DATA SH EET
Product specification
Supersedes data of March 1992
File under Integrated Circuits, IC01
1996 Sep 02
INTEGRATED CIRCUITS
TDA1591
PLL stereo decoder and noise
blanker
1996 Sep 02 2
Philips Semiconductors Product specification
PLL stereo decoder and noise blanker TDA1591
FEATURES
•Adjustment-free voltage controlled PLL oscillator for
ceramic resonator (f = 456 kHz)
•Pilot signal dependent mono/stereo switching
•Analog control of mono/stereo change over
[stereo blend, Stereo Noise Controller (SNC)]
•Adjacent channel noise suppression (114 kHz)
•Pilot canceller
•Analog control of de-emphasis; High Cut Control (HCC)
•Applicable as source selector for AM/FM/cassette
switching
•Separate interference noise detector
•Integrated input low-pass filter for delayed noise
blanking
•Noise blanking at MPX-demodulator outputs
•Internal voltage stabilization.
GENERAL DESCRIPTION
The TDA1591 is a monolithic bipolar integrated circuit
providing the stereo decoder function and noise blanking
for FM car radio applications.
The device operates in a power supply range of
7.5 to 12 V.
QUICK REFERENCE DATA
ORDERING INFORMATION
SYMBOL PARAMETER MIN. TYP. MAX. UNIT
VPsupply voltage (pin 5) 7.5 10 12 V
IPsupply current −12 −mA
Vo(rms) audio output signal (RMS value) −900 −mV
THD total harmonic distortion −0.1 0.3 %
S/N signal-to-noise ratio −76 −dB
αcs channel separation −40 −dB
Vtrigg interference voltage trigger level −10 −mV
TYPE
NUMBER PACKAGE
NAME DESCRIPTION VERSION
TDA1591 DIP20 plastic dual in-line package; 20 leads (300 mil) SOT146-1
TDA1591T SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
1996 Sep 02 3
Philips Semiconductors Product specification
PLL stereo decoder and noise blanker TDA1591
BLOCK DIAGRAM
handbook, full pagewidth
stereo
indication SNC HCC
Vi MPX 68 kΩ82 kΩ
0.1 µF68 pF Ccomp
470 kΩ0.1
µF
10 kΩ
Vref = 1 to 5 V
from pin 5 27 kΩ
27 kΩ
from IF level detector
100 kΩ100 kΩ
12 3 4567 8 9 10
111213141516
20 19 18 17
+
+
+
+
6.8 nF 6.8 nF
47 kΩ
0.22 µF
0.22 µF
V
0.22 µF
47 kΩ
47 kΩ
47 kΩ0.22 µF
mute on
VCO off
6.5 kΩ
6.5
kΩ
PILOT
DETECTOR SWITCH STEREO
BLEND
4-POLE
FILTER
(80 kHz) PILOT
CANCEL 2-POLE
FILTER
(30 kHz)
GATE
AND
HCC
PHASE
DETECTOR LOGIC INTERFERENCE
DETECTOR
PULSE
FORMER
VCO VOLTAGE
STABILIZER REFERENCE
CURRENT
NOISE
DETECTOR
470
pF
2.2
kΩ
470
pF
1.2
nF
0.1
µF
100 kΩ
CSB456F11
(Murata)
22
nF
0.22
µF
27 kΩ
VP = 10 V
INFI interference signal (TDA1596, pin 3)
19 kHz TDA1591
R1
75 kΩ
forced
mono
7.4 kΩ
7.4 kΩ
47
nF
IDENT
38 kHz
100
µF
FB-R
R2
R3
FB-L
10 Ω
(1)
MEH027
iAUX
VoL
VoR
ViAUX
PILOT
12 kΩ
Fig.1 Block diagram with external components, also used as test circuit.
(1) Simulates the roll-off of the FM demodulator.
1996 Sep 02 4
Philips Semiconductors Product specification
PLL stereo decoder and noise blanker TDA1591
PINNING
SYMBOL PIN DESCRIPTION
PLL 1 phase locked loop filter
OSC 2 oscillator input/output pin for
ceramic resonator
GND 3 ground (0 V)
Iref 4 reference current
VP5 supply voltage (+10 V)
INFI 6 interference signal input
PUFO 7 pulse former time constant;
VCO off
NDET 8 noise detector time constant;
mute on
FB-L 9 AF feedback input for left audio
signal
VoL 10 AF output signal left
VoR 11 AF output signal right
FB-R 12 AF feedback input for right audio
signal
CDEEL 13 de-emphasis capacitor for left
channel
CDEER 14 de-emphasis capacitor for right
channel
HCC 15 HCC input for de-emphasis control
SNC 16 stereo blend input
Vref 17 externally applied reference
voltage of 1 to 5 V
IDENT 18 identification output (HIGH = pilot
existing; stereo)
PILOT 19 pilot detector level (forced mono
input)
Vi MPX 20 MPX input signal from IF
demodulator Fig.2 Pin configuration.
handbook, halfpage
TDA1591
MHA363
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
PLL
OSC
GND
INFI
PUFO
NDET
FB-L
VoL
Iref
VP
Vi MPX
VoR
CDEEL
CDEER
HCC
SNC
IDENT
PILOT
Vref
FB-R
1996 Sep 02 5
Philips Semiconductors Product specification
PLL stereo decoder and noise blanker TDA1591
FUNCTIONAL DESCRIPTION
Adapting the MPX input to the level of the FM demodulator
output is realized by the value of input resistor R1
(see Fig.3). The total gain of the stereo decoder is
applicable by varying the feedback resistors R2 and R3
(see Figs 1 and 4).
In mute position and the VCO switched off (pin 7), the
output amplifiers can be used for cassette playback,
AM stereo purpose or other signal sources.
The Stereo Noise Controller (SNC) provides a smooth
mono to stereo take-over (see Fig.5).
For High Cut Control (HCC), the de-emphasis time
constant can be changed to higher values
(see Figs 7 and 8). This function is controlled by an analog
input signal.
The noise blanking facility is achieved by gating the stereo
decoder output signal.
The interference detector generates a gating pulse
preferable forced by the level detector voltage of the IF
part.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
Note
1. Equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor.
SYMBOL PARAMETER MIN. MAX. UNIT
VPsupply voltage (pin 5) 0 13.2 V
Ptot total power dissipation 0 0.25 W
Tstg storage temperature −55 +150 °C
Tamb operating ambient temperature −40 +85 °C
Ves electrostatic handling; note 1
pins 1 and 16 −400 +400 V
pin 5 −300 +300 V
all other pins −600 +600 V
1996 Sep 02 6
Philips Semiconductors Product specification
PLL stereo decoder and noise blanker TDA1591
CHARACTERISTICS
VP= 10 V; Tamb =25°C; input signal Vi MPX(p-p) = 1.7 V; m = 100% (∆f=±75 kHz, fmod = 1 kHz); de-emphasis of 50 µs
and series resistor at input R1 = 150 kΩ; measurements taken in Fig.1; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply
VPsupply voltage (pin 5) 7.5 10 12 V
IPsupply current −12 −mA
Stereo decoder
Vi MPX(p-p) MPX input signal on pin 20
(peak-to-peak value) −1.7 −V
∆Vi MPX(p-p) overdrive margin of MPX input signal THD = 1% 3 −−dB
Vo(rms) AF mono output signal at pins 10 and 11
(RMS value) without pilot −900 −mV
∆Vooverdrive margin of output signal THD = 1% 3 −−dB
V10-11/Vodifference of output voltage levels −−1dB
V
o 10,11 DC output voltage (pins 10 and 11) 3.3 3.8 4.3 V
Ro 10,11 output resistance −130 −Ω
α
cs channel separation pin 16 open-circuit;
see Fig.6 −40 −dB
THD total harmonic distortion −0.1 0.3 %
S/N signal-to-noise ratio f = 20 to 16000 Hz −76 −dB
α19 pilot signal suppression f = 19 kHz −50 −dB
α38 subcarrier suppression f = 38 kHz −50 −dB
α57 f = 57 kHz −46 −dB
α76 f = 76 kHz −60 −dB
IM2 intermodulation for fspur = 1 kHz fmod = 10 kHz; note 1 −60 −dB
IM3 fmod = 13 kHz; note 1 −58 −dB
α57ARI traffic radio (ARI) f = 57 kHz; note 2 −70 −dB
α67 Subsidiary Communication Authorization
(SCA) f = 67 kHz; note 3 70 −−dB
α114 Adjacent Channel Interference (ACI) f = 114 kHz; note 4 −80 −dB
α190 f = 190 kHz; note 4 −70 −dB
PSRR power supply ripple rejection f = 100 Hz;
Vripple(rms) = 100 mV −35 −dB
VCO (pin 2)
fosc oscillator frequency (ceramic resonator) −456 −kHz
frequency range of free running oscillator 452 −460 kHz
∆f/f capture and holding range −1−%
V7VCO-off voltage (pin 7) 0 −0.6 V
1996 Sep 02 7
Philips Semiconductors Product specification
PLL stereo decoder and noise blanker TDA1591
Mono/stereo control (pins 16, 17 and 19)
Vi pilot(rms) pilot threshold voltage for automatic switching
by pilot input voltage (RMS value) stereo on −24 30 mV
stereo off 820−mV
HYS hysteresis of pilot threshold voltage −2−dB
V19 switching voltage for external mono control
(pin 19) 0−1V
V
ref reference input voltage range (pin 17) 1 −5V
V
16-17 control voltage for channel separation due to
pin 17 (Vref)αcs = 6 dB; see Fig.5 −−85 −mV
αcs = 26 dB; see Fig.5 −−32 −mV
Pilot indicator logic level output (pin 18)
V18 LOW voltage I18 =−200 µA−250 400 mV
I18 HIGH current V18 =10V −−1µA
Muting (pin 8)
MUTEatt mute attenuation (pin 8) V8< 0.4 V −80 −dB
V8>4V −−0.2 dB
VO(offset) DC offset voltage (pins 10 and 11) after muting −−±400 mV
HCC (pin 15)
CRdeem control range of de-emphasis see Figs 7 and 8
for European standard Cdeem = 6.8 nF 50 −150 µs
for USA standard Cdeem =10nF 75 −225 µs
V15-17 control voltage (pin 15 due to pin 17) in both
standards lower value CRdeem −0−mV
upper value CRdeem −−300 −mV
Noise interference detector
Vtrigg trigger threshold (pin 6) fint = 120 kHz
V8(DC) = 7.7 V −10 −mV
V8(DC) = 6.7 V −100 −mV
∆V8voltage offset as a function of Vtrigg V6 trigg =10mV −200 −mV
V6 trigg = 100 mV −2.3 −V
tsup AF suppression time; pulse width −40 −µs
I
13,14 input offset current (pins 13 and 14) during AF suppression
time −20 −nA
Vpulse trigger sensitivity (pin 6) τpulse =10µs−10 −mV
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
1996 Sep 02 8
Philips Semiconductors Product specification
PLL stereo decoder and noise blanker TDA1591
Notes
1. Intermodulation suppression [Beat Frequency Components (BFC)]:
;
;
measured with 91% mono signal; fmod = 10 kHz or 13 kHz; 9% pilot signal.
2. ARI suppression:
measured with 91% stereo signal; fmod = 1 kHz; 9% pilot signal; 5% ARI subcarrier
(fs= 57 kHz; fmod = 23 Hz; AM m = 0.6).
3. Subsidiary Communication Authorization (SCA):
;
measured with 81% mono signal; fmod = 1 kHz; 9% pilot signal; 10% SCA subcarrier (fs= 67 kHz, unmodulated).
4. Adjacent Channel Interference (ACI):
;
;
measured with 90% mono signal; fmod = 1 kHz; 9% pilot signal; 1% spurious signal
(fs= 110 kHz or 186 kHz, unmodulated).
IM2 Vo(signal) at 1 kHz()
V
o(spurious) at 1 kHz()
--------------------------------------------------------
=fs2 10 kHz×()19 kHz–=
IM3 Vo(signal) at 1 kHz()
V
o(spurious) at 1 kHz()
--------------------------------------------------------
=fs3 13 kHz×()38 kHz–=
α57ARI Vo(signal) at 1 kHz()
V
o(spurious) at 1 kHz 23 Hz±()
-----------------------------------------------------------------------------
=
α67 Vo(signal) at 1 kHz()
V
o(spurious) at 9 kHz()
--------------------------------------------------------
=fs238kHz×()67 kHz–=
α114 Vo(signal) at 1 kHz()
V
o(spurious) at 4 kHz()
--------------------------------------------------------
=fs110 kHz 3 38 kHz×()–=
α
190 Vo(signal) at 1 kHz()
V
o(spurious) at 4 kHz()
--------------------------------------------------------
=fs186 kHz 5 38 kHz×()–=
1996 Sep 02 9
Philips Semiconductors Product specification
PLL stereo decoder and noise blanker TDA1591
Fig.3 Input signal as a function of series input resistor R1.
handbook, full pagewidth
300
R1 (kΩ)
1000
(V)
0200
2
4
Vi MPX(p-p)
MEH029
Fig.4 Overall signal gain as a function of feedback
resistors R2 and R3 (R1 = 150 kΩ).
handbook, halfpage
G
(dB)
0204060
R2, R3 (kΩ)
0
−2
−4
−6
2
4
6
MEH030
Fig.5 Stereo blend characteristic (SNC).
handbook, halfpage
−200 −100 0
control voltage V16−17 (mV)
50
40
30
20
10
0
αcs
(dB)
MEH031
1996 Sep 02 10
Philips Semiconductors Product specification
PLL stereo decoder and noise blanker TDA1591
Fig.6 Channel separation as a function of audio frequency.
(1) Coupling capacitor CK at pin 20 = 10 µF.
(2) Coupling capacitor CK at pin 20 = 0.1 µF.
handbook, full pagewidth
(1)
(2)
(dB)
αcs
0
50
10
20
30
40
MEH032
10 foAF (Hz)
102103104105
handbook, full pagewidth
foAF (Hz)
VoAF
(dB)
(2)
(1)
−10
2
0
−6
−8
−2
−4
MEH033
10 102103104
Fig.7 HCC as a function of audio frequency (pin 7 connected to GND; without pre-emphasis).
(1) V15-17 =0.
(2) V15-17 =−300 mV.
1996 Sep 02 11
Philips Semiconductors Product specification
PLL stereo decoder and noise blanker TDA1591
Fig.8 HCC with fmod = 10 kHz.
handbook, full pagewidth
0
control voltage V15−17 (mV)
−200−300
0
−100
−10
−2
∆Vo
(dB)
−4
−6
−8
MEH034
1996 Sep 02 12
Philips Semiconductors Product specification
PLL stereo decoder and noise blanker TDA1591
TEST INFORMATION
Fig.9 TDA1591 test board (component side).
handbook, full pagewidth
MHA364
12 kΩ
47 kΩ
47 kΩ
2.2 kΩ
47 kΩ
47 kΩ
27 kΩ
10 Ω27 kΩ
100 kΩ
100 kΩ
470 kΩ
10 kΩ
68 kΩ82 kΩ
27 kΩ
100 kΩ
100
µF
100
nF 100
nF
220 nF
220
nF
CSB456F11
220
nF
470
pF 470
pF
220
nF
22
nF
1.2 nF
220 nF
100 nF
47 nF
6.8 nF
6.8 nF
TDA1591
101.5
76.5
1
AUX IN
AF OUT
AF OUT
AUX IN
MUTE
VCO
OFF
MPX IN
Intf IN
Vref
SNC
HCC
PIL
GND
VP
MONO
Dimensions in mm.
1996 Sep 02 13
Philips Semiconductors Product specification
PLL stereo decoder and noise blanker TDA1591
PACKAGE OUTLINES
UNIT A
max. 1 2 b1cD E e M
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT146-1 92-11-17
95-05-24
A
min. A
max. bZ
max.
w
ME
e1
1.73
1.30 0.53
0.38 0.36
0.23 26.92
26.54 6.40
6.22 3.60
3.05 0.2542.54 7.62 8.25
7.80 10.0
8.3 2.04.2 0.51 3.2
0.068
0.051 0.021
0.015 0.014
0.009 1.060
1.045 0.25
0.24 0.14
0.12 0.010.10 0.30 0.32
0.31 0.39
0.33 0.0780.17 0.020 0.13
SC603
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
20
1
11
10
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
(1)
(1) (1)
DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1
1996 Sep 02 14
Philips Semiconductors Product specification
PLL stereo decoder and noise blanker TDA1591
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZ
ywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65 0.30
0.10 2.45
2.25 0.49
0.36 0.32
0.23 13.0
12.6 7.6
7.4 1.27 10.65
10.00 1.1
1.0 0.9
0.4 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT163-1 92-11-17
95-01-24
10
20
wM
bp
detail X
Z
e
11
1
D
y
0.25
075E04 MS-013AC
pin 1 index
0.10 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.51
0.49 0.30
0.29 0.050
1.4
0.055
0.42
0.39 0.043
0.039 0.035
0.016
0.01
0.25
0.01 0.004
0.043
0.016
0.01
0 5 10 mm
scale
X
θ
A
A1
A2
HE
Lp
Q
E
c
L
vMA
(A )
3
A
SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
1996 Sep 02 15
Philips Semiconductors Product specification
PLL stereo decoder and noise blanker TDA1591
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook”
(order code 9398 652 90011).
DIP
SOLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
REPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
•A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
•The longitudinal axis of the package footprint must be
parallel to the solder flow.
•The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
1996 Sep 02 16
Philips Semiconductors Product specification
PLL stereo decoder and noise blanker TDA1591
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
1996 Sep 02 17
Philips Semiconductors Product specification
PLL stereo decoder and noise blanker TDA1591
NOTES
1996 Sep 02 18
Philips Semiconductors Product specification
PLL stereo decoder and noise blanker TDA1591
NOTES
1996 Sep 02 19
Philips Semiconductors Product specification
PLL stereo decoder and noise blanker TDA1591
NOTES
Internet: http://www.semiconductors.philips.com
Philips Semiconductors – a worldwide company
© Philips Electronics N.V. 1996 SCA51
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
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252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 825 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101, Fax. +43 1 60 101 1210
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773
Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 689 211, Fax. +359 2 689 102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. +45 32 88 2636, Fax. +45 31 57 1949
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 615 800, Fax. +358 615 80920
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300
Greece: No. 15, 25th March Street, GR 17778 TAVROS,
Tel. +30 1 4894 339/911, Fax. +30 1 4814 240
Hungary: see Austria
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.
Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722
Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,
Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Middle East: see Italy
Printed in The Netherlands 517021/1200/02/pp20 Date of release: 1996 Sep 02 Document order number: 9397 750 00921
