ES1DAF, ES1JAF Surface Mount Ultrafast Rectifier Features * * * * * * * Fast Switching Speed - Maximum Trr 35 ns Ultra Thin Profile - Maximum Height of 1.0 mm Glass Passivated Junction UL Flammability 94V-0 Classification MSL 1 Green Mold Compound These Devices are Pb-Free, Halogen Free Free and are RoHS Compliant www.onsemi.com 1 Cathode 2 Anode Ultrafast Rectifier Specifications DO-214AD (SMAF) CASE 403AD ABSOLUTE MAXIMUM RATINGS (TA = 25C unless otherwise noted) Value Parameter Symbol ES1DAF ES1JAF Unit VRRM Recurrent Peak Reverse Voltage 200 600 V VRMS RMS Voltage 140 420 V DC Blocking Voltage 200 600 V VR IF(AV) Average Forward Current 1 A IFSM Peak Forward Surge Current: 8.3 ms Single Half Sine-Wave Superimposed on Rated Load 30 A Operating Junction Temperature Range -55 to +150 C Storage Temperature Range -55 to +150 C TJ TSTG MARKING DIAGRAMS $Y&Z&3 ES1DAF Band Indicates Cathode $Y &Z &3 ES1DAF = ON Semiconductor Logo = Assembly Plant Code = Data Code (Year & Week) = Specific Device Code $Y&Z&3 ES1JAF Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Band Indicates Cathode $Y &Z &3 ES1JAF = ON Semiconductor Logo = Assembly Plant Code = Data Code (Year & Week) = Specific Device Code ORDERING INFORMATION See detailed ordering and shipping information on page 2 of this data sheet. (c) Semiconductor Components Industries, LLC, 2015 May, 2018 - Rev. 2 1 Publication Order Number: ES1JAF/D ES1DAF, ES1JAF THERMAL CHARACTERISTICS (TA = 25C unless otherwise noted) Symbol Value Unit YJL Typical Thermal Characteristics, Junction-to-Lead (Note 1) Characteristic 24 C/W RqJA Typical Thermal Resistance, Junction-to-Ambient (Note 2) 150 C/W cm2 copper 1. Mounted on an FR4 PCB, single-sided copper, with 48 2. Mounted on an FR4 PCB, single-sided copper, mini pad. pad area. ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) Symbol VF Parameter Forward Voltage Conditions IF = 1 A Min Typ Max Unit ES1DAF - - 0.95 V ES1JAF - - 1.70 IR Reverse Current VR = VDC - - 1 mA trr Reverse Recovery Time IF = 0.5 A, IR = 1 A, Irr = 0.25 A - - 34 ns CJ Junction Capacitance VR = 4 V, f = 1 MHz - 15 - pF Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. ORDERING INFORMATION Part Number Top Mark Package Shipping ES1DAF ES1DAF DO-214AD (SMAF) (Pb-Free/Halogen Free) 10000 / Tape & Reel ES1JAF ES1JAF DO-214AD (SMAF) (Pb-Free/Halogen Free) 10000 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 2 ES1DAF, ES1JAF TYPICAL PERFORMANCE CHARACTERISTICS 0.8 0.6 0.4 0.2 0 IR, Reverse Current (mA) CJ, Junction Capacitance (pF) 1 0 25 50 75 100 125 10 1 100 Figure 1. Forward Current Derating Curve Figure 2. Typical Junction Capacitance 100 200 V TA = 125C 1 TA = 150C 0.1 TA = 75C TA = 25C 0.01 50 100 150 600 V TA = 150C 10 TA = 125C 1 TA = 75C 0.1 TA = 25C 0.01 200 20 VR, Peak Reverse Voltage (V) Figure 3. Typical Reverse Characteristics 200 V 1 TA = 125C TA = 150C 0.1 TA = 75C TA = 25C 0 0.2 0.4 0.6 0.8 100 40 60 80 Percent of Rated Peak Reverse Voltage (%) Figure 4. Typical Reverse Characteristics IF, Forward Current (A) IF, Forward Current (A) 10 VR, Reverse Bias Voltage (V) 10 0.01 1 0.1 TC, Case Temperature (5C) 100 0.001 100 150 IR, Reverse Current (mA) IF, Forward Current (A) 1.2 600 V 1 TA = 125C TA = 150C 0.1 TA = 75C TA = 25C 0.01 1 0 0.5 1 1.5 2 VF, Forward Voltage (V) VF, Forward Voltage (V) Figure 5. Typical Forward Characteristics Figure 6. Typical Forward Characteristics www.onsemi.com 3 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SMA-FL CASE 403AD ISSUE O DATE 31 AUG 2016 2.04 1.90 1.60 2.04 2.70 2.30 1.89 4.00 3.60 1.24 0.25 0.10 1.10 0.90 LAND PATTERN RECOMMENDATION 5.00 4.40 0.38 1.60 0.95 0.50 NOTES: A. THIS PACKAGE DOES NOT CONFORM TO ANY STANDARDS. B. ALL DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH AND TIE BAR PROTRUSIONS. 0.95 0.50 1.60 DOCUMENT NUMBER: STATUS: 98AON13439G ON SEMICONDUCTOR STANDARD NEW STANDARD: (c) Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 - Rev. 0 SMA-FL http://onsemi.com 1 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped "CONTROLLED COPY" in red. Case Outline Number: PAGE 1 OFXXX 2 DOCUMENT NUMBER: 98AON13439G PAGE 2 OF 2 ISSUE O REVISION RELEASED FOR PRODUCTION FROM FAIRCHILD DO214AD TO ON SEMICONDUCTOR. REQ. BY B. NG. DATE 31 AUG 2016 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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