1,8
1,8
1,22 DIA.
1,22 DIA.
1,52
1,52
0,25
0,25
0,23
0,23
0,97 DIA.
0,97 DIA.
0,71 DIA.
0,71 DIA.
5359-0-XX-XX-10-XX-10-0
Solder mount in Ø1,09±0,08 PTH.
#10 Contact for Ø0,3-0,43 pins.
Also available on 16mm wide carrier
tape: 3,000 parts per 330mm reel.
5359
2,54
2,54
1,47 DIA.
1,47 DIA.
2,18
2,18
0,64
0,64
0,23
0,23
1,02 DIA.
1,02 DIA.
0,79 DIA.
0,79 DIA.
0577-0-XX-XX-21-XX-10-0
Solder mount in Ø1,14±0,08 PTH.
#21 Contact for Ø0,38-0,56 pins.
Also available on 12mm wide carrier
tape: 3,000 parts per 330mm reel.
0577
2,54
2,54
1,73 DIA.
1,73 DIA.
2,26
2,26
0,51
0,51
0,23
0,23
1,32 DIA.
1,32 DIA.
1,09 DIA.
1,09 DIA.
4015-0-XX-XX-30-XX-10-0
Solder mount in Ø1,45±0,08 PTH.
#30 Contact for Ø0,38-0,64 pins.
Also available on 8mm wide carrier
tape: 5,500 parts per 330mm reel.
4015
SPECIFICATIONS
SHELL MATERIAL:
Brass Alloy 360, 1/2 Hard
CONTACT MATERIAL:
Beryllium Copper Alloy 172, HT
SOLDER BARRIER:
Organic Fibre Plug®
DIMENSION IN INCHES
TOLERANCES ON:
LENGTHS: ±0,13
DIAMETERS: ±0,05
ANGLES: ± 2°
• These through-hole (tubular) receptacles are designed for
hand, wave or reflow* soldering. The
ORGANIC FIBRE PLUG®
barrier prevents solder, paste or flux from contaminating the
spring contact.
• After soldering, the
OFP®
barrier is pushed out of the recep-
tacle when the device is plugged in.
• All parts are available as discrete receptacles; but for SMT
assembly, certain receptacles are supplied on carrier tape per
EIA-481 to feed industry standard pick and place machines.
*Intrusive reflow (also called "pin-in-paste") is a technique of using conventional
through-hole components in a reflow soldering process. The receptacles are
placed into plated through-holes in the circuit board (solder paste has previous-
ly been screen printed on pads adjacent to the holes) and the board is reflowed in the same pass as other SMT components.
Solder will fill the plated through-holes and achieve solder joints as reliable as wave soldering. The OFP® barrier prevents solder
paste from being picked-up inside the contact during pick ‘n place assembly. "Overprinting" paste on the solder mask can be
used to adjust the volume of paste required to fill each hole.
PINS
M
A
H
I
N
E
D
C
P
R
E
C
I
S
I
O
N
PIN RECEPTACLES
With Organic Fibre Plug®Solder Barrier
(see specific contact range on pages 216, 217 & 219)
www.mill-max.com 516-922-6000
164
ORDER CODE: XXXX - 0 - XX - XX - XX - XX -XX - 0
BASIC PART #
SPECIFY PACKAGING: SPECIFY CONTACT FINISH:
43 Discrete Receptacles 27
0,76
μm
GOLD OVER NICKEL
(RoHS)
67 Supplied on 13” Reels 02
2,54
μm
TIN/LEAD OVER NICKEL
SPECIFY SHELL FINISH: 84
2,54
μm
TIN OVER NICKEL
(RoHS)
01
5,08
μm
TIN/LEAD OVER NICKEL
80
5,08
μm
TIN OVER NICKEL
(RoHS) CONTACT
#10, #21 or #30 CONTACT (DATA ON PAGES 216, 217 & 219)
RoHS
2002/95/EC
