IXD_614 14-Ampere Low-Side Ultrafast MOSFET Drivers INTEGRATED CIRCUITS DIVISION Features Description * 14A Peak Source/Sink Drive Current * Wide Operating Voltage Range: 4.5V to 35V * -40C to +125C Extended Operating Temperature Range * Logic Input Withstands Negative Swing of up to 5V * Low Propagation Delay Time * Low, 10A Supply Current * Low Output Impedance The IXDD614 / IXDI614 / IXDN614 high-speed gate drivers are especially well suited for driving the latest IXYS MOSFETs and IGBTs. Each output can source and sink 14A of peak current while producing voltage rise and fall times of less than 30ns. Internal circuitry eliminates cross-conduction and current "shoot-through," making the driver virtually immune to latch up. Low propagation delay with fast rise and fall times make the IXD_614 family ideal for high-frequency and high-power applications. Applications * * * * * * Efficient Power MOSFET and IGBT Switching Switch Mode Power Supplies Motor Controls DC to DC Converters Class-D Switching Amplifiers Pulse Transformer Driver The IXDD614 is configured as a non-inverting driver with an enable. The IXDN614 is configured as a non-inverting driver, and the IXDI614 is configured as an inverting driver. The IXD_614 family is available in an 8-pin DIP (PI), an 8-pin Power SOIC with an exposed metal back (SI), a 5-pin TO-220 (CI), and a 5-pin TO-263 (YI) package. Ordering Information Part Number IXDD614PI IXDD614SI IXDD614SITR IXDD614CI IXDD614YI IXDI614PI IXDI614SI IXDI614SITR IXDI614CI IXDI614YI IXDN614PI IXDN614SI IXDN614SITR IXDN614CI IXDN614YI DS-IXD_614-R08 Logic Configuration IN OUT EN IN OUT IN OUT Package Type Packing Method Quantity 8-Pin DIP 8-Pin Power SOIC with Exposed Metal Back 8-Pin Power SOIC with Exposed Metal Back 5-Pin TO-220 5-Pin TO-263 8-Pin DIP 8-Pin Power SOIC with Exposed Metal Back 8-Pin Power SOIC with Exposed Metal Back 5-Pin TO-220 5-Pin TO-263 8-Pin DIP 8-Pin Power SOIC with Exposed Metal Back 8-Pin Power SOIC with Exposed Metal Back 5-Pin TO-220 5-Pin TO-263 Tube Tube Tape & Reel Tube Tube Tube Tube Tape & Reel Tube Tube Tube Tube Tape & Reel Tube Tube 50 100 2000 50 50 50 100 2000 50 50 50 100 2000 50 50 www.ixysic.com 1 IXD_614 INTEGRATED CIRCUITS DIVISION 1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 Electrical Characteristics: TA = 25C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.6 Electrical Characteristics: TA = - 40C to +125C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 3 3 3 4 5 6 2. Performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.2 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3. Block Diagrams & Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1 IXDD614 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2 IXDI614 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3 IXDN614 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 7 7 7 4. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.3 Soldering Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5.1 SI (8-Pin Power SOIC with Exposed Metal Back). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5.2 SI Package Tape & Reel Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5.3 YI (5-Pin TO-263) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5.4 CI (5-Pin TO-220) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5.5 PI (8-Pin DIP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 www.ixysic.com 11 11 11 11 11 12 12 12 13 13 14 R08 IXD_614 INTEGRATED CIRCUITS DIVISION 1 Specifications 1.1 Pin Configurations 1.2 Pin Definitions IXDD614 PI / SI IXDD614 CI / YI Pin Name VCC 1 8 VCC IN 2 7 OUT EN 3 6 OUT 4 5 GND GND VCC 1 OUT 2 GND 3 IN 4 EN 5 IXDI614 PI / SI Description IN Logic Input EN Output Enable - Drive pin low to disable output, and force output to a high impedance state OUT Output - Sources or sinks current to turn-on or turn-off a discrete MOSFET or IGBT OUT Inverted Output - Sources or sinks current to turn-on or turn-off a discrete MOSFET or IGBT VCC Supply Voltage - Provides power to the device GND Ground - Common ground reference for the device IXDI614 CI / YI VCC 1 8 VCC IN 2 7 OUT NC 3 6 OUT GND 4 5 GND VCC 1 OUT 2 GND 3 IN 4 NC 5 NC IXDN614 PI / SI IXDN614 CI / YI VCC 1 8 VCC IN 2 7 OUT NC GND Not connected 3 6 OUT 4 5 GND VCC 1 OUT 2 GND 3 IN 4 NC 5 Note: IXYS Integrated Circuits Division recommends that the exposed metal pad on the back of the "SI" package be connected to GND. The pad is not suitable for carrying current. 1.3 Absolute Maximum Ratings Parameter Symbol Minimum Maximum Units VCC -0.3 40 V VIN , VEN -5 VCC+0.3 V IOUT - 14 A Junction Temperature TJ -55 +150 C Storage Temperature TSTG -65 +150 C Supply Voltage Input Voltage Output Current Unless stated otherwise, absolute maximum electrical ratings are at 25C Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. 1.4 Recommended Operating Conditions Parameter Symbol Range Units VCC 4.5 to 35 V Operating Temperature Range TA -40 to +125 C R08 www.ixysic.com Supply Voltage 3 IXD_614 INTEGRATED CIRCUITS DIVISION 1.5 Electrical Characteristics: TA = 25C Test Conditions: 4.5V < VCC < 35V (unless otherwise noted). Parameter Conditions Symbol Minimum Typical Maximum Input Voltage, High 4.5V < VCC < 18V VIH 3.0 - - Input Voltage, Low 4.5V < VCC < 18V VIL - - 0.8 Input Current 0V < VIN < VCC IIN - - 10 EN Input Voltage, High IXDD614 only VENH 2/3VCC - - EN Input Voltage, Low IXDD614 only VENL - - 1/3VCC Output Voltage, High - VOH VCC-0.025 - - Output Voltage, Low - VOL - - 0.025 Output Resistance, High State VCC=18V, IOUT=-100mA ROH - 0.4 0.8 Output Resistance, Low State VCC=18V, IOUT=100mA ROL - 0.3 0.6 IDC - - 4 tR Units V A V V Rise Time Limited by package power dissipation CLOAD=15nF, VCC=18V - 25 35 Fall Time CLOAD=15nF, VCC=18V tF - 18 25 On-Time Propagation Delay CLOAD=15nF, VCC=18V tONDELAY - 50 70 Off-Time Propagation Delay CLOAD=15nF, VCC=18V tOFFDELAY - 50 70 Enable to Output-High Delay Time IXDD614 only tENOH - 31 60 Disable to High Impedance State Delay Time IXDD614 only tDOLD - 44 70 Enable Pull-Up Resistor IXDD614 only REN - 200 - k - 1 2 mA - <1 10 - <1 10 Output Current, Continuous VCC=18V, VIN=3.5V Power Supply Current VCC=18V, VIN=0V VCC=18V, VIN=VCC 4 www.ixysic.com ICC A ns A R08 IXD_614 INTEGRATED CIRCUITS DIVISION 1.6 Electrical Characteristics: TA = - 40C to +125C Test Conditions: 4.5V < VCC < 35V. Parameter Conditions Symbol Minimum Maximum Input Voltage, High 4.5V < VCC < 18V VIH 3.3 - Input Voltage, Low 4.5V < VCC < 18V VIL - 0.65 0V < VIN < VCC IIN - 10 Output Voltage, High - VOH VCC-0.025 - Output Voltage, Low - VOL - 0.025 Output Resistance, High State VCC=18V, IOUT=-100mA ROH - 1.5 Output Resistance, Low State VCC=18V, IOUT=100mA ROL - 1.2 IDC - 1 tR - 50 Input Current Rise Time Limited by package power dissipation CLOAD=15nF, VCC=18V Fall Time CLOAD=15nF, VCC=18V tF - 40 On-Time Propagation Delay CLOAD=15nF, VCC=18V tONDELAY - 90 Off-Time Propagation Delay CLOAD=15nF, VCC=18V tOFFDELAY - 90 IXDD614 only tENOH - 75 IXDD614 only tDOLD - 85 - 3 - 150 - 150 Output Current, Continuous Enable to Output-High Delay Time Disable to High Impedance State Delay Time VCC=18V, VIN=3.5V Power Supply Current VCC=18V, VIN=0V VCC=18V, VIN=VCC R08 www.ixysic.com ICC Units V A V A ns mA A 5 IXD_614 INTEGRATED CIRCUITS DIVISION 1.7 Thermal Characteristics Package Parameter Symbol Rating CI (5-Pin TO-220) Units 36 PI (8-Pin DIP) JA Thermal Impedance, Junction-to-Ambient SI (8-Pin Power SOIC) 125 85 YI (5-Pin TO-263) C/W 46 CI (5-Pin TO-220) 3 JC Thermal Impedance, Junction-to-Case SI (8-Pin Power SOIC) 10 YI (5-Pin TO-263) C/W 2 2 Performance 2.1 Timing Diagrams VIH IN VIH IN VIL tONDELAY VIL tOFFDELAY tOFFDELAY tONDELAY 90% OUT OUT 10% 90% 10% tF tR tF tR 2.2 Characteristics Test Diagram + 0.1F 10F IN VCC - OUT VCC EN VIN 6 VCC GND CLOAD www.ixysic.com Tektronix Current Probe 6302 R08 IXD_614 INTEGRATED CIRCUITS DIVISION 3 Block Diagrams & Truth Tables 3.1 IXDD614 3.3 IXDN614 VCC VCC IN OUT OUT IN GND EN GND IN EN OUT IN OUT 0 1 or open 0 0 0 1 1 or open 1 1 1 x 0 Z 3.2 IXDI614 VCC OUT IN GND R08 IN OUT 0 1 1 0 www.ixysic.com 7 IXD_614 INTEGRATED CIRCUITS DIVISION 4 Typical Performance Characteristics Rise Time vs. Supply Voltage (VIN=0-5V, f=10kHz, TA=25C) 60 50 CL=15nF CL=7.5nF CL=3.6nF 60 50 Fall Time (ns) 40 30 CL=15nF CL=7.5nF CL=3.6nF 40 30 20 20 10 10 0 0 0 5 10 15 20 25 30 Supply Voltage (V) 35 40 0 5 10 15 20 25 30 Supply Voltage (V) Rise Time vs. Load Capacitance 50 35 30 25 40 20 35 30 25 15 10 10 6 8 10 12 Load Capacitance (nF) 160 Propagation Delay (ns) Propagation Delay (ns) 4 Propagation Delay vs. Supply Voltage (VIN=0-5V, f=1kHz, CL=15nF) tOFFDLY 150 tONDLY 100 tF -40 -20 40 0 20 40 60 80 Temperature (C) 100 120 140 5 2 200 tR 20 15 5 250 15 14 13 12 11 10 9 8 7 6 5 VCC=4.5V VCC=8V VCC=12V VCC=18V VCC=25V VCC=30V VCC=35V 45 Fall Time (ns) Rise Time (ns) 40 Rise & Fall Time vs. Temperature (VIN=0-5V, f=10kHz, CL=3.6nF, VCC=18V) Fall Time vs. Load Capacitance 50 VCC=4.5V VCC=8V VCC=12V VCC=18V VCC=25V VCC=30V VCC=35V 45 35 50 14 16 2 4 6 8 10 12 Load Capacitance (nF) Propagation Delay vs. Input Voltage (VIN=0-5V, f=1kHz, CL=15nF, VCC=12V) 140 120 100 80 tOFFDLY 60 14 16 Propogation Delay vs. Junction Temperature (VIN=0-5V, f=1kHz, CL=15nF, VCC=18V) 70 Propagation Delay (ns) Rise Time (ns) 70 Time (ns) 80 Fall Time vs. Supply Voltage (VIN=0V-5V, f=10kHz, TA=25C) tOFFDLY 65 60 tONDLY 55 50 45 tONDLY 0 40 10 Input Threshold (V) 35 40 3.0 Min VIH 2.5 Max VIL 2.0 1.5 -40 -20 40 2 Input Threshold vs. Temperature (CL=3.6nF, VCC=18V) 3.5 8 15 20 25 30 Supply Voltage (V) 4 6 8 10 Input Voltage (V) 12 14 20 40 60 80 Temperature (C) 100 120 140 0 20 40 60 80 Temperature (C) 100 120 140 Enable Threshold vs. Supply Voltage Input Threshold vs. Supply Voltage 25 3.5 3.0 Min VIH 2.5 Max VIL 2.0 20 Min VENH 15 Max VENL 10 5 0 1.5 0 -40 -20 Enable Threshold (V) 5 Input Threshold (V) 0 0 5 10 15 20 25 30 Supply Voltage (V) www.ixysic.com 35 40 0 5 10 15 20 25 30 Supply Voltage (V) 35 40 R08 IXD_614 INTEGRATED CIRCUITS DIVISION f=1MHz f=500kHz 100 f=100kHz f=50kHz 10 f=10kHz 1000 Supply Current vs. Load Capacitance (VCC=18V) f=2MHz f=1MHz f=500kHz 100 f=100kHz f=50kHz 10 f=10kHz 1 f=1kHz 1000 Supply Current (mA) Supply Current (mA) f=2MHz Supply Current (mA) 1000 Supply Current vs. Load Capacitance (VCC=35V) Supply Current vs. Load Capacitance (VCC=12V) 100 f=2MHz f=1MHz f=500kHz 10 f=100kHz f=50kHz f=10kHz 1 f=1kHz f=1kHz 6 8 10 12 14 Load Capacitance (nF) 16 18 Supply Current vs. Load Capacitance (VCC=8V) 100 f=2MHz f=1MHz f=500kHz 10 f=100kHz f=50kHz 1 f=10kHz f=1kHz 0.1 2 2 18 10 1 16 10 1 0.1 10 100 1000 Frequency (kHz) 10 100 1000 Frequency (kHz) 1 1 0.1 1.0 0.8 0.6 0.4 0.2 0.0 -40 -20 100 1000 Frequency (kHz) 10000 20 40 60 80 Temperature (C) 100 120 140 10000 3.5V 5V 10V 0V & 18V 1.0 0.5 0.0 -0.5 -40 -20 -25 -20 -15 -10 -5 0 20 40 60 80 Temperature (C) 100 120 140 Output Sink Current vs. Supply Voltage (CL=330nF) 45 -30 40 35 30 25 20 15 10 5 0 0 0 100 1000 Frequency (kHz) 1.5 Output Source Current vs. Supply Voltage (CL=330nF) -35 Output Source Current (A) 1.2 10 10 2.0 10 1 Dynamic Supply Current vs. Temperature (VIN=0-5V, f=1kHz, CL=5.4nF, VCC=18V) 1 Quiescent Supply Current vs. Temperature CL=15nF CL=7.5nF CL=3.6nF 100 10000 18 10 10000 0.01 1 16 CL=15nF CL=7.5nF CL=3.6nF 100 Supply Current vs. Frequency (VCC=8V) 1000 CL=15nF C =7.5nF 100 CL=3.6nF L 6 8 10 12 14 Load Capacitance (nF) 0.1 1 18 4 Supply Current vs. Frequency (VCC=18V) 1000 CL=15nF CL=7.5nF 100 C =3.6nF L Supply Current (mA) 6 8 10 12 14 Load Capacitance (nF) Supply Current (mA) Supply Current (mA) 4 Supply Current vs. Frequency (VCC=12V) 1000 Supply Current (mA) 16 0.1 2 R08 6 8 10 12 14 Load Capacitance (nF) Supply Current vs. Frequency (VCC=35V) 1000 0.01 1.4 4 Output Sink Current (A) Supply Current (mA) 4 Supply Current (mA) 2 1000 0.1 0.1 Supply Current (mA) 1 0 5 10 15 20 25 30 Supply Voltage (V) www.ixysic.com 35 40 0 5 10 15 20 25 30 Supply Voltage (V) 35 40 9 IXD_614 INTEGRATED CIRCUITS DIVISION Output Source Current vs. Temperature (CL=330nF, VCC=18V) 24 Output Sink Current (A) Output Source Current (A) -22 -20 -18 -16 -14 -12 -10 -40 -20 0 20 40 60 80 Temperature (C) 22 21 20 19 18 17 0 20 40 60 80 Temperature (C) 100 120 140 Low-State Output Resistance @ +10mA vs. Supply Voltage 1.0 0.7 0.9 Output Resistance () Output Resistance () 23 16 -40 -20 100 120 140 High-State Output Resistance @ -10mA vs. Supply Voltage 0.8 0.7 0.6 0.5 0.4 0.3 0.6 0.5 0.4 0.3 0.2 0.1 0 10 Output Sink Current vs. Temperature (CL=330nF, VCC=18V) 5 10 15 20 25 30 Supply Voltage (V) 35 40 0 5 www.ixysic.com 10 15 20 25 30 Supply Voltage (V) 35 40 R08 IXD_614 INTEGRATED CIRCUITS DIVISION 5 Manufacturing Information 5.1 Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device IXD_614SI / IXD_614PI /IXD_614CI IXD_614YI Moisture Sensitivity Level (MSL) Classification MSL 1 MSL 3 5.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. 5.3 Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)C or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (TC) Dwell Time (tp) Max Reflow Cycles IXD_614CI IXD_614YI IXD_614PI IXD_614SI 245C 245C 250C 260C 30 seconds 30 seconds 30 seconds 30 seconds 1 3 3 3 5.4 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R08 www.ixysic.com 11 IXD_614 INTEGRATED CIRCUITS DIVISION 5.5 Mechanical Dimensions 5.5.1 SI (8-Pin Power SOIC with Exposed Metal Back) PCB Land Pattern 0.31 / 0.51 (0.012 / 0.020) 8x TOP VIEW 0.60 (0.024) BOTTOM VIEW 1.55 (0.061) 5 5.80 / 6.20 (0.228 / 0.244) PIN #1 1.27 0.05 6x 1.25 MIN (0.049 MIN) 1.70 MAX (0.067 MAX) 2.05 / 2.41 (0.081 / 0.095) 3.80 / 4.00 (0.150 / 0.157) 2.23 (0.088) 3.31 / 3.81 (0.130 / 0.150) 4 4.80 / 5.00 (0.189 / 0.197) 0.10 / 0.25 (0.004 / 0.010) A 0.25 (0.010) A 0 / 0.15 (0 / 0.006) 3.85 (0.152) 0.10 (0.004) GAUGE PLANE SEATING PLANE 8- 0 0.40 / 1.27 (0.016 / 0.050) 3.56 (0.140) Dimensions MIN / MAX Notes: 1. Controlling dimension: millimeters. 2. All dimensions are in mm (inches). 3. This package conforms to JEDEC Standard MS-012, variation BA, Rev. F. 4. Dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15mm per end. 5. Dimension does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25mm per side. 6. The exposed metal pad on the back of the package should be connected to GND. It is not suitable for carrying current. 7. Lead thickness includes plating. 5.5.2 SI Package Tape & Reel Information 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) K0= 2.10 (0.083) A0=6.50 (0.256) P1=8.00 (0.315) User Direction of Feed Embossed Carrier Embossment 12 W=12.00 (0.472) B0=5.30 (0.209) Dimensions mm (inches) NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2 www.ixysic.com R08 IXD_614 INTEGRATED CIRCUITS DIVISION 5.5.3 YI (5-Pin TO-263) E (Note 2) E1 E3 SYMBOL A A1 b b1 c c1 c2 D D1 D2 E E1 E3 e H L L1 L3 R R1 L1 D2 D1 D (Note 2) H * Pin 1 Indicator C C e ~4x b ~5x * Circular feature will be present on devices with the Optional Tip Lead Form. A c2 JEDEC TO-263 Optional Tip Lead Form MM MIN MAX 4.064 4.826 0.000 0.254 0.508 0.991 0.508 0.889 0.381 0.737 0.381 0.584 1.143 1.651 8.382 9.652 6.858 7.700 1.358 1.562 9.652 10.668 6.223 8.000 5.092 6.869 1.702 BSC 14.605 15.875 1.778 2.794 1.000 1.676 0.254 BSC 0.460 TYP 0.506 TYP 8 R1 10.75 (0.423) 2.20 (0.087) 8.40 (0.331) 3.80 (0.150) 8.05 (0.317) 1.05 (0.041) 10.50 (0.413) 1.702 (0.067) Dimensions mm (inches) BASE METAL c1 A1 b R1 Recommended PCB Pattern SECTION: C-C b1 PLATING (Note 3) c A1 INCH MIN MAX 0.160 0.190 0.000 0.010 0.020 0.039 0.020 0.035 0.015 0.029 0.015 0.023 0.045 0.065 0.330 0.380 0.270 0.303 0.053 0.062 0.380 0.420 0.245 0.315 0.200 0.270 0.067 BSC 0.575 0.625 0.070 0.110 0.039 0.066 0.010 BSC 0.018 TYP 0.02 TYP 8 L NOTES: 1. Reference JEDEC TO-263 Type "BA". 2. Dimension does not include mold flash; mold flash shall not exceed 0.127mm (0.005 inch) per side. 3. Minimum plating: 1000 microinches. 4. Controlling dimension: millimeters. L R R L3 L3 5.5.4 CI (5-Pin TO-220) A 0.127 BSC (0.005 BSC) 9.652 - 10.668 (0.380 - 0.420) B 3.810 - 3.860 (0.150 - 0.152) 3.556 - 4.826 (0.140 - 0.190) 0.508 - 1.397 (0.020 - 0.055) 0.355 M B A M 9.652 - 10.668 (0.380 - 0.420) 2.540 - 3.048 (0.100 - 0.120) 5.842 - 6.858 (0.230 - 0.270) 4.826 - 5.334 (0.190 - 0.210) 5.842 - 6.858 (0.230 - 0.270) 7.550 - 8.100 (0.297 - 0.319) 14.224 - 16.510 (0.560 - 0.650) 12.192 - 12.878 (0.480 - 0.507) 6.300 - 6.700 (0.248 - 0.264) 8.382 - 9.017 (0.330 - 0.355) THERMAL PAD 6.858 - 8.890 (0.270 - 0.350) 2.032 - 2.921 (0.080 - 0.115) C C 0.356 - 0.610 (0.014 - 0.024) 12.700 - 14.732 (0.500 - 0.580) 1.702 4x BSC (0.067 4x BSC) 0.381 - 1.016 5x (0.015 - 0.040 5x) 0.381 M B A M SECTION C-C PLATING 0.381 - 1.016 (0.015 - 0.040) BASE METAL Dimensions mm (inches) 0.356 - 0.559 (0.014 - 0.022) 0.356 - 0.610 (0.014 - 0.024) LEAD TIP 0.381 - 0.965 (0.015 - 0.038) R08 www.ixysic.com 13 IXD_614 INTEGRATED CIRCUITS DIVISION 5.5.5 PI (8-Pin DIP) 2.540 0.127 (0.100 0.005) 9.652 0.381 (0.380 0.015) 8-0.800 DIA. (8-0.031 DIA.) 2.540 0.127 (0.100 0.005) 9.144 0.508 (0.360 0.020) 6.350 0.127 (0.250 0.005) Pin 1 PCB Hole Pattern 7.620 0.254 (0.300 0.010) 0.457 0.076 (0.018 0.003) 4.064 TYP (0.160) 3.302 0.051 (0.130 0.002) 7.239 TYP. (0.285) 7.620 0.127 (0.300 0.005) 0.254 0.0127 (0.010 0.0005) 7.620 0.127 (0.300 0.005) Dimensions mm (inches) 0.813 0.102 (0.032 0.004) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division's Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-IXD_614-R08 (c)Copyright 2017, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 10/25/2017 14 www.ixysic.com R08