STPS10L25 Low drop power Schottky rectifier Datasheet - production data Description K A Single Schottky rectifier suited to switched mode power supplies and high frequency DC to DC converters. K K K This device is especially intended for use as a rectifier at the secondary of 3.3 V SMPS units. K A A NC TO-220AC A NC DPAK Features Table 1: Device summary Symbol Value IF(AV) 10 A VRRM 25 V VF (typ.) 0.30 V Tj (max.) 150 C Very low forward voltage drop for less power dissipation Optimized conduction / reverse losses tradeoff which means the highest efficiency in the applications Avalanche capability specified ECOPACK(R)2 compliant component for DPAK on demand October 2016 DocID3619 Rev 5 This is information on a product in full production. 1/12 www.st.com Characteristics 1 STPS10L25 Characteristics Table 2: Absolute ratings (limiting values at 25 C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 25 V IF(RMS) Forward rms current 30 A IF(AV) Average forward current = 0.5 square wave TC = 140 C 10 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 200 A PARM Repetitive peak avalanche power tp = 10 s, Tj = 125 C 395 W Tstg Storage temperature range Tj -65 to +150 Maximum operating junction temperature (1) 150 C Notes: (1)(dP tot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 3: Thermal parameters Symbol Rth(j-c) Parameter Max .value Unit 1.5 C/W Junction to case Table 4: Static electrical characteristics Symbol IR(1) Parameter Test conditions Reverse leakage current Tj = 25 C Tj = 125 C Tj = 25 C VF(1) Tj = 125 C Forward voltage drop Tj = 25 C Tj = 125 C VR = VRRM IF = 10 A IF = 20 A Min. Typ. - 135 - 0.41 test: tp = 380 s, < 2% To evaluate the maximum conduction losses, use the following equation: P = 0.22 x IF(AV) + 0.013 x IF2(RMS) 2/12 DocID3619 Rev 5 800 A 260 mA 0.35 0.55 Notes: (1)Pulse Unit 0.46 0.30 - Max. 0.48 V STPS10L25 1.1 Characteristics Characteristics (curves) Figure 1: Average forward power dissipation versus average forward current 5.0 Figure 2: Average forward current versus ambient temperature ( = 0.5) PF(AV)(W) = 0.2 = 0.1 4.5 = 0.5 = 0.05 IF(AV)(A) 12 4.0 Rth(j-a) = Rth(j-c) 10 3.5 8 3.0 = 1 2.5 6 2.0 4 Rth(j-a)=50C/W T 1.5 T 2 1.0 = tp/T Tamb(C) tp 0 0.5 = tp/T IF(AV)(A) tp 0 25 50 75 100 125 150 0.0 0 1 2 3 4 5 6 7 8 9 10 11 Figure 3: Normalized avalanche power deratings versus pulse duration (Tj = 125 C) 1 PARM (t p ) PARM (10 s) Figure 4: Relative variation of thermal impedance junction to case versus pulse duration 1. 0 Zth(j-c)/Rth(j-c) 0. 8 0.1 = 0.5 0. 6 0. 4 = 0.2 0.01 T = 0.1 0. 2 t p (s) Single pulse 0.001 1 10 100 1000 0. 0 1. 0E -4 Figure 5: Reverse leakage current versus reverse voltage applied (typical values) 5E+2 IR(mA) 1. 0E -3 tp(s) 1. 0E -2 = tp/T tp 1. 0E -1 1. 0E +0 Figure 6: Junction capacitance versus reverse voltage applied (typical values) 5.0 C(nF) Tj = 150 C F = 1MHz Tj = 25 C 1E+2 Tj = 125 C 1E+1 1.0 1E+0 Tj = 25 C 1E-1 VR(V) 1E-2 0 5 10 15 20 VR(V) 25 0.1 1 DocID3619 Rev 5 2 5 10 20 3/12 30 Characteristics STPS10L25 Figure 7: Forward voltage drop versus forward current (maximum values) Figure 8: Thermal resistance junction to ambient versus copper surface under tab for DPAK (typical values) 80 Rth(j-a) (C/W) 70 60 50 40 30 20 Epoxy printed board FR4, eCU= 35 m 10 SCu(cm) 0 0 4/12 DocID3619 Rev 5 5 10 15 20 25 30 35 40 Package information STPS10L25 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Cooling method: by conduction (C) Epoxy meets UL 94,V0 Recommended torque value: 0.55 N*m (for TO-220AC) Maximum torque value: 0.7 N*m (for TO-220AC) DocID3619 Rev 5 5/12 Package information 2.1 STPS10L25 DPAK package information Figure 9: DPAK package outline This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. 6/12 DocID3619 Rev 5 Package information STPS10L25 Table 5: DPAK package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.36 4.60 0.172 0.181 A1 0.00 0.25 0.000 0.010 b 0.70 0.93 0.028 0.037 b2 1.14 1.70 0.045 0.067 c 0.38 0.69 0.015 0.027 c2 1.19 1.36 0.047 0.053 D 8.60 9.35 0.339 0.368 D1 6.90 8.00 0.272 0.311 D2 1.10 1.50 0.043 0.060 E 10.00 10.55 0.394 0.415 E1 8.10 8.90 0.319 0.346 E2 6.85 7.25 0.266 0.282 e 2.54 typ. 0.100 e1 4.88 5.28 0.190 0.205 H 15.00 15.85 0.591 0.624 J1 2.49 2.90 0.097 0.112 L 1.90 2.79 0.075 0.110 L1 1.27 1.65 0.049 0.065 L2 1.30 1.78 0.050 0.070 R V2 0.4 typ. 0 0.015 8 DocID3619 Rev 5 0 8 7/12 Package information STPS10L25 Figure 10: DPAK recommended footprint (dimensions in mm) 8/12 DocID3619 Rev 5 Package information STPS10L25 2.2 TO-220AC package information Figure 11: TO-220AC package outline DocID3619 Rev 5 9/12 Package information STPS10L25 Table 6: TO-220AC package mechanical data Dimensions Ref. Millimeters Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 H2 10.00 10.40 0.393 0.409 L2 16.40 typ. 0.645 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M Diam 10/12 Inches 2.6 typ. 3.75 0.102 typ. 3.85 DocID3619 Rev 5 0.147 0.151 Ordering information STPS10L25 3 Ordering information Table 7: Ordering information Order code 4 Marking Package Weight Base qty. Delivery mode STPS10L25D STPS10L25D TO-220AC 1.86 g 50 Tube STPS10L25G-TR STPS10L25G DPAK 1.38 g 1000 Tape and reel Revision history Table 8: Document revision history Date Revision Jul-2003 4B 17-Oct-2016 5 Changes Updated cover page, Section 3: "Characteristics", Section 3.1: "Characteristics (curves)", Section 4.2: "DPAK package information" and Table 7: "Ordering information". 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All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. (c) 2016 STMicroelectronics - All rights reserved 12/12 DocID3619 Rev 5