SE30PAB, SE30PAD, SE30PAG, SE30PAJ www.vishay.com Vishay General Semiconductor Surface-Mount ESD Capability Rectifiers FEATURES eSMP(R) Series * Very low profile - typical height of 0.95 mm * Ideal for automated placement * Oxide planar chip junction * Low forward voltage drop, low leakage current Top View * ESD capability Bottom View * Meets MSL level 1, per J-STD-020, LF maximum peak of 260 C SMPA (DO-221BC) Anode * Not recommended for PCB bottom side wave mounting Cathode * AEC-Q101 qualified DESIGN SUPPORT TOOLS * Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 click logo to get started TYPICAL APPLICATIONS Models General purpose, power line polarity protection, in both consumer and automotive applications. Available MECHANICAL DATA PRIMARY CHARACTERISTICS IF(AV) 3.0 A VRRM 100 V, 200 V, 400 V, 600 V IFSM 32 A VF at IF = 3.0 A (TA = 125 C) 1.00 V IR 5 A TJ max. 175 C Package SMPA (DO-221BC) Circuit configuration Single Case: SMPA (DO-221BC) Molding compound meets UL 94 V-0 flammability rating Base P/N-M3 - halogen-free, RoHS-compliant, and commercial grade Base P/NHM3 - halogen-free, RoHS-compliant, and AEC-Q101 qualified Terminals: matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 M3 suffix meets JESD 201 class 2 whisker test, HM3 suffix meets JESD 201 class 2 whisker test Polarity: color band denotes the cathode end MAXIMUM RATINGS (TA = 25 C unless otherwise noted) PARAMETER SYMBOL Device marking code Maximum repetitive peak reverse voltage Maximum DC forward current Peak forward surge current 10 ms single half sine-wave superimposed on rated load Operating junction and storage temperature range VRRM SE30PAB SE30PAD SE30PAG SE30PAJ 30B 30D 30G 30J 100 200 400 600 UNIT V IF (1) 3.0 IF (2) 1.4 IFSM 32 A TJ, TSTG -55 to +175 C A Notes (1) Mounted on 20 mm x 20 mm pad areas, 2 oz. FR4 PCB (2) Free air, mounted on recommended copper pad area Revision: 13-Feb-2019 Document Number: 87702 1 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SE30PAB, SE30PAD, SE30PAG, SE30PAJ www.vishay.com Vishay General Semiconductor ELECTRICAL CHARACTERISTICS (TA = 25 C unless otherwise noted) PARAMETER TEST CONDITIONS IF = 1.5 A Instantaneous forward voltage SYMBOL TYP. TA = 25 C IF = 3.0 A VF (1) IF = 1.5 A TA = 125 C IF = 3.0 A TA = 25 C IR (2) MAX. 0.98 - 1.07 1.16 0.88 - 1.00 1.10 - 5 7 100 UNIT V A Reverse current Rated VR Typical reverse recovery time IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A trr 1.3 - s Typical junction capacitance 4.0 V, 1 MHz CJ 13 - pF TA = 125 C Notes (1) Pulse test: 300 s pulse width, 1 % duty cycle (2) Pulse test: Pulse width 40 ms THERMAL CHARACTERISTICS (TA = 25 c unless otherwise noted) PARAMETER SYMBOL RJA Typical thermal resistance SE30PAB SE30PAD (1) SE30PAG SE30PAJ 120 RJM (2) UNIT C/W 9 Notes (1) Free air, mounted on recommended PCB, 2 oz. pad area; thermal resistance R JA - junction to ambient (2) Mounted on 20 mm x 20 mm pad areas, 2 oz. FR4 PCB; R JM - junction to mount IMMUNITY TO ELECTRICAL STATIC DISCHARGE TO THE FOLLOWING STANDARDS (TA = 25 C unless otherwise noted) STANDARD AEC-Q101-001 TEST TYPE Human body model (contact mode) TEST CONDITIONS SYMBOL CLASS VALUE C = 100 pF, R = 1.5 k VC H3B > 8 kV ORDERING INFORMATION (Example) PREFERRED P/N UNIT WEIGHT (g) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE SE30PAJ-M3/I 0.033 I 14 000 13" diameter plastic tape and reel SE30PAJHM3/I (1) 0.033 I 14 000 13" diameter plastic tape and reel Note AEC-Q101 qualified (1) Revision: 13-Feb-2019 Document Number: 87702 2 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SE30PAB, SE30PAD, SE30PAG, SE30PAJ www.vishay.com Vishay General Semiconductor 3.5 Instantaneous Reverse Current (A) Average Forward Rectified Current (A) RATINGS AND CHARACTERISTICS CURVES (TA = 25 C unless otherwise noted) RthJM = 9 C/W 3 2.5 2 Free air, RthJA = 120 C/W 1.5 1 0.5 TM measured at cathode band terminal PCB mount 0 0 25 50 75 100 125 150 100 TJ = 175 C 10 TJ = 125 C 1 TJ = 75 C 0.1 0.01 TJ = 25 C 0.001 10 175 20 30 40 60 70 80 90 100 Fig. 4 - Typical Reverse Leakage Characteristics 4.0 100 TJ = 25 C f = 1.0 MHz Vsig = 50 mVp-p D = 0.8 3.6 3.2 D = 0.3 D = 1.0 2.8 D = 0.2 2.4 D = 0.1 2.0 1.6 1.2 T 0.8 D = tp/T Junction Capacitance (pF) D = 0.5 0.4 10 tp 0.0 1 0 0.4 0.8 1.2 1.6 2 2.4 2.8 3.2 3.6 0.1 1 Average Forward Current (A) Transient Thermal Impedance (C/W) TJ = 175 C TJ = 150 C TJ = 125 C TJ =75 C TJ = 25 C 0.1 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 100 Fig. 5 - Typical Junction Capacitance 10 1 10 Reverse Voltage (V) Fig. 2 - Forward Power Loss Characteristics Instantaneous Forward Current (A) 50 Percent of Rated Peak Reverse Voltage (%) Case Temperature (C) Fig. 1 - Maximum Forward Current Derating Curve Average Power Loss (W) TJ = 150 C 1.3 1.4 Instantaneous Forward Voltage (V) Fig. 3 - Typical Instantaneous Forward Characteristics 1000 Junction to Ambient 100 10 1 0.01 0.1 1 10 100 t - Pulse Duration (s) Fig. 6 - Typical Transient Thermal Impedance Revision: 13-Feb-2019 Document Number: 87702 3 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SE30PAB, SE30PAD, SE30PAG, SE30PAJ www.vishay.com Vishay General Semiconductor PACKAGE OUTLINE DIMENSIONS in inches (millimeters) SMPA (DO-221BC) 0.059 (1.50) 0.030 (0.75) 0.122 (3.10) 0.098 (2.50) Cathode Band 0.057 (1.45) 0.049 (1.25) 0.106 (2.70) 0.098 (2.50) 0.171 (4.35) 0.163 (4.15) 0.211 (5.35) 0.199 (5.05) 0.087 (2.20) 0.063 (1.6) 0.059 (1.50) 0.030 (0.75) Typ.: 0.019 (0.48) Mounting Pad Layout MAX. 0.037 (0.92) 0.039 (1.00) 0.035 (0.90) 0.012 (0.30) 0.006 (0.15) 0.087 (2.20) MIN. 0.060 (1.52) MIN. MIN. 0.122 (3.10) MIN. 0.059 (1.50) 0.217 (5.52) Revision: 13-Feb-2019 Document Number: 87702 4 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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