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Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) "Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries. (Note 2) "Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics. M66515FP Laser Diode Driver/Controller REJ03F0084-0100Z Rev.1.0 Sep.22.2003 Description The M66515 is a laser diode driver/controller that performs drive and controls the laser power control of a type of semiconductor laser diode the anode of which is connected, with the cathode of a photodiode for monitoring, to a stem in which the semiconductor laser diode anode and monitoring photo diode cathode are connected to the stem. This IC has a sink-type laser driving current output pin, and can drive a laser diode with a bias current of up to a maximum 30 mA and with switched currents of up to 120 mA, switched at rates of up to 40 Mbps. The IC incorporates a sample hold circuit, so that a self-APC (Automatic Power Control) system, which does not require external laser power control, can be realized. Features * * * * * Internal sample-and-hold circuit for self-APC configuration High-speed switching (40 Mbps) High driving currents (150 mA max) Settable bias current (30 mA max) Single 5 V power supply Applications * Equipment employing semiconductor laser diodes Function Overview The M66515 is a laser diode driver/controller which drives and controls the laser power of a semiconductor laser diode (LD) the anode of which is connected, with the cathode of a photodiode (PD) for monitoring, to a stem (among Mitsubishi lasers, N type models). LD driving and laser power control are executed by connecting an external capacitance to the CH pin and applying a reference voltage to the Vr pin. The PD current occurring when a LD emits light flows through a resistance connected across 1RM and 2RM, resulting in a potential difference (VM). This VM is compared with the voltage applied to the Vr pin, and when VM<Vr, a constant current source from the CH pin flows to charge the external capacitor. When VM>Vr, a constant current sink from the CH pin causes the charge on the external capacitor to be discharged. This operation is performed when the S/H input is "L" (sample); when the S /H input is in the "H" state, the CH pin is in the high-impedance state (hold), regardless of VM, Vr and the DATA input state. The LD driving current consists of a switched current ISW, which is controlled by the DATA input, and IB, a LD bias current which is independent of the DATA input state. Rev.1.00, Sep.22.2003, page 1 of 11 M66515FP Pin Configuration (top view) Description of Pin Pin name Name Function LD PD RS Laser current output Monitor diode input Switching current setting load output Connected to the semiconductor LD cathode Connected to the monitor PD anode Connects the load resistance to set the current for switching (ISW ) to GND RB Bias current setting load output Connects the load resistance to set the bias current (IB) to GND. If IB is not used, this pin should be left open. VB Bias current setting voltage input DATA 1RM, 2RM Switching data input Load input for monitoring The bias current value (IB) can be set by applying a voltage to this pin. If IB is not used, this pin should be left open. At "L", the current ISW+IB flows to the LD; at "H", the current to the LD is IB Connect a load resistance to convert the monitor PD current to a voltage across 1RM and 2RM ENB RO S/H Laser current enable input Laser current load output Sample hold control input When "H", all current source circuits are turned off Connect a laser current load resistance between this pin and VCC When "L", sample (APC) operation is performed; when "H", hold (switching) is performed CH Hold capacitor load input/output Connect a hold capacitor between this pin and GND. This pin is connected within the M66515 to the sample hold circuit output and ISW current source input. Vref Vr Reference voltage output Reference voltage input TEST VCC1 Test pin Power supply pin 1 Output pin for the M66515 internal reference voltage (1.2 V typ) A reference voltage is applied to cause operation of the comparator within the sample hold circuit. When using the reference voltage within the M66515, this pin should be connected to the Vref pin. Pin used for testing at time of shipment of the M66515; should be left open Power supply for the internal analog system; connect to a positive power supply (+5 V) VCC2 Power supply pin 2 Power supply for the internal digital system; connect to a positive power supply (+5 V) GND1 GND pin 1 GND for internal analog system GND2 GND pin 2 GND for internal digital system Rev.1.00, Sep.22.2003, page 2 of 11 M66515FP Block Diagram Explanation of operation 1. Laser driving current values The values of the laser driving currents ISW and IB can be approximated as follows, if VC is the voltage of the hold capacitor connected to the CH pin. (1) ISW (switched current) Here 0VCVCC-1.8 V, ISW (max) =120 mA, and RS is the value of the resistance connected between the RS pin and GND (2) IB (bias current) Here 0VBVCC-2.7 V, IB (max) =30 mA, and RB is the value of the resistance connected between the RB pin and GND 2. Switching operation When DATA="L", the LD driving current is ISW+IB; when DATA="H", the LD driving current is IB. 3. ENB input Whereas the laser driving current is controlled by DATA input by controlling the driving current applied to the laser with the current source in the M66515 turned on, control by ENB turns the current source operation on and off. When ENB="L" the current source is turned on, and when ENB="H" the current source is turned off. When ENB="H", the CH pin is forced to "L" level, and the charge on the capacitor connected to the CH pin is forcibly discharged. 4. Internal reset operation The M66515 incorporates a reset circuit to prevent the flow of excessive current to the laser when power is turned on; when VCC<3.5 V (typ), the internal current source is turned off and the CH pin is forced to "L" level. Rev.1.00, Sep.22.2003, page 3 of 11 M66515FP 5. RO pin The RO pin is connected to the laser driving current load resistance; current essentially equal to ISW flows from this pin. The load resistance is connected between this pin and VCC; by this means the Power dissipation within the IC is reduced. However, the circuit operation requires that the voltage at this pin be 2.5 V or above. Hence if the maximum value of ISW is ISW(max), then the maximum value RO(max) of the load resistance RO is as follows. For example, if VCC(min)=4.75 V and ISW(max)=120 mA, then RO(max)=18.8 . In other words, when setting the resistance RS such that the maximum value of ISW is 120 mA, RO should be 18.8 or lower. 6. Sample-and-hold circuit (1) Summary of circuit operation The following is a summary of operation of the sample hold circuit within the M66515. A PD current arising upon LD light emission flows through the resistance connected between 1RM and 2RM, giving rise to a potential difference (VM). This VM is compared with the voltage applied to the pin Vr, and if VM<Vr, pin CH is a constant current source which charges the external capacitor. If VM>Vr, pin CH is a constant current sink which discharges the external capacitor. This operation is performed when the S /H input is "L" (sample); when the S/H input is "H", the CH pin is kept in the high-impedance state (hold), regardless of VM, Vr, and the DATA input state. Function table Input Switched state ENB S/H Vm, Vr SW1 SW2 H L L X H L X X VM < Vr VM > Vr OFF OFF ON OFF OFF OFF OFF ON Tr1 Output ON OFF OFF OFF Fixed at "L" High-impedance state (hold) Constant current source (sample) Constant current sink (sample) X: arbitrary (2) APC operation timing chart An example of an APC operation timing chart for a given sample hold control signal is shown below. In this example, a case is shown in which it is assumed that the direction of the leakage current of the CH pin in the hold state is the direction flowing out from the M66515 (the negative direction). Rev.1.00, Sep.22.2003, page 4 of 11 M66515FP 7. VCC and GND pins The VCC1 and VCC2 pins and the GND1 and GND2 pins are related to the power supply. The internal circuitry connected to these pins is as follows. VCC1, GND1: Connected to analog circuitry VCC2, GND2: Connected to digital circuitry The following should be taken into account in designing the actual wiring. (1) Wiring widths should be as broad as possible, and drawn-out lengths of wiring should be avoided. (2) The electrolytic capacitor for voltage stability should be positioned close to VCC1 and GND1. (3) The bypass capacitor should be positioned close to VCC2 and GND2. Important Information Regarding Peripheral Element Wiring Peripheral elements necessary for M66515 operation should be positioned as close to the M66515 as possible. Method of Calculating Power dissipation The M66515 Power dissipation P is essentially given by the following formula. P = ICC x VCC + I(RO) x I(RO) + I(LD) x V(LD) Here V(RO) is the RO pin voltage, V(LD) is the LD pin voltage, I(RO) is the RO pin load current, and I(LD) is the LD pin load current. For example, when VCC = 5.25 V, V(RO) = V(LD) = 2.5 V, and I(RO) = I(LD) = 150 mA, the Power dissipation when the laser is turned on and off is as follows. (1) When the laser is on (DATA = "L", ICC = 75 mA): PON = 75 x 5.25 + 0 + 150 x 2.5 = 768.8 (mW) (2) When the laser is off (DATA = "H", ICC = 74 mA): POFF = 74 x 5.25 + 0 + 150 x 2.5 = 763.5 (mW) Rev.1.00, Sep.22.2003, page 5 of 11 M66515FP Absolute Maximum Ratings (Unless otherwise noted, Ta = -20 to 70C) Symbol Parameter VCC VO ISW IB Pd Power supply voltage Input voltage CH, Vr DATA, ENB, S/H Output voltage RO Switching current Bias current Power dissipation Tstg Storage temperature VI Conditions Mounted on board, with Ta=25C (see note) Value Unit -0.5 to +7.0 -0.3 to VCC -0.3 to +7.0 -0.5 to +7.0 150 45 1200 V V V V mA mA mW -60 to +150 C Note: When Ta 25C, derating at 9.6 mW/C should be performed. Recommended Operating Conditions (Unless otherwise noted, Ta = -20 to 70C) Symbol VCC ISW IB Topr Parameter Power supply voltage Switching current Bias current Operating ambient temperature Rev.1.00, Sep.22.2003, page 6 of 11 Limits Unit Min Typ Max 4.75 5.0 -20 5.25 120 30 70 V mA mA C M66515FP Electrical Characteristics (Unless otherwise noted, VCC = 5 V 5%, Ta = -20 to 70C) Symbol Parameter Measurement conditions Limits VIH "H" input voltage DATA, ENB, S/H VIL "L" input voltage DATA, ENB, S/H Vr Reference voltage input Vr Vref Reference voltage output Vref IO = -10 A 1.2 V Temperature coefficient Ta = -20 to 25C -0.9 mV/C VLD Operating voltage range LD 2.5 VI Effective voltage upper limit CH VCC- 1.8 VOH "H" output voltage CH ENB = 0.8 V, IOH = -2 mA VOL "L" output voltage CH ENB = 0.8 V, IOL = 2 mA IL Input current DATA, ENB VI = 2.7 V VI = 0.4 V -0.2 mA CH VI = 0 to VCC 1 A Min Unit Typ Max 2.0 V 0.4 Ta = 25 to 70C Measurement circuit 0.8 V 2.0 V 1 -0.9 VCC VCC- 1.4 V V 4.0 V 1 0.6 V 1 20 A CH = 3.0 V, Rs = 360 , VLD = 2 V 120 mA Ta = 20 to 70C 0.11 mA/C LD VB = 1.2 V, RB = 360 , VLD = 2 V 30 mA 2 Load charging current CH ENB = 0.8 V, VO = 0.6 to 4.0 V -0.66 -2.0 mA 3 Idg Load discharge current CH ENB = 0.8 V, VO = 0.6 to 4.0 V 0.66 2.0 mA 3 Ioz Output current in off state CH VO = 0 to VCC, Hold state 5 A 3 IOFF Output current when off LD A 2 mA 4 Switching current (see note) LD IB Bias current (see note) Icg ISW ICC Temperature coefficient Power supply current ENB = 0.8 V, DATA = 2.0 V 0.33 50 ENB = 2.0 V, DATA = 0.8 V 0.01 50 DATA = 0V 54 75 DATA = 4.5 V 52 74 VCC = 5.25 V, ENB = 0 V, CH = 3.0 V, VB = 1.2 V, RS = 300 , RB = 360 , RO = LD = 5.0 V 2 *Typical values are for Ta = 25C, VCC = 5 V. Note: These quantities indicate the input voltage-output current conversion characteristic; ISW and IB should be used within the range of the rated values under recommended operating conditions. Rev.1.00, Sep.22.2003, page 7 of 11 M66515FP Switching Characteristics (Ta = 25C, VCC = 5 V) Symbol Item fOP Operating frequency Circuit response time 1 Measurement pin Input tRP1 tRP2 Circuit response time 2 Output Measurement conditions Limits Min. Unit Typ. Max. 40 CH voltage PD current LD current CH voltage Mbps 7 s 2 s 15 s |IPD| = 0.2 mA RM = 1 k (Note 2) 8 s ILD(L) = 0 mA ILD(H) = 60 mA (Note 1) ILD(L) = 55 mA ILD(H) = 65 mA (Note 1) IPD(L) = 0 mA IPD(H) = 2 mA RM = 1 k (Note 2) tRP3 Circuit response time 3 S/H voltage CH voltage IPD = 0 mA, 2 mA RM = 1 k, Vr = 1.2 V (Note 3) 1 s tON Circuit turn-on time ENB voltage LD current ILD(H) = 60 mA (Note 4) 5 s tOFF Circuit turn-off time ENB voltage LD current ILD(H) = 60 mA (Note 4) 2 s Note 1. Measurement circuit and Timing chart Rev.1.00, Sep.22.2003, page 8 of 11 M66515FP Note 2. Measurement circuit and Timing chart Note 3. Measurement circuit and Timing chart Rev.1.00, Sep.22.2003, page 9 of 11 M66515FP Note 4. Measurement circuit and Timing chart Application example Rev.1.00, Sep.22.2003, page 10 of 11 Rev.1.00, Sep.22.2003, page 11 of 11 G Z1 E HE 1 20 EIAJ Package Code SOP20-P-300-1.27 z Detail G e D JEDEC Code -- y b x Weight(g) 0.26 M 10 11 F A Detail F A2 Lead Material Cu Alloy L1 MMP c A1 A A1 A2 b c D E e HE L L1 z Z1 x y Symbol e1 b2 e1 I2 b2 Dimension in Millimeters Min Nom Max -- 2.1 -- 0.1 0.2 0 1.8 -- -- 0.5 0.35 0.4 0.2 0.18 0.25 12.6 12.7 12.5 5.3 5.4 5.2 1.27 -- -- 7.8 8.1 7.5 0.6 0.8 0.4 -- 1.25 -- -- 0.585 -- -- -- 0.735 -- -- 0.25 -- 0.1 -- -- 0 8 -- -- 0.76 -- 7.62 -- 1.27 -- -- Recommended Mount Pad e Plastic 20pin 300mil SOP I2 20P2N-A M66515FP Package Dimensions L Sales Strategic Planning Div. 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