TLP2766F Photocouplers GaAAs Infrared LED & Photo IC TLP2766F 1. Applications * Factory Networking * High-Speed Digital Interfacing for Instrumentation and Control Devices * Plasma Display Panels (PDPs) 2. General The Toshiba TLP2766F consists of a high-output GaAAs light-emitting diode coupled with a high-speed photodiode-transistor chip. The TLP2766 guarantees operation at up to 125 and on supplies from 2.7 V to 5.5 V. It is offered in the SDIP6 package. The TLP2766 has an internal Faraday shield that provides a guaranteed commonmode transient immunity of 20 kV/s. 3. Features (1) Inverter logic type (Totem pole output) (2) Package: SDIP6 (3) Operating temperature: -40 to 125 (4) Supply voltage: 2.7 to 5.5 V (5) Data transfer rate: 20 MBd (typ.) (NRZ) (6) Threshold input current: 3.5 mA (max) (7) Supply current: 3 mA (max) (8) Common-mode transient immunity: 20 kV/s (min) (9) Isolation voltage: 5000 Vrms (min) (10) Safety standards UL-approved: UL1577, File No.E67349 cUL-approved: CSA Component Acceptance Service No.5A File No.E67349 VDE-approved: EN60747-5-5 (Note 1) Note 1: When an EN60747-5-5 approved type is needed, please designate the Option (D4) (D4). 4. Packaging and Pin Configuration 1: Anode 2: N.C. 3: Cathode 4: GND 5: VO (Output) 6: VCC 11-5J101S (c)2016 Toshiba Corporation 1 2016-01-14 Rev.4.0 TLP2766F 5. Internal Circuit (Note) Note: A 0.1F bypass capacitor must be connected between pin 6 and pin 4. 6. Principle of Operation 6.1. Truth Table Input LED M1 M2 Output H ON OFF ON L L OFF ON OFF H 6.2. Mechanical Parameters 10.16-mm Pitch TLP2766F Unit Creepage distances 8.0 (min) mm Clearance distances 8.0 (min) Internal isolation thickness 0.4 (min) Characteristics (c)2016 Toshiba Corporation 2 2016-01-14 Rev.4.0 TLP2766F 7. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 ) Characteristics LED Symbol Input forward current Input forward current derating Unit IF 25 mA IF/Ta -0.67 mA/ 40 mA (Ta 110 ) IFP/Ta -1.0 mA/ PD 40 mW PD/Ta -1.0 mW/ IFP Input power dissipation Input power dissipation derating Rating (Ta 110 ) Input forward current (pulsed) Input forward current derating (pulsed) Note (Ta 110 ) Input reverse voltage (Note 1) VR 5 V IO 10 mA Output voltage VO 6 V Supply voltage VCC 6 Detector Output current Output power dissipation Output power dissipation derating (Ta 110 ) Common Operating temperature Storage temperature Lead soldering temperature Isolation voltage PO 60 mW PO/Ta -1.5 mW/ Topr -40 to 125 Tstg -55 to 150 (10 s) Tsol 260 AC, 60 s, R.H. 60 % BVS (Note 2) 5000 Vrms Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Pulse width (PW) 1 ms, duty = 50 % Note 2: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6 are shorted together. 8. Recommended Operating Conditions (Note) Characteristics Symbol Note Min Typ. Max Unit Input on-state current IF(ON) (Note 1) 4.5 Input off-state voltage VF(OFF) 0 15 mA 0.8 V Supply voltage VCC (Note 2) 2.7 3.3/5.0 5.5 Operating temperature Topr (Note 2) -40 125 Note: The recommended operating conditions are given as a design guide necessary to obtain the intended performance of the device. Each parameter is an independent value. When creating a system design using this device, the electrical characteristics specified in this datasheet should also be considered. Note: A ceramic capacitor (0.1 F) should be connected between pin 6 and pin 4 to stabilize the operation of a highgain linear amplifier. Otherwise, this photocoupler may not switch properly. The bypass capacitor should be placed within 1 cm of each pin. Note 1: The rise and fall times of the input on-current should be less than 0.5 s. Note 2: Denotes the operating range, not the recommended operating condition. (c)2016 Toshiba Corporation 3 2016-01-14 Rev.4.0 TLP2766F 9. Electrical Characteristics (Note) (Unless otherwise specified, Ta = -40 to 125 , VCC = 2.7 to 5.5 V) Characteristics Input forward voltage Input forward voltage temperature coefficient Input reverse current Input capacitance Symbol Test Circuit Test Condition Min Typ. Max Unit VF IF = 10 mA, Ta = 25 1.45 1.55 1.7 V VF/Ta IF = 10 mA -2.0 mV/ IR VR = 5 V, Ta = 25 10 A Ct V = 0 V, f = 1 MHz, Ta = 25 60 pF Low-level output voltage VOL Fig. 12.1.1 IF = 14 mA, IO = 4 mA 0.4 V High-level output voltage VOH Fig. 12.1.2 VF = 1.05 V, IO = -4 mA, VCC = 3.3 V 2.3 VF = 1.05 V, IO = -4 mA, VCC = 5 V 4 Low-level supply current ICCL Fig. 12.1.3 IF = 14 mA 1.6 3 High-level supply current ICCH Fig. 12.1.4 IF = 0 mA 1.5 3 Threshold input current (H/L) IFHL IO = 1.6 mA, VO < 0.4 V 0.9 3.5 Min Typ. Max Unit Note: mA All typical values are at Ta = 25 . 10. Isolation Characteristics (Unless otherwise specified, Ta = 25 ) Characteristics Symbol Note Test Conditions Total capacitance (input to output) CS (Note 1) VS = 0 V, f = 1 MHz 0.8 pF Isolation resistance RS (Note 1) VS = 500 V, R.H. 60 % 1 x 1012 1014 (Note 1) AC, 60 s 5000 Vrms AC, 1 s in oil 10000 DC, 60 s in oil 10000 Isolation voltage BVS Vdc Note 1: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6 are shorted together. (c)2016 Toshiba Corporation 4 2016-01-14 Rev.4.0 TLP2766F 11. Switching Characteristics (Note) 11.1. Switching Characteristics (1) (Unless otherwise specified, Ta = -40 to 125 , VCC = 2.7 to 3.6 V) Characteristics Symbol Note Propagation delay time (H/L) tpHL (Note 1) Propagation delay time (L/H) tpLH Pulse width distortion Test Circuit Min Typ. Max Unit Fig. IF = 0 14 mA, RIN = 100 , 12.1.5 CL = 15 pF 28 40 ns (Note 1) IF = 14 0 mA, RIN = 100 , CL = 15 pF 25 40 |tpHLtpLH| (Note 1) IF = 14 mA, RIN = 100 , CL = 15 pF 3 25 Propagation delay skew (device to device) tpsk (Note 1), (Note 2) -30 30 Propagation delay time (H/L) tpHL (Note 1) Fig. IF = 0 6 mA, RIN = 100 , 12.1.5 CL = 15 pF 34 55 Propagation delay time (L/H) tpLH (Note 1) IF = 6 0 mA, RIN = 100 , CL = 15 pF 25 55 Pulse width distortion |tpHLtpLH| (Note 1) IF = 6 mA, RIN = 100 , CL = 15 pF 9 30 tpsk (Note 1), (Note 2) -30 30 Fall time tf (Note 1) Fig. IF = 0 14 mA, RIN = 100 , 12.1.5 CL = 15 pF 15 Rise time tr (Note 1) IF = 14 0 mA, RIN = 100 , CL = 15 pF 15 20 25 20 25 Propagation delay skew (device to device) Common-mode transient immunity at output high CMH Common-mode transient immunity at output low CML Test Condition Fig. VCM = 1000 Vp-p, IF = 0 mA, 12.1.6 VO(min) = 2 V, VCC = 3.3 V, Ta = 25 VCM = 1000 Vp-p, IF = 14 mA, VO(max) = 0.4 V, VCC = 3.3 V, Ta = 25 kV/s Note: All typical values are at Ta = 25 . Note 1: f = 5 MHz, duty = 50 %, input current tr = tf = 5 ns, CL is approximately 15 pF which includes probe and stray wiring capacitance. Note 2: The propagation delay skew, tpsk, is equal to the magnitude of the worst-case difference in tpHL and/or tpLH that will be seen between units at the same given conditions (supply voltage, input current, temperature, etc). (c)2016 Toshiba Corporation 5 2016-01-14 Rev.4.0 TLP2766F 11.2. Switching Characteristics (2) (Unless otherwise specified, Ta = -40 to 125 , VCC = 4.5 to 5.5 V) Characteristics Symbol Note Propagation delay time (H/L) tpHL (Note 1) Propagation delay time (L/H) tpLH Pulse width distortion Test Circuit Min Typ. Max Unit Fig. IF = 0 14 mA, RIN = 100 , 12.1.5 CL = 15 pF 30 45 ns (Note 1) IF = 14 0 mA, RIN = 100 , CL = 15 pF 24 45 |tpHLtpLH| (Note 1) IF = 14 mA, RIN = 100 , CL = 15 pF 6 25 Propagation delay skew (device to device) tpsk (Note 1), (Note 2) -30 30 Propagation delay time (H/L) tpHL (Note 1) IF = 0 6 mA, RIN = 100 , CL = 15 pF 38 55 Propagation delay time (L/H) tpLH (Note 1) IF = 6 0 mA, RIN = 100 , CL = 15 pF 28 55 Pulse width distortion |tpHLtpLH| (Note 1) IF = 6 mA, RIN = 100 , CL = 15 pF 10 30 tpsk (Note 1), (Note 2) -30 30 Fall time tf (Note 1) Fig. IF = 0 14 mA, RIN = 100 , 12.1.5 CL = 15 pF 15 Rise time tr (Note 1) IF = 14 0 mA, RIN = 100 , CL = 15 pF 15 20 25 20 25 Propagation delay skew (device to device) Common-mode transient immunity at output high CMH Common-mode transient immunity at output low CML Fig. 12.1.5 Test Condition Fig. VCM = 1000 Vp-p, IF = 0 mA, 12.1.6 VO(min) = 4 V, VCC = 5 V, Ta = 25 VCM = 1000 Vp-p, IF = 14 mA, VO(max) = 0.4 V, VCC = 5 V, Ta = 25 kV/s Note: All typical values are at Ta = 25 . Note 1: f = 5 MHz, duty = 50 %, input current tr = tf = 5 ns, CL is approximately 15 pF which includes probe and stray wiring capacitance. Note 2: The propagation delay skew, tpsk, is equal to the magnitude of the worst-case difference in tpHL and/or tpLH that will be seen between units at the same given conditions (supply voltage, input current, temperature, etc). (c)2016 Toshiba Corporation 6 2016-01-14 Rev.4.0 TLP2766F 12. Test Circuits and Characteristics Curves 12.1. Test Circuits Fig. 12.1.1 VOL Test Circuit Fig. 12.1.2 VOH Test Circuit Fig. 12.1.3 ICCL Test Circuit Fig. 12.1.4 ICCH Test Circuit Fig. 12.1.5 Switching Time Test Circuit and Waveform Fig. 12.1.6 Common-Mode Transient Immunity Test Circuit and Waveform (c)2016 Toshiba Corporation 7 2016-01-14 Rev.4.0 TLP2766F 12.2. Characteristics Curves (Note) Fig. 12.2.1 IF - VF Fig. 12.2.2 IF - Ta Fig. 12.2.3 VOL - Ta Fig. 12.2.4 VOH - Ta Fig. 12.2.5 ICCH / ICCL - Ta Fig. 12.2.6 ICCH / ICCL - Ta (c)2016 Toshiba Corporation 8 2016-01-14 Rev.4.0 TLP2766F Fig. 12.2.7 IFHL - Ta Fig. 12.2.8 IFHL - Ta Fig. 12.2.9 tpLH / tpHL - Ta Fig. 12.2.10 |tpHL-tpLH| - Ta Fig. 12.2.11 tpLH / tpHL - Ta Fig. 12.2.12 |tpHL-tpLH| - Ta (c)2016 Toshiba Corporation 9 2016-01-14 Rev.4.0 TLP2766F Fig. 12.2.13 tpLH / tpHL - IF Fig. 12.2.14 |tpHL-tpLH| - IF Fig. 12.2.15 tpLH / tpHL - IF Fig. 12.2.16 |tpHL-tpLH| - IF Fig. 12.2.17 tpLH / tpHL - VCC Fig. 12.2.18 |tpHL-tpLH| - VCC NOTE: The above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted. (c)2016 Toshiba Corporation 10 2016-01-14 Rev.4.0 TLP2766F 13. Soldering and Storage 13.1. Precautions for Soldering The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective of whether a soldering iron or a reflow soldering method is used. * When using soldering reflow. The soldering temperature profile is based on the package surface temperature. (See the figure shown below, which is based on the package surface temperature.) Reflow soldering must be performed once or twice. The mounting should be completed with the interval from the first to the last mountings being 2 weeks. Fig. 13.1.1 An Example of a Temperature Profile When Sn-Pb Eutectic Solder Is Used * Fig. 13.1.2 An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used When using soldering flow (Applicable to both eutectic solder and Lead(Pb)-Free solder) Preheat the device at a temperature of 150 (package surface temperature) for 60 to 120 seconds. Mounting condition of 260 within 10 seconds is recommended. Flow soldering must be performed once. * When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder) Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not exceeding 350 Heating by soldering iron must be done only once per lead. 13.2. Precautions for General Storage * Avoid storage locations where devices may be exposed to moisture or direct sunlight. * Follow the precautions printed on the packing label of the device for transportation and storage. * Keep the storage location temperature and humidity within a range of 5 to 35 and 45 % to 75 %, respectively. * Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions. * Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads. * When restoring devices after removal from their packing, use anti-static containers. * Do not allow loads to be applied directly to devices while they are in storage. * If devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use. (c)2016 Toshiba Corporation 11 2016-01-14 Rev.4.0 TLP2766F 14. Land Pattern Dimensions for Reference Only Unit: mm 15. Marking (c)2016 Toshiba Corporation 12 2016-01-14 Rev.4.0 TLP2766F 16. EN60747-5-5 Option (D4) Specification * Part number: TLP2766F (Note 1) * The following part naming conventions are used for the devices that have been qualified according to option (D4) of EN60747. Example: TLP2766F(D4-TP, F) D4: EN60747 option TP: Tape type F: [[G]]/RoHS COMPATIBLE (Note 2) Note 1: Use TOSHIBA standard type number for safety standard application. e.g., TLP2766F(D4-TP,F) TLP2766F Note 2: Please contact your Toshiba sales representative for details on environmental information such as the product's RoHS compatibility. RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronics equipment. Fig. 16.1 EN60747 Isolation Characteristics (c)2016 Toshiba Corporation 13 2016-01-14 Rev.4.0 TLP2766F Fig. 16.2 Insulation Related Specifications (Note) Note: This photocoupler is suitable for safe electrical isolation only within the safety limit data. Maintenance of the safety data shall be ensured by means of protective circuits. Fig. 16.3 Marking Example (Note) Note: The above marking is applied to the photocouplers that have been qualified according to option (D4) of EN60747. (c)2016 Toshiba Corporation 14 2016-01-14 Rev.4.0 TLP2766F Fig. 16.4 Measurement Procedure (c)2016 Toshiba Corporation 15 2016-01-14 Rev.4.0 TLP2766F Package Dimensions Unit: mm Weight: 0.26 g (typ.) Package Name(s) TOSHIBA: 11-5J101S (c)2016 Toshiba Corporation 16 2016-01-14 Rev.4.0 TLP2766F RESTRICTIONS ON PRODUCT USE * Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. * Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. * PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales representative. * Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. * Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. * The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. * ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. * GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. * Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. * Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. (c)2016 Toshiba Corporation 17 2016-01-14 Rev.4.0