BUZ71 N - CHANNEL 50V - 0.085 - 17A TO-220 STripFET POWER MOSFET T YPE BUZ71 V DSS R DS(on) ID 50 V < 0.1 17 A TYPICAL RDS(on) = 0.085 AVALANCHE RUGGED TECHNOLOGY 100% AVALANCHE TESTED HIGH CURRENT CAPABILITY 175oC OPERATING TEMPERATURE 3 1 APPLICATIONS HIGH CURRENT, HIGH SPEED SWITCHING SOLENOID AND RELAY DRIVERS REGULATORS DC-DC & DC-AC CONVERTERS MOTOR CONTROL, AUDIO AMPLIFIERS AUTOMOTIVE ENVIRONMENT (INJECTION, ABS, AIR-BAG, LAMPDRIVERS, Etc.) 2 TO-220 INTERNAL SCHEMATIC DIAGRAM ABSOLUTE MAXIMUM RATINGS Symbol V DS V DGR V GS Value Un it Drain-source Voltage (VGS = 0) Parameter 50 V Drain- gate Voltage (R GS = 20 k) 50 V 20 V G ate-source Voltage o ID Drain Current (continuous) at Tc = 25 C 17 A IDM Drain Current (pulsed) 68 A P tot Ts tg Tj o T otal Dissipation at Tc = 25 C Storage Temperature Max. Operating Junction Temperature DIN HUMIDITY CAT EGORY (DIN 40040) IEC CLIMAT IC CAT EG ORY (DIN IEC 68-1) 60 W -65 to 175 o C 175 o C E 55/150/56 First digit of the datecode being Z or K identifies silicon characterized in this datasheet. July 1999 1/8 BUZ71 THERMAL DATA R thj -case R thj -amb Thermal Resistance Junction-case 2.5 o C/W 62.5 o C/W Max Thermal Resistance Junction-ambient Max AVALANCHE CHARACTERISTICS Symbo l Parameter Valu e Unit IAR Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by Tj max) 17 A E AS Single Pulse Avalanche Energy (starting Tj = 25 o C, ID = IAR , V DD = 25 V) 50 mJ ELECTRICAL CHARACTERISTICS (Tcase = 25 oC unless otherwise specified) OFF Symbo l V (BR)DSS Parameter Drain-source Breakdown Voltage Test Con ditions I D = 250 A V GS = 0 I DSS V DS = Max Rating Zero Gate Voltage Drain Current (V GS = 0) V DS = Max Rating IGSS Gate-body Leakage Current (VDS = 0) Min. Typ. Max. 50 Unit V Tj = 125 oC V GS = 20 V 1 10 A A 100 nA Max. Unit ON () Symbo l Parameter Test Con ditions V GS(th) Gate Threshold Voltage V DS = V GS R DS(on) Static Drain-source On Resistance ID = 1 mA V GS = 10 V Min. 2.1 Typ. 3 4 V 0.085 0.1 Min. Typ. Max. Unit 4 7.7 S 760 100 30 pF pF pF ID = 9 A DYNAMIC Symbo l g f s () C iss C os s C rss Parameter Test Con ditions Forward Transconductance V DS = 25 V ID = 9 A Input Capacitance Output Capacitance Reverse Transfer Capacitance V DS = 25 V f = 1 MHz V GS = 0 SWITCHING Symbo l t d(on) tr t d(of f) tf 2/8 Parameter Turn-on Time Rise Time Turn-off Delay T ime Fall T ime Test Con ditions V DD = 30 V R GS = 50 ID = 8 A V GS = 10 V Min. Typ. 20 65 70 35 Max. Unit ns ns ns ns BUZ71 ELECTRICAL CHARACTERISTICS (continued) SOURCE DRAIN DIODE Symbo l ISD Parameter Test Con ditions I SDM Source-drain Current Source-drain Current (pulsed) V SD () Forward On Voltage I SD = 28 A Reverse Recovery Time Reverse Recovery Charge I SD = 14 A di/dt = 100 A/s V DD = 30 V T j = 150 o C t rr Q rr Min. Typ. V GS = 0 Max. Unit 17 68 A A 1.8 V 65 ns 0.17 C () Pulsed: Pulse duration = 300 s, duty cycle 1.5 % Safe Operating Area Thermal Impedance 3/8 BUZ71 Output Characteristics Transfer Characteristics Transconductance Static Drain-source On Resistance Gate Charge vs Gate-source Voltage Capacitance Variations 4/8 BUZ71 Normalized Gate Threshold Voltage vs Temperature Normalized On Resistance vs Temperature Source-drain Diode Forward Characteristics 5/8 BUZ71 Fig. 1: Unclamped Inductive Load Test Circuit Fig. 2: Unclamped Inductive Waveform Fig. 3: Switching Times Test Circuits For Resistive Load Fig. 4: Gate Charge test Circuit Fig. 5: Test Circuit For Inductive Load Switching And Diode Recovery Times 6/8 BUZ71 TO-220 MECHANICAL DATA mm DIM. MIN. inch TYP. MAX. MIN. TYP. MAX. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 D1 0.107 1.27 0.050 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.067 F2 1.14 1.70 0.044 0.067 G 4.95 5.15 0.194 0.203 G1 2.4 2.7 0.094 0.106 H2 10.0 10.40 0.393 0.409 14.0 0.511 L2 16.4 L4 0.645 13.0 0.551 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.2 6.6 0.244 0.260 L9 3.5 3.93 0.137 0.154 DIA. 3.75 3.85 0.147 0.151 D1 C D A E L5 H2 G G1 F1 L2 F2 F Dia. L5 L9 L7 L6 L4 P011C 7/8 BUZ71 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibil ity for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specific ation mentioned in this publication are subjec t to change without notice. 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