PIC16F722-E/SP - Microchip Technology

 2011 Microchip Technology Inc. DS80382J-page 1

PIC16(L)F72X

The PIC16(L)F72X family devices that you have

received conform functionally to the current Device Data

Sheet (DS41341E), except for the anomalies described

in this document.

The silicon issues discussed in the following pages are

for silicon revisions with the Device and Revision IDs

listed in Table 1. The silicon issues are summarized in

Table 2.

The errata describ ed in this document will be addressed

in future revisions of the PIC16(L)F72X silicon.

Data Sheet clarifications and corrections start on page 6,

following the discu ssion of silicon issues .

The silicon revision level can be identified using the

current version of MPLAB® IDE and Microchip’s

programmers, debuggers, and emulation tools, which

are available at the Microchip corporate web site

(www.microchip.com).

For example, to identify the silicon revision level using

MPLAB IDE in conjunction with MPLAB ICD 2 or

PICkit™ 3:

1. Using the appropriate interface, connect the

device to the MPLAB ICD 2 programmer/

debugger or PICkit™ 3.

2. From the main menu in MPLAB IDE, select

Configure>Select Device, and then select the

target part number in the dialog box.

3. Select the MPLAB hardware tool

(Debugger>Select Tool).

4. Perform a “Connect” operation to the device

(Debugger>Connect). Depending on the

development tool used, the part number and

Device Revision ID value appear in the Output

window.

The DEVREV values for the various PIC16(L)F72X

silicon revisions are shown in Table 1.

Note: This document summarizes all silicon

errata issues from all revisions of silicon,

previous as well as current. Only the

issues indicated in the last column of

Table 2 apply to the current silicon

revision (AK).

Note: If you are unable to extract the silicon

revision level, please contact your local

Microchip sales office for assistance.

TABLE 1: SILICON DEVREV VALUES

Part Number Device ID(1) Revision ID for Silicon Revision(2)

A7 A9 AA AB AC AD AK

PIC16F722 01 1000 100x xxxx 0x7 0x9 0xA 0xB 0xC 0xD 0x12

PIC16LF722 01 1001 100x xxxx 0x7 0x9 0xA 0xB 0xC 0xD 0x12

PIC16F723 01 1000 011x xxxx 0x7 0x9 0xA 0xB 0xC 0xD 0x12

PIC16LF723 01 1001 011x xxxx 0x7 0x9 0xA 0xB 0xC 0xD 0x12

PIC16F724 01 1000 010x xxxx 0x7 0x9 0xA 0xB 0xC 0xD 0x12

PIC16LF724 01 1001 010x xxxx 0x7 0x9 0xA 0xB 0xC 0xD 0x12

PIC16F726 01 1000 001x xxxx 0x7 0x9 0xA 0xB 0xC 0xD 0x12

PIC16LF726 01 1001 001x xxxx 0x7 0x9 0xA 0xB 0xC 0xD 0x12

PIC16F727 01 1000 000x xxxx 0x7 0x9 0xA 0xB 0xC 0xD 0x12

PIC16LF727 01 1001 000x xxxx 0x7 0x9 0xA 0xB 0xC 0xD 0x12

Note 1: The Device ID is located at 2006h. The 5 Least Significant bits comprise the revision ID.

2: Refer to the “PIC16F72X Memory Programming Specification” (DS41332) for detailed information on

Device and Revi sion IDs for your specific de vice.

PIC16(L)F72X Family

Silicon Errata and Data Sheet Clarification

PIC16(L)F72X

DS80382J-page 2  2011 Microchip Technology Inc.

TABLE 2: SILICON ISSUE SUMMARY

Module Feature Item

Number Issue Summary Aff ected Revisions(1)

A7 A9 AA AB AC AD AK

ADC (Analog-to-Digital

Converter) Power-down 1.1 ADC Power-down in Sleep. XXXX

ADC (Analog-to-Digital

Converter) Offset Error 1.2 Error on Infrequent

Conversions. XXXXX

ADC (Analog-to-Digital

Converter) Conversion

Results 1.3 Incorrect Conversion below

0°C. XXXXX

Timer1 Timer1

Oscillator 2.1 Operation above 90°C. XXXXXXX

Internal Os cillator Frequency 3.1 Frequency Shift on Reset. X

Internal Os cillator Frequency 3.2 Failure to wake from Sleep. X X

Internal Os cillator Frequency 3.3 Frequency Tolerance. XXXXXXX

External Oscillator External

Oscillator 4.1 Operation below 2.7V in HS

mode. XXXXXXX

CPU Sleep 5.1 Reset on Wake. X X

BOR Current 6.1 Current Draw in Sleep. XXXX

WDT CLRWDT

Instruction 7.1 CLRWDT Instruction after WDT

Time-out. XXXXX

Interrupts Stack Push 8. Interrupt logic incorrectly

pushes two addresses to the

stack.

XXXXXXX

 2011 Microchip Technology Inc. DS80382J-page 3

PIC16(L)F72X

Silicon Errata Issues

1. Module: ADC (Analog-to-Digital

Converter)

1.1 ADC Power-down in Sleep

The ADC module incorrectly fails to power-down

after a con ve r si on if the dev ice is in Sleep an d the

ADC interrupt is disabled. The proper operation is

to power the ADC off after the conversion is

complete if the device is sleeping and the ADC

inter rupt is disab led .

Work around

Use the ADC conversion complete interrupt

(ADIF) to wake-up and explicitly shut down the

ADC by clearing the ADON bit.

Affected Silicon Revisions

1.2 Error on Infrequent Conversions

The offset error inco rrectly exc eeds the d ata she et

specifications if time between conversions is

longer than 10 ms. If the time between

conversions is greater than 10 ms, the offset error

is 1 LSb typical and 3.3 LSb maximum.

Work around

The time de pendent e rror i s i nsign ifi can t w he n th e

time between conversions is less than 10 ms.

When the time between conversions is greater

than 10 ms, take two back-to-back ADC

conversions and discard the results of the first

conversion.

Affected Silicon Revisions

1.3 Incorrect Conversion below 0°C

In some de vice s, the ADC m ay im properl y co nvert

if the tem perature is bel ow 0°C an d the ADC cloc k

source is set to FOSC/8, FOSC/16, FOSC/32, FOSC/

64.

Work around

Set the ADC clock source to FOSC/2, FOSC/4 or

RC.

Affected Silicon Revisions

2. Module: Timer1

2.1 Operation abov e 90°C

The Timer1 oscillator does not operate above

90C.

Work around

None.

Affected Silicon Revisions

3. Module: Internal Oscillator

3.1 Frequency Shift on Reset

The internal oscillator module on the PIC16F72X

family of devices may experience a ±1% frequency

shift after a Reset. The frequency shift is not

consistent and could cause the oscillator to

operate outside of the 2% specification.

Work around

To minimize the chances of experiencing the

frequency shift, the following steps should be

taken:

1. Operate the internal oscillator at 8 MHz or

2MHz.

2. Use an external pull-up on MCLR or use

internal MCLR mode.

3. Disable the Pow er Rese t Ti mer (PWRT).

4. The bypass capacitor and Voltage Regulator

Capac itor (VCAP) should be used ap propriatel y

to minimize noise in the device.

Affected Silicon Revisions

Note: This document summarizes all silicon

errata issues from all revisions of silicon,

previous as well as current. Only the

issues indicated by the shaded column in

the following tables apply to the current

silicon revision (as applicable).

A7 A9 AA AB AC AD AK

XXXX

A7 A9 AA AB AC AD AK

XXXXX

A7 A9 AA AB AC AD AK

XXXXX

A7 A9 AA AB AC AD AK

XXXXXXX

A7 A9 AA AB AC AD AK

PIC16(L)F72X

DS80382J-page 4  2011 Microchip Technology Inc.

3.2 Failure to Wake from Sleep

Due to internal race conditions upon entering

Sleep mode, the device will occasionally fail to

wake-up from Sleep. Only a device Power-on

Reset will force the device to exit Sleep mode.

Work around

None. Do not use Sleep command.

Affected Silicon Revisions

3.3 Fre quen cy Toler an ce

The freq uency to lerance of the i nternal os cillato r is

±2% from 0-60°C and ±3% from 60-85°C (see

Figure 1).

Work around

None.

Affected Silicon Revisions

FIGURE 1: HFINTOSC FREQUENCY ACCURACY OVER DEVICE VDD AND

TEMPERATURE(1)

A7 A9 AA AB AC AD AK

XXXXXXX

125

2.0

VDD (V)

4.0 5.04.5

Temperature (°C)

2.5 3.0 3.5 5.51.8

Note 1: This chart covers both regulator enabled and regulator disabled states.

2: Regulator Nominal voltage.

3.3(2)

-40

-20

+ 5%

± 2%

+ 5%

± 3%

 2011 Microchip Technology Inc. DS80382J-page 5

PIC16(L)F72X

4. Module: External Oscillator

4.1 Minimum Operating Voltage for HS Mode

The minim um dev ice VDD when usi ng the ext ernal

crystal oscillator in HS mode is 2.7V.

Work around

Use the internal oscillator or an external clock

source if operation below 2.7V is required for the

frequency range supported by HS mode.

Affected Silicon Revisions

5. Module: CPU

5.1 Reset on Wake

If a wake from Sleep event occurs during the

execution of a Sleep command, the device may

reset. This Reset will be seen as a Power-on

Reset to the device.

Work around

1. Disable all asynchronous interrupt before

going to Sleep.

2. Make sure the timing of an asynchronous

interrupt will not happen during the execution

of the Sleep instruction.

Affected Silicon Revisions

6. Module: BOR

6.1 Current Draw in Sleep

With the BOR set to “Enabled during operation and

disabled during Sleep”, the device draws 2A

more during Sleep than when the BOR is set to

“Disabled”.

Work around

None.

Affected Silicon Revisions

7. Module: WDT

7.1 CLRWDT Instruction after WDT Time-out

After a WDT Reset, the TO bit of the STATUS

CLRWDT instruction is issued, then, the TO bit will

be set. If t he CLRWDT instruction i s issued within 20

S of the Reset, the TO bit will remain clear.

Work around

W ait at least 20 S after a WDT Reset before using

the CLRWDT instruction.

Affected Silicon Revisions

8. Module: Interrupts

The interrupt logic incorrectly pushes two

addresses to the stack when vectoring to the

interrupt vector. Specifically, the interrupt vector

address 0x4 is in correctly p ushed to the stack af ter

the current PC, at the time the interrupt was

received, is pushed. This will cause the stack to

overflow if the user program is operating seven

calls deep when an interrupt arrives. Because the

stack is circular , the overflow causes the first stack

address to be overw ritt en.

Work around

Disable interrupts by clearing the GIE bit in the

INTCON register whenever the user program is

operating seven calls deep. This ensures that

interrupts will not cause the stack to overflow.

Affected Silicon Revisions

A7 A9 AA AB AC AD AK

XXXXXXX

A7 A9 AA AB AC AD AK

XXXX

A7 A9 AA AB AC AD AK

XXXXX

A7 A9 AA AB AC AD AK

XXXXXXX

PIC16(L)F72X

DS80382J-page 6  2011 Microchip Technology Inc.

Data Sheet Clarifications

None.

 2011 Microchip Technology Inc. DS80382J-page 7

PIC16(L)F72X

APPENDIX A: DOCUMENT

REVISION HISTORY

Rev. A Document (07/2008)

First revision of this document.

Rev. B Document (08/2008)

Added Module 4: Internal Oscillator; Revised Modules

1 and 2.

Rev. C Document (11/2008)

Added Module 5: Internal Oscillator , Module 6: CPU and

Module 7: BOR.

Rev. D Document (07/2009)

Updated document with new format. Added items 1.3

and 3.3. Updated Tables 1 and 2. Other minor changes.

Rev. E Document (09/2009)

Added M odule 6: W DT; Revise d Tables 1 and 2; Adde d

Rev. ID AC.

Rev. F Document (01/2010)

Added Rev. AD Silicon.

Rev. G Document (03/2010)

Added new Module 4: External Oscillator; Revised

Table 2; Revised Module 3.3: Frequency Tolerance;

Other minor corrections.

Rev. H Document (04/2010)

Updated Tables 1 and 2, adding Rev. AK silicon;

Updated Module 3, clarified condition.

Rev. J Document (02/2011)

Updated errata to new format; Added Module 8,

Interrupts.

PIC16(L)F72X

DS80382J-page 8  2011 Microchip Technology Inc.

NOTES:

 2011 Microchip Technology Inc. DS80382J-page 9

Information contained in this publication regarding device

applications a nd t he lik e is provid ed only for your convenience

and may be su perseded by updates. I t is y our respo ns i bil it y to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC,

KEELOQ, KEELOQ logo, MPLAB, PIC , PI Cmi cro, PI CSTART,

PIC32 logo, rfPIC and UNI/O are registered trademarks of

Microchip Technology Incorporated in the U.S.A. and other

countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,

MXDEV, MXLAB, SEEVAL and The Embedded Control

Solutions Company are registered trademarks of Microchip

Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, CodeGuard,

dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,

ECONOMONIT OR, FanSense, HI-TIDE, In-Circuit Se r i a l

Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Cert ified

logo, MPLIB, MPLINK, mTouch, Omniscient Code

Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,

PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance,

TSHARC, UniWinDriver, WiperLock and ZENA are

trademarks of Microchip Technology Incorporated in the

U.S.A. and other countries.

SQTP is a service mark of Microchip T echnology Incorporated

in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

ISBN: 978-1-60932-912-9

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that it s family of products is one of the most secure families of it s kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is c onstantly evolving. We a t Microc hip are co m mitted to continuously improving the code prot ect ion featur es of our

products. Attempts to break Microchip’ s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2002 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona; Gresham, Oregon and design centers in California

and India. The Company’s quality system processes and procedures

are for its PIC® MCUs and d sPIC® DSCs, KEELOQ® code hoppi ng

devices, Serial EEPROMs, microperiph erals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

DS80382J-page 10  2011 Microchip Technology Inc.

AMERICAS

Corporate Office

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

http://www.microchip.com/

support

Web Address:

www.microchip.com

Atlanta

Duluth, GA

Tel: 678-957-9614

Fax: 678-957-1455

Boston

Westborough, MA

Tel: 774-760-0087

Fax: 774-760-0088

Chicago

Itasc a , IL

Tel: 630-285-0071

Fax: 630-285-0075

Cleveland

Independence, OH

Tel: 216-447-0464

Fax: 216-447-0643

Dallas

Addison, TX

Tel: 972-818-7423

Fax: 972-818-2924

Detroit

Farmington Hills, MI

Tel: 248-538-2250

Fax: 248-538-2260

Indianapolis

Noblesville, IN

Tel: 317-773-8323

Fax: 317-773-5453

Los A n ge les

Mission Viejo, CA

Tel: 949-462-9523

Fax: 949-462-9608

Santa Clara

Santa Clara, CA

Tel: 408-961-6444

Fax: 408-961-6445

Toronto

Mississauga, Ontario,

Canada

Tel: 905-673-0699

Fax: 905-673-6509

ASIA/PACIFIC

Asia Pacific Office

Suites 3707-14, 37th Floor

Tower 6, The Gateway

Harbour City, Kowloon

Hong Kong

Tel: 852-2401-1200

Fax: 852-2401-3431

Australia - Sydney

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

China - Beijing

Tel: 86-10-8528-2100

Fax: 86-10-8528-2104

China - Chengdu

Tel: 86-28-8665-5511

Fax: 86-28-8665-7889

China - Chongqing

Tel: 86-23-8980-9588

Fax: 86-23-8980-9500

China - Hong Kong SAR

Tel: 852-2401-1200

Fax: 852-2401-3431

China - Nanjing

Tel: 86-25-8473-2460

Fax: 86-25-8473-2470

China - Qingdao

Tel: 86-532-8502-7355

Fax: 86-532-8502-7205

China - Shanghai

Tel: 86-21-5407-5533

Fax: 86-21-5407-5066

China - Shenyang

Tel: 86-24-2334-2829

Fax: 86-24-2334-2393

China - Shenzhen

Tel: 86-755-8203-2660

Fax: 86-755-8203-1760

China - Wuhan

Tel: 86-27-5980-5300

Fax: 86-27-5980-5118

China - Xian

Tel: 86-29-8833-7252

Fax: 86-29-8833-7256

China - Xiamen

Tel: 86-592-2388138

Fax: 86-592-2388130

China - Zhuhai

Tel: 86-756-3210040

Fax: 86-756-3210049

ASIA/PACIFIC

India - Bangalore

Tel: 91-80-3090-4444

Fax: 91-80-3090-4123

India - New Delhi

Tel: 91-11-4160-8631

Fax: 91-11- 4160-8632

India - Pune

Tel: 91-20-2566-1512

Fax: 91-20-2566-1513

Japan - Yokohama

Tel: 81-45-471- 6166

Fax: 81-45-471-6122

Korea - Daegu

Tel: 82-53-744-4301

Fax: 82-53-744-4302

Korea - Seoul

Tel: 82-2-554-7200

Fax: 82-2-558-5932 or

82-2-558-5934

Malaysia - Kuala Lumpur

Tel: 60-3-6201-9857

Fax: 60-3-6201-9859

Malaysia - Penang

Tel: 60-4-227-8870

Fax: 60-4-227-4068

Philippines - Manila

Tel: 63-2-634-9065

Fax: 63-2-634-9069

Singapore

Tel: 65-6334-8870

Fax: 65-6334-8850

Taiwan - Hsin Chu

Tel: 886-3-6578-300

Fax: 886-3-6578-370

Taiwan - Kaohsiung

Tel: 886-7-213-7830

Fax: 886-7-330-9305

Taiwan - Taipei

Tel: 886-2-2500-6610

Fax: 886-2-2508-0102

Thailand - Bangkok

Tel: 66-2-694-1351

Fax: 66-2-694-1350

EUROPE

Austria - Wels

Tel: 43-7242-2244-39

Fax: 43-7242-2244-393

Denmark - Cop e nha gen

Tel: 45-4450-2828

Fax: 45-4485-2829

France - Paris

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

Germany - Munich

Tel: 49-89-627-144-0

Fax: 49-89-627-14 4-44

Italy - Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

Spain - Madrid

Tel: 34-91-708-08-90

Fax: 34-91-708-08 -91

UK - Wokingham

Tel: 44-118-921-5869

Fax: 44-118-921-5820

Worldwide Sales and Service

02/18/11