TXB0104DRG4 - Texas Instruments - Datasheet.Directory

GXU/ZXU PACKAGE

(TOP VIEW)

A B C

7OE

D OR PW PACKAGE

(TOP VIEW)

GND

VCCA

VCCB

RGY PACKAGE

Exposed

Center

Pad

(TOP VIEW)

1 14

7 8

OE VCCB

GND VCCA

VCCB

RUT PACKAGE

(TOP VIEW)

VCCA

GND

TXB0104

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SCES650F –APRIL 2006–REVISED MAY 2012

4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR

WITH AUTOMATIC DIRECTION SENSING AND ±15-kV ESD PROTECTION

Check for Samples: TXB0104

1FEATURES

2• 1.2 V to 3.6 V on A Port and 1.65 V to 5.5 V on • Latch-Up Performance Exceeds 100 mA Per

B Port (VCCA ≤VCCB) JESD 78, Class II

• VCC Isolation Feature – If Either VCC Input Is at • ESD Protection Exceeds JESD 22

GND, All Outputs Are in the High-Impedance – A Port

State – 2500-V Human-Body Model (A114-B)

• OE Input Circuit Referenced to VCCA – 1500-V Charged-Device Model (C101)

• Low Power Consumption, 5-μA Max ICC – B Port

• Ioff Supports Partial-Power-Down Mode – ±15-kV Human-Body Model (A114-B)

Operation – 1500-V Charged-Device Model (C101)

TERMINAL ASSIGNMENTS

(GXU/ZXU Package)

ABC

4A4 GND B4

3A3 OE B3

2A2 VCCA B2

1A1 VCCB B1

A. N.C. −No internal connection

B. For RGY, if the exposed center pad is used, it must only be connected as a secondary ground or left electrically open.

C. Pull up resistors are not required on both sides for Logic I/O.

D. If pull up or pull down resistors are needed, the resistor value must be over 50 kΩ.

E. 50 kΩis a safe recommended value, if the customer can accept higher Vol or lower Voh, smaller pull up or pull down

resistor is allowed, the draft estimation is Vol = Vccout × 4.5k/(4.5k + Rpu) and Voh = Vccout × Rdw/(4.5k + Rdw).

F. If pull up resistors are needed, please refer to the TXS0104 or contact TI.

G. For detailed information, please refer to application note SCEA043.

1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2NanoFree is a trademark of Texas Instruments.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

YZT PACKAGE

(TOP VIEW)

321

TXB0104

SCES650F –APRIL 2006–REVISED MAY 2012

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

TERMINAL ASSIGNMENTS

(YZT Package)

321

DA4 GND B4

CA3 OE B3

BA2 VCCA B2

AA1 VCCB B1

DESCRIPTION/ORDERING INFORMATION

This 4-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to

track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB

accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation

between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCA should not exceed VCCB.

When the output-enable (OE) input is low, all outputs are placed in the high-impedance state. To ensure the

high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor;

the minimum value of the resistor is determined by the current-sourcing capability of the driver.

The TXB0104 is designed so that the OE input circuit is supplied by VCCA.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,

preventing damaging current backflow through the device when it is powered down.

ORDERING INFORMATION(1)

TAPACKAGE(2) ORDERABLE PART NUMBER TOP-SIDE MARKING(3)

NanoFree™ — WCSP (DSBGA)

0.23-mm Large Bump – YZT Reel of 3000 TXB0104YZTR _ _ _ 2 K _

(Pb-free) 0.625-mm max height

UFBGA – GXU Reel of 2500 TXB0104GXUR YE04

UFBGA – ZXU (Pb-Free) Reel of 2500 TXB0104ZXUR YE04

TXB0104RGYR

QFN – RGY Reel of 1000 YE04

TXB0104RGYRG4

–40°C to 85°C uQFN – RUT Reel of 1000 TXB0104RUTR 2KR

TXB0104D

Tube of 50 TXB0104DG4

SOIC – D TXB0104

TXB0104DR

Reel of 2500 TXB0104DRG4

TXB0104PWR

TSSOP – PW Reel of 2000 YE04

TXB0104PWRG4

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(3) YZT: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).

Product Folder Link(s): TXB0104

TXB0104

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SCES650F –APRIL 2006–REVISED MAY 2012

PIN DESCRIPTION

PIN NO. BALL NO. NAME FUNCTION

D, PW, GXU/

RUT YZT

OR RGY ZXU

1 1 B2 B2 VCCA A-port supply voltage 1.2 V ≤VCCA ≤3.6 V and VCCA ≤VCCB.

2 2 A1 A3 A1 Input/output 1. Referenced to VCCA.

3 3 A2 B3 A2 Input/output 2. Referenced to VCCA.

4 4 A3 C3 A3 Input/output 3. Referenced to VCCA.

5 5 A4 D3 A4 Input/output 4. Referenced to VCCA.

6 – – – NC No connection. Not internally connected.

7 6 B4 D2 GND Ground

3-state output-mode enable. Pull OE low to place all outputs in 3-state mode.

8 12 B3 C2 OE Referenced to VCCA.

9 – – – NC No connection. Not internally connected.

10 7 C4 D1 B4 Input/output 4. Referenced to VCCB.

11 8 C3 C1 B3 Input/output 3. Referenced to VCCB.

12 9 C2 B1 B2 Input/output 2. Referenced to VCCB.

13 10 C1 A1 B1 Input/output 1. Referenced to VCCB.

14 11 B1 A2 VCCB B-port supply voltage 1.65 V ≤VCCB ≤5.5 V.

ABSOLUTE MAXIMUM RATINGS(1)

over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT

VCCA –0.5 4.6

Supply voltage range V

VCCB –0.5 6.5

A port –0.5 4.6

VIInput voltage range V

B port –0.5 6.5

A port –0.5 4.6

Voltage range applied to any output in the high-impedance or

VOV

power-off state B port -0.5 6.5

A port –0.5 VCCA + 0.5

VOVoltage range applied to any output in the high or low state(2) V

B port –0.5 VCCB + 0.5

IIK Input clamp current VI< 0 –50 mA

IOK Output clamp current VO< 0 –50 mA

IOContinuous output current ±50 mA

Continuous current through VCCA, VCCB, or GND ±100 mA

Tstg Storage temperature range –65 150 °C

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) The value of VCCA and VCCB are provided in the recommended operating conditions table.

Product Folder Link(s): TXB0104

TXB0104

SCES650F –APRIL 2006–REVISED MAY 2012

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THERMAL IMPEDANCE RATINGS UNIT

D package(1) 86

GXU/ZXU package(1) 129

PW package(1) 113

θJA Package thermal impedance °C/W

RGY package(2) 47

RUT package TBD

YZT package 90

(1) The package thermal impedance is calculated in accordance with JESD 51-7.

(2) The package thermal impedance is calculated in accordance with JESD 51-5.

RECOMMENDED OPERATING CONDITIONS(1) (2)

VCCA VCCB MIN MAX UNIT

VCCA 1.2 3.6

Supply voltage V

VCCB 1.65 5.5

Data inputs 1.2 V to 3.6 V 1.65 V to 5.5 V VCCI × 0.65(3) VCCI

VIH High-level input voltage V

OE 1.2 V to 3.6 V 1.65 V to 5.5 V VCCA × 0.65 5.5

Data inputs 1.2 V to 5.5 V 1.65 V to 5.5 V 0 VCCI × 0.35(3)

VIL Low-level input voltage V

OE 1.2 V to 3.6 V 1.65 V to 5.5 V 0 VCCA × 0.35

Voltage range applied to any A-port 0 3.6

VOoutput in the high-impedance 1.2 V to 3.6 V 1.65 V to 5.5 V V

B-port 0 5.5

or power-off state A-port inputs 1.2 V to 3.6 V 1.65 V to 5.5 V 40

Input transition

Δt/Δv 1.65 V to 3.6 V 40 ns/V

rise or fall rate B-port inputs 1.2 V to 3.6 V 4.5 V to 5.5 V 30

TAOperating free-air temperature –40 85 °C

(1) The A and B sides of an unused data I/O pair must be held in the same state, i.e., both at VCCI or both at GND.

(2) VCCA must be less than or equal to VCCB and must not exceed 3.6 V.

(3) VCCI is the supply voltage associated with the input port.

Product Folder Link(s): TXB0104

TXB0104

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SCES650F –APRIL 2006–REVISED MAY 2012

ELECTRICAL CHARACTERISTICS(1) (2)

over recommended operating free-air temperature range (unless otherwise noted) TA= 25°C –40°C to 85°C

PARAMETER TEST CONDITIONS VCCA VCCB UNIT

MIN TYP MAX MIN MAX

1.2 V 1.1

VOHA IOH = –20 μA V

1.4 V to 3.6 V VCCA – 0.4

1.2 V 0.9

VOLA IOL = 20 μA V

1.4 V to 3.6 V 0.4

VOHB IOH = –20 μA 1.65 V to 5.5 V VCCB – 0.4 V

VOLB IOL = 20 μA 1.65 V to 5.5 V 0.4 V

IIOE VI= VCCI or GND 1.2 V to 3.6 V 1.65 V to 5.5 V ±1 ±2 μA

A port VIor VO= 0 to 3.6 V 0 V 0 V to 5.5 V ±1 ±2

Ioff μA

B port VIor VO= 0 to 5.5 V 0 V to 3.6 V 0 V ±1 ±2

IOZ A or B port OE = GND 1.2 V to 3.6 V 1.65 V to 5.5 V ±1 ±2 μA

1.2 V 1.65 V to 5.5 V 0.06

1.4 V to 3.6 V 1.65 V to 5.5 V 5

VI= VCCI or GND,

ICCA μA

IO= 0 3.6 V 0 V 2

0 V 5.5 V –2

1.2 V 1.65 V to 5.5 V 3.4

1.4 V to 3.6 V 1.65 V to 5.5 V 5

VI= VCCI or GND,

ICCB μA

IO= 0 3.6 V 0 V –2

0 V 5.5 V 2

1.2 V 1.65 V to 5.5 V 3.5

VI= VCCI or GND,

ICCA + ICCB μA

IO= 0 1.4 V to 3.6 V 1.65 V to 5.5 V 10

VI= VCCI or GND, 1.2 V 1.65 V to 5.5 V 0.05

ICCZA IO= 0, μA

1.4 V to 3.6 V 1.65 V to 5.5 V 5

OE = GND

VI= VCCI or GND, 1.2 V 1.65 V to 5.5 V 3.3

ICCZB IO= 0, μA

1.4 V to 3.6 V 1.65 V to 5.5 V 5

OE = GND

CiOE 1.2 V to 3.6 V 1.65 V to 5.5 V 3 4 pF

A port 5 6

Cio 1.2 V to 3.6 V 1.65 V to 5.5 V pF

B port 11 14

(1) VCCI is the supply voltage associated with the input port.

(2) VCCO is the supply voltage associated with the output port.

Product Folder Link(s): TXB0104

TXB0104

SCES650F –APRIL 2006–REVISED MAY 2012

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TIMING REQUIREMENTS

TA= 25°C, VCCA = 1.2 V VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V UNIT

TYP TYP TYP TYP

Data rate 20 20 20 20 Mbps

twPulse duration Data inputs 50 50 50 50 ns

TIMING REQUIREMENTS

over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted)

VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V

± 0.15 V ± 0.2 V ± 0.3 V ± 0.5 V UNIT

MIN MAX MIN MAX MIN MAX MIN MAX

Data rate 40 40 40 40 Mbps

twPulse duration Data inputs 25 25 25 25 ns

TIMING REQUIREMENTS

over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)

VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V

± 0.15 V ± 0.2 V ± 0.3 V ± 0.5 V UNIT

MIN MAX MIN MAX MIN MAX MIN MAX

Data rate 60 60 60 60 Mbps

twPulse duration Data inputs 17 17 17 17 ns

TIMING REQUIREMENTS

over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)

VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V

± 0.2 V ± 0.3 V ± 0.5 V UNIT

MIN MAX MIN MAX MIN MAX

Data rate 100 100 100 Mbps

twPulse duration Data inputs 10 10 10 ns

TIMING REQUIREMENTS

over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)

VCCB = 3.3 V VCCB = 5 V

± 0.3 V ± 0.5 V UNIT

MIN MAX MIN MAX

Data rate 100 100 Mbps

twPulse duration Data inputs 10 10 ns

Product Folder Link(s): TXB0104

TXB0104

www.ti.com

SCES650F –APRIL 2006–REVISED MAY 2012

SWITCHING CHARACTERISTICS

TA= 25°C, VCCA = 1.2 V VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V

FROM TO

PARAMETER UNIT

(INPUT) (OUTPUT) TYP TYP TYP TYP

A B 6.9 5.7 5.3 5.5

tpd ns

B A 7.4 6.4 6 5.8

A 1 1 1 1

ten OE μs

B 1 1 1 1

A 18 15 14 14

tdis OE ns

B 20 17 16 16

trA, tfA A-port rise and fall times 4.2 4.2 4.2 4.2 ns

trB, tfB B-port rise and fall times 2.1 1.5 1.2 1.1 ns

tSK(O) Channel-to-channel skew 0.4 0.5 0.5 1.4 ns

Max data rate 20 20 20 20 Mbps

SWITCHING CHARACTERISTICS

over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted)

VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V

FROM TO ± 0.15 V ± 0.2 V ± 0.3 V ± 0.5 V

PARAMETER UNIT

(INPUT) (OUTPUT) MIN MAX MIN MAX MIN MAX MIN MAX

A B 1.4 12.9 1.2 10.1 1.1 10 0.8 9.9

tpd ns

B A 0.9 14.2 0.7 12 0.4 11.7 0.3 13.7

A 1111

ten OE μs

B 1111

A 5.9 31 5.7 25.9 5.6 23 5.7 22.4

tdis OE ns

B 5.4 30.3 4.9 22.8 4.8 20 4.9 19.5

trA, tfA A-port rise and fall times 1.4 5.1 1.4 5.1 1.4 5.1 1.4 5.1 ns

trB, tfB B-port rise and fall times 0.9 4.5 0.6 3.2 0.5 2.8 0.4 2.7 ns

tSK(O) Channel-to-channel skew 0.5 0.5 0.5 0.5 ns

Max data rate 40 40 40 40 Mbps

SWITCHING CHARACTERISTICS

over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)

VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V

FROM TO ± 0.15 V ± 0.2 V ± 0.3 V ± 0.5 V

PARAMETER UNIT

(INPUT) (OUTPUT) MIN MAX MIN MAX MIN MAX MIN MAX

A B 1.6 11 1.4 7.7 1.3 6.8 1.2 6.5

tpd ns

B A 1.5 12 1.3 8.4 1 7.6 0.9 7.1

A 1111

ten OE μs

B 1111

A 5.9 31 5.1 21.3 5 19.3 5 17.4

tdis OE ns

B 5.4 30.3 4.4 20.8 4.2 17.9 4.3 16.3

trA, tfA A-port rise and fall times 1 4.2 1.1 4.1 1.1 4.1 1.1 4.1 ns

trB, tfB B-port rise and fall times 0.9 3.8 0.6 3.2 0.5 2.8 0.4 2.7 ns

tSK(O) Channel-to-channel skew 0.5 0.5 0.5 0.5 ns

Max data rate 60 60 60 60 Mbps

Product Folder Link(s): TXB0104

TXB0104

SCES650F –APRIL 2006–REVISED MAY 2012

www.ti.com

SWITCHING CHARACTERISTICS

over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)

VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V

FROM TO ± 0.2 V ± 0.3 V ± 0.5 V

PARAMETER UNIT

(INPUT) (OUTPUT) MIN MAX MIN MAX MIN MAX

A B 1.1 6.3 1 5.2 0.9 4.7

tpd ns

B A 1.2 6.6 1.1 5.1 0.9 4.4

A 1 1 1

ten OE μs

B 1 1 1

A 5.1 21.3 4.6 15.2 4.6 13.2

tdis OE ns

B 4.4 20.8 3.8 16 3.9 13.9

trA, tfA A-port rise and fall times 0.8 3 0.8 3 0.8 3 ns

trB, tfB B-port rise and fall times 0.7 2.6 0.5 2.8 0.4 2.7 ns

tSK(O) Channel-to-channel skew 0.5 0.5 0.5 ns

Max data rate 100 100 100 Mbps

SWITCHING CHARACTERISTICS

over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)

VCCB = 3.3 V VCCB = 5 V

FROM TO ± 0.3 V ± 0.5 V

PARAMETER UNIT

(INPUT) (OUTPUT) MIN MAX MIN MAX

A B 0.9 4.7 0.8 4

tpd ns

B A 1 4.9 0.9 3.8

A 1 1

ten OE μs

B 1 1

A 4.6 15.2 4.3 12.1

tdis OE ns

B 3.8 16 3.4 13.2

trA, tfA A-port rise and fall times 0.7 2.5 0.7 2.5 ns

trB, tfB B-port rise and fall times 0.5 2.1 0.4 2.7 ns

tSK(O) Channel-to-channel skew 0.5 0.5 ns

Max data rate 100 100 Mbps

Product Folder Link(s): TXB0104

TXB0104

www.ti.com

SCES650F –APRIL 2006–REVISED MAY 2012

OPERATING CHARACTERISTICS

TA= 25°C VCCA

1.2 V 1.2 V 1.5 V 1.8 V 2.5 V 2.5 V 3.3 V

VCCB

PARAMETER TEST CONDITIONS UNIT

3.3 V

5 V 1.8 V 1.8 V 1.8 V 2.5 V 5 V to

5 V

TYP TYP TYP TYP TYP TYP TYP

A-port input, B-port output 7.8 10 9 8 8 8 9

CL= 0, f = 10 MHz,

CpdA B-port input, A-port output 12 11 11 11 11 11 11

tr= tf= 1 ns, pF

OE = VCCA

A-port input, B-port output 38.1 28 28 28 29 29 29

CpdB (outputs enabled)

B-port input, A-port output 25.4 19 18 18 19 21 22

A-port input, B-port output 0.01 0.01 0.01 0.01 0.01 0.01 0.01

CL= 0, f = 10 MHz,

CpdA B-port input, A-port output 0.01 0.01 0.01 0.01 0.01 0.01 0.01

tr= tf= 1 ns, pF

OE = GND

A-port input, B-port output 0.01 0.01 0.01 0.01 0.01 0.01 0.03

CpdB (outputs disabled)

B-port input, A-port output 0.01 0.01 0.01 0.01 0.01 0.01 0.04

Product Folder Link(s): TXB0104

A B

VCCA VCCB

One

Shot

One

Shot

One

Shot

One

Shot

TXB0104

SCES650F –APRIL 2006–REVISED MAY 2012

www.ti.com

PRINCIPLES OF OPERATION

Applications

The TXB0104 can be used in level-translation applications for interfacing devices or systems operating at

different interface voltages with one another.

Architecture

The TXB0104 architecture (see Figure 1) does not require a direction-control signal to control the direction of

data flow from A to B or from B to A. In a dc state, the output drivers of the TXB0104 can maintain a high or low,

but are designed to be weak, so that they can be overdriven by an external driver when data on the bus starts

flowing the opposite direction.

The output one shots detect rising or falling edges on the A or B ports. During a rising edge, the one shot turns

on the PMOS transistors (T1, T3) for a short duration, which speeds up the low-to-high transition. Similarly,

during a falling edge, the one shot turns on the NMOS transistors (T2, T4) for a short duration, which speeds up

the high-to-low transition. The typical output impedance during output transition is 70 Ωat VCCO = 1.2 V to 1.8 V,

50 Ωat VCCO = 1.8 V to 3.3 V, and 40 Ωat VCCO = 3.3 V to 5 V.

Figure 1. Architecture of TXB0104 I/O Cell

Input Driver Requirements

Typical IIN vs VIN characteristics of the TXB0104 are shown in Figure 2. For proper operation, the device driving

the data I/Os of the TXB0104 must have drive strength of at least ±2 mA.

Product Folder Link(s): TXB0104

IIN

VIN

VT/4 kW

–(VD – VT)/4 kW

A. VT is the input threshold voltage of the TXB0104 (typically VCCI/2).

B. VD is the supply voltage of the external driver.

TXB0104

www.ti.com

SCES650F –APRIL 2006–REVISED MAY 2012

Figure 2. Typical IIN vs VIN Curve

Power Up

During operation, ensure that VCCA ≤VCCB at all times. During power-up sequencing, VCCA ≥VCCB does not

damage the device, so any power supply can be ramped up first. The TXB0104 has circuitry that disables all

output ports when either VCC is switched off (VCCA/B = 0 V).

Enable and Disable

The TXB0104 has an OE input that is used to disable the device by setting OE = low, which places all I/Os in the

high-impedance (Hi-Z) state. The disable time (tdis) indicates the delay between when OE goes low and when the

outputs acutally get disabled (Hi-Z). The enable time (ten) indicates the amount of time the user must allow for the

one-shot circuitry to become operational after OE is taken high.

Pullup or Pulldown Resistors on I/O Lines

The TXB0104 is designed to drive capacitive loads of up to 70 pF. The output drivers of the TXB0104 have low

dc drive strength. If pullup or pulldown resistors are connected externally to the data I/Os, their values must be

kept higher than 50 kΩto ensure that they do not contend with the output drivers of the TXB0104.

For the same reason, the TXB0104 should not be used in applications such as I2C or 1-Wire where an open-

drain driver is connected on the bidirectional data I/O. For these applications, use a device from the TI TXS01xx

series of level translators.

Product Folder Link(s): TXB0104

From Output

Under Test

LOAD CIRCUIT FOR

ENABLE/DISABLE

TIME MEASUREMENT

2 × VCCO

Open

50 kW

VCCI

0 V

VCCI/2 VCCI/2

VOLTAGE WAVEFORMS

PROPAGATION DELAY TIMES VOLTAGE WAVEFORMS

PULSE DURATION

Input

tPZL/tPLZ

tPHZ/tPZH

2 × VCCO

Open

TEST S1

A. CL includes probe and jig capacitance.

B. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, ZO = 50 Ω, dv/dt ≥ 1 V/ns.

C. The outputs are measured one at a time, with one transition per measurement.

D. tPLH and tPHL are the same as tpd.

E. VCCI is the VCC associated with the input port.

F. VCCO is the VCC associated with the output port.

G. All parameters and waveforms are not applicable to all devices.

50 kW

From Output

Under Test

1 MW

15 pF 15 pF

LOAD CIRCUIT FOR MAX DATA RATE,

PULSE DURATION PROPAGATION

DELAY OUTPUT RISE AND FALL TIME

MEASUREMENT

tPLH tPHL

0 V

VCCO/2

VCCI/2 VCCI/2

0.9 y VCCO

VCCO/2

0.1 y VCCO tf

VCCI

Input

Output VOH

VOL

TXB0104

SCES650F –APRIL 2006–REVISED MAY 2012

www.ti.com

PARAMETER MEASUREMENT INFORMATION

Figure 3. Load Circuits and Voltage Waveforms

Product Folder Link(s): TXB0104

TXB0104

www.ti.com

SCES650F –APRIL 2006–REVISED MAY 2012

REVISION HISTORY

Changes from Revision E (February 2010) to Revision F Page

• Added notes to pin out graphics. .......................................................................................................................................... 1

Product Folder Link(s): TXB0104

PACKAGE OPTION ADDENDUM

www.ti.com 7-May-2012

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

TXB0104D ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

TXB0104DG4 ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

TXB0104DR ACTIVE SOIC D 14 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

TXB0104DRG4 ACTIVE SOIC D 14 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

TXB0104GXUR ACTIVE BGA

MICROSTAR

JUNIOR

GXU 12 2500 TBD SNPB Level-1-240C-UNLIM

TXB0104PWR ACTIVE TSSOP PW 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

TXB0104PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

TXB0104RGYR ACTIVE VQFN RGY 14 3000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

TXB0104RGYRG4 ACTIVE VQFN RGY 14 3000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

TXB0104RUTR ACTIVE UQFN RUT 12 3000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

TXB0104YZTR ACTIVE DSBGA YZT 12 3000 Green (RoHS

& no Sb/Br) SNAGCU Level-1-260C-UNLIM

TXB0104ZXUR ACTIVE BGA

MICROSTAR

JUNIOR

ZXU 12 2500 Green (RoHS

& no Sb/Br) SNAGCU Level-1-260C-UNLIM

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

PACKAGE OPTION ADDENDUM

www.ti.com 7-May-2012

Addendum-Page 2

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF TXB0104 :

•Automotive: TXB0104-Q1

NOTE: Qualified Version Definitions:

•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

TXB0104DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1

TXB0104GXUR BGA MI

CROSTA

R JUNI

GXU 12 2500 330.0 8.4 2.3 2.8 1.0 4.0 8.0 Q2

TXB0104PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1

TXB0104RGYR VQFN RGY 14 3000 330.0 12.4 3.75 3.75 1.15 8.0 12.0 Q1

TXB0104RUTR UQFN RUT 12 3000 180.0 8.4 1.95 2.3 0.75 4.0 8.0 Q1

TXB0104YZTR DSBGA YZT 12 3000 180.0 8.4 1.49 1.99 0.75 4.0 8.0 Q2

TXB0104ZXUR BGA MI

CROSTA

R JUNI

ZXU 12 2500 330.0 8.4 2.3 2.8 1.0 4.0 8.0 Q2

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

TXB0104DR SOIC D 14 2500 367.0 367.0 38.0

TXB0104GXUR BGA MICROSTAR

JUNIOR GXU 12 2500 340.5 338.1 20.6

TXB0104PWR TSSOP PW 14 2000 367.0 367.0 35.0

TXB0104RGYR VQFN RGY 14 3000 367.0 367.0 35.0

TXB0104RUTR UQFN RUT 12 3000 202.0 201.0 28.0

TXB0104YZTR DSBGA YZT 12 3000 210.0 185.0 35.0

TXB0104ZXUR BGA MICROSTAR

JUNIOR ZXU 12 2500 340.5 338.1 20.6

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

Pack Materials-Page 2

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