by the register name, together with the R or W functionality for the register bits. Shaded values indicate default initial power-up values. In the equations replace Bn with 1 for HI state, and 0 for LO state. B7 B6 B5 B4 B3 B2 B1 B0 SM3_I4 set SM3_I3 set SM3_I2 set SM3_I1 set SM3_I0 set FLASH_PER1 FLASH_PER0 SM3_SET, ADDRESS=16, ALL BITS R/W Bit Name SM3_I7 set SM3_I6 set SM3_I5 set Function SM3 DUTY CYCLE CONTROL Value See Table 13 for SM3 duty cycle settings, default = 0 (OFF) RGB_FLASH, ADDRESS= 17, ALL BITS R/W Bit Name FLASH_EN Function FLASH MODE ON/OFF CTRL FLASH_ON2 FLASH MODE ON TIME FLASH_ON1 FLASH_ON0 FLASH_PER3 FLASH_PER2 FLASH MODE PERIOD When 0 OFF ON See Table 14 for RGB ON TIME settings, default = 0.1 See Table 14 for RGB FLASH settings, default = 1 When 1 RGB_RED, ADDRESS=18, ALL BITS R/W Bit Name Function When 0 RGB_ISET1 RGB_ISET0 PHASE PWMR_D4 PWMR_D3 PWMR_D2 PWMR_D1 RGB LED CURRENT SETTINGS PHASE CONTROL REG DRIVER DUTY CYCLE CONTROL 00 = 0 10 = 8 mA 01 = 4 mA 11 = 12 mA GREEN out of with RED and BLUE See Table 14 for RGB_RED DUTY settings, default = 0 PWMR_D0 BLUE out of with RED and GREEN When 1 RGB_GREEN, ADDRESS=19, ALL BITS R/W Bit Name NOT USED NOT USED NOT USED Function NOT USED NOT USED NOT USED PWMG_D4 PWMG_D3 GREEN DRIVER DUTY CYCLE CONTROL PWMG_D2 PWMG_D1 PWMG_D0 Value NOT USED NOT USED NOT USED See Table 14 for RGB_GREEN DUTY settings, default = 0 RGB_BLUE, ADDRESS=1A, ALL BITS R/W Bit Name NOT USED NOT USED NOT USED Function NOT USED NOT USED NOT USED PWMB_D4 PWMB_D3 BLUE DRIVER DUTY CYCLE CONTROL PWMB_D2 PWMB_D1 Value NOT USED NOT USED NOT USED See Table 14 for RGB_BLUE DUTY settings, default = 0 PWMB_D0 PWM, ADDRESS=1D, ALL BITS R/W Bit Name PWM_EN Function PWM ON/OFF CONTROL When 0 Disabled When 1 Enabled PWM1_F2 PWM_F1 PWM_F0 PWM_D3 PWM DRIVER FREQUENCY SETTINGS 000 = 15.6 kHz 001 = 7.8 kHz 010 = 4.5 kHz 011 = 3 kHz 100 = 2 kHz 101 = 1.5 kHz 110 = 1 kHz 111 = 500 Hz Default = 15.6 kHz LPWM_5 set LPWM_4 set PWM_D2 PWM_D1 PWM_D0 PWM DRIVER DUTY CYCLE SETTINGS See Table 15 for PWM DUTY settings, default = 0.0625 LED_PWM, ADDRESS=27, ALL BITS R/W Bit Name LPWM_7 set LPWM_6 set Function Value 80 LPWM_3 set LPWM_2 set LPWM_1 set LPWM_0 set LED_PWM DRIVER DUTY CYCLE CONTROL See Table 13 for LED_PWM DUTY settings, default = 0 (OFF) Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 Table 13. SM3 and LED_PWM Duty Cycle Settings Dec B7-B0 Dcpu Dec B7-B0 Dcpu Dec B7-B0 Dcpu Dec B7-B0 Dcpu Dec B7-B0 Dcpu 0 0000 0000 - 52 0011 0100 0.203 104 0110 1000 0.406 156 1001 1100 0.609 208 1101 0000 0.813 1 0000 0001 0.004 53 0011 0101 0.207 105 0110 1001 0.410 157 1001 1101 0.613 209 1101 0001 0.816 2 0000 0010 0.008 54 0011 0110 0.211 106 0110 1010 0.414 158 1001 1110 0.617 210 1101 0010 0.820 3 0000 0011 0.012 55 0011 0111 0.215 107 0110 1011 0.418 159 1001 1111 0.621 211 1101 0011 0.824 4 0000 0100 0.016 56 0011 1000 0.219 108 0110 1100 0.422 160 1010 0000 0.625 212 1101 0100 0.828 5 0000 0101 0.020 57 0011 1001 0.223 109 0110 1101 0.426 161 1010 0001 0.629 213 1101 0101 0.832 6 0000 0110 0.023 58 0011 1010 0.227 110 0110 1110 0.430 162 1010 0010 0.633 214 1101 0110 0.836 7 0000 0111 0.027 59 0011 1011 0.230 111 0110 1111 0.434 163 1010 0011 0.637 215 1101 0111 0.840 8 0000 1000 0.031 60 0011 1100 0.234 112 0111 0000 0.438 164 1010 0100 0.641 216 1101 1000 0.844 9 0000 1001 0.035 61 0011 1101 0.238 113 0111 0001 0.441 165 1010 0101 0.645 217 1101 1001 0.848 10 0000 1010 0.039 62 0011 1110 0.242 114 0111 0010 0.445 166 1010 0110 0.648 218 1101 1010 0.852 11 0000 1011 0.043 63 0011 1111 0.246 115 0111 0011 0.449 167 1010 0111 0.652 219 1101 1011 0.855 12 0000 1100 0.047 64 0100 0000 0.250 116 0111 0100 0.453 168 1010 1000 0.656 220 1101 1100 0.859 13 0000 1101 0.051 65 0100 0001 0.254 117 0111 0101 0.457 169 1010 1001 0.660 221 1101 1101 0.863 14 0000 1110 0.055 66 0100 0010 0.258 118 0111 0110 0.461 170 1010 1010 0.664 222 1101 1110 0.867 15 0000 1111 0.059 67 0100 0011 0.262 119 0111 0111 0.465 171 1010 1011 0.668 223 1101 1111 0.871 16 0001 0000 0.063 68 0100 0100 0.266 120 0111 1000 0.469 172 1010 1100 0.672 224 1110 0000 0.875 17 0001 0001 0.066 69 0100 0101 0.270 121 0111 1001 0.473 173 1010 1101 0.676 225 1110 0001 0.879 18 0001 0010 0.070 70 0100 0110 0.273 122 0111 1010 0.477 174 1010 1110 0.680 226 1110 0010 0.883 19 0001 0011 0.074 71 0100 0111 0.277 123 0111 1011 0.480 175 1010 1111 0.684 227 1110 0011 0.887 20 0001 0100 0.078 72 0100 1000 0.281 124 0111 1100 0.484 176 1011 0000 0.688 228 1110 0100 0.891 21 0001 0101 0.082 73 0100 1001 0.285 125 0111 1101 0.488 177 1011 0001 0.691 229 1110 0101 0.895 22 0001 0110 0.086 74 0100 1010 0.289 126 0111 1110 0.492 178 1011 0010 0.695 230 1110 0110 0.898 23 0001 0111 0.090 75 0100 1011 0.293 127 0111 1111 0.496 179 1011 0011 0.699 231 1110 0111 0.902 24 0001 1000 0.094 76 0100 1100 0.297 128 1000 0000 0.500 180 1011 0100 0.703 232 1110 1000 0.906 25 0001 1001 0.098 77 0100 1101 0.301 129 1000 0001 0.504 181 1011 0101 0.707 233 1110 1001 0.910 26 0001 1010 0.102 78 0100 1110 0.305 130 1000 0010 0.508 182 1011 0110 0.711 234 1110 1010 0.914 27 0001 1011 0.105 79 0100 1111 0.309 131 1000 0011 0.512 183 1011 0111 0.715 235 1110 1011 0.918 28 0001 1100 0.109 80 0101 0000 0.313 132 1000 0100 0.516 184 1011 1000 0.719 236 1110 1100 0.922 29 0001 1101 0.113 81 0101 0001 0.316 133 1000 0101 0.520 185 1011 1001 0.723 237 1110 1101 0.926 30 0001 1110 0.117 82 0101 0010 0.320 134 1000 0110 0.523 186 1011 1010 0.727 238 1110 1110 0.930 31 0001 1111 0.121 83 0101 0011 0.324 135 1000 0111 0.527 187 1011 1011 0.730 239 1110 1111 0.934 32 0010 0000 0.125 84 0101 0100 0.328 136 1000 1000 0.531 188 1011 1100 0.734 240 1111 0000 0.938 33 0010 0001 0.129 85 0101 0101 0.332 137 1000 1001 0.535 189 1011 1101 0.738 241 1111 0001 0.941 34 0010 0010 0.133 86 0101 0110 0.336 138 1000 1010 0.539 190 1011 1110 0.742 242 1111 0010 0.945 35 0010 0011 0.137 87 0101 0111 0.340 139 1000 1011 0.543 191 1011 1111 0.746 243 1111 0011 0.949 36 0010 0100 0.141 88 0101 1000 0.344 140 1000 1100 0.547 192 1100 0000 0.750 244 1111 0100 0.953 37 0010 0101 0.145 89 0101 1001 0.348 141 1000 1101 0.551 193 1100 0001 0.754 245 1111 0101 0.957 38 0010 0110 0.148 90 0101 1010 0.352 142 1000 1110 0.555 194 1100 0010 0.758 246 1111 0110 0.961 39 0010 0111 0.152 91 0101 1011 0.355 143 1000 1111 0.559 195 1100 0011 0.762 247 1111 0111 0.965 40 0010 1000 0.156 92 0101 1100 0.359 144 1001 0000 0.563 196 1100 0100 0.766 248 1111 1000 0.969 41 0010 1001 0.160 93 0101 1101 0.363 145 1001 0001 0.566 197 1100 0101 0.770 249 1111 1001 0.973 42 0010 1010 0.164 94 0101 1110 0.367 146 1001 0010 0.570 198 1100 0110 0.773 250 1111 1010 0.977 43 0010 1011 0.168 95 0101 1111 0.371 147 1001 0011 0.574 199 1100 0111 0.777 251 1111 1011 0.980 44 0010 1100 0.172 96 0110 0000 0.375 148 1001 0100 0.578 200 1100 1000 0.781 252 1111 1100 0.984 45 0010 1101 0.176 97 0110 0001 0.379 149 1001 0101 0.582 201 1100 1001 0.785 253 1111 1101 0.988 46 0010 1110 0.180 98 0110 0010 0.383 150 1001 0110 0.586 202 1100 1010 0.789 254 1111 1110 0.992 47 0010 1111 0.184 99 0110 0011 0.387 151 1001 0111 0.590 203 1100 1011 0.793 255 1111 1111 0.996 48 0011 0000 0.188 100 0110 0100 0.391 152 1001 1000 0.594 204 1100 1100 0.797 49 0011 0001 0.191 101 0110 0101 0.395 153 1001 1001 0.598 205 1100 1101 0.801 50 0011 0010 0.195 102 0110 0110 0.398 154 1001 1010 0.602 206 1100 1110 0.805 51 0011 0011 0.199 103 0110 0111 0.402 155 1001 1011 0.605 207 1100 1111 0.809 Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 81 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com Table 14. RGB Duty Cycle Control Settings RGB_D4 RGB_D3 RGB_D2 RGB_D1 RGB_D0 82 DC(%) FLASH_PER3 FLASH_PER2 FLASH_PER1 FLASH_PER0 0 0 0 0 0 0.00 0 0 0 0 1 0 0 0 0 1 3.23 0 0 0 1 1.5 0 0 0 1 0 6.45 0 0 1 0 2 0 0 0 1 1 9.68 0 0 1 1 2.5 0 0 1 0 0 12.90 0 1 0 0 3 0 0 1 0 1 16.13 0 1 0 1 3.5 0 0 1 1 0 19.35 0 1 1 0 4 0 0 1 1 1 22.58 0 1 1 1 4.5 0 1 0 0 0 25.80 1 0 0 0 5 0 1 0 0 1 29.03 1 0 0 1 5.5 0 1 0 1 0 32.25 1 0 1 0 6 0 1 0 1 1 35.48 1 0 1 1 6.5 0 1 1 0 0 38.70 1 1 0 0 7 0 1 1 0 1 41.93 1 1 0 1 7.5 0 1 1 1 0 45.15 1 1 1 0 8 0 1 1 1 1 48.38 1 1 1 1 Continuous 1 0 0 0 0 51.60 1 0 0 0 1 54.83 1 0 0 1 0 58.05 FLASH_ON2 FLASH_ON1 FLASH_ON0 ON_TIME (s) 1 0 0 1 1 61.23 0 0 0 0.1 1 0 1 0 0 64.50 0 0 1 0.15 1 0 1 0 1 67.73 0 1 0 0.2 1 0 1 1 0 70.95 0 1 1 0.25 1 0 1 1 1 74.18 1 0 0 0.3 1 1 0 0 0 77.40 1 0 1 0.4 1 1 0 0 1 80.63 1 1 0 0.5 1 1 0 1 0 83.85 1 1 1 0.6 1 1 0 1 1 87.08 1 1 1 0 0 90.30 1 1 1 0 1 93.53 1 1 1 1 0 96.75 1 1 1 1 1 99.98 Submit Documentation Feedback P(s) Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 Table 15. PWM Frequency and Duty Cycle Settings PWM FREQUENCY TABLE PWM_D DUTY CYCLE PWM_F2 PWM_F1 PWM_F0 f (Hz) PWM2_D3 PWM2_D2 PWM2_D1 PWM2_D0 D_cycle (pu) 0 0 0 15,600 0 0 0 0 0.0625 0 0 1 7,800 0 0 0 1 0.125 0 1 0 4,500 0 0 1 0 0.1875 0 1 1 3,000 0 0 1 1 0.25 1 0 0 2,000 0 1 0 0 0.3125 1 0 1 1,500 0 1 0 1 0.375 1 1 0 1,000 0 1 1 0 0.4375 1 1 1 500 0 1 1 1 0.5 1 0 0 0 0.5625 1 0 0 1 0.625 1 0 1 0 0.6875 1 0 1 1 0.75 1 1 0 0 0.8125 1 1 0 1 0.875 1 1 1 0 0.9375 1 1 1 1 1 Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 83 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com FUNCTIONALITY GUIDE - GENERAL PURPOSE INPUTS/OUTPUTS GPIO3 FUNCTIONS CONFIGURED AS OUTPUT CONFIGURED AS INPUT POWER-UP DEFAULT OUTPUT LEVEL Io(max) mA A/D CONVERSION START TRIGGER HI or LO at output set via I2C 5 Falling or rising edge selected via I2C Input, no mode selected CONFIGURED AS INPUT POWER-UP DEFAULT GPIO2 FUNCTIONS CONFIGURED AS OUTPUT OUTPUT LEVEL Io(max) mA HOST INTERRUPT REQUEST SM2 ENABLE HI or LO at output set via I2C 5 Set INT pin to LO via I2C when GPIO2 pin edge is detected. Rising or falling edge detection selected via I2C GPIO2 level sets SM2 converter ON/OFF operation. GPIO2 pin level (HI or LO) for ON operation selected via I2C Input, no mode selected The host interrupt request and SM2 enable GPIO2 functions are mutually exclusive, and they should NOT be configured simultaneously GPIO1 FUNCTIONS CONFIGURED AS OUTPUT CONFIGURED AS INPUT OUTPUT LEVEL Io(max) mA HOST INTERRUPT REQUEST SM1 ENABLE SM1 AND SM2 STANDBY CONTROL HI or LO at output set via I2C 5 Set INT pin to LO via I2C when GPIO1 pin edge is detected. Rising or falling edge detection set via I2C GPIO1 level sets SM1 converter ON/OFF operation. GPIO2 pin level (HI or LO) for ON operation set via I2C GPIO1 level sets SM2 and SM1 converters in standby mode. GPIO1 pin level (HI or LO) for standby mode set selected via I2C POWER-UP DEFAULT Input, no mode selected The host interrupt request, SM1 enable and SM1/SM2 standby control GPIO1 functions are mutually exclusive, and they should NOT be configured simultaneously. TPS65820 GPIO1 CONFIGURATION MODES: 1-OUTPUT 2-SM1/SM2 STANDBY CONTROL INPUT 3-SM1 ON/OFF CONTROL INPUT 4-INTERRUPT REQUEST CONTROL INPUT GENERATES INT PIN HI(R)LO TRANSITION I2C SETTINGS GPIO FUNCTION GPIO GPIO2 CONTROL AND MODE CONFIGURATION MODES: 1-OUTPUT 2-SM2 ON/OFF CONTROL 3-INTERRUPT REQUEST CONTROL INPUT 4-GENERATES INT PIN HI(R)LO TRANSITION GPIO3 CONFIGURATION MODES: 1-OUTPUT 2-ADC TRIGGER CONTROL 3-LDC0 ENABLE 4-CHARGE VOLTAGE SELECTION Figure 58. Required External Components, Recommended Values, External Connections 84 Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 General Purpose I/Os -- GPIO 1, 2, 3 The TPS65820 integrates 3 general purpose open drain ports (GPIOs) that can be configured as selectable inputs or outputs. When configured as outputs the output level can be set to LO or HI via I2C commands. When the GPIOs are configured as inputs the action to be taken when a transition or HI/LO level is detected at the GPIO pin is selectable via I2C. When configured as inputs the GPIOs can be set in the following modes: 1. Interrupt request: In this mode of operation, a transition at the GPIO pin generates an interrupt request at the interrupt controller. The GPIO interrupt request can be masked at the INT_MASK register. This operation mode is available for GPIOs 1 and 2. 2. SM1 and SM2 control: The GPIOs can be used to turn the converters SM1 and SM2 ON/OFF, as well as setting them in standby mode. This control mode is available for GPIO1 (SM1 on/off and SM1/SM2 standby) and GPIO2 (SM2 on/off control). 3. ADC trigger : GPIO3 can be configured as an external ADC trigger. The GPIO3 trigger configuration bit is located at the ADC register ADC_DELAY. GPIOs Input Level Configuration When using I2C commands, the GPIO1 and GPIO2 pins can be configured as logic output signals or as level-controlled inputs which enables (or disables) the switch mode converters SM1 and/or SM2. These pins may also be configured as rising- or falling-edge-triggered inputs to externally control the generation of an interrupt signal (INT), if desired. The GPIO3 pin may be used as an external trigger source to start an A/D conversion cycle or as a logic output. See Figure 59 for a description of the logic used for GPIO1 and GPIO2 inputs when configured for edge-triggered interrupt generation. The signal from the GPIO pin input is double-latched before being sent to the interrupt contoller logic. The inversion of the Q output from the first flip-flop must be HI to allow the output latch to be cleared when a READ command occurs. On the initial edge of the GPIO signal, the Q output of the flip-flop is set (HI). The INT line is asserted (LO) after the initial selected edge from the GPIO pin. On the next falling (or rising) edge of the GPIO pin, the interrupt can again be cleared (which allows the INT pin to go back high). The INT signal is cleared (set back HI) after an I2C READ operation is performed. Thus, two successive edges of the GPIO signal, followed by an I2C READ command, are required to clear the INT pin output. If no I2C READ commands occur, repeatedly applying edges to the GPIO pin does not toggle the state of the INT pin output. In addition to an I2C READ command after two GPIO edges, a UVLO event or reconfiguration of the GPIO pins as outputs also de-asserts the INT signal. 2 I C INTACK READ Command? Multiplexer S1 GPIO Signal Pin Equivalent circuit for internal logic when configured as edge interrupt with no masking D Q INT D INT Q CLR S2 C SET ENB HI = Rising Edge, LO = Falling Edge UVLO GPIO Config = OUTPUT Figure 59. GPIO 1 or GPIO2 Configured as an Interrupt Request Input Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 85 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com Function Implementation: I2C Commands Versus GPIO Commands Some of the GPIO SM1/SM2 control functions overlap I2C register control functions. Table 16 describes the TPS65820 action when the GPIO's command and I2C registers commands are not compatible with each other. Table 16. GPIO Commands and I2C Registers Commands SM1 AND SM2 ON/OFF I2C COMMAND GPIO COMMAND SM1 OR SM2 MODE SET CONVERTER DISABLED DON'T CARE DISABLED CONVERTER ENABLED CONVERTER ENABLED ENABLED DON'T CARE CONVERTER DISABLED DISABLED SM1 AND SM2 STANDBY I2C COMMAND GPIO COMMAND SM1 OR SM2 MODE SET DO NOT SET STANDBY DON'T CARE NORMAL SET STANDBY SET STANDBY STANDBY DON'T CARE DO NOT SET STANDBY NORMAL GPIO Configuration Table Table 17 describes the I2C register settings required to program the available GPIO modes. Table 17. Recommended GPIO Configuration Procedure GPIO MODE I2C REGISTERS I2C REGISTER BIT SETTING ADDITIONAL DETAILS GPIO3 = OUTPUT GPIO3 GPIO3I/O=HI AND GPIO3OUT=HI GPIO3 PIN SET TO HIGH IMPEDANCE MODE GPIO3I/O=HI AND GPIO3OUT=LO V(GPIO3) = VOL GPIO3I/O=LO AND ADC_TRG_GPIO3=HI AND EDGE_GPIO3=HI GPIO3 pin rising edge triggers ADC conversion GPIO3I/O=LO AND ADC_TRG_GPIO3=HI AND EDGE_GPIO3=LO GPIO3 pin falling edge triggers ADC conversion GPIO2I/O=HI AND GPIO2OUT=HI GPIO2 PIN SET TO HIGH IMPEDANCE MODE GPIO2I/O=HI AND GPIO2OUT=LO V(GPIO2) VOL GPIO2I/O=LO AND GPIO2INT=HI AND GPIO2LVL=HI AND GPIO2SM2=LO INT pin HILOHI at V(GPIO2) falling edge GPIO2I/O=LO AND GPIO2INT=HI AND GPIO2LVL=HI AND GPIO2SM2=LO INT pin HILOHI at V(GPIO2) rising edge GPIO2I/O=LO AND GPIO2INT=LO AND GPIO2LVL=HI AND GPIO2SM2=HI SM2 converter ON at V(GPIO2)=HI GPIO2I/O=LO AND GPIO2INT=LO AND GPIO2LVL=LO AND GPIO2SM2=HI SM2 converter ON at V(GPIO2)=LO GPIO1I/O=HI AND GPIO1OUT=HI GPIO1 PIN SET TO HIGH IMPEDANCE MODE GPIO1I/O=HI AND GPIO1OUT=LO V(GPIO1) VOL GPIO1I/O=LO AND GPIO1INT=HI AND GPIO1LVL=HI AND GPIO1SM1=LO AND GPIO1SMSBY=LO INT pin HILOHI at V(GPIO1) falling edge GPIO1I/O=LO AND GPIO1INT=HI AND GPIO1LVL=LO AND GPIO1SM1=LO AND GPIO1SMSBY=LO INT pin HILOHI at V(GPIO1) rising edge GPIO1I/O=LO AND GPIO1INT=LO AND GPIO1LVL=HI AND GPIO1SM1=HI AND GPIO1SMSBY=LO SM1 converter ON at V(GPIO1)=HI GPIO1I/O=LO AND GPIO1INT=LO AND GPIO1LVL=LO AND GPIO1SM1=HI AND GPIO1SMSBY=LO SM1 converter ON at V(GPIO1)=LO GPIO3 =INPUT ADC CONVERSION START TRIGGER GPIO3 AND ADC_DELAY GPIO2 = OUTPUT GPIO12 GPIO2=INPUT, HOST INTERRUPT REQUEST GPIO12 AND GPIO3 GPIO2=INPUT, SM2 ENABLE GPIO12 AND GPIO3 GPIO1 = OUTPUT GPIO1=INPUT, HOST INTERRUPT REQUEST GPIO1=INPUT, SM1 ENABLE 86 GPIO12 GPIO12 AND GPIO3 GPIO12 AND GPIO3 Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 Table 17. Recommended GPIO Configuration Procedure (continued) GPIO MODE I2C REGISTERS I2C REGISTER BIT SETTING ADDITIONAL DETAILS GPIO1=INPUT, SM1/SM2 STANDBY CONTROL GPIO12 AND GPIO3 GPIO1I/O=LO AND GPIO1INT=LO AND GPIO1LVL=HI AND GPIO1SM1=LO AND GPIO1SMSBY=HI SM1/SM2 converter standby set at V(GPIO1) = HI GPIO1I/O=LO AND GPIO1INT=LO AND GPIO1LVL=LO AND GPIO1SM1=LO AND GPIO1SMSBY=HI SM1/SM2 converter standby set at V(GPIO1) = LO GPIOs -- I2C Registers The I2C registers that control GPIO-related functions are shown below. The HEX address for each register is shown by the register name, together with the R or W functionality for the register bits. Shaded values indicate default initial power-up values. B7 B6 B5 B4 B3 B2 B1 B0 GPIO12, ADDRESS=1B, ALL BITS R/W Bit Name GPIO2I/O GPIO1I/O GPIO2OUT GPIO1OUT GPIO2LVL GPIO1LVL GPIO1SMSBY GPIO1SM1 Function GPIO2 MODE GPIO1 MODE SET GPIO2 LEVEL (OUTPUT ONLY) SET GPIO1 LEVEL (OUTPUT ONLY) GPIO2 EDGE AND LEVEL DETECTION GPIO1 EDGE AND LEVEL DETECTION GPIO 1 CONTROLS SM1 AND SM2 STANDBY ON/OFF GPIO1 CONTROLS SM1 ON/OFF When 0 INPUT INPUT LOW LOW RISING EDGE, LO LEVEL RISING EDGE, LO LEVEL DISABLED DISABLED When 1 OUTPUT OUTPUT HIGH HIGH FALLING EDGE, HI LEVEL FALLING EDGE, HI LEVEL ENABLED ENABLED GPIO3, ADDRESS=1C, ALL BITS R/W Bit Name GPIO3I/O GPIO3OUT LDO0_EN CHG_VOLT RTC_SET GPIO2 INT GPIO1 INT GPIO2SM2 Function GPIO3 MODE SET GPIO3 LEVEL (OUTPUT ONLY) LDO0 ON/OFF CONTROL CHARGE VOLTAGE SAFETY BIT RTC_LDO OUTPUT VOLTAGE GPIO2 TRIGGERS INT:HILO GPIO1 TRIGGERS INT:HILO SM2 ON/OFF CONTROL When 0 INPUT LOW OFF 4.20 V 3.1 V DISABLED DISABLED DISABLED When 1 OUTPUT HIGH ON 4.36 V 2.6 V ENABLED ENABLED ENABLED Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 87 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com APPLICATION INFORMATION INDUCTOR AND CAPACITOR SELECTION -- CONVERTERS SM1 AND SM2 SM1 and SM2 are designed with internal voltage mode compensation and the stabilization is based on choosing an LC filter that has a corner frequency around 27 kHz. It is not recommended to use LC values that would be outside the range of 13 kHz to 40 kHz. Equation 9 calculates the corner frequency of the output LC filter. The standard recommended LC values are 3.3 H and 10 F. 1 F+ + 27.7 kHz (a) for L + 3.3 mH and C + 10 mF 2p LC (9) The inductor value, along with the input voltage VIN, output voltage VOUT and switching frequency f define the ripple current. Typically the ripple current target is 30% of the full load current. At light loads it is desirable for ripple current to be less then 150% of the light load current. The inductor should be chosen with a rating to handle the peak ripple current., if an inductor's current gets higher than its rated saturation level (DCR), the inductance starts to fall off, and the inductor's ripple current increases exponentially. The DCR of the inductor plays an important role in efficiency and size of the inductor. Larger diameter wire has less DCR but may increase the size of the inductor Equation 10 calculates the target inductor value. If an inductor value has already been chosen, Equation 11, calculates the inductor's ripple current under static operating conditions. The ripple amplitude can be calculated during the on time (positive ramp) or during the off time (negative ramp). It is easiest to calculate the ripple using the off time since the inductor's voltage is the output voltage. V OUT I target + 0.3 I OUT_MAX V DI L + L L V Dt + OUT L 1* VOUT VIN_MAX f 1* (10) VOUT VIN f (11) Equation 12 calculates the peak current due to the output load and ripple current DI I Lmax + I OUTmax ) L 2 (12) For a faster transient response, a lower inductor and higher capacitance allows the output current to ramp faster, while the addition capacitance holds up the output longer (a 2.2-H inductor in combination with a 22-F output capacitor are recommended). The highest inductor current occurs at the maximum input voltage. The peak inductor current during a transient may be higher than the steady state peak current and should be considered when choosing an inductor. Monitoring the inductor current for non-saturation operation during a transient of 1.2 x I_loadmax at Vin_max ensures adequate saturation margin. Table 18. Inductors for Typical Operation Conditions 88 DEVICE INDUCTOR VALUE TYPE DCDC3 converter 3.3 H CDRH2D14NP-3R3 Sumida 3.3 H PDS3010-332 Coilcraft 3.3 H VLF4012AT-3R3M1R3 TDK 2.2 H VLF4012AT-2R2M1R5 TDK 2.2 H NR3015T2R2 Taoup-Uidem Submit Documentation Feedback COMPONENT SUPPLIER Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 Table 18. Inductors for Typical Operation Conditions (continued) DEVICE INDUCTOR VALUE TYPE COMPONENT SUPPLIER DCDC2 converter 3.3 H CDRH2D18/HPNP-3R3 Sumida 3.3 H VLF4012AT-3R3M1R3 TDK 2.2 H VLCF4020-2R2 TDK 3.3 H CDRH3D14/HPNP-3R2 Sumida 3.3 H CDRH4D28C-3R2 Sumida 3.3 H MSS5131-332 Coilcraft 2.2 H VLCF4020-2R2 TDK DCDC1 converter OUTPUT CAPACITOR SELECTION, SM1, SM2 CONVERTERS The advanced fast-response voltage mode control scheme of the SM1, SM2 converters implemented in the TPS65020 allow the use of small ceramic capacitors with a typical value of 10 F for a 3.3-H inductor, without having large output voltage under and overshoots during heavy load transients. Ceramic capacitors having low ESR values have low output voltage ripple, and recommended values and manufacturers are listed in Table 1. Often, due to the low ESR, the ripple current rating of the ceramic capacitor is adequate to meet the inductor's currents requirements. The RMS ripple current is calculated as: V 1 * OUT VIN 1 I RMSCout + 3 2 L f (13) At nominal load current, the inductive converters operate in PWM mode. The overall output voltage ripple is the sum of the voltage spike caused by the output capacitor ESR plus the voltage ripple caused by charging and discharging the output capacitor: The output voltage ripple is maximum at the highest input voltage Vin. V 1 * OUT VIN 1 V RMSCout + ) ESR L f 8 Cout f (14) At light load currents, the converters operate in PFM and the output voltage ripple is dependent on the output capacitor value. The output voltage ripple is set by the internal PFM output voltage comparator delay and the external capacitor. The typical output voltage ripple is less than 1% of the nominal output voltage. Table 19. Input/Output Capacitors for Typical Operation Conditions CAPACITOR VALUE CASE SIZE COMPONENT SUPPLIER COMMENTS 22 F 22 F 1260 TDK C3216X5R0J226M Ceramic 1260 Taiyo Yuden JMK316BJ226ML Ceramic 10 F 0805 Taiyo Yuden JMK212BJ106M Ceramic 10 F 0805 TDK C2012X5R0J106M Ceramic 22 F 0805 TDK C2012X5R0J226MT Ceramic 22 F 0805 Taiyo Yuden JMK212BJ226MG Ceramic Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 89 TPS65820 SLVS663B - MAY 2006 - REVISED APRIL 2008 .............................................................................................................................................................. www.ti.com INPUT CAPACITOR SELECTION, SM1, SM2 CONVERTERS Buck converters have a pulsating input current that can generate high input voltage spikes at VIN. A low ESR input capacitor is required to filter the input voltage, minimizing the interference with other circuits connected to the same power supply rail. Each dc-dc converter requires a 10-F ceramic input capacitor on its input pin. OUTPUT VOLTAGE SELECTION, SM1, SM2 CONVERTERS Typically the output voltage is programmed by the I2C. An external divider can be added to raise the output voltage, if the available I2C values do not meet the application requirements. Care must be taken with this special option, since this external divider (gain factor) would apply to any selected I2C output voltage value for this converter. Equation 16 calculates R1, Let R2 = 20 k: R1 + V SMxOUT * 1 R2 V FB (16) Where VFB is the I2C selected voltage, is the desired output voltage and R1/R2 is the feedback divider. DESIGN EXAMPLES SM1, SM2 CONVERTER DESIGN EXAMPLE Design Conditions and Parametrs for SM1 or SM2: Vin_SM1/2: 4.6V typical (May be less if input source is limited). Vout_SM1/2: 1.24 V Iout_max: 0.6 A fsw = 1500 kHz fc = 25 kHz V OUT L target + 0.3 I OUT_MAX C+ L[2 1 p fc] 2 1* VOUT VIN_MAX fsw + 3.35 mH, 3.3 mH is a good target. (17) + 10.5 mF 10 mF is a good target. (18) CHARGER DESIGN EXAMPLE Design Conditions and Parameters for Charger: Vout: 4.6 V; (OUT pin is input to charger) Fast-charge current, IPGM: 1 A DPPM-OUT threshold: 4.3 V; (charging current reduces when OUT falls to this level) Safety timer: 5 hr Battery short-circuit delay, tDELAY: 47 s; (delays BAT short circuit during hot plug of battery) TS Temperature range: Disabled KSET= 400; VSET= 2.5 V; KDPPM = 1.15; IDPPM = 100 A; KTMR= 0.36 s/ Program Fast Charge Current Level: K VSET R ISET + SET + 1 kW I PGM (19) Program DPPM_OUT Voltage Level (Level at Which Charging Current Reduces) V DPPM_OUT R DPPM + + 3.74 kW KDPPM I DPPM (20) 90 Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 TPS65820 www.ti.com .............................................................................................................................................................. SLVS663B - MAY 2006 - REVISED APRIL 2008 Program BAT Short-Circuit Delay (Used for Inserting Battery) C DPPM + t DELAY I DPPM + 4.7 Nf (21) Program 5-Hour Safety timer t 3600 sechr R TMR + SAFETY*HR + 50 kW K TMR (22) Disable/Program TS RTS = 49.9k - fixed resistor to disable TS input. VTS = ITS x RTS = 20 A x 49.9 k = 0.998 V The TS pin has a 20-A current source output that biases the resistor or thermistor. If VTS is within the 0.5- to 2.5-V window, normal operation is allowed. If a 503AT thermistor is used, the typical range is 4C to 41C. Submit Documentation Feedback Copyright (c) 2006-2008, Texas Instruments Incorporated Product Folder Link(s): TPS65820 91 PACKAGE OPTION ADDENDUM www.ti.com 8-Dec-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TPS65820RSHR ACTIVE VQFN RSH 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR TPS65820RSHRG4 ACTIVE VQFN RSH 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR TPS65820RSHT ACTIVE VQFN RSH 56 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR TPS65820RSHTG4 ACTIVE VQFN RSH 56 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TPS65820RSHR VQFN RSH 56 2000 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 TPS65820RSHT VQFN RSH 56 250 180.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS65820RSHR VQFN RSH 56 2000 367.0 367.0 38.0 TPS65820RSHT VQFN RSH 56 250 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. 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