Ver. 201007 Multilayer Power Inductor CIG22B Series (2520/ EIA 1008) APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Excellent efficiency (High Q) High Current Magnetically shielded structure Free of all RoHS-regulated substances Monolithic structure for high reliability 2.5mm 1.6mm 3.3mm DIMENSION Type 22 Dimension [mm] L W 2.50.2 2.00.2 t d 1.0max 0.550.25 DESCRIPTION Part no. Size Inductance DC Rated Current (A) (inch/mm) (uH)@1MHz Resistance() Max. CIG22B1R0MNE 1008/2520 1.0 20 % 0.1220 % 1.20 CIG22B2R2MNE 1008/2520 2.2 20 % 0.1820 % 1.10 CIG22B3R3MNE 1008/2520 3.3 20 % 0.2120 % 1.05 CIG22B4R7MNE 1008/2520 4.7 20 % 0.2520 % 1.00 Rated Current: DC current value when the self-generation of heat rises to 40 (Reference ambient temperature:20) Operating temperature range -40 to +85C Test equipment:Agilent 4291B+16193A CHARACTERISTIC DATA 1) Frequency characteristics (Typ.) 2) DC Bias characteristics (Typ.) Ver. 201007 PRODUCT IDENTIFICATION CI (1) (1) (3) (5) (7) (8) G (2) 22 (3) B (4) 1R0 (5) M (6) N (7) E (8) Chip Inductor (2) Power Inductor Dimension (4) Product Series (B:High Current Type& Low Profile) Inductance (1R0:1.0uH) (6) Tolerance (M:20%) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard) Packaging(C:paper tape, E:embossed tape) RECOMMENDED SOLDERING CONDITION FLOW SOLDERING REFLOW SOLDERING PACKAGING Packaging Style Quantity(pcs/reel) Embossed Taping 3000 NOTICE :All specifications are subject to change without previous notice. Please contact with product representatives or engineers to check specifications.