NTC MULTILAYER CHIP NTC THERMISTORS OPERATING TEMP. K55VJ125C FEATURES Y125C YB Y YEIAJ Y YGuaranteed up to 125C. YLarge B constant for higher temperature sensing capability. YIdeal for automatic mounting in bulk or from tapes because of front-rear symmetry. YAvailable in a standard EIA compatible case size. YImproved reliability due to use of internal electrodes. APPLICATIONS YTelecommunications equipmentDmobile telephones,cellular telephones, cordless telephones, etc. YOffice automationDprinters, facsimiles, word processors, etc. YConsumer electronicsDVCRs, color television sets, LCD television sets, CD players, etc. YBattery protection circuit Y YOA Y CD Y ORDERING CODE 9 1 3 5 7 [mm] [E] B [K] TB NTC S0 S1 1.0P0.5f0402g 1.6P0.8f0603g 2 4 P R S fg 102 154 295 410 1000 150000 5 K55 10 [C] 6 8 [L] B [L] J K M [C] P10 2950 4100 Q H M 5 M10 M20 M3 125 11 Q Q= T B P S 1 S 1 0 3 K 4 4 0 H 5 Q 1 2 3 4 5 6 7 8 3 5 7 Dimension[mm] Nominal Zero-Power Resistance[E] Nominal B constant[K] S0 S1 NTC THERMISTOR 1.0P0.5f0402g 1.6P0.8f0603g 2 4 Shape P Plated terminal Packaging R S Tape&Reel Bulk example 102 154 1000 150000 example 295 410 SymbolP10 2950 4100 8 Resistance tolerance[L] B constant tolerance[L] M 5 M10 M20 Min. temperature[C] 5 K55 10 Q H M3 125 11 Internal code Q 486 11 Max. temperature[C] 6 J K M 10 9 1 Type TB 9 Standard product Q=Blank space EXTERNAL DIMENSIONS Type 1005 f0402g 1608 f0603g L 1.0M0.05 W 0.5M0.05 T 0.5M0.05 e 0.25M0.10 f0.039M0.002g f0.020M0.002g f0.020M0.002g f0.010M0.004g 1.6M0.15 0.8M0.15 0.8M0.15 0.35M0.25 f0.063M0.006g f0.031M0.006g f0.031M0.006g f0.014M0.010g Unit:mm fInchg R-TR-T CHARACTERISTICS 1005typef0402g 1608typef0603g 9 THERMISTORS SPECIFICATIONS Tolerance fSymbolsg R25 M5%fJg, M10%fKg, M20%fMg B Constant Selection Guide P.12 M3% fHg Part Numbers P.488 Electrical Characteristics P.489 Packaging P.490 Reliability Data Precautions P.492 OOO etc 487 PART NUMBERS 1005TYPE R25 Ordering Code [kE] B B constant Thermal time Dissipation fK:25/85Cg constant factor TBP S0 Z 222 Q 410 H 5Q 2.2 4100 TBP S0 Z 332 Q 410 H 5Q 3.3 4100 TBP S0 Z 472 Q 410 H 5Q 4.7 4100 TBP S0 Z 682 Q 410 H 5Q 6.8 4100 TBP S0 Z 103 Q 410 H 5Q 10 4100 TBP S0 Z 153 Q 410 H 5Q 15 4100 TBP S0 Z 223 Q 440 H 5Q 22 4400 TBP S0 Z 333 Q 440 H 5Q 33 4400 TBP S0 Z 473 Q 455 H 5Q 47 4550 TBP S0 Z 683 Q 455 H 5Q 68 4550 TBP S0 Z 104 Q 455 H 5Q 100 4550 TBP S0 Z 154 Q 455 H 5Q 150 4550 T3 sec 0.5V2.0 mW/C Rated Power Remark 35mW R=S=J,K,M ZPlease specify the packaging codefRDtape & reel, SDBulkgand Q the resistance tolerance codefJ, K, Mg. 1608TYPE Ordering Code R25 [kE] B B constant Thermal time Dissipation fK:25/85Cg constant factor TBP S1 Z 470 Q 295 H 5Q 0.047 2950 TBP S1 Z 680 Q 295 H 5Q 0.068 2950 TBP S1 Z 101 Q 315 H 5Q 0.100 3150 TBP S1 Z 151 Q 315 H 5Q 0.150 3150 TBP S1 Z 221 Q 410 H 5Q 0.22 4100 TBP S1 Z 331 Q 410 H 5Q 0.33 4100 TBP S1 Z 471 Q 410 H 5Q 0.47 4100 TBP S1 Z 681 Q 410 H 5Q 0.68 4100 TBP S1 Z 102 Q 410 H 5Q 1.0 4100 TBP S1 Z 152 Q 410 H 5Q 1.5 4100 TBP S1 Z 222 Q 410 H 5Q 2.2 4100 TBP S1 Z 332 Q 410 H 5Q 3.3 4100 TBP S1 Z 472 Q 440 H 5Q 4.7 4400 TBP S1 Z 682 Q 440 H 5Q 6.8 4400 TBP S1 Z 103 Q 440 H 5Q 10 4400 TBP S1 Z 153 Q 460 H 5Q 15 4600 TBP S1 Z 223 Q 460 H 5Q 22 4600 TBP S1 Z 333 Q 460 H 5Q 33 4600 TBP S1 Z 473 Q 475 H 5Q 47 4750 TBP S1 Z 683 Q 475 H 5Q 68 4750 TBP S1 Z 104 Q 475 H 5Q 100 150 4750 4750 TBP S1 Z 154 Q 475 H 5Q T5 sec R=S= ZPlease specify the packaging codefRDtape & reel, SDBulkgand Q the resistance tolerance code. 488 1.0V2.5 mW/C Rated Power Remark 63mW ELECTRICAL CHARACTERISTICS 1005typef0402g High Temperature Life Test Test Condition 125C Damp Heatfsteady stateg Test Condition 85C95% 9 THERMISTORS 1608typef0603g High Temperature Life Test Test Condition 125C Damp Heatfsteady stateg Test Condition 85C95% 489 PACKAGING Standard quantity 1005 (0402) Thickness [mm] 0.5 (0.020) 1608 f0603g 0.8 f0.031g Type Leader and Blank portion Standard quantity [pcs] Bulk Taping 10000 10000 4000 4000 Tape material Reel size UnitDmm fInchg Taping Dimensions Top Tape Strength 8mm Paper tapef0.315inches wideg Type 1005f0402g 1608f0603g 0.10.7N The top tape requires a peel;-off force of 0.1V0.7N in the direction of the arrow as illustrated below. Insertion pitch Tape thickness Chip cavity A B F T 0.65M0.1 1.15M0.1 2.0M0.05 0.8max f0.026M0.004g f0.045M0.004g f0.079M0.002g f0.031maxg 1.0M0.2 1.8M0.2 4.0M0.1 1.1max f0.039M0.008g f0.071M0.008g f0.157M0.004g f0.043maxg UnitDmmfInchg 490 1/2 RELIABILITY DATA MULTILAYER CHIP NTC THERMISTORS Specified Value Test Methods and Remarks Item 1005(0402) 1608(0603) 1. Operating Temperature Range K55 to J125C 2. Storage Temperature Range K55 to J125C 35mW 3. Rated Power 4. Nominal Zero-Power Resistance 63mW 2.2V150kE 0.047V150kE M 5L M 5L M 10L M 10L M 20L 5. Nominal B Constant 6. Dissipation Constantfsingle unitg Measuring electric powerD0.1mW max. M 20L 4100V4550K 2950V4750K M3L M3L 0.5 to 2.0mWNC 1.0 to 2.5mWNC This represents the amount of electric power required to raise the temperature of the element by 1C through self-heating under thermal equilibrium. Within 5 sec. This represents the amount of time for the temperature of the thermistor element to change by 63.2L of the difference between the initial temperature and the ambient temperature by the drastic change of power application into thermistor from non-zero-power to zero-power state. Within 3 sec. Measure the resistance at the ambient temperatures of 25M0.2C and J85M0.2C. This represents the maximum ambient temperature at which rated power could be applied. 25C 8. Rated Ambient Temperature This represents the relations between the ambient temperature and the maximum permissible power. 9. Electric Power Derating Curve As shown in the figure at right. 10. Resistance to Flexure of Substrate R25 changeDWithin M3L R25 changeDWithin M5L B constant changeD B constant changeD Within M1L Within M2L 9 THERMISTORS 7. Thermal Time Constantfsingle unitg Ambient temperatureD25M0.2C WarpD2mm Testing boardDglass-epoxy-resin substrate Board thicknessD0.8mm Pressing speedD0.5mmNsec. DurationD30 sec. 11. Adhesion of Terminal Electrode R25 changeDWithin M3L R25 changeDWithin M5L Applied forceD5N B constant changeD B constant changeD DurationD10sec. Within M1L Within M2L 493 2/2 RELIABILITY DATA MULTILAYER CHIP NTC THERMISTORS Specified Value Test Methods and Remarks Item 1005(0402) 12. Solderability 13. Resistance to Soldering 1608(0603) At least 75% of terminal At least 80% of terminal According to JIS C5102 clause 8.4. electrode is covered by new electrode is covered by new Solder temperatureD230M5C solder. solder. DurationD4M1 sec. R25 changeDWithin M3L R25 changeDWithin M5L Reflow solderingD B constant changeD B constant changeD Solder temperatureD240C Within M2L Within M1L DurationD5 sec. Preheating temperatureD150C Preheating timeD90 sec. Number of reflowsD3 times testing substrateDglass-epoxy-resin substrate 14. Thermal Shock R25 changeD Within M3L R25 changeD Within M5L B Constant changeD B Constant changeD Conditions for 1 cycleNStep 1DK55M2C Within M3L Within M1L 30 min. Step 2DRoom temperature15 min. Step 3DJ125M2C 30 min. Step 4DRoom temperature15 min. Number of cyclesD100 RecoveryD2 hrs of recovery under the standard condition after the test. 15. High Temperature Life Test R25 changeD Within M3L R25 changeD Within M5L TemperatureD125M2C B Constant changeD B Constant changeD DurationD1000M12 hrs Within M1L Within M3L R25 changeD Within M3L R25 changeD Within M5L TemperatureD85M2C B Constant changeD B Constant changeD HumidityD90 to 95LRH RecoveryD2 hrs of recovery under the standard condition after the removal from test chamber. testing substrateDglass-epoxy-resin substrate 16. Damp Heatf steady stateg Within M1L Within M3L THERMISTORS testing substrateDglass-epoxy-resin substrate 9 DurationD1000M12 hrs RecoveryD2 hrs of recovery under the standard condition after the removal from test chamber. testing substrateDglass-epoxy-resin substrate Note on standard conditionD"standard condition" referred to herein is defined as followsD 5 to 35C of temperature, 45 to 85L relative humidity and 86 to 106kPa of air pressure. When there are questions concerning measurement resultsD In order to provide correlation data, the test shall be conducted under condition of 20M2C of temperature, 65 to 70L relative humidity and 86 to 106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition." 495