PIC16(L)F72X PIC16(L)F72X Family Silicon Errata and Data Sheet Clarification The PIC16(L)F72X family devices that you have received conform functionally to the current Device Data Sheet (DS41341E), except for the anomalies described in this document. The silicon issues discussed in the following pages are for silicon revisions with the Device and Revision IDs listed in Table 1. The silicon issues are summarized in Table 2. The errata described in this document will be addressed in future revisions of the PIC16(L)F72X silicon. Note: This document summarizes all silicon errata issues from all revisions of silicon, previous as well as current. Only the issues indicated in the last column of Table 2 apply to the current silicon revision (AK). For example, to identify the silicon revision level using MPLAB IDE in conjunction with MPLAB ICD 2 or PICkitTM 3: 1. 2. 3. 4. Note: Data Sheet clarifications and corrections start on page 6, following the discussion of silicon issues. The silicon revision level can be identified using the current version of MPLAB(R) IDE and Microchip's programmers, debuggers, and emulation tools, which are available at the Microchip corporate web site (www.microchip.com). TABLE 1: Using the appropriate interface, connect the device to the MPLAB ICD 2 programmer/ debugger or PICkitTM 3. From the main menu in MPLAB IDE, select Configure>Select Device, and then select the target part number in the dialog box. Select the MPLAB hardware tool (Debugger>Select Tool). Perform a "Connect" operation to the device (Debugger>Connect). Depending on the development tool used, the part number and Device Revision ID value appear in the Output window. If you are unable to extract the silicon revision level, please contact your local Microchip sales office for assistance. The DEVREV values for the various PIC16(L)F72X silicon revisions are shown in Table 1. SILICON DEVREV VALUES Part Number Revision ID for Silicon Revision(2) Device ID(1) A7 A9 AA AB AC AD AK PIC16F722 01 1000 100x xxxx 0x7 0x9 0xA 0xB 0xC 0xD 0x12 PIC16LF722 01 1001 100x xxxx 0x7 0x9 0xA 0xB 0xC 0xD 0x12 PIC16F723 01 1000 011x xxxx 0x7 0x9 0xA 0xB 0xC 0xD 0x12 PIC16LF723 01 1001 011x xxxx 0x7 0x9 0xA 0xB 0xC 0xD 0x12 PIC16F724 01 1000 010x xxxx 0x7 0x9 0xA 0xB 0xC 0xD 0x12 PIC16LF724 01 1001 010x xxxx 0x7 0x9 0xA 0xB 0xC 0xD 0x12 PIC16F726 01 1000 001x xxxx 0x7 0x9 0xA 0xB 0xC 0xD 0x12 PIC16LF726 01 1001 001x xxxx 0x7 0x9 0xA 0xB 0xC 0xD 0x12 PIC16F727 01 1000 000x xxxx 0x7 0x9 0xA 0xB 0xC 0xD 0x12 PIC16LF727 01 1001 000x xxxx 0x7 0x9 0xA 0xB 0xC 0xD 0x12 Note 1: 2: The Device ID is located at 2006h. The 5 Least Significant bits comprise the revision ID. Refer to the "PIC16F72X Memory Programming Specification" (DS41332) for detailed information on Device and Revision IDs for your specific device. 2011 Microchip Technology Inc. DS80382J-page 1 PIC16(L)F72X TABLE 2: SILICON ISSUE SUMMARY Module Feature Item Number Affected Revisions(1) Issue Summary A7 A9 AA AB AC AD AK ADC (Analog-to-Digital Converter) Power-down 1.1 ADC Power-down in Sleep. X X X X ADC (Analog-to-Digital Converter) Offset Error 1.2 Error on Infrequent Conversions. X X X X X ADC (Analog-to-Digital Converter) Conversion Results 1.3 Incorrect Conversion below 0C. X X X X X Timer1 Timer1 Oscillator 2.1 Operation above 90C. X X X X X X X Internal Oscillator Frequency 3.1 Frequency Shift on Reset. X Internal Oscillator Frequency 3.2 Failure to wake from Sleep. X X Internal Oscillator Frequency 3.3 Frequency Tolerance. X X X X X X X External Oscillator External Oscillator 4.1 Operation below 2.7V in HS mode. X X X X X X X CPU Sleep 5.1 Reset on Wake. X X BOR Current 6.1 Current Draw in Sleep. X X X X WDT CLRWDT Instruction 7.1 CLRWDT Instruction after WDT Time-out. X X X X X Interrupts Stack Push 8. Interrupt logic incorrectly pushes two addresses to the stack. X X X X X X X DS80382J-page 2 2011 Microchip Technology Inc. PIC16(L)F72X Silicon Errata Issues Note: 1.3 Incorrect Conversion below 0C This document summarizes all silicon errata issues from all revisions of silicon, previous as well as current. Only the issues indicated by the shaded column in the following tables apply to the current silicon revision (as applicable). 1. Module: ADC (Analog-to-Digital Converter) The ADC module incorrectly fails to power-down after a conversion if the device is in Sleep and the ADC interrupt is disabled. The proper operation is to power the ADC off after the conversion is complete if the device is sleeping and the ADC interrupt is disabled. Work around Use the ADC conversion complete interrupt (ADIF) to wake-up and explicitly shut down the ADC by clearing the ADON bit. Affected Silicon Revisions A9 AA AB X X X X AC AD AK The offset error incorrectly exceeds the data sheet specifications if time between conversions is longer than 10 ms. If the time between conversions is greater than 10 ms, the offset error is 1 LSb typical and 3.3 LSb maximum. Work around The time dependent error is insignificant when the time between conversions is less than 10 ms. When the time between conversions is greater than 10 ms, take two back-to-back ADC conversions and discard the results of the first conversion. Affected Silicon Revisions A9 AA AB AC X X X X X AD Set the ADC clock source to FOSC/2, FOSC/4 or RC. A7 A9 AA AB AC X X X X X AD AK 2. Module: Timer1 2.1 Operation above 90C The Timer1 oscillator does not operate above 90C. Work around None. Affected Silicon Revisions A7 A9 AA AB AC AD AK X X X X X X X 3. Module: Internal Oscillator 1.2 Error on Infrequent Conversions A7 Work around Affected Silicon Revisions 1.1 ADC Power-down in Sleep A7 In some devices, the ADC may improperly convert if the temperature is below 0C and the ADC clock source is set to FOSC/8, FOSC/16, FOSC/32, FOSC/ 64. AK 3.1 Frequency Shift on Reset The internal oscillator module on the PIC16F72X family of devices may experience a 1% frequency shift after a Reset. The frequency shift is not consistent and could cause the oscillator to operate outside of the 2% specification. Work around To minimize the chances of experiencing the frequency shift, the following steps should be taken: 1. Operate the internal oscillator at 8 MHz or 2 MHz. 2. Use an external pull-up on MCLR or use internal MCLR mode. 3. Disable the Power Reset Timer (PWRT). 4. The bypass capacitor and Voltage Regulator Capacitor (VCAP) should be used appropriately to minimize noise in the device. Affected Silicon Revisions A7 A9 AA AB AC AD AK X 2011 Microchip Technology Inc. DS80382J-page 3 PIC16(L)F72X 3.2 Failure to Wake from Sleep 3.3 Frequency Tolerance Due to internal race conditions upon entering Sleep mode, the device will occasionally fail to wake-up from Sleep. Only a device Power-on Reset will force the device to exit Sleep mode. The frequency tolerance of the internal oscillator is 2% from 0-60C and 3% from 60-85C (see Figure 1). Work around None. Work around None. Do not use Sleep command. Affected Silicon Revisions Affected Silicon Revisions A7 A9 X X AA FIGURE 1: AB AC AD A7 A9 AA AB AC AD AK X X X X X X X AK HFINTOSC FREQUENCY ACCURACY OVER DEVICE VDD AND TEMPERATURE(1) 125 + 5% 85 Temperature (C) 3% 60 2% 25 0 -20 + 5% -40 1.8 2.0 2.5 3.0 3.3(2) 3.5 4.0 4.5 5.0 5.5 VDD (V) Note 1: This chart covers both regulator enabled and regulator disabled states. 2: Regulator Nominal voltage. DS80382J-page 4 2011 Microchip Technology Inc. PIC16(L)F72X 4. Module: External Oscillator 7. Module: WDT 4.1 Minimum Operating Voltage for HS Mode 7.1 CLRWDT Instruction after WDT Time-out The minimum device VDD when using the external crystal oscillator in HS mode is 2.7V. Work around Use the internal oscillator or an external clock source if operation below 2.7V is required for the frequency range supported by HS mode. A7 A9 AA AB AC AD AK X X X X X X X 5. Module: CPU 5.1 Reset on Wake Work around 1. Disable all asynchronous interrupt before going to Sleep. 2. Make sure the timing of an asynchronous interrupt will not happen during the execution of the Sleep instruction. X X A7 A9 AA AB AC X X X X X AD AK AB AC The interrupt logic incorrectly pushes two addresses to the stack when vectoring to the interrupt vector. Specifically, the interrupt vector address 0x4 is incorrectly pushed to the stack after the current PC, at the time the interrupt was received, is pushed. This will cause the stack to overflow if the user program is operating seven calls deep when an interrupt arrives. Because the stack is circular, the overflow causes the first stack address to be overwritten. Work around Affected Silicon Revisions AA Affected Silicon Revisions 8. Module: Interrupts If a wake from Sleep event occurs during the execution of a Sleep command, the device may reset. This Reset will be seen as a Power-on Reset to the device. A9 Work around Wait at least 20 S after a WDT Reset before using the CLRWDT instruction. Affected Silicon Revisions A7 After a WDT Reset, the TO bit of the STATUS register remains clear until a SLEEP instruction or CLRWDT instruction is issued, then, the TO bit will be set. If the CLRWDT instruction is issued within 20 S of the Reset, the TO bit will remain clear. AD AK 6. Module: BOR Disable interrupts by clearing the GIE bit in the INTCON register whenever the user program is operating seven calls deep. This ensures that interrupts will not cause the stack to overflow. Affected Silicon Revisions 6.1 Current Draw in Sleep With the BOR set to "Enabled during operation and disabled during Sleep", the device draws 2A more during Sleep than when the BOR is set to "Disabled". A7 A9 AA AB AC AD AK X X X X X X X Work around None. Affected Silicon Revisions A7 A9 AA AB X X X X 2011 Microchip Technology Inc. AC AD AK DS80382J-page 5 PIC16(L)F72X Data Sheet Clarifications None. DS80382J-page 6 2011 Microchip Technology Inc. PIC16(L)F72X APPENDIX A: DOCUMENT REVISION HISTORY Rev. A Document (07/2008) First revision of this document. Rev. B Document (08/2008) Added Module 4: Internal Oscillator; Revised Modules 1 and 2. Rev. C Document (11/2008) Added Module 5: Internal Oscillator, Module 6: CPU and Module 7: BOR. Rev. D Document (07/2009) Updated document with new format. Added items 1.3 and 3.3. Updated Tables 1 and 2. Other minor changes. Rev. E Document (09/2009) Added Module 6: WDT; Revised Tables 1 and 2; Added Rev. ID AC. Rev. F Document (01/2010) Added Rev. AD Silicon. Rev. G Document (03/2010) Added new Module 4: External Oscillator; Revised Table 2; Revised Module 3.3: Frequency Tolerance; Other minor corrections. Rev. H Document (04/2010) Updated Tables 1 and 2, adding Rev. AK silicon; Updated Module 3, clarified condition. Rev. J Document (02/2011) Updated errata to new format; Added Module 8, Interrupts. 2011 Microchip Technology Inc. DS80382J-page 7 PIC16(L)F72X NOTES: DS80382J-page 8 2011 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2011, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-60932-912-9 Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 2011 Microchip Technology Inc. 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