SE30PAJ-M3/I - VISHAY - Datasheet.Directory

SE30PAB, SE30PAD, SE30PAG, SE30PAJ

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Revision: 13-Feb-2019 1Document Number: 87702

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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

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Surface-Mount ESD Capability Rectifiers

DESIGN SUPPORT TOOLS

FEATURES

• Very low profile - typical height of 0.95 mm

• Ideal for automated placement

• Oxide planar chip junction

• Low forward voltage drop, low leakage

current

• ESD capability

• Meets MSL level 1, per J-STD-020, LF maximum

peak of 260 °C

• Not recommended for PCB bottom side wave mounting

• AEC-Q101 qualified

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

TYPICAL APPLICATIONS

General purpose, power line polarity protection, in both

consumer and automotive applications.

MECHANICAL DATA

Case: SMPA (DO-221BC)

Molding compound meets UL 94 V-0 flammability rating

Base P/N-M3 - halogen-free, RoHS-compliant, and

commercial grade

Base P/NHM3 - halogen-free, RoHS-compliant, and

AEC-Q101 qualified

Terminals: matte tin plated leads, solderable per

J-STD-002 and JESD 22-B102

M3 suffix meets JESD 201 class 2 whisker test, HM3 suffix

meets JESD 201 class 2 whisker test

Polarity: color band denotes the cathode end

Notes

(1) Mounted on 20 mm x 20 mm pad areas, 2 oz. FR4 PCB

(2) Free air, mounted on recommended copper pad area

PRIMARY CHARACTERISTICS

IF(AV) 3.0 A

VRRM 100 V, 200 V, 400 V, 600 V

IFSM 32 A

VF at IF = 3.0 A (TA = 125 °C) 1.00 V

IR5 μA

TJ max. 175 °C

Package SMPA (DO-221BC)

Circuit configuration Single

SMPA (DO-221BC)

eSMP® Series

Top View Bottom View

Cathode

node

click logo to get started

Available

Models

MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)

PARAMETER SYMBOL SE30PAB SE30PAD SE30PAG SE30PAJ UNIT

Device marking code 30B 30D 30G 30J

Maximum repetitive peak reverse voltage VRRM 100 200 400 600 V

Maximum DC forward current IF (1) 3.0 A

IF (2) 1.4

Peak forward surge current 10 ms single half

sine-wave superimposed on rated load IFSM 32 A

Operating junction and storage temperature range TJ, TSTG -55 to +175 °C

SE30PAB, SE30PAD, SE30PAG, SE30PAJ

www.vishay.com Vishay General Semiconductor

Revision: 13-Feb-2019 2Document Number: 87702

For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Notes

(1) Pulse test: 300 μs pulse width, 1 % duty cycle

(2) Pulse test: Pulse width  40 ms

Notes

(1) Free air, mounted on recommended PCB, 2 oz. pad area; thermal resistance RJA - junction to ambient

(2) Mounted on 20 mm x 20 mm pad areas, 2 oz. FR4 PCB; RJM - junction to mount

Note

(1) AEC-Q101 qualified

ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)

PARAMETER TEST CONDITIONS SYMBOL TYP. MAX. UNIT

Instantaneous forward voltage

IF = 1.5 A TA = 25 °C

VF (1)

0.98 -

IF = 3.0 A 1.07 1.16

IF = 1.5 A TA = 125 °C 0.88 -

IF = 3.0 A 1.00 1.10

Reverse current Rated VR

TA = 25 °C IR (2) -5

μA

TA = 125 °C 7 100

Typical reverse recovery time IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A trr 1.3 - μs

Typical junction capacitance 4.0 V, 1 MHz CJ13 - pF

THERMAL CHARACTERISTICS (TA = 25 °c unless otherwise noted)

PARAMETER SYMBOL SE30PAB SE30PAD SE30PAG SE30PAJ UNIT

Typical thermal resistance RJA (1) 120 °C/W

RJM (2) 9

IMMUNITY TO ELECTRICAL STATIC DISCHARGE TO THE FOLLOWING STANDARDS 

(TA = 25 °C unless otherwise noted)

STANDARD TEST TYPE TEST CONDITIONS SYMBOL CLASS VALUE

AEC-Q101-001 Human body model (contact mode) C = 100 pF, R = 1.5 kVCH3B > 8 kV

ORDERING INFORMATION (Example)

PREFERRED P/N UNIT WEIGHT (g) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE

SE30PAJ-M3/I 0.033 I 14 000 13" diameter plastic tape and reel

SE30PAJHM3/I (1) 0.033 I 14 000 13" diameter plastic tape and reel

SE30PAB, SE30PAD, SE30PAG, SE30PAJ

www.vishay.com Vishay General Semiconductor

Revision: 13-Feb-2019 3Document Number: 87702

For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted)

Fig. 1 - Maximum Forward Current Derating Curve

Fig. 2 - Forward Power Loss Characteristics

Fig. 3 - Typical Instantaneous Forward Characteristics

Fig. 4 - Typical Reverse Leakage Characteristics

Fig. 5 - Typical Junction Capacitance

Fig. 6 - Typical Transient Thermal Impedance

0.5

1.5

2.5

3.5

0 255075100125150175

Average Forward Rectied Current (A)

Case Temperature (°C)

RthJM = 9 °C/W

Free air, RthJA = 120 °C/W

TMmeasured at cathode band

terminal PCB mount

0.0

0.4

0.8

1.2

1.6

2.0

2.4

2.8

3.2

3.6

4.0

0 0.4 0.8 1.2 1.6 2 2.4 2.8 3.2 3.6

Average Power Loss (W)

Average Forward Current (A)

D = 0.1

D = 0.2

D = 0.3

D = 0.5

D = 1.0

D = 0.8

D = tp/T

0.1

0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4

Instantaneous Forward Current (A)

Instantaneous Forward Voltage (V)

= 150 °C

= 25 °C

=75 °C

= 125 °C

= 175 °C

0.001

0.01

0.1

100

10 20 30 40 50 60 70 80 90 100

Instantaneous Reverse Current (μA)

Percent of Rated Peak Reverse Voltage (%)

= 150 °C

= 125 °C

= 75 °C

= 25 °C

= 175 °C

100

0.1 1 10 100

Junction Capacitance (pF)

Reverse Voltage (V)

TJ= 25 °C

f = 1.0 MHz

Vsig = 50 mVp-p

100

1000

0.01 0.1 1 10 100

Transient Thermal Impedance (°C/W)

t - Pulse Duration (s)

Junction to Ambient

SE30PAB, SE30PAD, SE30PAG, SE30PAJ

www.vishay.com Vishay General Semiconductor

Revision: 13-Feb-2019 4Document Number: 87702

For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

PACKAGE OUTLINE DIMENSIONS in inches (millimeters)

Cathode Band

0.106 (2.70)

0.098 (2.50)

SMPA (DO-221BC)

0.171 (4.35)

0.163 (4.15)

0.211 (5.35)

0.199 (5.05)

0.039 (1.00)

0.035 (0.90)

0.057 (1.45)

0.049 (1.25)

0.059 (1.50)

0.030 (0.75)

0.012 (0.30)

0.006 (0.15)

Typ.: 0.019 (0.48)

0.122 (3.10)

0.098 (2.50)

0.059 (1.50)

0.030 (0.75)

0.087 (2.20)

0.063 (1.6)

Mounting Pad Layout

0.087 (2.20)

MIN.

0.059 (1.50)

MIN. 0.122 (3.10)

MAX. 0.037 (0.92)

0.217 (5.52)

0.060 (1.52)

MIN.

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