TLP2766F(TP,F) - TOSHIBA - Datasheet.Directory

TLP2766F

1

Photocouplers GaAℓAs Infrared LED & Photo IC

TLP2766F

1.

1. Applications

Applications

• Factory Networking

• High-Speed Digital Interfacing for Instrumentation and Control Devices

• Plasma Display Panels (PDPs)

2.

2. General

General

The Toshiba TLP2766F consists of a high-output GaAℓAs light-emitting diode coupled with a high-speed photo-

diode-transistor chip. The TLP2766 guarantees operation at up to 125  and on supplies from 2.7 V to 5.5 V. It

is offered in the SDIP6 package. The TLP2766 has an internal Faraday shield that provides a guaranteed common-

mode transient immunity of ±20 kV/µs.

3.

3. Features

Features

(1) Inverter logic type (Totem pole output)

(2) Package: SDIP6

(3) Operating temperature: -40 to 125 

(4) Supply voltage: 2.7 to 5.5 V

(5) Data transfer rate: 20 MBd (typ.) (NRZ)

(6) Threshold input current: 3.5 mA (max)

(7) Supply current: 3 mA (max)

(8) Common-mode transient immunity: ±20 kV/µs (min)

(9) Isolation voltage: 5000 Vrms (min)

(10) Safety standards

UL-approved: UL1577, File No.E67349

cUL-approved: CSA Component Acceptance Service No.5A File No.E67349

VDE-approved: EN60747-5-5 (Note 1)

(Note 1)

Note 1: When an EN60747-5-5 approved type is needed, please designate the Option (D4)

Option (D4)

Option (D4).

4.

4. Packaging and Pin Configuration

Packaging and Pin Configuration

11-5J101S

1: Anode

2: N.C.

3: Cathode

4: GND

5: VO (Output)

6: VCC

2016-01-14

Rev.4.0

TLP2766F

2

5.

5. Internal Circuit (Note)

Internal Circuit (Note)

Note: A 0.1µF bypass capacitor must be connected between pin 6 and pin 4.

6.

6. Principle of Operation

Principle of Operation

6.1.

6.1. Truth Table

Truth Table

Input

H

L

LED

ON

OFF

M1

OFF

ON

M2

ON

OFF

Output

L

H

6.2.

6.2. Mechanical Parameters

Mechanical Parameters

Characteristics

Creepage distances

Clearance distances

Internal isolation thickness

10.16-mm Pitch

TLP2766F

8.0 (min)

0.4 (min)

Unit

mm

2016-01-14

Rev.4.0

TLP2766F

3

7.

7. Absolute Maximum Ratings (Note) (Unless otherwise specified, T

Absolute Maximum Ratings (Note) (Unless otherwise specified, T

Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta

a

a = 25

= 25

= 25 



)

)

LED

Detector

Common

Characteristics

Input forward current

Input forward current derating

Input forward current (pulsed)

Input forward current derating

(pulsed)

Input power dissipation

derating

Input reverse voltage

Output current

Output voltage

Supply voltage

Output power dissipation

derating

Operating temperature

Storage temperature

Lead soldering temperature

Isolation voltage

(Ta ≥ 110 )

(10 s)

AC, 60 s, R.H. ≤ 60 %

Symbol

IF

∆IF/∆Ta

IFP

∆IFP/∆Ta

PD

∆PD/∆Ta

VR

IO

VO

VCC

PO

∆PO/∆Ta

Topr

Tstg

Tsol

BVS

Note

(Note 1)

(Note 2)

Rating

25

-0.67

40

-1.0

40

-1.0

5

10

6

60

-1.5

-40 to 125

-55 to 150

260

5000

Unit

mA

mA/

mA

mA/

mW

mW/

V

mA

V

mW

mW/



Vrms

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Note 1: Pulse width (PW) ≤ 1 ms, duty = 50 %

Note 2: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6

are shorted together.

8.

8. Recommended Operating Conditions (Note)

Recommended Operating Conditions (Note)

Characteristics

Input on-state current

Input off-state voltage

Supply voltage

Operating temperature

Symbol

IF(ON)

VF(OFF)

VCC

Topr

Note

(Note 1)

(Note 2)

Min

4.5

0

2.7

-40

Typ.



3.3/5.0



Max

15

0.8

5.5

125

Unit

mA

V



Note: The recommended operating conditions are given as a design guide necessary to obtain the intended

performance of the device. Each parameter is an independent value. When creating a system design using

this device, the electrical characteristics specified in this datasheet should also be considered.

Note: A ceramic capacitor (0.1 µF) should be connected between pin 6 and pin 4 to stabilize the operation of a high-

gain linear amplifier. Otherwise, this photocoupler may not switch properly. The bypass capacitor should be

placed within 1 cm of each pin.

Note 1: The rise and fall times of the input on-current should be less than 0.5 µs.

Note 2: Denotes the operating range, not the recommended operating condition.

2016-01-14

Rev.4.0

TLP2766F

4

9.

9. Electrical Characteristics (Note)

Electrical Characteristics (Note)

(Unless otherwise specified, T

(Unless otherwise specified, Ta

a

a = -40 to 125

= -40 to 125

= -40 to 125 



, V

, V

, VCC

CC

CC = 2.7 to 5.5 V)

= 2.7 to 5.5 V)

Characteristics

Input forward voltage

Input forward voltage temperature

coefficient

Input reverse current

Input capacitance

Low-level output voltage

High-level output voltage

Low-level supply current

High-level supply current

Threshold input current (H/L)

Symbol

VF

∆VF/∆Ta

IR

Ct

VOL

VOH

ICCL

ICCH

IFHL

Test

Circuit



Fig.

12.1.1

Fig.

12.1.2

Fig.

12.1.3

Fig.

12.1.4



Test Condition

IF = 10 mA, Ta = 25 

IF = 10 mA

VR = 5 V, Ta = 25 

V = 0 V, f = 1 MHz, Ta = 25 

IF = 14 mA, IO = 4 mA

VF = 1.05 V, IO = -4 mA,

VCC = 3.3 V

VF = 1.05 V, IO = -4 mA,

VCC = 5 V

IF = 14 mA

IF = 0 mA

IO = 1.6 mA, VO < 0.4 V

Min

1.45



2.3

4



Typ.

1.55

-2.0



60



1.6

1.5

0.9

Max

1.7



10



0.4



3

3.5

Unit

V

mV/

µA

pF

V

mA

Note: All typical values are at Ta = 25 .

10.

10. Isolation Characteristics (Unless otherwise specified, T

Isolation Characteristics (Unless otherwise specified, T

Isolation Characteristics (Unless otherwise specified, Ta

a

a = 25

= 25

= 25 



)

)

Characteristics

Total capacitance (input to output)

Isolation resistance

Isolation voltage

Symbol

CS

RS

BVS

Note

(Note 1)

Test Conditions

VS = 0 V, f = 1 MHz

VS = 500 V, R.H. ≤ 60 %

AC, 60 s

AC, 1 s in oil

DC, 60 s in oil

Min



1

× 1012

5000



Typ.

0.8

1014



10000

Max



Unit

pF

Ω

Vrms

Vdc

Note 1: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6

are shorted together.

2016-01-14

Rev.4.0

TLP2766F

5

11.

11. Switching Characteristics (Note)

Switching Characteristics (Note)

11.1.

11.1. Switching Characteristics (1)

Switching Characteristics (1)

(Unless otherwise specified, T

(Unless otherwise specified, Ta

a

a = -40 to 125

= -40 to 125

= -40 to 125 



, V

, V

, VCC

CC

CC = 2.7 to 3.6 V)

= 2.7 to 3.6 V)

Characteristics

Propagation delay time (H/L)

Propagation delay time (L/H)

Pulse width distortion

Propagation delay skew

(device to device)

Propagation delay time (H/L)

Propagation delay time (L/H)

Pulse width distortion

Propagation delay skew

(device to device)

Fall time

Rise time

Common-mode transient

immunity at output high

Common-mode transient

immunity at output low

Symbol

tpHL

tpLH

|tpHL-

tpLH|

tpsk

tpHL

tpLH

|tpHL-

tpLH|

tpsk

tf

tr

CMH

CML

Note

(Note 1)

(Note 1),

(Note 2)

(Note 1)

(Note 1),

(Note 2)

(Note 1)

Test

Circuit

Fig.

12.1.5

Fig.

12.1.5

Fig.

12.1.5

Fig.

12.1.6

Test Condition

IF = 0 → 14 mA, RIN = 100 Ω,

CL = 15 pF

IF = 14 → 0 mA, RIN = 100 Ω,

CL = 15 pF

IF = 14 mA, RIN = 100 Ω,

CL = 15 pF

IF = 0 → 6 mA, RIN = 100 Ω,

CL = 15 pF

IF = 6 → 0 mA, RIN = 100 Ω,

CL = 15 pF

IF = 6 mA, RIN = 100 Ω,

CL = 15 pF

IF = 0 → 14 mA, RIN = 100 Ω,

CL = 15 pF

IF = 14 → 0 mA, RIN = 100 Ω,

CL = 15 pF

VCM = 1000 Vp-p, IF = 0 mA,

VO(min) = 2 V, VCC = 3.3 V,

Ta = 25 

VCM = 1000 Vp-p, IF = 14 mA,

VO(max) = 0.4 V, VCC = 3.3 V,

Ta = 25 

Min



-30



-30



±20

Typ.

28

25

3



34

25

9



15

±25

Max

40

25

30

55

30



Unit

ns

kV/µs

Note: All typical values are at Ta = 25 .

Note 1: f = 5 MHz, duty = 50 %, input current tr = tf = 5 ns, CL is approximately 15 pF which includes probe and stray

wiring capacitance.

Note 2: The propagation delay skew, tpsk, is equal to the magnitude of the worst-case difference in tpHL and/or tpLH

that will be seen between units at the same given conditions (supply voltage, input current, temperature, etc).

2016-01-14

Rev.4.0

TLP2766F

6

11.2.

11.2. Switching Characteristics (2)

Switching Characteristics (2)

(Unless otherwise specified, T

(Unless otherwise specified, Ta

a

a = -40 to 125

= -40 to 125

= -40 to 125 



, V

, V

, VCC

CC

CC = 4.5 to 5.5 V)

= 4.5 to 5.5 V)

Characteristics

Propagation delay time (H/L)

Propagation delay time (L/H)

Pulse width distortion

Propagation delay skew

(device to device)

Propagation delay time (H/L)

Propagation delay time (L/H)

Pulse width distortion

Propagation delay skew

(device to device)

Fall time

Rise time

Common-mode transient

immunity at output high

Common-mode transient

immunity at output low

Symbol

tpHL

tpLH

|tpHL-

tpLH|

tpsk

tpHL

tpLH

|tpHL-

tpLH|

tpsk

tf

tr

CMH

CML

Note

(Note 1)

(Note 1),

(Note 2)

(Note 1)

(Note 1),

(Note 2)

(Note 1)

Test

Circuit

Fig.

12.1.5

Fig.

12.1.5

Fig.

12.1.5

Fig.

12.1.6

Test Condition

IF = 0 → 14 mA, RIN = 100 Ω,

CL = 15 pF

IF = 14 → 0 mA, RIN = 100 Ω,

CL = 15 pF

IF = 14 mA, RIN = 100 Ω,

CL = 15 pF

IF = 0 → 6 mA, RIN = 100 Ω,

CL = 15 pF

IF = 6 → 0 mA, RIN = 100 Ω,

CL = 15 pF

IF = 6 mA, RIN = 100 Ω,

CL = 15 pF

IF = 0 → 14 mA, RIN = 100 Ω,

CL = 15 pF

IF = 14 → 0 mA, RIN = 100 Ω,

CL = 15 pF

VCM = 1000 Vp-p, IF = 0 mA,

VO(min) = 4 V, VCC = 5 V,

Ta = 25 

VCM = 1000 Vp-p, IF = 14 mA,

VO(max) = 0.4 V, VCC = 5 V,

Ta = 25 

Min



-30



-30



±20

Typ.

30

24

6



38

28

10



15

±25

Max

45

25

30

55

30



Unit

ns

kV/µs

Note: All typical values are at Ta = 25 .

Note 1: f = 5 MHz, duty = 50 %, input current tr = tf = 5 ns, CL is approximately 15 pF which includes probe and stray

wiring capacitance.

Note 2: The propagation delay skew, tpsk, is equal to the magnitude of the worst-case difference in tpHL and/or tpLH

that will be seen between units at the same given conditions (supply voltage, input current, temperature, etc).

2016-01-14

Rev.4.0

TLP2766F

7

12.

12. Test Circuits and Characteristics Curves

Test Circuits and Characteristics Curves

12.1.

12.1. Test Circuits

Test Circuits

Fig.

Fig. 12.1.1

12.1.1

12.1.1 V

V

VOL

OL

OL Test Circuit

Test Circuit

Test Circuit Fig.

Fig.

Fig. 12.1.2

12.1.2

12.1.2 V

V

VOH

OH

OH Test Circuit

Test Circuit

Fig.

Fig. 12.1.3

12.1.3

12.1.3 I

I

ICCL

CCL

CCL Test Circuit

Test Circuit

Test Circuit Fig.

Fig.

Fig. 12.1.4

12.1.4

12.1.4 I

I

ICCH

CCH

CCH Test Circuit

Test Circuit

Fig.

Fig. 12.1.5

12.1.5

12.1.5 Switching Time Test Circuit and Waveform

Switching Time Test Circuit and Waveform

Fig.

Fig. 12.1.6

12.1.6

12.1.6 Common-Mode Transient Immunity Test Circuit and Waveform

Common-Mode Transient Immunity Test Circuit and Waveform

2016-01-14

Rev.4.0

TLP2766F

8

12.2.

12.2. Characteristics Curves (Note)

Characteristics Curves (Note)

Fig.

Fig. 12.2.1

12.2.1

12.2.1 I

I

IF

F

F - V

- V

- VF

F

FFig.

Fig.

Fig. 12.2.2

12.2.2

12.2.2 I

I

IF

F

F - T

- T

- Ta

a

Fig.

Fig. 12.2.3

12.2.3

12.2.3 V

V

VOL

OL

OL - T

- T

- Ta

a

aFig.

Fig.

Fig. 12.2.4

12.2.4

12.2.4 V

V

VOH

OH

OH - T

- T

- Ta

a

Fig.

Fig. 12.2.5

12.2.5

12.2.5 I

I

ICCH

CCH

CCH / I

/ I

/ ICCL

CCL

CCL - T

- T

- Ta

a

aFig.

Fig.

Fig. 12.2.6

12.2.6

12.2.6 I

I

ICCH

CCH

CCH / I

/ I

/ ICCL

CCL

CCL - T

- T

- Ta

a

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Rev.4.0

TLP2766F

9

Fig.

Fig. 12.2.7

12.2.7

12.2.7 I

I

IFHL

FHL

FHL - T

- T

- Ta

a

aFig.

Fig.

Fig. 12.2.8

12.2.8

12.2.8 I

I

IFHL

FHL

FHL - T

- T

- Ta

a

Fig.

Fig. 12.2.9

12.2.9

12.2.9 t

t

tpLH

pLH

pLH / t

/ t

/ tpHL

pHL

pHL - T

- T

- Ta

a

aFig.

Fig.

Fig. 12.2.10

12.2.10

12.2.10 |t

|t

|tpHL

pHL

pHL-t

-t

-tpLH

pLH

pLH| - T

| - T

| - Ta

a

Fig.

Fig. 12.2.11

12.2.11

12.2.11 t

t

tpLH

pLH

pLH / t

/ t

/ tpHL

pHL

pHL - T

- T

- Ta

a

aFig.

Fig.

Fig. 12.2.12

12.2.12

12.2.12 |t

|t

|tpHL

pHL

pHL-t

-t

-tpLH

pLH

pLH| - T

| - T

| - Ta

a

2016-01-14

Rev.4.0

TLP2766F

10

Fig.

Fig. 12.2.13

12.2.13

12.2.13 t

t

tpLH

pLH

pLH / t

/ t

/ tpHL

pHL

pHL - I

- I

- IF

F

FFig.

Fig.

Fig. 12.2.14

12.2.14

12.2.14 |t

|t

|tpHL

pHL

pHL-t

-t

-tpLH

pLH

pLH| - I

| - I

| - IF

F

Fig.

Fig. 12.2.15

12.2.15

12.2.15 t

t

tpLH

pLH

pLH / t

/ t

/ tpHL

pHL

pHL - I

- I

- IF

F

FFig.

Fig.

Fig. 12.2.16

12.2.16

12.2.16 |t

|t

|tpHL

pHL

pHL-t

-t

-tpLH

pLH

pLH| - I

| - I

| - IF

F

Fig.

Fig. 12.2.17

12.2.17

12.2.17 t

t

tpLH

pLH

pLH / t

/ t

/ tpHL

pHL

pHL - V

- V

- VCC

CC

CC Fig.

Fig.

Fig. 12.2.18

12.2.18

12.2.18 |t

|t

|tpHL

pHL

pHL-t

-t

-tpLH

pLH

pLH| - V

| - V

| - VCC

CC

NOTE: The above characteristics curves are presented for reference only and not guaranteed by production test,

unless otherwise noted.

2016-01-14

Rev.4.0

TLP2766F

11

13.

13. Soldering and Storage

Soldering and Storage

13.1.

13.1. Precautions for Soldering

Precautions for Soldering

The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective

of whether a soldering iron or a reflow soldering method is used.

• When using soldering reflow.

The soldering temperature profile is based on the package surface temperature.

(See the figure shown below, which is based on the package surface temperature.)

Reflow soldering must be performed once or twice.

The mounting should be completed with the interval from the first to the last mountings being 2 weeks.

Fig.

Fig. 13.1.1

13.1.1

13.1.1 An Example of a Temperature

An Example of a Temperature

Profile When Sn-Pb Eutectic Solder Is Used

Fig.

Fig. 13.1.2

13.1.2

13.1.2 An Example of a Temperature

An Example of a Temperature

Profile When Lead(Pb)-Free Solder Is Used

• When using soldering flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)

Preheat the device at a temperature of 150  (package surface temperature) for 60 to 120 seconds.

Mounting condition of 260  within 10 seconds is recommended.

Flow soldering must be performed once.

• When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)

Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not

exceeding 350

Heating by soldering iron must be done only once per lead.

13.2.

13.2. Precautions for General Storage

Precautions for General Storage

• Avoid storage locations where devices may be exposed to moisture or direct sunlight.

• Follow the precautions printed on the packing label of the device for transportation and storage.

• Keep the storage location temperature and humidity within a range of 5  to 35  and 45 % to 75 %,

respectively.

• Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty

conditions.

• Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during

storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the

solderability of the leads.

• When restoring devices after removal from their packing, use anti-static containers.

• Do not allow loads to be applied directly to devices while they are in storage.

• If devices have been stored for more than two years under normal storage conditions, it is recommended

that you check the leads for ease of soldering prior to use.

2016-01-14

Rev.4.0

TLP2766F

12

14.

14. Land Pattern Dimensions for Reference Only

Land Pattern Dimensions for Reference Only

Unit: mm

15.

15. Marking

Marking

2016-01-14

Rev.4.0

TLP2766F

13

16.

16. EN60747-5-5 Option (D4) Specification

EN60747-5-5 Option (D4) Specification

• Part number: TLP2766F (Note 1)

(Note 1)

• The following part naming conventions are used for the devices that have been qualified according to

option (D4) of EN60747.

Example: TLP2766F(D4-TP, F)

D4: EN60747 option

TP: Tape type

F: [[G]]/RoHS COMPATIBLE (Note 2)

(Note 2)

Note 1: Use TOSHIBA standard type number for safety standard application.

e.g., TLP2766F(D4-TP,F) → TLP2766F

Note 2: Please contact your Toshiba sales representative for details on environmental information such as the product's

RoHS compatibility.

RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the

restriction of the use of certain hazardous substances in electrical and electronics equipment.

Fig.

Fig. 16.1

16.1

16.1 EN60747 Isolation Characteristics

EN60747 Isolation Characteristics

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Rev.4.0

TLP2766F

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Fig.

Fig. 16.2

16.2

16.2 Insulation Related Specifications (Note)

Insulation Related Specifications (Note)

Note: This photocoupler is suitable for safe electrical isolation

safe electrical isolation

safe electrical isolation only within the safety limit data.

Maintenance of the safety data shall be ensured by means of protective circuits.

Fig.

Fig. 16.3

16.3

16.3 Marking Example (Note)

Marking Example (Note)

Note: The above marking is applied to the photocouplers that have been qualified according to option (D4) of EN60747.

2016-01-14

Rev.4.0

TLP2766F

15

Fig.

Fig. 16.4

16.4

16.4 Measurement Procedure

Measurement Procedure

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Rev.4.0

TLP2766F

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Package Dimensions

Unit: mm

Weight: 0.26 g (typ.)

Package Name(s)

TOSHIBA: 11-5J101S

2016-01-14

Rev.4.0

TLP2766F

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RESTRICTIONS ON PRODUCT USE

• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information

in this document, and related hardware, software and systems (collectively "Product") without notice.

• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's

written permission, reproduction is permissible only if reproduction is without alteration/omission.

• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible

for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which

minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage

to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate

the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA

information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the

precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application

with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,

including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating

and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample

application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.

TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.

• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE

PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE

EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY

CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT

("UNINTENDED USE").

("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation,

equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles,

trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices,

elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR

IF YOU USE PRODUCT FOR

UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT.

UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales

representative.

• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.

• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any

applicable laws or regulations.

• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any

infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any

intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,

INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING

WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND

(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,

OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR

PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.

Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.

• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,

for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products

(mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and

regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration

Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all

applicable export laws and regulations.

• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.

Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,

including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING

TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING

AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.

2016-01-14

Rev.4.0