MCS 0402, MCT 0603, MCU 0805, MCA 1206 - Precision
www.vishay.com Vishay Beyschlag
Revision: 16-Aug-16 1Document Number: 28700
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Precision Thin Film Chip Resistors
Thin film flat chip resistors combine the proven reliability of
the professional products with an advanced level of
precision and stability. Therefore they are perfectly suited
for applications in the fields of test and measurement
equipment together with industrial and medical electronics.
FEATURES
• Approved to EN 140401-801
• Low TCR: ± 10 ppm/K to ± 25 ppm/K
• Precision tolerance of resistance:
± 0.1 % and ± 0.25 %
• Superior overall stability: class 0.1 and 0.25
• Sulfur resistance verified according to ASTM B 809
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Automotive
• Test and measuring equipment
• Medical equipment
• Industrial equipment
Note
(1) Please refer to APPLICATION INFORMATION below.
APPLICATION INFORMATION
When the resistor dissipates power, a temperature rise above the ambient temperature occurs, dependent on the thermal
resistance of the assembled resistor together with the printed circuit board. The rated dissipation applies only if the permitted
film temperature is not exceeded.
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift
increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a
functional lifetime.
TECHNICAL SPECIFICATIONS
DESCRIPTION MCS 0402 MCT 0603 MCU 0805 MCA 1206
Imperial size 0402 0603 0805 1206
Metric size code RR1005M RR1608M RR2012M RR3216M
Resistance range 100 to 221 k39 to 511 k39 to 1.5 M39 to 2 M
Resistance tolerance ± 0.25 %; ± 0.1 %
Temperature coefficient ± 25 ppm/K; ± 15 ppm/K; ± 10 ppm/K
Rated dissipation, P70 (1) 0.063 W 0.100 W 0.125 W 0.250 W
Operating voltage, Umax. ACRMS/DC 50 V 75 V 150 V 200 V
Permissible film temperature,
F max. (1) 125 °C
Operating temperature range -55 °C to 125 °C
Permissible voltage against ambient
(insulation):
1 min; Uins 75 V 100 V 200 V 300 V
Failure rate: FITobserved 0.1 x 10-9/h
MCS 0402, MCT 0603, MCU 0805, MCA 1206 - Precision
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Note
• The presented operation modes do not refer to different types of resistors, but actually show examples of different loads, that lead to
different film temperatures and different achievable load-life stability (drift) of the resistance value. A suitable low thermal resistance of the
circuit board assembly must be safeguarded in order to maintain the film temperature of the resistors within the specified limits. Please
consider the application note “Thermal Management in Surface-Mounted Resistor Applications” (www.vishay.com/doc?28844) for
information on the general nature of thermal resistance.
Note
• Resistance ranges printed in bold are preferred TCR / tolerance combinations with optimized availability.
MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION
OPERATION MODE PRECISION STANDARD
Rated dissipation, P70
MCS 0402 0.016 W 0.063 W
MCT 0603 0.032 W 0.100 W
MCU 0805 0.050 W 0.125 W
MCA 1206 0.100 W 0.250 W
Operating voltage, Umax. ACRMS/DC
MCS 0402 12.5 V 50 V
MCT 0603 25 V 75 V
MCU 0805 35 V 150 V
MCA 1206 50 V 200 V
Operating temperature range -10 °C to 85 °C -55 °C to 125 °C
Permissible film temperature,
F max. 85 °C 125 °C
Max. resistance change at P70 for resistance range,
|R/R| after:
MCS 0402 100 to 221 k100 to 221 k
MCT 0603 39 to 511 k39 to 511 k
MCU 0805 39 to 1.5 M39 to 1.5 M
MCA 1206 39 to 2 M39 to 2 M
1000 h 0.05 % 0.1 %
8000 h 0.1 % 0.25 %
225 000 h 0.25 % 0.5 %
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
TYPE / SIZE TCR TOLERANCE RESISTANCE E-SERIES
MCS 0402
± 25 ppm/K ± 0.25 % 100 to 221 k
E24; E192
± 0.1 % 100 to 221 k
± 15 ppm/K ± 0.25 % 100 to 150 k
± 0.1 % 100 to 150 k
± 10 ppm/K ± 0.25 % 100 to 130 k
± 0.1 % 100 to 130 k
MCT 0603
± 25 ppm/K ± 0.25 % 39 to 511 k
± 0.1 % 47 to 511 k
± 15 ppm/K ± 0.25 % 39 to 332 k
± 0.1 % 47 to 332 k
± 10 ppm/K ± 0.25 % 39 to 221 k
± 0.1 % 47 to 221 k
MCU 0805
± 25 ppm/K ± 0.25 % 39 to 1.5 M
± 0.1 % 47 to 1.5 M
± 15 ppm/K ± 0.25 % 39 to 1 M
± 0.1 % 47 to 1 M
± 10 ppm/K ± 0.25 % 39 to 511 k
± 0.1 % 47 to 511 k
MCA 1206
± 25 ppm/K ± 0.25 % 39 to 2 M
± 0.1 % 47 to 2 M
± 15 ppm/K ± 0.25 % 39 to 1.5 M
± 0.1 % 47 to 1.5 M
± 10 ppm/K ± 0.25 % 39 to 1 M
± 0.1 % 47 to 1 M
MCS 0402, MCT 0603, MCU 0805, MCA 1206 - Precision
www.vishay.com Vishay Beyschlag
Revision: 16-Aug-16 3Document Number: 28700
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Note
• Products can be ordered using either the PART NUMBER or PRODUCT DESCRIPTION.
PACKAGING
TYPE / SIZE CODE QUANTITY PACKAGING STYLE WIDTH PITCH PACKAGING
DIMENSIONS
MCS 0402
E1 1000
Paper tape acc.
IEC 60286-3,
Type 1a
8 mm
2 mm Ø 180 mm/7"E5 5000
E0 10 000
MCT 0603
P1 1000
4 mm
Ø 180 mm/7"
P5 5000
PW 20 000 Ø 330 mm/13"
MCU 0805
P1 1000
Ø 180 mm/7"
P5 5000
PW 20 000 Ø 330 mm/13"
MCA 1206
P1 1000
Ø180 mm/7"
P5 5000
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: MCT06030D4641BPW00
TYPE / SIZE VERSION TCR RESISTANCE TOLERANCE PACKAGING
MCS0402
MCT0603
MCU0805
MCA1206
0 = neutral F = ± 10 ppm/K
E = ± 15 ppm/K
D = ± 25 ppm/K
3 digit value
1 digit
multiplier
Multiplier
9 = *10-1
0 = *100
1 = *101
2 = *102
3 = *103
4 = *104
B = ± 0.1 %
C = ± 0.25 %
E1
E5
E0
P1
P5
PW
Product Description: MCT 0603-25 0.1 % PW 4K64
MCT 0603 -25 0.1 % PW 4K64
TYPE SIZE TCR TOLERANCE PACKAGING RESISTANCE
MCS
MCT
MCU
MCA
0402
0603
0805
1206
± 10 ppm/K
± 15 ppm/K
± 25 ppm/K
± 0.1 %
± 0.25 %
E1
E5
E0
P1
P5
PW
4K64 = 4.64 k
50R1 = 50.1
CT06030D4M41BPW006
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DESCRIPTION
Production is strictly controlled and follows an extensive
set of instructions established for reproducibility. A
homogeneous film of metal alloy is deposited on a high
grade ceramic substrate (Al2O3) and conditioned to achieve
the desired temperature coefficient. Specially designed
inner contacts are deposited on both sides. A special laser
is used to achieve the target value by smoothly fine trimming
the resistive layer without damaging the ceramics. A further
conditioning is applied in order to stabilize the trimming
result. The resistor elements are covered by a protective
coating designed for electrical, mechanical and climatic
protection. The terminations receive a final pure tin on nickel
plating.
The result of the determined production is verified by an
extensive testing procedure and optical inspection
performed on 100 % of the individual chip resistors. This
includes full screening for the elimination of products with
potential risk of early field failures. Only accepted products
are laid directly into the paper tape in accordance with
IEC 60286-3 Type 1a (1).
ASSEMBLY
The resistors are suitable for processing on automatic SMD
assembly systems and for automatic soldering using wave,
reflow or vapor phase. The encapsulation is resistant to all
cleaning solvents commonly used in the electronics
industry, including alcohols, esters and aqueous solutions.
The suitability of conformal coatings, potting compounds
and their processes, if applied, shall be qualified by
appropriate means to ensure the long-term stability of the
whole system.
The resistors are RoHS-compliant, the pure tin plating
provides compatibility with lead (Pb)-free and
lead-containing soldering processes. Solderability is
specified for 2 years after production or requalification. The
permitted storage time is 20 years. The immunity of the
plating against tin whisker growth has been proven under
extensive testing.
MATERIALS
Vishay acknowledges the following systems for the
regulation of hazardous substances:
• IEC 62474, Material Declaration for Products of and for the
Electrotechnical Industry, with the list of declarable
substances given therein (2)
• The Global Automotive Declarable Substance List
(GADSL) (3)
• The REACH regulation (1907/2006/EC) and the related list
of substances with very high concern (SVHC) (4) for its
supply chain
The products do not contain any of the banned substances
as per IEC 62474, GADSL, or the SVHC list, see
www.vishay.com/how/leadfree.
Hence the products fully comply with the following
directives:
• 2000/53/EC End-of-Life Vehicle Directive (ELV) and
Annex II (ELV II)
• 2011/65/EU Restriction of the Use of Hazardous
Substances Directive (RoHS) with amendment
2015/863/EU
• 2012/19/EU Waste Electrical and Electronic Equipment
Directive (WEEE)
Vishay pursues the elimination of conflict minerals from its
supply chain, see the Conflict Minerals Policy at
www.vishay.com/doc?49037.
APPROVALS
The resistors are approved within the IECQ-CECC Quality
Assessment System for Electronic Components to the detail
specification EN 140401-801 which refers to EN 60115-1,
EN 60115-8 and the variety of environmental test
procedures of the IEC 60068 (1) series.
Conformity is attested by the use of the CECC logo ( ) as
the mark of conformity on the package label.
Vishay Beyschlag has achieved “Approval of
Manufacturer” in accordance with IECQ 03-1. The release
certificate for “Technology Approval Schedule” in
accordance with CECC 240001 based on IECQ 03-3-1 is
granted for the Vishay Beyschlag manufacturing process.
RELATED PRODUCTS
Resistors are available with established reliability in
accordance with EN 140401-801 version E. Please refer to
the special datasheet (www.vishay.com/doc?28744) for
information on failure rate level, available resistance ranges
and order codes.
For more information about products with higher rated
power and higher operation temperature please refer to the
Professional Thin Film Chip Resistor datasheet
(www.vishay.com/doc?28705).
Precision chip resistor arrays may be used in voltage
divider applications or precision amplifiers where close
matching between multiple resistors is necessary.
Please refer to the ACAS 0612 - Precision datasheet
(www.vishay.com/doc?28751).
Notes
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents.
(2) The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474.
(3) The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at
www.gadsl.org.
(4) The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-table.
MCS 0402, MCT 0603, MCU 0805, MCA 1206 - Precision
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FUNCTIONAL PERFORMANCE
Derating - Standard Operation
MCT 0603
MCU 0805
MCA 1206
Ambient Temperature
°C
100 150
-50
50
0
70
0
0.1
0.2
Power Dissipation
amb
MCS 0402
ϑ
P
0.3
W
Ambient Temperature
100 150
-50
50
0
70
0
0.1
0.2
W
P
°C
MCT 0603
MCU 0805
MCA 1206
MCS 0402
amb
ϑ
Power Dissipation
0.3
Derating - Precision Operation
Current Noise Voltage Ratio
In accordance with IEC 60195
1
µV/V
Current Noise Voltage Ratio
100
Ω
Resistance Value
R
10
0.1
0.01
1 k
Ω
10 k
Ω
100 k
Ω
1 M
Ω
MCS 0402
MCT 0603
MCU 0805
MCA 1206
MCS 0402, MCT 0603, MCU 0805, MCA 1206 - Precision
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TESTS AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
EN 60115-1, generic specification
EN 60115-8 (successor of EN 140400), sectional
specification
EN 140401-801, detail specification
IEC 60068-2-xx, test methods
The components are approved under the IECQ-CECC
quality assessment system for electronic components.
The parameters stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of EN 140401-801. The table presents only
the most important tests, for the full test schedule refer to
the documents listed above. However, some additional
tests and a number of improvements against those
minimum requirements have been included.
The testing also covers most of the requirements specified
by EIA/ECA-703 and JIS-C-5201-1.
The tests are carried out under standard atmospheric
conditions in accordance with IEC 60068-1, 4.3, whereupon
the following values are applied:
Temperature: 15 °C to 35 °C
Relative humidity: 25 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar)
A climatic category LCT / UCT / 56 is applied, defined by the
lower category temperature (LCT), the upper category
temperature (UCT), and the duration of exposure in the
damp heat, steady state test (56 days).
The components are mounted for testing on printed circuit
boards in accordance with EN 60115-8, 2.4.2, unless
otherwise specified.
TEST PROCEDURES AND REQUIREMENTS
EN
60 115-1
CLAUSE
IEC
60 068-2 (1)
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 0.1 STABILITY CLASS 0.25
Stability for product types:
MCS 0402 100 to 10 k> 10 kto 221 k
MCT 0603 100 to 10 k39 to < 100 ;
> 10 k to 511 k
MCU 0805 100 to 47.5 k39 to < 100 ;
> 47.5 k to 1.5 M
MCA 1206 47 to 332 k39 to < 47 ;
> 332 k to 2 M
4.5 - Resistance - ± 0.1 % R; ±0.25 % R
4.8 - Temperature
coefficient
At (20 / - 10 / 20) °C and
(20 / 85 / 20) °C
± 25 ppm/K; ± 15 ppm/K;
± 10 ppm/K -
At (20 / - 55 / 20) °C and
(20 / 125 / 20) °C -± 25 ppm/K; ± 15 ppm/K;
± 10 ppm/K
4.25.1 -
Endurance
at 70 °C:
precision
operation mode
U = or U = Umax.;
whichever is the less
severe;
1.5 h on; 0.5 h off;
70 °C; 1000 h ± (0.05 % R + 0.02 )
70 °C; 8000 h ±(0.1 % R + 0.02 )
Endurance
at 70 °C:
standard
operation mode
U = or U = Umax.;
whichever is the less
severe;
1.5 h on; 0.5 h off;
70 °C; 1000 h ± (0.1 % R + 0.02 )
70 °C; 8000 h ±(0.25 % R + 0.05 )
4.25.3 -
Endurance at
upper category
temperature
85 °C; 1000 h ±(0.1 % R + 0.02 ) ± (0.2 % R + 0.02 )
125 °C; 1000 h ± (0.2 % R + 0.02 )±(0.25 % R + 0.05 )
4.24 78 (Cab) Damp heat,
steady state
(40 ± 2) °C; 56 days;
(93 ± 3) % RH ± (0.1 % R + 0.02 )±(0.25 % R + 0.05 )
P70 x R
P70 x R
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4.23
Climatic
sequence:
standard
operation mode:
4.23.2 2 (Bb) Dry heat 125 °C; 16 h
± (0.1 % R + 0.02 ) ± (0.25 % R + 0.05 )
4.23.3 30 (Db) Damp heat,
cyclic
55 °C; 24 h; > 90 % RH;
1 cycle
4.23.4 1 (Ab) Cold -55 °C; 2 h
4.23.5 13 (M) Low air pressure 8.5 kPa; 2 h; (25 ± 10) °C
4.23.6 30 (Db) Damp heat,
cyclic
55 °C; 24 h; > 90 % RH;
5 cycles
4.23.7 - DC load U = Umax.;
1 min.
- 1 (Aa) Cold -55 °C; 2 h ± (0.05 % R + 0.01 )
4.19 14 (Na) Rapid change
of temperature
30 min at LCT and
30 min at UCT;
LCT = -10 °C;
UCT = 85 °C;
5 cycles
± (0.05 % R + 0.01 )
no visible damage
LCT = -55 °C;
UCT = 125 °C;
1000 cycles
± (0.25 % R + 0.05 )
no visible damage
4.13 -
Short time
overload:
precision
operation mode
U = 2.5 x
or U = 2 x Umax.;
whichever is the less severe;
5 s
±(0.05 % R + 0.01 )
Short time
overload:
standard
operation mode
U = 2.5 x
or U = 2 x Umax.;
whichever is the less severe;
5 s
±(0.05 % R + 0.01 )
4.27 -
Single pulse high
voltage overload:
standard
operation mode
Severity no. 4:
U = 10 x
or U = 2 x Umax.;
whichever is the less severe;
10 pulses 10 μs/700 μs
± (0.5 % R + 0.05 )
no visible damage
4.39 -
Periodic electric
overload:
standard
operation mode
U =
or U = 2 x Umax.;
whichever is the less severe;
0.1 s on; 2.5 s off;
1000 cycles
± (0.5 % R + 0.05 )
no visible damage
TEST PROCEDURES AND REQUIREMENTS
EN
60 115-1
CLAUSE
IEC
60 068-2 (1)
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 0.1 STABILITY CLASS 0.25
Stability for product types:
MCS 0402 100 to 10 k> 10 kto 221 k
MCT 0603 100 to 10 k39 to < 100 ;
> 10 k to 511 k
MCU 0805 100 to 47.5 k39 to < 100 ;
> 47.5 k to 1.5 M
MCA 1206 47 to 332 k39 to < 47 ;
> 332 k to 2 M
P70 x R
P70 x R
P70 x R
P70 x R
15 x P70 x R
MCS 0402, MCT 0603, MCU 0805, MCA 1206 - Precision
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Note
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents.
4.38 -
Electro static
discharge
(human body
model)
IEC 61340-3-1 (1);
3 pos. + 3 neg.
(equivalent to MIL-STD-883,
method 3015)
MCS 0402: 500 V
MCT 0603: 1000 V
MCU 0805: 1500 V
MCA 1206: 2000 V
±(0.5 % R + 0.05 )
4.22 6 (Fc) Vibration
Endurance by sweeping;
10 Hz to 2000 Hz;
no resonance; amplitude
1.5 mm or 200 m/s2;
7.5 h
± (0.05 % R + 0.01 )
no visible damage
4.17 58 (Td) Solderability
Solder bath method;
SnPb40; non-activated flux;
(215 ± 3) °C; (3 ± 0.3) s
Good tinning ( 95 % covered);
no visible damage
Solder bath method;
SnAg3Cu0.5 or SnAg3.5;
non-activated flux;
(235 ± 3) °C; (2 ± 0.2) s
Good tinning ( 95 % covered);
no visible damage
4.18 58 (Td) Resistance to
soldering heat
Solder bath method;
(260 ± 5) °C; (10 ± 1) s ±(0.05 % R + 0.01 )
4.29 45 (XA)
Component
solvent
resistance
Isopropyl alcohol; + 50 °C;
method 2 No visible damage
4.32 21 (Ue3)Shear
(adhesion)
MCS 0402 and MCT 0603;
9 N No visible damage
MCU 0805 and MCA 1206;
45 N No visible damage
4.33 21 (Ue1)Substrate
bending Depth 2 mm, 3 times ±(0.05 % R + 0.01 )
no visible damage, no open circuit in bent position
4.7 - Voltage proof URMS = Uins; (60 ± 5) s No flashover or breakdown
4.35 - Flammability IEC 60695-11-5 (1),
needle flame test; 10 s No burning after 30 s
TEST PROCEDURES AND REQUIREMENTS
EN
60 115-1
CLAUSE
IEC
60 068-2 (1)
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 0.1 STABILITY CLASS 0.25
Stability for product types:
MCS 0402 100 to 10 k> 10 kto 221 k
MCT 0603 100 to 10 k39 to < 100 ;
> 10 k to 511 k
MCU 0805 100 to 47.5 k39 to < 100 ;
> 47.5 k to 1.5 M
MCA 1206 47 to 332 k39 to < 47 ;
> 332 k to 2 M
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DIMENSIONS
SOLDER PAD DIMENSIONS
Notes
• The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x (1),
or in publication IPC-7351.
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents.
DIMENSIONS AND MASS
TYPE / SIZE H
(mm)
L
(mm)
W
(mm)
WT
(mm)
Tt
(mm)
Tb
(mm)
MASS
(mg)
MCS 0402 0.32 ± 0.05 1.0 ± 0.05 0.5 ± 0.05 > 75 % of W 0.2 + 0.1 / - 0.15 0.2 ± 0.1 0.6
MCT 0603 0.45 + 0.1 / - 0.05 1.55 ± 0.05 0.85 ± 0.1 > 75 % of W 0.3 + 0.15 / - 0.2 0.3 + 0.15 / - 0.2 1.9
MCU 0805 0.45 + 0.1 / - 0.05 2.0 ± 0.1 1.25 ± 0.15 > 75 % of W 0.4 + 0.1 / - 0.2 0.4 + 0.1 / - 0.2 4.6
MCA 1206 0.55 ± 0.1 3.2 + 0.1 / - 0.2 1.6 ± 0.15 > 75 % of W 0.5 ± 0.25 0.5 ± 0.25 9.2
RECOMMENDED SOLDER PAD DIMENSIONS
TYPE / SIZE
WAVE SOLDERING REFLOW SOLDERING
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
MCS 0402 - - - - 0.35 0.55 0.55 1.45
MCT 0603 0.55 1.10 1.10 2.75 0.65 0.70 0.95 2.05
MCU 0805 0.80 1.25 1.50 3.30 0.90 0.90 1.40 2.70
MCA 1206 1.40 1.50 1.90 4.40 1.50 1.15 1.75 3.80
Tb
Tt
L
H
W WT
GX
Y
Z
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Revision: 16-Aug-16 10 Document Number: 28700
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
HISTORICAL 12NC INFORMATION
• The resistors had a 12-digit numeric code starting with
2312.
• The subsequent 4 digits indicated the resistor type,
specification and packaging; see the 12NC table.
• The remaining 4 digits indicated the resistance value:
- The first 3 digits indicated the resistance value.
- The last digit indicated the resistance decade in
accordance with the 12NC Indicating Resistance
Decade table.
Last Digit of 12NC Indicating Resistance Decade
Historical 12NC example
The 12NC of a MCT 0603 resistor, value 47 k and TCR 25
with ± 0.1 % tolerance, supplied in cardboard tape of
5000 units per reel was: 2312 216 74703.
RESISTANCE DECADE LAST DIGIT
10 to 99.9 9
100 to 999 1
1 k to 9.99 k2
10 k to 99.9 k3
100 k to 999 k4
1 M to 9.99 M5
HISTORICAL 12NC - Resistors type and packaging
DESCRIPTION 2312... .....
CARDBOARD TAPE ON REEL
TYPE TCR TOL. P1
1000 UNITS
P5
5000 UNITS
PW
20 000 UNITS
E1
1000 UNITS
E0
10 000 UNITS
MCS 0402
± 25 ppm/K ± 0.25 % - - - 261 6.... 276 6....
± 0.1 % - - - 261 7.... 276 7....
± 15 ppm/K ± 0.25 % - - - 262 6.... 277 6....
± 0.1 % - - - 262 7.... 277 7....
± 10 ppm/K ± 0.25 % - - - 263 6.... 278 6....
± 0.1 % - - - 263 7.... 278 7....
MCT 0603
± 25 ppm/K ± 0.25 % 201 6.... 216 6.... 206 6.... - -
± 0.1 % 201 7.... 216 7.... 206 7.... - -
± 15 ppm/K ± 0.25 % 202 6.... 217 6.... 207 6.... - -
± 0.1 % 202 7.... 217 7.... 207 7.... - -
± 10 ppm/K ± 0.25 % 203 6.... 218 6.... 208 6.... - -
± 0.1 % 203 7.... 218 7.... 208 7.... - -
MCU 0805
± 25 ppm/K ± 0.25 % 241 6.... 256 6.... 246 6.... - -
± 0.1 % 241 7.... 256 7.... 246 7.... - -
± 15 ppm/K ± 0.25 % 242 6.... 257 6.... 247 6.... - -
± 0.1 % 242 7.... 257 7.... 247 7.... - -
± 10 ppm/K ± 0.25 % 243 6.... 258 6.... 248 6.... - -
± 0.1 % 243 7.... 258 7.... 248 7.... - -
MCA 1206
± 25 ppm/K ± 0.25 % 381 6.... 396 6.... 386 6.... - -
± 0.1 % 381 7.... 396 7.... 386 7.... - -
± 15 ppm/K ± 0.25 % 382 6.... 397 6.... 387 6.... - -
± 0.1 % 382 7.... 397 7.... 387 7.... - -
± 10 ppm/K ± 0.25 % 383 6.... 398 6.... 388 6.... - -
± 0.1 % 383 7.... 398 7.... 388 7.... - -
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Revision: 08-Feb-17 1Document Number: 91000
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