2017 Microchip Technology Inc. DS20005834A-page 1
MIC39100/1/2
Features
• Fixed and Adjustable Output Voltages to 1.24V
• 410 mV Typical Dropout at 1A Load
- Best Recommended for 3.0V to 2.5V Conver-
sion
- Best Recommended for 2.5V to 1.8V Conver-
sion
• 1A Minimum Guaranteed Output Current
• 1% Initial Accuracy
• Low Ground Current
• Current-Limiting and Thermal-Shutdown
Protection
• Reversed-Battery and Reversed-Leakage
Protection
• Fast Transient Response
• Low Profile SOT-223 Package
• Power SO-8 Package
Applications
• LDO Linear Regulator for PC Add-In Cards
• High-Efficiency Linear Power Supplies
• SMPS Post Regulator
• Multimedia and PC Processor Supplies
• Battery Chargers
• Low Voltage Microcontrollers and Digital Logic
General Description
The MIC39100, MIC39101, and MIC39102 are 1A low
dropout linear voltage regulators that provide low
voltage, high current output from an extremely small
package. The MIC39100/1/2 offers extremely low
dropout (typically 410 mV at 1A) and low ground
current (typically 11 mA at 1A).
The MIC39100 is a fixed output regulator offered in the
SOT-223 package. The MIC39101 and MIC39102 are
fixed and adjustable regulators, respectively, in a
thermally enhanced 8-lead SOIC package.
The MIC39100/1/2 is ideal for PC add-in cards that
need to convert from standard 5V to 3.3V, 3.3V to 2.5V,
or 2.5V to 1.8V. A guaranteed maximum dropout
voltage of 630 mV over all operating conditions allows
the MIC39100/1/2 to provide 2.5V from a supply as low
as 3.13V and 1.8V from a supply as low as 2.43V.
The MIC39100/1/2 is fully protected with overcurrent
limiting, thermal-shutdown, and reverse-battery
protection. Fixed voltages of 5.0V, 3.3V, 2.5V, and 1.8V
are available on MIC39100/1 with adjustable output
voltages to 1.24V on MIC39102.
Package Types
MIC39100-XX (FIXED)
SOT-223 (S)
(Top View)
123
IN GND OUT
GND
TAB
MIC39101-XX (FIXED)
SOIC-8 (M)
(Top View)
MIC39102 (ADJ.)
SOIC-8 (M)
(Top View)
1EN
IN
OUT
FLG
8 GND
GND
GND
GND
7
6
5
2
3
4
1EN
IN
OUT
ADJ
8 GND
GND
GND
GND
7
6
5
2
3
4
1A, Low Voltage, Low Dropout Regulator
with Reversed-Battery Protection
MIC39100/1/2
DS20005834A-page 2 2017 Microchip Technology Inc.
Typical Application Circuits
2.5V/1A R egulator
IN 2.5V
VIN
3.3V
10μF
TANTALUM
OUT
GND
MIC39100
2.5V/1A Regulator with Error Flag
IN
R1
100k
2.5V
ERROR FLAG
OUTPUT
V
IN
3.3V
10μF
TANTALUM
EN
OUT
FLG
GND
MIC39101
ENABLE
SHUTDOWN
1.5V/1A Adjustable Regulator
IN
R1
1.5V
R2
EN
OUT
ADJ
GND
MIC39102
ENABLE
SHUTDOWN
V
IN
2.5V
10μF
TANTALUM
2017 Microchip Technology Inc. DS20005834A-page 3
MIC39100/1/2
Functional Block Diagrams
18V
O. V. ILIMIT
1.240V
IN OUT
GND
MIC39100
REFERENCE
THERMAL
SHUTDOWN
MIC39100 Fixed Regulator
18V
1.240V1.180V
EN
IN
FLG
GND
OUT
MIC39101
O. V. ILIMIT
THERMAL
SHUTDOWN
REFERENCE
18V
1.240V
EN
IN
GND
OUT
ADJ
MIC39102
O. V. ILIMIT
THERMAL
SHUTDOWN
REFERENCE
MIC39101 Fixed Regulator
with Flag and Enable
MIC39102 Adjustable Regulator
MIC39100/1/2
DS20005834A-page 4 2017 Microchip Technology Inc.
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage (VIN).................................................................................................................................... –20V to +20V
Enable Voltage (VEN) ................................................................................................................................................+20V
ESD Rating ............................................................................................................................................................ Note 1
Maximum Power Dissipation (PD(MAX)) .................................................................................................................. Note 2
Operating Ratings ‡
Supply Voltage (VIN)................................................................................................................................. +2.25V to +16V
Enable Voltage (VEN) ................................................................................................................................................+16V
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
‡ Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 k in series
with 100 pF.
2: PD(MAX) = (TJ(MAX) – TA) ÷ JA, where JA depends upon the printed circuit layout (see Application Informa-
tion).
TABLE 1-1: ELECTRICAL CHARACTERISTICS
Electrical Characteristics: VIN = VOUT + 1V; VEN = 2.25V; TJ = +25°C, bold values indicate –40°C TJ +125°C,
unless noted. Note 1
Parameter Symbol Min. Typ. Max. Units Conditions
Output Voltage VOUT
–1 — 1
%
IOUT = 10 mA
–2 —210 mA IOUT 1A,
VOUT +1V VIN 8V
Line Regulation — — 0.06 0.5 % IOUT = 10 mA,
VOUT + 1V VIN 16V
Load Regulation — — 0.2 1 % VIN = VOUT + 1V,
10 mA IOUT 1A
Output Voltage Temperature
Coefficient
VOUT/
T— 40 100 ppm/°C Note 2
Dropout Voltage, Note 3 VDO
—140
200
mV
IOUT = 100 mA, VOUT = –1%
250
—275— I
OUT = 500 mA, VOUT = –1%
—300500 IOUT = 750 mA, VOUT = –1%
—410
550 IOUT = 1A, VOUT = –1%
630
Ground Current, Note 4 IGND
—400— µAI
OUT = 100 mA, VIN = VOUT + 1V
—4—
mA
IOUT = 500 mA, VIN = VOUT + 1V
—6.5— I
OUT = 750 mA, VIN = VOUT + 1V
—1120 IOUT = 1A, VIN = VOUT + 1V
Current Limit IOUT(LIM) —1.82.5 AV
OUT = 0V, VIN = VOUT + 1V
Enable Input
Enable Input Voltage VEN
——0.8 VLogic LOW (Off)
2.25 — — Logic HIGH (On)
2017 Microchip Technology Inc. DS20005834A-page 5
MIC39100/1/2
Enable Input Current IEN
11530
µA
VEN = 2.25V
——75
—— 2 VEN = 0.8V
—— 4
Flag Output
Output Leakage Voltage IFLG(LEAK) —0.01 1µA VOH = 16V
2
Output Low Voltage VFLG(DO) —210
300 mV VIN = 2.250V, IOL = 250 µA, Note 5
400
Low Threshold
VFLG
93 — —
%
% of VOUT
High Threshold — — 99.2 % of VOUT
Hysteresis — 1 — —
MIC39102 Only
Reference Voltage —
1.228 1.240 1.252
VIOUT = 10 mA
1.215 1.265
1.203 —1.277 Note 6
Adjust Pin Bias Current — — 40 80 nA —
120
Reference Voltage
Temperature Coefficient — — 20 — ppm/°C —
Adjust Pin Bias Current
Temperature Coefficient — — 0.1 — nA/°C —
Note 1: Specification for packaged product only.
2: Output voltage temperature coefficient is VOUT(WORST CASE) ÷ (TJ(MAX) – TJ(MIN)), where TJ(MAX) =
+125°C and TJ(MIN) = –40°C.
3: VDO = VIN – VOUT when VOUT decreases to 99% of its nominal output voltage with VIN = VOUT + 1V. For
output voltages below 2.25V, dropout voltage is the input-to-output voltage differential with the minimum
input voltage being 2.25V. Minimum input operating voltage is 2.25V.
4: IGND is the quiescent current (IIN = IGND + IOUT).
5: For a 2.5V device, VIN = 2.250V (device is in dropout).
6: VREF VOUT (VIN – 1V), 2.25V VIN 16V, 10 mA IL 1A, TJ = TMAX.
TABLE 1-1: ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VIN = VOUT + 1V; VEN = 2.25V; TJ = +25°C, bold values indicate –40°C TJ +125°C,
unless noted. Note 1
Parameter Symbol Min. Typ. Max. Units Conditions
MIC39100/1/2
DS20005834A-page 6 2017 Microchip Technology Inc.
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
Junction Operating Temperature
Range
TJ–40 — +125 °C —
Storage Temperature Range TS–65 — +150 °C —
Lead Temperature — — — +260 °C Soldering, 5s
Package Thermal Resistances
Thermal Resistance SOT-223 JC —15 —°C/W—
Thermal Resistance SOIC-8 JC —20 —°C/W—
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
2017 Microchip Technology Inc. DS20005834A-page 7
MIC39100/1/2
2.0 TYPICAL PERFORMANCE CURVES
FIGURE 2-1: Power Supply Rejection
Ratio.
FIGURE 2-2: Power Supply Rejection
Ratio.
FIGURE 2-3: Power Supply Rejection
Ratio.
FIGURE 2-4: Power Supply Rejection
Ratio.
FIGURE 2-5: Dropout Voltage vs. Output
Current.
FIGURE 2-6: Dropout Voltage vs.
Temperature.
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
PSRR (dB)
80
60
40
20
0
10 100 1K 10K 100K 1M
V
IN
= 5V
V
OUT
= 3.3V
I
OUT
= 1A
C
OUT
= 10μF
C
IN
= 0μF
FREQUENCY (Hz)
0
20
40
60
80
1E+1 1E+2 1E+3 1E+4 1E+5 1E+6
PSRR (dB)
FREQUENCY (Hz)
VIN = 5V
VOUT = 3.3V
IOUT = 1A
COUT = 47μF
CIN = 0μF
10 100 1K 10K 100K 1M
0
20
40
60
80
1E+1 1E+2 1E+3 1E+4 1E+5 1E+6
PSRR (dB)
FREQUENCY (Hz)
VIN = 3.3V
VOUT = 2.5V
IOUT = 1A
COUT = 10μF
CIN = 0μF
10 100 1K 10K 100K 1M
0
20
40
60
80
1E+1 1E+2 1E+3 1E+4 1E+5 1E+6
PSRR (dB)
FREQUENCY (Hz)
VIN = 3.3V
VOUT = 2.5V
IOUT = 1A
COUT = 47μF
CIN = 0μF
10 100 1K 10K 100K 1M
2.5V
200
300
400
500
1E+2 1E+3 1E+4 1E+5 1E+6
DROPOUT VOLTAGE (mV)
OUTPUT CURRENT (mA)
TA = 25°C
0 250 500 750 1000 1250
150
250
350
450
50
0
100
3.3V
1.8V
2.5V
450
500
550
600
DROPOUT VOLTAGE (mV)
TEMPERATURE (°C)
ILOAD = 1A
350
300
400
3.3V
1.8V
1E+2 1E+3 1E+4 1E+5
–40 –20 0 20 40 60 80 100 120
MIC39100/1/2
DS20005834A-page 8 2017 Microchip Technology Inc.
FIGURE 2-7: Dropout Characteristics
(2.5V).
FIGURE 2-8: Dropout Characteristics
(3.3V).
FIGURE 2-9: Ground Current vs. Output
Current.
FIGURE 2-10: Ground Current vs. Supply
Voltage (2.5V).
FIGURE 2-11: Ground Current vs. Supply
Voltage (2.5V).
FIGURE 2-12: Ground Current vs. Supply
Voltage (3.3V).
2.2
2.4
2.6
2.8
OUTPUT VOLTAGE (V)
SUPPLY VOLTAGE (V)
ILOAD = 100mA
1.8
1.6
2.0
1E+2 1E+3 1E+4
2 2.3 2.6 2.9 3.5
ILOAD = 750mA
ILOAD = 1A
3.2
1.4
OUTPUT VOLTAGE (V)
SUPPLY VOLTAGE (V)
ILOAD = 100mA
ILOAD = 750mA
ILOAD = 1A
3.2
3.4
3.6
2.8
2.6
3.0
1E+2 1E+3 1E+4
2.8 3.2 3.6 4.0 4.4
2.4
GROUND CURRENT (mA)
OUTPUT CURRENT (mA)
1.8V
3.3V
2.5V
8
10
12
4
2
6
0 200 400 600 800
0
1000
14
GROUND CURRENT (mA)
SUPPLY VOLTAGE (V)
ILOAD = 100mA
ILOAD = 10mA
0.8
1.0
1.2
0.4
0.2
0.6
02468
0
2.0
1.4
1.6
1.8
GROUND CURRENT (mA)
SUPPLY VOLTAGE (V)
ILOAD = 1A
10
15
5
02468
0
35
20
25
30
GROUND CURRENT (mA)
SUPPLY VOLTAGE (V)
ILOAD = 100mA
ILOAD = 10mA
0.8
1.0
1.2
0.4
0.2
0.6
02468
0
1.4
2017 Microchip Technology Inc. DS20005834A-page 9
MIC39100/1/2
FIGURE 2-13: Ground Current vs. Supply
Voltage (3.3V).
FIGURE 2-14: Ground Current vs.
Temperature.
FIGURE 2-15: Ground Current vs.
Temperature.
FIGURE 2-16: Ground Current vs.
Temperature.
FIGURE 2-17: Output Voltage vs.
Temperature.
FIGURE 2-18: Short-Circuit vs.
Temperature.
GROUND CURRENT (mA)
SUPPLY VOLTAGE (V)
I
LOAD
= 1A
40
50
20
10
30
02468
0
GROUND CURRENT (mA)
TEMPERATURE (°C)
ILOAD = 10mA
0.8
1.0
0.4
0.2
0.6
–40 –20 0 20 40
0
60 80 100 120
3.3V
2.5V
1.8V
GROUND CURRENT (mA)
TEMPERATURE (°C)
ILOAD = 500mA
4.5
5.0
3.5
3.0
4.0
–40 –20 0 20 40
2.5
60 80 100 120
3.3V
2.5V
1.8V
1.5
2.0
0.5
1.0
0
GROUND CURRENT (mA)
TEMPERATURE (°C)
I
LOAD
= 1A
15
20
10
–40 –20 0 20 40 60 80 100 120
3.3V
2.5V 1.8V
5
0
OUTPUT VOLTAGE (V)
TEMPERATURE (°C)
3.40
3.30
3.35
–40 –20 0 20 40 60 80 100 120
TYPICAL 3.3V DEVICE
3.25
3.20
SHORT-CIRCUIT CURRENT (A)
TEMPERATURE (°C)
2.5
2.0
–40 –20 0 20 40
1.5
60 80 100 120
3.3V
2.5V 1.8V
0.5
1.0
0
MIC39100/1/2
DS20005834A-page 10 2017 Microchip Technology Inc.
FIGURE 2-19: Error Flag Voltage vs.
Pull-Up Resistor Value.
FIGURE 2-20: Enable Current vs.
Temperature.
FIGURE 2-21: Flag-Low Voltage vs.
Temperature.
FIGURE 2-22: Load Transient Response.
FIGURE 2-23: Load Transient Response.
FIGURE 2-24: Line Transient Response.
FLAG VOLTAGE (V)
RESISTANCE ()
6
5
10 100 1K 10K 100K
4
1M 10M
VIN = 5V
FLAG HIGH (OK)
FLAG LOW (FAULT)
2
3
0
1
ENABLE CURRENT (μA)
VIN = VOUT + 1V
VEN = 2.4V
TEMPERATURE (°C)
12
8
10
–40 –20 0 20 40 60 80 100 120
6
4
140
2
0
FLAG VOLTAGE (mV)
V
IN
= 2.25V
R
PULL-UP
= 22k
TEMPERATURE (°C)
250
150
200
–40 –20 0 20 40 60 80 100 120
100
50
140
0
FLAG-LOW
VOLTAGE
VOUT = 2.5V
COUT = 10μF
OUTPUT
VOLTAGE
(200mV/div)
LOAD
CURRENT
(500mA/div)
TIME (250μs/div)
100mA
1A
VOUT = 2.5V
COUT = 47μF
OUTPUT
VOLTAGE
(200mV/div)
LOAD
CURRENT
(500mA/div)
TIME (500μs/div)
10mA
1A
VOUT = 2.5V
COUT = 10μF
OUTPUT
VOLTAGE
(50mV/div)
INPUT
VOLTAGE
(2V/div)
TIME (25μs/div)
2017 Microchip Technology Inc. DS20005834A-page 11
MIC39100/1/2
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
Pin Number
MIC39100 Pin Number
MIC39101 Pin Number
MIC39102 Pin Name Description
— 1 1 EN Enable (Input): CMOS-compatible control input.
Logic HIGH = enable; logic LOW or OPEN =
shutdown.
1 2 2 IN Supply (Input).
3 3 3 OUT Regulator Output.
— 4 — FLG Flag (Output): Open-collector error flag output.
Active LOW = output undervoltage.
— — 4 ADJ Adjustable Input: Feedback input. Connect to
resistive voltage-divider network.
2, TAB 5, 6, 7, 8 5, 6, 7, 8 GND Ground.
MIC39100/1/2
DS20005834A-page 12 2017 Microchip Technology Inc.
4.0 APPLICATION INFORMATION
The MIC39100/1/2 is a high performance, low dropout
voltage regulator suitable for moderate to high current
voltage regulator applications. Its 630 mV dropout
voltage at full load and over temperature makes it
especially valuable in battery-powered systems and as
high efficiency noise filters in post-regulator
applications. Unlike older NPN-pass transistor designs,
where the minimum dropout voltage is limited by the
base-to-emitter voltage drop and collector-to-emitter
saturation voltage, dropout performance of the PNP
output of these devices is limited only by the low VCE
saturation voltage.
A trade-off for the low dropout voltage is a varying base
drive requirement that reduces the drive requirement to
only 2% of the load current.
The MIC39100/1/2 regulator is fully protected from
damage due to fault conditions. Linear current limiting
is provided. Output current during overload conditions
is constant. Thermal shutdown disables the device
when the die temperature exceeds the maximum safe
operating temperature. Transient protection allows
device (and load) survival even when the input voltage
spikes above and below nominal. The output structure
of these regulators allows voltages in excess of the
desired output voltage to be applied without reverse
current flow.
FIGURE 4-1: Capacitor Requirements.
4.1 Output Capacitor
The MIC39100/1/2 requires an output capacitor to
maintain stability and improve transient response.
Proper capacitor selection is important to ensure
proper operation. The MIC39100/1/2 output capacitor
selection is dependent upon the equivalent series
resistance (ESR) of the output capacitor to maintain
stability. When the output capacitor is 10 µF or greater,
the output capacitor should have an ESR less than 2.
This will improve transient response as well as promote
stability. Ultra-low ESR capacitors (<100 m), such as
ceramic-chip capacitors, may promote instability.
These very low ESR levels may cause an oscillation
and/or underdamped transient response. A low-ESR
solid tantalum capacitor works extremely well and
provides good transient response and stability over
temperature. Aluminum electrolytics can also be used,
as long as the ESR of the capacitor is <2.
The value of the output capacitor can be increased
without limit. Higher capacitance values help to
improve transient response and ripple rejection and
reduce output noise.
4.2 Input Capacitor
An input capacitor of 1 µF or greater is recommended
when the device is more than four inches away from
the bulk ac supply capacitance or when the supply is a
battery. Small, surface mount, ceramic chip capacitors
can be used for bypassing. Larger values will help to
improve ripple rejection by bypassing the input to the
regulator, further improving the integrity of the output
voltage.
4.3 Error Flag
The MIC39101 features an error flag (FLG) that
monitors the output voltage and signals an error
condition when this voltage drops 5% below its
expected value. The error flag is an open-collector
output that pulls low under fault conditions and may
sink up to 10 mA. Low output voltage signifies a
number of possible problems, including an overcurrent
fault (the device is in current-limit) or low input voltage.
The flag output is inoperative during overtemperature
conditions. A pull-up resistor from FLG to either VIN or
VOUT is required for proper operation. For information
regarding the minimum and maximum values of pull-up
resistance, refer to Figure 2-19.
4.4 Enable Input
The MIC39101 and MIC39102 feature an active-HIGH
enable input (EN) that allows on/off control of the
regulator. Current drain reduces to zero when the
device is shutdown, with only microamperes (µA) of
leakage current. The EN input has
TTL/CMOS-comparable thresholds for simple logic
interfacing. EN can be directly tied to VIN and pulled-up
to the maximum supply voltage.
4.5 Transient Response and 3.3V to
2.5V or 2.5V to 1.8V Conversion
The MIC39100/1/2 has excellent transient response to
variations in input voltage and load current. The device
has been designed to respond quickly to load current
variations and input voltage variations. Large output
capacitors are not required to obtain this performance.
A standard 10 µF output capacitor, preferably tantalum,
is all that is required. Larger values help to improve
performance even further.
By virtue of its low dropout voltage, this device does not
saturate into dropout as readily as similar NPN-based
designs. When converting from 3.3V to 2.5V or 2.5V to
1.8V, the NPN-based regulators are already operating
in dropout, with typical dropout requirements of 1.2V or
V
IN
C
IN
MIC39100-x.x.
V
OUT
C
OUT
IN OUT
GND
2017 Microchip Technology Inc. DS20005834A-page 13
MIC39100/1/2
greater. To convert down to 2.5V or 1.8V without
operating in dropout, NPN-based regulators require an
input voltage of 3.7V at the very least.
The MIC39100 regulator will provide excellent
performance with an input as low as 3.0V or 2.5V
respectively. This gives the PNP-based regulators a
distinct advantage over older, NPN-based linear
regulators.
4.6 Minimum Load Current
The MIC39100/1/2 regulator is specified between finite
loads. If the output current is too small, leakage
currents dominate and the output voltage rises. A
10 mA minimum load current is necessary for proper
regulation.
4.7 Adjustable Regulator Design
The MIC39102 allows programming the output voltage
anywhere between 1.24V and the 16V maximum
operating rating of the family. Two resistors are used.
Resistors can be quite large, up to 1 M, because of
the very high input impedance and low bias current of
the sense comparator: The resistor values are
calculated by Equation 4-1:
EQUATION 4-1:
Applications with widely varying load currents may
scale the resistors to draw the minimum load current
required for proper operation (Figure 4-2).
FIGURE 4-2: Adjustable Regulator with
Resistors.
EQUATION 4-2:
4.8 Power SOIC-8 Thermal
Characteristics
One of the secrets of the MIC39101/2’s performance is
its power SO-8 package. Lower thermal resistance
means more output current or higher input voltage for a
given package size.
Lower thermal resistance is achieved by joining the
four ground leads with the die attach paddle to create a
single-piece electrical and thermal conductor. This
concept has been used by MOSFET manufacturers for
years, proving very reliable and cost effective for the
user.
Thermal resistance consists of two main elements, JC
(junction-to-case thermal resistance) and CA
(case-to-ambient thermal resistance, see Figure 4-3).
JC is the resistance from the die to the leads of the
package. CA is the resistance from the leads to the
ambient air and it includes CS (case-to-sink thermal
resistance) and SA (sink-to-ambient thermal
resistance).
FIGURE 4-3: Thermal Resistance.
Using the power SOIC-8 reduces the JC dramatically
and allows the user to reduce CA. The total thermal
resistance, JA, (junction-to-ambient thermal
resistance) is the limiting factor in calculating the
maximum power dissipation capability of the device.
Typically, the power SOIC-8 has a JC of 20°C/W,
which is significantly lower than the standard SOIC-8
(typically 75°C/W). CA is reduced due to the capability
of soldering Pins 5 through 8 directly to a ground plane.
R1R2VOUT
1.240
------------- 1–
=
Where:
VOUT Desired output voltage.
MIC39102
VIN
ENABLE
SHUTDOWN
VOUT
R1
R2
COUT
EN
GND
ADJ
OUTIN
VOUT 1.240V1R1
R2
-------+
=
GROUND PLANE
HEAT SINK AREA
AMBIENT
PRINTED CIRCUIT BOARD
TJA
TJC TCA
MIC39100/1/2
DS20005834A-page 14 2017 Microchip Technology Inc.
This significantly reduces the case-to-sink thermal
resistance as well as the sink-to-ambient thermal
resistance.
Low dropout linear regulators from Microchip are rated
to a maximum junction temperature of +125°C. It is
important not to exceed this maximum junction
temperature during operation of the device. To prevent
this maximum junction temperature from being
exceeded, the appropriate ground plane heat sink must
be used.
Figure 4-4 shows copper area versus power
dissipation with each trace corresponding to a different
temperature rise above ambient.
FIGURE 4-4: Copper Area vs. Power
SOIC Power Dissipation (∆TJA).
From these curves, the minimum area of copper
necessary for the part to operate safely can be
determined. The maximum allowable temperature rise
must be calculated to determine operation along which
curve.
For example, the maximum ambient temperature is
50°C, the T is determined as in Equation 4-3:
EQUATION 4-3:
Using Figure 4-4, the minimum amount of required
copper can be determined based on the required
power dissipation. Power dissipation in a linear
regulator is calculated as in Equation 4-4:
EQUATION 4-4:
Using a 2.5V output device and a 3.3V input at an
output current of 1A, the power dissipation is calculated
as in Equation 4-5:
EQUATION 4-5:
From Figure 4-4, the minimum amount of copper
required to operate this application at a T of 75°C is
160 mm2.
4.9 Quick Method
Determine the power dissipation requirements for the
design along with the maximum ambient temperature
at which the device will be operated. Refer to
Figure 4-5, which shows safe operating curves for
three different ambient temperatures: 25°C, 50°C, and
85°C. From these curves, the minimum amount of
copper can be determined by knowing the maximum
power dissipation required. If the maximum ambient
temperature is 50°C and the power dissipation is as
above, 836 mW, the curve in Figure 4-5 shows that the
required area of copper is 160 mm2.
The JA of this package is ideally 63°C/W, but it will
vary depending upon the availability of copper ground
plane to which it is attached.
POWER DISSIPATION (W)
0 0.25 0.50 0.75 1.00 1.25 1.50
COPPER AREA (mm2)
0
200
100
300
500
400
600
700
900
800
40°C
50°C
55°C
65°C
75°C
85°C
100°C
¨T
JA
=
T125C50C–75C==
Where:
TT
J(MAX) – TA(MAX)
TJ(MAX) +125°C
TA(MAX) Max. ambient operating temperature
PDVIN VOUT
–IOUT VIN
+IGND
=
PD3.3V2.5V–1A3.3V+11 mA
800 mW 36 mW+ 836 mW
=
==
2017 Microchip Technology Inc. DS20005834A-page 15
MIC39100/1/2
FIGURE 4-5: Copper Area vs. Power
SOIC Power Dissipation (TA).
50°C
25°C
TJ = 125°C
85°C
TA =
POWER DISSIPATION (W)
0 0.25 0.50 0.75 1.00 1.25 1.50
COPPER AREA (mm2)
200
100
300
500
400
600
700
900
800
0
MIC39100/1/2
DS20005834A-page 16 2017 Microchip Technology Inc.
5.0 PACKAGING INFORMATION
5.1 Package Marking Information
Example
X.XWNNNP
XXXXX
XXXXX
3-Pin SOT-223*
(MIC39100)
Example
8-Pin SOIC*
(MIC39101)
WNNN
2.58103P
39100
-X.XXX
39101
6987
-3.3Y
XXX
Example
8-Pin SOIC*
(MIC39102)
WNNN
XXXXXXX
MIC
3112
39102YM
Legend: XX...X Product code or customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
, , Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar () symbol may not be to scale.
3
e
3
e
2017 Microchip Technology Inc. DS20005834A-page 17
MIC39100/1/2
3-Lead SOT-223 Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
MIC39100/1/2
DS20005834A-page 18 2017 Microchip Technology Inc.
8-Lead SOIC Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2017 Microchip Technology Inc. DS20005834A-page 19
MIC39100/1/2
APPENDIX A: REVISION HISTORY
Revision A (August 2017)
• Converted Micrel document MIC39100/1/2 to
Microchip data sheet DS20005834A.
• Minor text changes throughout.
MIC39100/1/2
DS20005834A-page 20 2017 Microchip Technology Inc.
2017 Microchip Technology Inc. DS20005834A-page 21
MIC39100/1/2
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
a) MIC39100-1.8WS: 1A, Low Voltage, Low Dropout
Regulator, 1.8V,
–40°C to +125°C, 3-Lead
SOT-223, 78/Tube
b) MIC39100-3.3WS-TR: 1A, Low Voltage, Low Dropout
Regulator, 3.3V,
–40°C to +125°C, 3-Lead
SOT-223, 2,500/Reel
c) MIC39101-2.5YM: 1A, Low Voltage, Low Dropout
Regulator, 2.5V,
–40°C to +125°C, 8-Lead
SOIC, 95/Tube
d) MIC39101-5.0YM-TR: 1A, Low Voltage, Low Dropout
Regulator, 5.0V,
–40°C to +125°C, 8-Lead
SOIC, 2,500/Reel
e) MIC39102YM: 1A, Low Voltage, Low Dropout
Regulator, Adjustable Voltage,
–40°C to +125°C, 8-Lead
SOIC, 95/Tube
f) MIC39102YM-TR: 1A, Low Voltage, Low Dropout
Regulator, Adjustable Voltage,
–40°C to +125°C, 8-Lead
SOIC, 2,500/Reel
PART NO. XX
Package
Device
Device: MIC39100/1/2: 1A, Low Voltage, Low Dropout Regulator
Voltage: 1.8 = 1.8V
2.5 = 2.5V
3.3 = 3.3V
5.0 = 5.0V
<blank>= Adjustable (MIC39102 Only)
Temperature: Y = –40°C to +125°C
W = –40°C to +125°C (with high-melting solder
exemption)
Package: M = 8-Lead SOIC
S = 3-Lead SOT-223 (MIC39100 Only)
Media Type: <blank>= 78/Tube (MIC39100)
<blank>= 95/Tube (MIC39101/2)
TR = 2,500/Reel
–X.
X
Voltage
X
Temperature
Note 1: Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
–XX
Media Type
MIC39100/1/2
DS20005834A-page 22 2017 Microchip Technology Inc.
NOTES:
2017 Microchip Technology Inc. DS20005834A-page 23
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,
CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST
Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,
CodeGuard, CryptoAuthentication, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip Technology
Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2017, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-2098-9
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITYMANAGEMENTS
YSTEM
CERTIFIEDBYDNV
== ISO/TS16949==
DS20005834A-page 24 2017 Microchip Technology Inc.
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