486
形名表記法 ORDERING CODE
用途 APPLICATIONS
特長 FEATURES
HM3
J
K
M
M 5
M10
M20
HM3
J
K
M
M 5
M10
M20
Y125C保証
YB定数が大きく温度検知能力が優れている
Y表裏の区別がなくバルク、テーピングでの自動装着が可能
Y寸法はEIAJ規格に準拠
Y内部電極構造を採用することにより、信頼性向上を実現しています
積 層 チップ NTCサ ーミスタ
MULTILAYER CHIP NTC THERMISTORS
Y通信機用
自動車電話、携帯電話、コードレス電話ほか
YOA機器用
プリンタ、ファクシミリ、ワードプロセッサほか
Y民生機器用
ビデオ、カラーテレビ、液晶テレビ、CDプレーヤほか
Yバッテリ保護回路用
OPERATING TEMP. K55VJ125C
YGuaranteed up to 125C.
YLarge B constant for higher temperature sensing capability.
YIdeal for automatic mounting in bulk or from tapes because of front-rear
symmetry.
YAvailable in a standard EIA compatible case size.
YImproved reliability due to use of internal electrodes.
YTelecommunications equipmentDmobile telephones,cellular telephones,
cordless telephones, etc.
YOffice automationDprinters, facsimiles, word processors, etc.
YConsumer electronicsDVCRs, color television sets, LCD television sets,
CD players, etc.
YBattery protection circuit
TBPS1S103K440H5Q○
1 2 3 4 5 6 7 8 9 10 11
Q 標準品
    Q=スペース
1
TB NTC サーミスタ
形式
3
寸法 [mm]
S0
S1
1.0P0.5f0402g
1.6P0.8f0603g
5
公称零負荷抵抗 [E]
6
1000
150000
B定数許容差 [L]
8
7
公称 B定数 [K]
当社管理記号
11
最高温度 [C]
10
  Q 125
例
295
410
記号P10
2950
4100
抵抗許容差 [L]
例
102
154
9
5 K55
最低温度 [C]
4
包装
R
S
紙テーピング
単品f袋づめg
2
Pメッキ電極品
形状
Q Standard product
    Q=Blank space
1
TB NTC THERMISTOR
Type
3
Dimension[mm]
S0
S1
1.0P0.5f0402g
1.6P0.8f0603g
5
Nominal Zero-Power Resistance[E]
6
1000
150000
B constant tolerance[L]
8
7
Nominal B constant[K]
Internal code
11
Max. temperature[C]
10
  Q 125
example
295
410
SymbolP10
2950
4100
Resistance tolerance[L]
example
102
154
9
5 K55
Min. temperature[C]
4
Packaging
R
S
Tape&Reel
Bulk
2
PPlated terminal
Shape
487
THERMISTORS
9
P.488 P.489 P.490 P.492 OOOP.12
etc
外形寸法 EXTERNAL DIMENSIONS
Type L W Te
R-T特性図 R-T CHARACTERISTICS
1.6M0.15
f0.063M0.006g
0.8M0.15
f0.031M0.006g
0.8M0.15
f0.031M0.006g
0.35M0.25
f0.014M0.010g
1608 f0603g
仕様 SPECIFICATIONS
Unit:mm fInchg
1005typef0402g
アイテム一覧
Part Numbers
特性図
Electrical Characteristics
梱包
Packaging
信頼性
Reliability Data
使用上の注意
Precautions
セレクションガイド
Selection Guide
R25
Ｂ定数
B Constant
許容差（記号）Tolerance fSymbolsg
M5%fJg, M10%fKg, M20%fMg
M3% fHg
1.0M0.05
f0.039M0.002g
0.5M0.05
f0.020M0.002g
0.5M0.05
f0.020M0.002g
0.25M0.10
f0.010M0.004g
1005 f0402g
1608typef0603g
488
TBP S0 Z 222 Q 410 H 5Q
TBP S0 Z 332 Q 410 H 5Q
TBP S0 Z 472 Q 410 H 5Q
TBP S0 Z 682 Q 410 H 5Q
TBP S0 Z 103 Q 410 H 5Q
TBP S0 Z 153 Q 410 H 5Q
TBP S0 Z 223 Q 440 H 5Q
TBP S0 Z 333 Q 440 H 5Q
TBP S0 Z 473 Q 455 H 5Q
TBP S0 Z 683 Q 455 H 5Q
TBP S0 Z 104 Q 455 H 5Q
TBP S0 Z 154 Q 455 H 5Q
アイテム一覧 PART NUMBERS
1005TYPE
T3 sec 0.5V2.0
mW/C35mW
4100
4100
4100
4100
4100
4100
4400
4400
4550
4550
4550
4550
熱放散定数
Dissipation
factor
熱時定数
Thermal time
constant
B定数
B constant
fK:25/85Cg
R25
[kE]
形 名
Ordering Code
2.2
3.3
4.7
6.8
10
15
22
33
47
68
100
150
定格電力
Rated Power
形名の○には包装 （R=テーピング、S=単品）、△には抵抗許容差記号（J,K,M） が入ります。
ZPlease specify the packaging codefRDtape & reel, SDBulkgand Q the resistance tolerance codefJ, K, Mg.
備 考
Remark
TBP S1 Z 470 Q 295 H 5Q
TBP S1 Z 680 Q 295 H 5Q
TBP S1 Z 101 Q 315 H 5Q
TBP S1 Z 151 Q 315 H 5Q
TBP S1 Z 221 Q 410 H 5Q
TBP S1 Z 331 Q 410 H 5Q
TBP S1 Z 471 Q 410 H 5Q
TBP S1 Z 681 Q 410 H 5Q
TBP S1 Z 102 Q 410 H 5Q
TBP S1 Z 152 Q 410 H 5Q
TBP S1 Z 222 Q 410 H 5Q
TBP S1 Z 332 Q 410 H 5Q
TBP S1 Z 472 Q 440 H 5Q
TBP S1 Z 682 Q 440 H 5Q
TBP S1 Z 103 Q 440 H 5Q
TBP S1 Z 153 Q 460 H 5Q
TBP S1 Z 223 Q 460 H 5Q
TBP S1 Z 333 Q 460 H 5Q
TBP S1 Z 473 Q 475 H 5Q
TBP S1 Z 683 Q 475 H 5Q
TBP S1 Z 104 Q 475 H 5Q
TBP S1 Z 154 Q 475 H 5Q
1608TYPE
T5 sec 1.0V2.5
mW/C63mW
2950
2950
3150
3150
4100
4100
4100
4100
4100
4100
4100
4100
4400
4400
4400
4600
4600
4600
4750
4750
4750
4750
熱放散定数
Dissipation
factor
熱時定数
Thermal time
constant
B定数
B constant
fK:25/85Cg
R25
[kE]
形 名
Ordering Code
 0.047
 0.068
 0.100
 0.150
 0.22
 0.33
 0.47
 0.68
 1.0
 1.5
 2.2
 3.3
 4.7
 6.8
10
15
22
33
47
68
100
150
定格電力
Rated Power
形名の○には包装 （R=テーピング、S=単品）、△には抵抗許容差記号が入ります。
ZPlease specify the packaging codefRDtape & reel, SDBulkgand Q the resistance tolerance code.
備 考
Remark
489
THERMISTORS
9
特性図 ELECTRICAL CHARACTERISTICS
高温放置 High Temperature Life Test
耐湿性 Damp Heatfsteady stateg
試験条件 Test Condition 85C95%
試験条件 Test Condition 125C
高温放置 High Temperature Life Test
耐湿性 Damp Heatfsteady stateg
試験条件 Test Condition 85C95%
試験条件 Test Condition 125C
1005typef0402g
1608typef0603g
490
梱包 PACKAGING
③テーピング寸法 Taping Dimensions
標準数量 Standard quantity [pcs]形 式
Type
製品厚み
Thickness
[mm]袋づめ Bulk
10000
4000
0.5 (0.020)
0.8 f0.031g
紙テープ Taping
10000
4000
④リーダ部・空部 Leader and Blank portion
⑤リール寸法 Reel size
⑥トップテープ強度 Top Tape Strength
トップテープのはがし力は下図矢印方向にて0.1〜0.7Nとなります。
The top tape requires a peel;-off force of 0.1V0.7N in the direction of the
arrow as illustrated below.
UnitDmm fInchg
①標準数量 Standard quantity
1005 (0402)
1608 f0603g
紙テープ（8mm幅） Paper tapef0.315inches wideg
チップ挿入部 挿入ピッチ テープ厚み
形 式 Chip cavity
Insertion pitch
Tape thickness
AB F T
1005f0402g0.65M0.1 1.15M0.1 2.0M0.05 0.8max
f0.026M0.004gf0.045M0.004gf0.079M0.002g
f0.031maxg
1608f0603g1.0M0.2 1.8M0.2 4.0M0.1 1.1max
f0.039M0.008gf0.071M0.008gf0.157M0.004g
f0.043maxg
UnitDmmfInchg
②テーピング材質 Tape material
Type
493
THERMISTORS
9
RELIABILITY DATA
Item
Specified Value
Test Methods and Remarks
Applied forceD5N
DurationD10sec.
MULTILAYER CHIP NTC THERMISTORS
1. Operating Temperature Range
2. Storage Temperature Range
3. Rated Power
4. Nominal Zero-Power Resistance
5. Nominal B Constant
6. Dissipation Constantfsingle unitg
7. Thermal Time Constantfsingle unitg
8. Rated Ambient Temperature
9. Electric Power Derating Curve
10. Resistance to Flexure of Substrate
11. Adhesion of Terminal Electrode
Ambient temperatureD25M0.2C
Measuring electric powerD0.1mW max.
Measure the resistance at the ambient temperatures of 25M0.2C and J85M0.2C.
This represents the amount of electric power required to raise the temperature of
the element by 1C through self-heating under thermal equilibrium.
This represents the amount of time for the temperature of the thermistor element to
change by 63.2L of the difference between the initial temperature and the ambi-
ent temperature by the drastic change of power application into thermistor from
non-zero-power to zero-power state.
This represents the maximum ambient temperature at which rated power could be applied.
This represents the relations between the ambient temperature and the maximum
permissible power.
R25 changeDWithin M5L
B constant changeD
Within M2L
K55 to J125C
K55 to J125C
35mW 63mW
2.2V150kE0.047V150kE
M5LM5L
M10LM10L
M20LM20L
4100V4550K 2950V4750K
M3LM3L
0.5 to 2.0mWNC 1.0 to 2.5mWNC
Within 3 sec. Within 5 sec.
25C
As shown in the figure at right.
R25 changeDWithin M5L
B constant changeD
Within M2L
WarpD2mm
Testing boardDglass-epoxy-resin substrate
Board thicknessD0.8mm
Pressing speedD0.5mmNsec.
DurationD30 sec.
1/2
1005(0402) 1608(0603)
R25 changeDWithin M3L
B constant changeD
Within M1L
R25 changeDWithin M3L
B constant changeD
Within M1L
495
THERMISTORS
9
RELIABILITY DATA
Note on standard conditionD"standard condition" referred to herein is defined as followsD
5 to 35C of temperature, 45 to 85L relative humidity and 86 to 106kPa of air pressure.
When there are questions concerning measurement resultsD
In order to provide correlation data, the test shall be conducted under condition of 20M2C of temperature, 65 to 70L relative humidity and 86 to 106kPa of air pressure.
Unless otherwise specified, all the tests are conducted under the "standard condition."
Item Specified Value Test Methods and Remarks
At least 80% of terminal
electrode is covered by new
solder.
R25 changeDWithin M5L
B constant changeD
Within M2L
R25 changeD Within M5L
B Constant changeD
Within M3L
According to JIS C5102 clause 8.4.
Solder temperatureD230M5C
DurationD4M1 sec.
Reflow solderingD
Solder temperatureD240C
DurationD5 sec.
Preheating temperatureD150C
Preheating timeD90 sec.
Number of reflowsD3 times
testing substrateDglass-epoxy-resin substrate
Conditions for 1 cycleNStep 1DK55M2C  30 min.
Step 2DRoom temperature 15 min.
Step 3DJ125M2C 
30 min.
Step 4DRoom temperature 15 min.
Number of cyclesD100
RecoveryD2 hrs of recovery under the standard condition after the test.
testing substrateDglass-epoxy-resin substrate
TemperatureD125M2C
DurationD1000M12 hrs
RecoveryD2 hrs of recovery under the standard condition after the removal
from test chamber.
testing substrateDglass-epoxy-resin substrate
TemperatureD85M2C
HumidityD90 to 95LRH
DurationD1000M12 hrs
RecoveryD2 hrs of recovery under the standard condition after the removal
from test chamber.
testing substrateDglass-epoxy-resin substrate
12. Solderability
13. Resistance to Soldering
14. Thermal Shock
15. High Temperature Life Test
16. Damp Heatfsteady stateg
R25 changeD Within M5L
B Constant changeD
Within M3L
R25 changeD Within M5L
B Constant changeD
Within M3L
2/2
MULTILAYER CHIP NTC THERMISTORS
1005(0402) 1608(0603)
At least 75% of terminal
electrode is covered by new
solder.
R25 changeDWithin M3L
B constant changeD
Within M1L
R25 changeD Within M3L
B Constant changeD
Within M1L
R25 changeD Within M3L
B Constant changeD
Within M1L
R25 changeD Within M3L
B Constant changeD
Within M1L